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© 2006 Hewlett-Packard Development Company, L.P.The information contained herein is subject to change without notice
Adaptive Infrastructure
Power and CoolingJeff Otchis
September 2006
2단기 4339년 10월9일
Adaptive InfrastructureDelivering on the next generation data center vision
“24x7 lights-out computing environment, based on standard building blocks, automated using modular software, delivered through comprehensive services.”
Delivered today as modular systems, products, software and services, and tomorrow through an integrated common architecture.
• Lower cost of IT operations• Higher quality of service• Speed in introducing IT change
3단기 4339년 10월9일
AutomationVirtualizationSecurityIT Systems & Services
Adaptive InfrastructureKey enablers
Current state Future stateHigh-costIT islands
Low-costpooled ITassets Automated 24x7
lights-out computing
Power & Cooling Management
• Scalability based on standards
• IT services and solutions
• Energy-efficient computing
• Proactive best practices and built-in protection
• Pooling and sharing of IT resources to optimize utilization
• Dynamic IT re-deployment to meet changing business demand
• Unified Infrastructure Management
Key enablers
4단기 4339년 10월9일
“Maximize power density while achieving optimal power utilization”
• Efficient systems –processor, servers and storage
• Energy-aware provisioning• Flexible designs and modeling
tools
Power & CoolingEnergy-efficient computing
High-costIT islands
Low-costpooled ITassets
Current state Future stateAutomated 24x7 lights-out computing
AutomationVirtualizationSecurityIT Systems& Services
Key enablers
Power &Cooling
Management
Systems:• Modular Cooling
System• Power Management
– HP BladeSystem– HP ProLiant servers– HP Integrity servers
• Universal Rackinfrastructure
Services:• Data Center Services –
power and cooling• Thermal Modeling
Data Center power
& cooling
HP C ClassBlade – PowerManagement
5단기 4339년 10월9일
A Growing ProblemServer power densities up 10x in last 10 yrs
Source: Datacom Equipment Power Trends and Cooling Applications, ASHRAE, 2005, http://www.ashrae.org
6단기 4339년 10월9일
Current Data Center Design
Intake
Discharge Supply Air Plenum Perforated Tiles
Intake
Raised Floor
CRAC CRAC
22ºC
• Raised floors, with air delivered through perforated floor tilesArchitecture unchanged from mainframe days
7단기 4339년 10월9일
Current Data Center Design
Intake
Discharge Supply Air Plenum Perforated Tiles
Intake
Raised Floor
CRAC CRAC
22ºC34ºC
• Raised floors, with air delivered through perforated floor tiles• 40-50% efficient at best
Architecture unchanged from mainframe days
8단기 4339년 10월9일
Current Data Center Design
Intake
Discharge Supply Air Plenum Perforated Tiles
Intake
Raised Floor
CRAC CRAC
22ºC34ºC40ºC
• 40-50% efficient at best• Barrier to deployment of newer higher density technologies
Poorly suited to cooling today’s server and storage platforms
9단기 4339년 10월9일
Current Data Center Design
Intake
Discharge Supply Air Plenum Perforated Tiles
Intake
Raised Floor
CRAC CRAC
22ºC34ºC40ºC45ºC
• 40-50% efficient at best• Barrier to deployment of newer higher density technologies
Poorly suited to cooling today’s server and storage platforms
10단기 4339년 10월9일
Current Data Center Design
Intake
Discharge Supply Air Plenum Perforated Tiles
Intake
Raised Floor
CRAC CRAC
22ºC34ºC40ºC45ºC52ºC
Poorly suited to cooling today’s server and storage platforms• 40-50% efficient at best• Barrier to deployment of newer higher density technologies
11단기 4339년 10월9일
Improving Data Center Design
Alternating hot and cold aisles are a better solution, however:
• Hot racks/cold racks causes non-trivial rack placement considerations
• 8-10 kW per rack is approaching the maximum supportable with traditional forced air cooling
• A significant percentage of data center costs go to power and cooling
12단기 4339년 10월9일
Next Generation Data Center DesignPower and cooling are becoming more important• Data center power density up 10x in
the last 10 years − 2.1kW/rack (1992); 14kW/rack
(2006)• Larger proportion of IT spend for
energy• 3-year energy cost roughly equivalent
to entry level server acquisition cost in US; in Europe it could be as high as 2X
• Can take as much power to cool the heat generated from a system as it takes to power the system
• Requires a holistic perspective− Complex problem− Multi-layered challenge− Interdependencies – standards-
based approach− Energy – finite planet resource
Tem
pera
tur
e
CHIP
SYSTEM
DATA CENTER
Exergy (available work)
Flow irreversibility
Non-uniform power
Flow irreversibility
Thermodynamic irreversibility
Flow
and
ther
mod
ynam
ic w
ork
Energ
y flow
Ground state (ambient)
Non-ideal effects
Non-ideal effects
Non-uniform power
Non-uniform power
2nd law-based tool from chipscale to data center scale
Source: HP Labs and UC Berkeley
13단기 4339년 10월9일
Important to consider all the costs
Power Generator
UPSSwitch Gear
Battery Backup/Flywheel
Chiller
Q
•TCO model considers details of the power and cooling stack•Power: substation to the chip•Cooling: chip to the cooling tower
Ref. Patel, C. and Shah, A., “Cost Model for Planning, Development and Operation of a Data Center”, HPL-2005-107(r.1)
3-4x server power costs
Power & Cooling Infrastructure
TCO Real Estate Cost
Burdened Power& Cooling Cost
Operation Cost++=
14단기 4339년 10월9일
Localized
Quick AssessmentGap analysis & written report highlighting best practices and quick wins
Enterprise-Plus
Smaller scale investment for quick wins
Larger scale, investment for bigger savings
Adaptive Smart Cooling (future)
Static Modeling Scientific approach to predicting airflow and temperature using sophisticated modeling tools. Changes recommended to eliminate hot spots and reclaim capacity.
Optimizing Data Center Design
15단기 4339년 10월9일
Static Data Center Thermal Modeling• The Static Smart Cooling service
enables customers to optimize existing or new data centers for compaction and/or energy efficient operation by:− optimizing placement of
computational resources− optimizing configuration of
cooling resources• AC systems
− failure mitigation• The Static Smart Cooling service
is available today
16단기 4339년 10월9일
Region Size
50% load
100 %load
Dynamic Data Center ModelingImpact of load or cooling changes
For a given data center (at 2250 watts per square meter) with an air-conditioning failure, the reaction time to reduce load is less than ~ 35 seconds to prevent redlining & shutdown
Modeling has the capability to show the impact of:
• Turning on new machines
• Air-conditioning shutdown for scheduled maintenance
• Air-conditioning failure
18단기 4339년 10월9일
Helping Maximize Data Center Energy Budgets• Energy efficient design approach - from each component
to entire data center • 40% reduction in power• Doubling the number of servers with same power• …and using 50% less airflow to cool them• +30% improved energy efficiency versus rack-mount
Measuring and managing every watt for efficiencyThermal Logic Technology
19단기 4339년 10월9일
View/trend power usage and temperature: component, enclosure and rack
• Rack-level BTU/Hr.• Enclosure inflow & outflow temp• Actual power utilization• Max power available
Thermal Logic TechnologyInsight to measure, tools to adapt power & cooling
Dynamically adapt thermal controls to maximize power budget and ensure availability
• Power usage and distribution– HP Dynamic Power Saver
• Airflow and acoustics– PARSEC – HP Active Cool fans
• Performance– HP Power Regulator
• Workload balancing– Virtualization and automation
20단기 4339년 10월9일
Thermal Logic Management Rack-level BTU/hour
Enclosure inflow and
outflow temperatures
Actual power usage
Maximum power available
21단기 4339년 10월9일
HP Dynamic Power Saver
• 6 power supplies, 300W each, 75% efficiency• 2400W in for 1800W out• 600W wasted
• 2 power supplies, 900W each, 91% efficiency• 1978W in for 1800W out• Saving of 422W per enclosure
20 enclosures @ 0.075 per kW/hr can save ≈ US$5,545 per year
Example: 1800W draw system
22단기 4339년 10월9일
Dynamic Power Saver
Greater efficiency and cost savings with Dynamic Power Saver
Typical Rack Servers
Typical server blades
Rack server
Rack server
Rack server
Rack server
Rack server
Rack server
Rack server
Rack server
BL20p
BL20p
BL20p
BL20p
BL20p
BL20p
BL20p
BL20p
Power supply efficiency
0% 10% 20% 30% 40% 50% 60% 70% 80% 90% 100%
Output load
Blade PSU
Typical PSU
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
Effic
iency
23단기 4339년 10월9일
HP Active Cool Fan technology
• Best-in-class power consumption• High air flow (CFM)• High pressure• Best-in-class acoustics
20patents
Innovations from HP “Cool Team”• 66% less power consumption
than traditional fans• 50% less data center
air-conditioning required
24단기 4339년 10월9일
PARSEC architecture
Interconnect bays• The interconnects are powered and
cooled as part of the PARSEC architecture
Active Cool fans• Adaptive flow for maximum power
efficiency, air movement, and acoustics
Onboard Administrator• Remote administration view• Robust, multi-enclosure control
Power management• Single- or three-phase enclosures and
N+N or N+1 redundancy• Best performance per watt
PARSEC architecture• Parallel, redundant and
scalable cooling and airflow design
c7000 Enclosure
25단기 4339년 10월9일
HP Modular Cooling System (MCS)• Cooling for high density deployments• 30KW of cooling capacity in a single rack• Uniform air flow across the front of the servers• Redundant power source • Safety features to prevent water contact with
servers• Adjustable temperature setpoint• Does not add to the heat load in data center• Polycarbonate front door reduces ambient noise
considerably • Server/Blade deployment unaffected by design• Level 2 Integration with HP SIM
26단기 4339년 10월9일
MCS Functional Design
Fan Assembly
Heat Exchanger
Water Connections
Side Air Duct
Side ViewTop View
Blind-Mate Quick
Disconnect Couplings
Front Panel
Display
Controller
28단기 4339년 10월9일
Deployment Options•Options
1-Independent loop connected to water-to-water heat exchanger (see diagram)
2-Independent water chiller dedicated to MCS.
3- Direct connect to house chilled water
29단기 4339년 10월9일
Lifting the Data Center ConstraintsPower and thermal management
Power monitoring PDU
Power Regulator
Power Efficient Components
Modular Cooling System
• Local power monitoring display• Unique color-coded load
segment identification
• Only HP offers direct control thru on board processor (iLO)
• Dynamic power throttling• Power meter reporting
•Power calculator
•High efficiency power supplies•Zone cooling designs•Lower power processors•SFF SAS drives draw ½ the
power
• Cooling for high density deployments
• Support up to 30kW in a single rack
Plus a variety of Data Center planning services
30단기 4339년 10월9일
Key takeaways:Energy efficient IT engineeringHolistic approach across the data center
Efficient data centers • HP Modular Cooling
• Data Center Thermal Assessment• Data Center Site Planning
Efficient systems
• Processor Power Regulator• Enterprise chipsets• Integrity Virtual Server Environment• StorageWorks
Efficient components • Small drives
• Intelligent power supplies• Efficient power conversion
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