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TECHNICAL CAPABILITY TECHNICAL CAPABILITY

Technical Capability

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Page 1: Technical  Capability

TECHNICAL CAPABILITYTECHNICAL CAPABILITY

Page 2: Technical  Capability

Thru hole :Thru hole : Aspect ratio =< 14 Drilling diameter 150 µ

Materials (RoHS) : High Tg epoxy (Tg 175°C) completely compatible RoHS (Filler et phenolic hardener) Materials for high frequencies (4 to 15 GHz)M Green materials (Halogen free) Low deformation materials (X,Y,Z)L

Lines & spacing : AOI check Clean room classe 100 40 µ lines / 60 µ spacing

Laser vias : Sequential multilayers (3 levels) Stacked Microvias Laser Holes 75 µ

Finishes : Electroless nickel-gold Electroless tin - OSP HASL- Fused tin-lead Ionic contamination < 0.3 µg/cm2

Blind vias :Blind vias : drilling 100 µ

General capability

Page 3: Technical  Capability

Today 2009 2010External lines and spacing 75 µ / 85 µ 60 µ / 75 µ 50 µ / 70 µ

CMS minimum pitch 200 µ 200 µ 200 µ

BGA minimum pitch 300 µ 250 µ 200 µ

Drilled holes (D)--> board 150 µ 100 µ 100

--> laser via 75 µ 75 µ 75 µ

Pad diameter D + 250 µ D + 220 µ D + 200 µ

Aspect ratio 14:1 16:1 16:1

Internal lines and spacing 60 µ / 80 µ 50 µ / 75 µ 40 µ / 60 µ

Base MaterialsHigh Tg Epoxy - Halogen

free - Polyimide - BT epoxy - Rogers

High Tg Epoxy - Halogen free - Polyimide - BT

epoxy - Rogers

High Tg Epoxy - Halogen free - Polyimide - BT

epoxy - Rogers

Technology Sequential multilayers - laser µvias 2 & 3 levels - Stacked vias - Burried &

blind vias - Thermal drains- Rigid-flex

Sequential multilayers - laser µvias 2 & 3 levels - Stacked vias - Burried &

blind vias - Thermal drains- Rigid-flex

Sequential multilayers - laser µvias 2 & 3 levels - Stacked vias - Burried &

blind vias - Thermal drains- Rigid-flex

General capability

Page 4: Technical  Capability

Technical investments

Page 5: Technical  Capability

Laser vias filling lineRouter with CCD camera and Z axis control

Drilling(OIR & 300KT/MN)

LDI (Paragon 8W)Laser plotter (LP5008)

DES lineAOI & AOR (Automatic Optical Repair)

Electroless nickel-gold line

200920082007

Technical investments

Page 6: Technical  Capability

Reliability

Page 7: Technical  Capability

• 12 layers • 2.4 mm thickness• 8000 interconnected holes

( « daisy chain ») • Drilled holes from 0.25 mm to 1.1 mm• BGA’s au pas de 1 et 1.27 mm• CMS pads• Internal connections at several levels

Reliability : Process Control BoardReliability : Process Control Board

Page 8: Technical  Capability

Process Control BoardProcess Control Board

• Production of 3 boards per week

• Base Materials control (Tg 175°C)B

• Plating Control (Electroless & electrolytic copper baths)

• Thermal shocks and microsections :

- 1 to 4*10s at 287 °C on “standard” high Tg epoxy- 2 to 8*10s at 300 °C on high Tg epoxy « ROHS »

--> Controls according to IPC A600 (classe 3)

Advance detection of board failure modesProcess and Material board qualification

Page 9: Technical  Capability

Industrial designs & examples

for high reliable boards

Page 10: Technical  Capability

(µ)Thickness 400 to 1500Drilled hole diameter 150 to 250Aspect ratio 4 à 8

"Intermediate board"

Layers (µ)Externals 9 to 18 Signal inner 18 to 35

Base Copper Thickness

or

Base materials : high Tg (175°C°) epoxywith fillers and phenolic hardener

Page 11: Technical  Capability

BGA from 0.8 to 1 mm pitch

Pitch Pads diameter Line width Technology

1000 µ 550 µ 120 µ (one line between 2 pads) "Dog bone" and thru holes

75 µ (two lines between 2 pads)

800 µ 400 µ 75 to 100 µ (one line between two pads) "Dog bone" and thru holes

Page 12: Technical  Capability
Page 13: Technical  Capability

Blind holes

Thru holes

BGA at 1 mmpitch

(1500 boules)

Page 14: Technical  Capability

Main technology in the case of “large” BGA’s

(number of balls from 800 to 1800)

Main markets : Avionics, Military, Industriel, “big” computers

Evolutions : high number of layers (+ 40% in 4 years)

Base copper thickness of 35µ (Low voltage ; “differential” signals)

Controlled impedances

“Sequential” boards

Page 15: Technical  Capability

High Density PCB’s

Designs & examples

for HDI boards

(Advanced technology)

Page 16: Technical  Capability

High Density PCB’s

The packaging “orientation” is mainly due to :

- the market segment (”consumer” vs “professional”...)

- the BGA pitch

- the “matrix” size (number of balls)

- the electrical constraints (impedance, signal quality ...)

- the assembly constraints (thermal shocks, finishes ...)

Page 17: Technical  Capability

High Density PCB’s

BGA at 0.5 to 0.3 mm pitch

Pitch Pads diameter Line width Technology

500 µ 250 to 300 µ 70 to 60 µ (one line between 2 pads) Vias laser "in pad"1 to 3 levels of microvias

400 µ 200 to 220 µ 40 to 60 µ (one line between 2 pads) Vias laser "in pad"1 to 3 levels of microvias

"Stacked" microvias

300 µ 160 to 180 µ 30 to 40 µ (one line between 2 pads) Vias laser "in pad"1 to 3 levels of microvias

"Stacked" microvias

Page 18: Technical  Capability

High Density PCB’s

1 2 3 4 5 6 7

1

2

3Orientations - 24 pads rangée 1 : connection par couche 1

4 - 16 pads rangée 2 : connection par couche 2 (liaison 1-2 par vias laser) - 8 pads rangée 3 : connection par couche 3 (Liaison 1-3 avec trous superposés)

5

6

7

Rangée 1 2 3 Pastille Trou Diélectrique Traits/isolements

Qté 24 16 8 (µ) (Perçé) (µ)

Couche 1 260 100 (laser) 100/12550 à 75 Prepreg

Couche 2 300 100 (laser) 100/12550 à 75 Prepreg

Couche 3 300 100/125

BGA at 0.5 mm pitch without lines between pads

Page 19: Technical  Capability

High Density PCB’s

Example

Thru holes drilled at 0.25 mm

Laser holes drilled at 0.1 mm

100 µ lines

Thickness : 1 mm

BGA pitch 0.5 mm

External Layer Internal Layer

Page 20: Technical  Capability

High Density PCB’s

Dimensions en microns

V1 V2

Pas BGA 500 500

Diamètre pad 250 280

Trait 70 60Isolement 90 80Diamètre trou laser 100 100

Diamètre épargne VE 350 380

Pad interne (pour trou laser) 300 300

BGA at 0.5 mm pitch with one line between 2 pads

Page 21: Technical  Capability

High Density PCB’s

1 2 3 4 5 6 7 8 9 10

1

2

3

4

5

6

7

8

9

10

Rangées 1 2 et 3 4 et 5 Pad Trou Cuivre Dielectric Trait/isolement(µ) (µ) (µ) (µ)

(laser)

Couche n-2 220 100 25-30 55 / 62.550 à 75 Prepreg

Couche n-1 220 100 25-30 55 / 62.550 à 75 Prepreg

Couche n 250 40-45 120 / 120

Un trait entre 2 pads (au pas de 400 µ) couches n-1 et n-2

BGA at 0.4 mm pitch with one line between 2 pads

Page 22: Technical  Capability

High Density PCB’s

1 2 3 4 5

1

2

3

4

5

Rangée 1 2 3 Pastille Trou Ep Vernis Diélectrique Traits/isolements

Qté 16 8 1 (µ) (Perçé) (µ) (µ)

Couche 1 220 100 220 100/12550 à 75 Prepreg

Couche 2 220 100 100 100/12550 à 75 Prepreg

Couche 3 300 100/125

Orientations - 16 pads rangée 1 : connection par couche 1 - 8 pads rangée 2 : connection par couche 2 (liaison 1-2 par vias laser) - 1 pad central : connection par un trait en couche 3

Pas de 300µ

BGA at 0.3 mm pitch without lines between pads

Page 23: Technical  Capability

High Density PCB’s

Main packaging when BGA pitch =< 0.5 mm

Main markets : communication and/or handled Electronic devices (mobile phones, Bluetooth, PDA ...)

Future : high packages matrix (more balls)stacked viasLess total plated thru holesthinner lines & spacing

Page 24: Technical  Capability

High Density PCB’s

Advanced technology for

Specific Needs (close to silicon devices)

Page 25: Technical  Capability

High Density PCB’s

Pastilles couche 6 de 250µ percées à 100µTrait mini interne : 75µIsolement mini interne : 75µ

couche 6

Fonction COUCHE TYPE CU de base Mesures (µ)externe 1 CU 9 50

PPG 50 100PPG 50

plan Cuivre 2 CU 18 18STRAT 100 100

logique 3 CU 18 18PPG 50 86PPG 50

logique 4 CU 18 18STRAT 100 100

plan Cuivre 5 CU 18 18PPG 50 110PPG 50

externe 6 CU 9 27PPG 50 460PPG 50PPG 50

logique 0 CU 0STRAT 150

logique 0 CU 0PPG 50PPG 50PPG 50

plan Cuivre 7 CU 18 18STRAT 508 500

externe 8 CU 18 50MATIERE : époxy haut Tg (175°C) low CTE (Hitachi 679FJ) TOTAL

Sur époxy 1573Sur cuivre 1673

Perçage et métallisations

CuivreDiamètre mini 1-6 100 14-15 µDiamètre mini 1-8 250

Pastilles

Externe 295 base - 280 sommetcouche 6 210 base - 190 sommet

Traitscouche 6 75 base - 65 sommet

DESIGNBGA au pas de 500µ (matrice : 17*17 = 289 boules)Pastilles couche externe de 350µ percées à 100µTrait mini externe : 100µ

Page 26: Technical  Capability

High Density PCB’s

BGA at 0.5 mm pitch : one line between 2 pads sequential board

COUCHE TYPECUIVRE (*) SYMBOLES

(microns)

1 E 45 ======

2 P 18 ---------

3 L 18 ---------

4 P 18 ---------

5 L 18 ---------

6 EP 25 ======

L 18 ---------

L 18 ---------

7 EP 25 ======

8 L 18 ---------

9 P 18 ---------

10 L 18 ---------

11 P 18 ---------

12 E 45 ======(mm)

Epaisseur totale sur époxy 4.00Epaisseur totale sur métallisation 4.09

==== cuivre "externe"

------- cuivre "interne"préimprégnésstratifiés

Drilled holes at 150µ60 µ lines

Page 27: Technical  Capability

High Density PCB’s

100µ

200µ

Cuivre

Nickel-Or chimique

Double sided board : - Flip-chip at 250 µ pitch - 165 µ pad - Drilling at 100 µ - Base material : Hitachi 679F

Page 28: Technical  Capability

High Density PCB’s

COUCHE TYPE CUIVRE (*) SYMBOLES MESURES

(microns) (microns)

1 E 45 ====== 3267

2 ELP 25 ====== 3038

3 ELP 25 ====== 3063

4 ELP 25 ====== 3143

5 ELP 25 ====== 3072

6 LP 12 --------- 12100

7 LP 12 --------- 1382

8 ELP 25 ====== 3043

9 ELP 25 ====== 3264

10 ELP 25 ====== 2736

11 ELP 25 ====== 3168

12 E 45 ====== 30

TOTAL 314

(mm)Epaisseur totale sur époxy 0.94Epaisseur totale sur métallisation 1.00

==== cuivre "externe"

------- cuivre "interne"préimprégnésstratifiés

(*) : E = cuivre de base 9 µ + recharge(*) : L, P ou LP = cuivre de base(*) :EL,EP ou ELP = cuivre de base+recharge

Page 29: Technical  Capability

High Density PCB’s

58 µ

55 µ

30 µ

35 µ

45 µ

90 µ

110 µ

External line with Nickel & Gold Inner line

Inner line

100 µ drilled hole

Page 30: Technical  Capability

High Density PCB’s