Cерверы Depo storm 3400 на базе новейших процессоров intel xeon e5 2600v3 fin

Серверы DEPO Storm 3400 на базе новейших процессоров Intel® Xeon® E5-2600v3 в современных решениях для ИТ-инфраструктуры

Регламент вебинара

Основные докладчики:

Сергей Сенько, руководитель направления по серверной продукции компании DEPO Computers

Михаил Опарин, инженер по техническому маркетингу компании Intel

Ответы на вопросы в текстовом режиме (Окно «Q&A»):

Владимир Князькин, инженер по техническому маркетингу компании Intel

Евгений Зенин, менеджер по серверной продукции компании DEPO Computers

Андрей Тюнин, руководитель группы продаж корпоративным заказчикам DEPO Computers

Во время вебинара мы попросим вас ответить на несколько вопросов

В конце вебинара у вас будет возможность скачать в электронном виде материалы по решениям DEPO Computers и слайды основной презентации

2

3

План и программа вебинара

Вступление

Опрос №1

Детальное ознакомление с новыми возможностями Intel Xeon E5-2600v3 и связанными с ним технологиями – DDR4, SAS 12Gbit, NVM-E и их преимуществами

Опрос №2

Представление модельного ряда DEPO Storm 3400 в котором полностью реализованы данные технологии

Обсуждение примеров построения серверной инфраструктуры на новых технологиях для компаний различного размера (от Cluster-In-A-Box на 100 пользователей, до частного облака на тысячи и 10 тысяч пользователей)

Анонс промо-программ и возможностей по детальному ознакомлению с обсуждаемыми решениями

Опрос №3

Секция вопросов и ответов

Опрос №4

Визитная карточка

DEPO Computers

DEPO Computers –

единственная российская вертикально

интегрированная инжиниринговая

компания, совмещающая наличие:

• целостной платформы облачных

сервисов;

• компетенций системного

интегратора;

• научно-исследовательского центра;

• масштабного производства

компьютерной техники;

• сервисной сети во всех регионах РФ

4

5 серверы и системы

хранения данных

Собственное производство

промышленные

планшеты

серверные шкафы и мини-

ЦОДы

рабочие станции,

ПК и терминалы моноблоки

Продукция DEPO Computers

ТОП-5 основных поставщиков серверов РФ

в CY2013, Gartner, % шт

Рейтинг производителей серверов WW

CY2012, шт.

Опрос №1

Просим Вас ответить на несколько вопросов

6

www.depo.ru

Михаил Опарин

инженер по техническому маркетингу компании Intel

Детальное ознакомление с новыми возможностями Intel Xeon E5-2600v3 и связанными с ним технологиями – DDR4, SAS 12Gbit, NVM-E и их преимуществами

http://www.depo.ru/

© 2015 Intel Corporation. All rights reserved. Other brands and names are the property of their respective owners.

Intel® Xeon® Processor E5-2600 v3

Product Family update.

Agenda • Intel® Xeon® Processor E5-2600 v3 Product Family

• DDR4 and NVDIMM technologies support

• Intel® NVMe SSDs

• Intel® 12Gb/s RAID Controllers

9

Key Differences Between E5-2600 v2 &

E5-2600 v3 Xeon E5-2600 v2

“Ivy Bridge-EP”

Xeon E5-2600 v3

“Haswell-EP”

Core Count Up to 12 Cores Up to 18 Cores

Frequency TDP & Turbo Frequencies TDP & Turbo Freq

AVX & AVX Turbo Freq

AVX Support Intel® AVX

8 DP Flops/Clock

Intel® AVX 2

16 DP Flops/Clock

Memory Type 4xDDR3 channels

RDIMM, UDIMM, LRDIMM

4xDDR4 channels

RDIMM, LRDIMM

Memory Frequency

(MHz) 1866 (1DPC), 1600, 1333, 1033

RDIMM: 2133 (1DPC), 1866 (2DPC), 1600

LRDIMM: 2133 (1&2DPC), 1600

QPI Speed Up to 8.0 GT/s Up to 9.6 GT/s

TDP

Up to 130W Server, 150W Workstation

Up to 145W Server, 160W Workstation

Increase due to Integrated Voltage Regulator

Power

Management

Same P-states for all cores

Same core & uncore frequency

Per-core P-states

Independent uncore frequency scaling

Energy Efficient Turbo

10

10

Feature Comparison across Intel®

Xeon® Generations

11

Intel® Xeon® Processor X5600

Series (Westmere-EP)

Intel® Xeon® Processor E5-2600

Product Family (Sandy Bridge-EP)


Product Family (Ivy Bridge-EP )


Product Family (Haswell-EP)

Essentials

Launch Date Q1'11 Q1'12 Q3'13 Q3'14

Maximum # of Cores 6 8 12 18

Maximum # of Threads 12 16 24 36

Last Level Cache (LLC) Up to 12 MB Up to 20 MB Up to 30 MB Up to 45 MB

Maximum QPI Bus Speed 6.4 GT/s 8 GT/s 8 GT/s 9.6 GT/s

Instruction Set Extensions SSE4.2 Intel® AVX Intel® AVX Intel® AVX 2

Intel Process Technology 32 nm 32 nm 22 nm 22 nm

Intel® Turbo Boost Technology 1.0 2.0 2.0 2.0

Power Management Same P-States for All Cores

Fixed Uncore Frequency

Same P-States for All Cores

Same Core and Uncore Frequency

Same P-States for All Cores

Same Core and Uncore Frequency

Per Core P-States

Independent Uncore Frequency Scaling

Memory Specifications

Max Memory Size per Socket 288 GB 384 GB 768 GB 768 GB

Memory Types

DDR3

800/1066/1333

RDIMM/UDIMM

DDR3

800/1066/1333/1600

RDIMM/UDIMMs

Quad Rank LRDIMM

DDR3

800/1066/1333/1600/1866

RDIMM/UDIMM

Quad Rank LRDIMM

DDR4

1600/1866/2133

RDIMM

Quad Rank LRDIMM

# of Memory Channels 3 4 4 4

Max # of DIMMs/Channel 3 3 3 3

Max # of DIMMs/Socket 9 12 12 12

Theoretical Max Memory Bandwidth

per Socket 32 GB/s 51.2 GB/s 59.7 GB/s 68.2 GB/s

Expansion Options

PCI Express Revision 2.0 (in Chipset) 3.0 3.0 3.0

Max # of PCI Express Lanes N/A 40 40 40

PCI Express Configurations N/A x4, x8, x16 x4, x8, x16

x16 Non-Transparent Bridge

x4, x8, x16

x16 Non-Transparent Bridge

All comparisons based on a single socket.

Feature Comparison across Intel®

Xeon® Generations

Intel® Xeon® Processor X5600

Series (Westmere-EP)

Intel® Xeon® Processor E5-2600

Product Family (Sandy Bridge-EP)


Product Family (Ivy Bridge-EP )


Product Family (Haswell-EP)

Advanced Technologies

Thermal Monitoring Technologies N/A √ √ √

Intel® Integrated I/O N/A √ √ √

Intel® Data Direct I/O N/A √ √ √

Integrated Voltage Regulator (IVR) N/A N/A N/A √

Intel® Virtualization Technology

Intel® Virtualization Technology (VT-x) √ √ APIC Virtualization Cache QoS Monitoring

EPT A/D Bits

Intel® Data Protection Technology

Intel® Advanced Encryption Standard

New Instructions (AES-NI) √ √ √ AVX2 enhancements to AES-NI

Secure Key N/A N/A √ √

Intel® Platform Protection Technology

Intel® Trusted Execution Technology (TXT) √ Greater hypervisor and OS support

Launch control policy enhancements

Greater hypervisor and OS support

Launch control policy enhancements SMM External Call Trap (SECT)

OS Guard N/A N/A √ √

12

Advanced

25-30 MB LLC cache -2.5MB/core

9.6 GT/s QPI DDR4-2133 Intel® Hyper-Threading Intel® Turbo boost

Standard

Basic

Segmented Optimized

Frequency Optimized

≥2.5MB/core LLC cache – See SKU 9.6 GT/s QPI DDR4-2133 Intel® Hyper-Threading Intel® Turbo boost 2U cooling

Low Power 2.5 MB/Core LLC Cache E5-2650L v3: 9.6 GT/s QPI E5-2630L v3: 8.0 GT/s QPI E5-2650L v3: DDR4-2133 E5-2630L v3: DDR4-1866 Intel® Hyper-Threading Intel® Turbo boost

12C 120W 2.3 GHz

10C 105W 2.3 GHz

12C 120W 2.5 GHz

8C 85W 2.4 GHz

12C 65W 1.8 GHz

8C 55W 1.8 GHz

6C 85W 1.6 GHz

Intel® Xeon® Processor E5-2600 v3 Product Family SKU Stack

Workstation Only

12C 135W 2.6 GHz

10C 105W 2.6 GHz

10C 2S 160W 3.1 GHz

35-45 MB LLC cache - 2.5MB/core 9.6 GT/s QPI DDR4-2133 Intel® Hyper-Threading Intel® Turbo boost

14C (1U) 120W 2.3 GHz

14C (2U) 145W 2.6 GHz

14C (1U) 120W 2.0 GHz

E5-2603 v3

E5-2670 v3

E5-2690 v3

E5-2680 v3

E5-2650 v3

E5-2660 v3

8C 90W 2.6 GHz

6C 85W 2.4 GHz

8C (20MB) 135W 3.2 GHz (2U)

6C (20MB) 135W 3.4 GHz (2U)

4C (15MB) 135W 3.5GHz (2U)

6C 85W 1.9 GHz E5-2609 v3

E5-2620 v3

E5-2640 v3

E5-2630 v3

E5-2697 v3

E5-2695 v3

E5-2683 v3

E5-2637 v3

E5-2667 v3

E5-2687W v3

E5-2643 v3

E5-2630Lv3

E5-2650L v3

Legend

Medium Core Count (MCC)

High Core Count (HCC) 4C (10MB) 105W

3.0GHz (1U) E5-2623 v3

Low Core Count (LCC)

10MB LLC cache 8.0GT/s QPI DDR4-1866 Intel® Hyper-Threading Intel® Turbo boost 1U cooling

25MB LLC cache 9.6 GT/s QPI DDR4-2133 Intel® Hyper-Threading Intel® Turbo boost

18C (2U) 145W 2.3 GHz

16C (1U) 135W 2.3 GHz

E5-2699 v3

E5-2698 v3

15 MB LLC cache - 2.5MB/core 6.4 GT/s QPI DDR4-1600

15-20 MB LLC cache - 2.5MB/core 8.0 GT/s QPI DDR4-1866 Intel® Hyper-Threading Intel® Turbo boost

13

E5-2600 v3 (HSW) E5-2600 v2 (IVB)

Up to 44%, 33%

Up to 30%, 26%

Up to 26%, 22%

Up to 20%,18%

Up to 41%, 33%

Up to 24%, 17%

Up to 21%, 20%

Processor Transition Guidance – v2 to v3

Source: Published results on www.spec.org as of Oct. 13, 2014. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance

tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to

vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other

products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web

sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. For more

information go to http://www.intel.com/performance *Other names and brands may be claimed as the property of others.

942

890

617

415

546

446

682

659

522

387

462

400

775

556

1360

1230

1190

1070

1070

911

860

838

791

774

619

471

12C 130W 2.7GHz E5-2697 v2

12C 115W 2.4GHz E5-2695 v2

14C 120W 2.3 GHz

14C 145W 2.6 GHz

14C 120W 2.0 GHz

E5-2697 v3

E5-2695 v3

E5-2683 v3

18C 145W 2.3 GHz

16C 135W 2.3 GHz

E5-2699 v3

E5-2698 v3

6C 135W 3.4 GHz

4C 135W 3.5GHz E5-2637 v3

E5-2643 v3

4C 105W 3.0GHz E5-2623 v3

8C 135W 3.2 GHz E5-2667 v3

4C 130W 3.5GHz E5-2637 v2

8C 130W 3.3GHz E5-2667 v2

6C 130W 3.5GHz E5-2643 v2

6C 60W 2.4GHz E5-2630L v2

10C 70W 1.7GHz E5-2650L v2

12C 65W 1.8 GHz

8C 55W 1.8 GHz E5-2630L v3

E5-2650L v3

602

IVB-to-HSW %gains on

SIR, SFR SPECint*_rate

_base2006

score

on IC 14

SPECfp*_rate

_base2006

score

on IC14

780 Up to 4%, 8% 815 653

Up to 8%, 9% 669 571

Up to 10%, 9% 457 422

Up to 1%, 1% 412 378

SIR score

on IC 14 SFR score

on IC 14

SIR score

on IC14

SFR score

on IC14

14

http://www.spec.org/

http://www.intel.com/performance

Up to 23%, 23%

Up to 24%, 21%

Up to 22%, 24%

Up to 24%, 23%

Up to 34%, 28%

Up to 36%, 31%

Up to 22%, 22%

Up to 22%, 19%

15

871

830

791

722

663

524

489

417

244

181

4C 80W 2.5GHz E5-2609 v2

4C 80W 1.8GHz E5-2603 v2

10C 115W 2.5GHz E5-2670 v2

10C 130W 3.0GHz E5-2690 v2

10C 115W 2.8GHz E5-2680 v2

8C 95W 2.6GHz E5-2650 v2

10C 95W 2.2GHz E5-2660 v2

6C 80W 2.1GHz E5-2620 v2

8C 95W 2.0GHz E5-2640 v2

6C 80W 2.6GHz E5-2630 v2

643

626

607

575

547

451

427

381

258

201

12C 120W 2.3 GHz

10C 105W 2.3 GHz

12C 120W 2.5 GHz

8C 85W 2.4 GHz

6C 85W 1.6 GHz

12C 135W 2.6 GHz

10C 105W 2.6 GHz

E5-2603 v3

E5-2670 v3

E5-2690 v3

E5-2680 v3

E5-2650 v3

E5-2660 v3

8C 90W 2.6 GHz

6C 85W 2.4 GHz

6C 85W 1.9 GHz E5-2609 v3

E5-2620 v3

E5-2640 v3

E5-2630 v3

1080

1030

970

884

824

703

666

509

792

763

754

689

675

578

561

466

Up to 25%, 24% 306 321

Up to 46%, 39% 266 280

IVB-to-HSW %gains

on SIR, SFR SIR score

on IC14 SFR score

on IC14

SIR score

on IC14

SFR score

on IC14

SPECfp*_rate

_base2006

score

on IC14

SPECint*_rate

_base2006

score

on IC 14

Source: Published results on www.spec.org as of Oct. 13, 2014. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance

tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to

vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other

products. Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in this document. Intel encourages all of its customers to visit the referenced Web

sites or others where similar performance benchmark data are reported and confirm whether the referenced benchmark data are accurate and reflect performance of systems available for purchase. For more


E5-2600 v3 (HSW) E5-2600 v2 (IVB)

Processor Transition Guidance – v2 to v3

15

http://www.spec.org/


1.20 1.24 1.28 1.27 1.38 1.42 1.44 1.60 1.60 1.67 1.70

1.91 1.97

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Intel® Xeon® Processor E5-2699 v3 (18C, 2.3GHz, 145W) vs. Intel® Xeon® Processor E5-2697 v2 (12C, 2.7GHz, 130W)


Product Family

Generational Performance Summary

+Baseline is E5-2660 v2 (10C, 2.2GHz, 95W) ++New configuration is E5-2690 v3 (12C, 2.6GHz, 135W)

Source as of Sept 8 2014, see next slide. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as

SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You

should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other

products. For more information go to http://www.intel.com/performance Intel does not control or audit the design or implementation of third party benchmark data or Web sites referenced in

this document. Intel encourages all of its customers to visit the referenced Web sites or others where similar performance benchmark data are reported and confirm whether the referenced

benchmark data are accurate and reflect performance of systems available for purchase. *Other names and brands may be claimed as the property of others

16


16


Intel® AVX and AVX 2.0 comparison

Simple example of existing vectorized code optimization using AVX 2.0

https://software.intel.com/en-us/articles/how-intel-avx2-improves-performance-on-server-applications

https://software.intel.com/en-us/blogs/2011/06/13/haswell-new-instruction-descriptions-now-available 17



















https://software.intel.com/en-us/blogs/2011/06/13/haswell-new-instruction-descriptions-now-available













TDP and AVX frequencies. Which

workloads will run at what frequency?

18

2.8

2.7

2.6

2.5

2.4

2.3

2.2

2.1

2.0

1.9 AVX Base Frequency

AVX Max All Core Turbo Frequency

Expected

frequencies for

most AVX

workloads Expected

frequencies for

workloads with

heavy AVX usage

Frequency range of E5-2699 v3

Expected frequencies for

non-AVX workloads

Base Frequency (Non-AVX)

Max All Core Turbo Frequency (Non-AVX)

Workloads not using Intel AVX 2.0 instructions will continue to operate at or

above the TDP frequency 18


Product Family

Snoop Modes

19

Each mode is configurable through

BIOS settings

Early Snoop Mode

Intel’s BIOS default for HSW-EP

Same mode available on SNB-EP

Home Snoop Mode

Same mode available on IVB-EP*

Cluster on Die Mode

New mode introduced on HSW-EP

Memory bandwidth & latency

tradeoffs will vary across the

3 die configurations for each

snoop mode

Intel recommends exposing

all snoop modes as BIOS

options to the user

*Home Snoop mode is available on IVB-EP but is not the default setting

19


Product Family

Snoop Modes Supported in 2S

Configurations Early Snoop

(Default for HSW-EP) Home Snoop Cluster on Die

Previously available on E5-2600 (SNB) E5-2600 v2 (IVB)* New for

E5-2600 v3

Snoop sent by Caching Agent Home Agent Check Directory Cache,

then Home Agent

Best used for Latency sensitive

workloads

NUMA workloads that

need max local & remote

bandwidth

Highly NUMA optimized

workloads

Benchmarks TPC*-E,

TPC*-C SPECCPU*2006 (speed)

SPECCPU*_rate2006,

SPECjEnterprise*2010,

SPECpower*_ssj2008,

SAP* SD

*Home Snoop mode is available on E5-2600 v2 but is not the default setting 20

Cluster on Die (COD) Mode

Cluster0

Cbo

LLC

Cbo

LLC

Sbo

Sbo

Cbo

LLC

Cbo

LLC Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

HA0

QPI

0/1 IIO

HA1

Cor

e

Cor

e Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cluster1

Cbo

LLC

Cbo

LLC

Cbo

LLC Cor

e

Cor

e

Cor

e

Cor

e

Cbo

LLC

COD Mode for 18C HSW-EP Supported on 2S HSW-EP SKUs

with 2 Home Agents (10+ cores)

Targeted at NUMA workloads where

latency is more important than

sharing data across Caching Agents

(Cbo)

Reduces average LLC hit and local

memory latencies

HA mostly sees requests from

reduced set of threads which can lead

to higher memory bandwidth

OS/VMM own NUMA and process

affinity decisions

21

Cluster on Die (COD) Mode

Cbo

LLC

Cbo

LLC

Sbo

Sbo

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

HA0

QPI

0/1 IIO

HA1

Cor

e

Cor

e Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

Cor

e Cor

e

Cor

e

Cor

e

Cor

e

Cor

e

COD Mode for 14C HSW-EP Cluster0

Cluster1

COD Mode for 12C HSW-EP

Cbo

LLC

Cbo

LLC

Sbo

Sbo

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

Cbo

LLC

HA0

QPI

0/1 IIO

HA1

Core

Core Core

Core

Core Core

Core

Core

Core

Core

Core Cbo

LLC Core

22

New BIOS Features

Energy Efficient Turbo – Enable/Disable. CPU cores enters Turbo Mode (P0-state) only

when high utilization was detected by PCU.

Uncore Frequency Scaling – Enable/Disable. Allow the voltage and frequency of Uncore to

programmed intependenly.

Intel Configurable TDP: Nominal, TDP Level 1, TDP Level 2. Available only on certain SKUs

of Haswell server processors. indicates the number of configurable TDP levels.

Perfomance P-Limit: Enable/Disable. Allows the Uncore frequency coordination of two

processors to avoid increasing of latency.

Cluster-on-Die (COD): Enable/Disable. Divides single processor (Cores/Caches/Home

Agents) in two NUMA domains (clusters). OS support required through ACPI SLIT/SRAT tables.

Not supported on SKUs with 4-8 cores.

23


Intel® Xeon® Processor E5-2600 v3.

New memory technologies support.

NVDIMM support

NVDIMM is a DDR3/DDR4 based memory module which is designed to preserve

data in the event of the power failure and across power cycles and platform resets.

Main features:

Can be DDR3 or DDR4 based

Operated at DDR3/DDR4 speeds

Persistent to power failures

Requires processor, chipset and BIOS MRC support

DDR3 NVDIMM commonly use BBU (but not always)

DDR4 NVDIMM commonly use Super Capacitor (which can be internal or external)

Hybrid module – NVDIMM which has DRAM and NAND flash onboard

25

26

DDR4 support

Main features:

Low power consumption (work voltage = 1.05-1.2V, different electrical design).

DDR3L operates on 1.35V as minimum.

Larger memory capacity per DIMM = up to 512 GB (theoretical) / 128 (practical).

DDR3 has 128GB theoretical limit per DIMM.

Higher throughput (16 internal banks + 284 contacts) (34.1 GB/s for 2133 MHz)

Lower latency

Improved RAS (Reliability, availability, serviceability)

26

Frequencies & Advantages of DDR4

DIMM frequency shown for RDIMM configurations. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as

SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should

consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more


1333

1066

800

1866

1600

1066

2133

1866

1600

0

500

1000

1500

2000

2500

1 DIMM/Channel 2 DIMM/Channel 3 DIMM/Channel

DIM

M F

req

uen

cy (

MH

z)

X5600 SeriesDDR33 memory channels/socket

E5-2600 v2DDR34 memory channels/socket

E5-2600 v3DDR44 memory channels/socket

DDR4 enables faster memory speeds

at larger memory capacities for Intel® E5 v3

27



Product Family

Memory Bandwidth – STREAM (triad)

118.7 118.7 118.3 113.6

90.4 89.6

58

0

20

40

60

80

100

120

140

E5-2699 v3(18C, 2.3GHz, 145W)

E5-2697 v3(14C, 2.6GHz, 145W)

E5-2690 v3(12C, 2.6GHz, 135W)

E5-2660 v3(10C, 2.6GHz, 105W)

E5-2667 v3(8C, 3.2GHz, 135W)

E5-2640 v3(8C, 2.6GHz, 90W)

E5-2609 v3(6C, 1.9GHz, 85W)

GB

/sec DDR4

2133

2 MC

HS mode

DDR4

2133

1 MC

HS mode DDR4

1866

1 MC

HS mode DDR4

1600

1 MC

HS mode

Source as of August 2014: Intel internal measurements using Intel® Server System R2208WTTYS with 8x16GB DR-RDIMMs on stream_omp v5.4 with Intel compiler 14.0.3.174 from TR# 3044 for 12-18C,

TR#3028 for E5-266x v3, TR#3029 for 6-8C. Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. You should consult other information

and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more information go to

http://www.intel.com/performance *Other names and brands may be claimed as the property of others.

DDR4-2133

2 memory controllers (MC)

COD mode

28


Type Ranks Per DIMM

and Data Width

DIMM Capacity (GB)

Speed (MT/s); Voltage (V);

Slot Per Channel (SPC) and DIMM Per Channel (DPC)

1 Slot Per Channel 2 Slots Per Channel 3 Slots Per Channel

1DPC 1DPC 2DPC 1DPC 2DPC 3DPC

4Gb 8Gb 1.2V 1.2V 1.2V 1.2V 1.2V 1.2V

RDIMM SRx4 8GB 16GB 2133 2133 1866 2133 1866 1600

RDIMM SRx8 4GB 8GB 2133 2133 1866 2133 1866 1600

RDIMM DRx8 8GB 16GB 2133 2133 1866 2133 1866 1600

RDIMM DRx4 16GB 32GB 2133 2133 1866 2133 1866 1600

LRDIMM QRx4 32GB 64GB 2133 2133 2133 2133 2133 1600

Intel® Xeon® Processor E5-2600 v3 Product

Family. Memory POR

Memory validation results are publicly available

29

http://www.intel.com/content/www/us/en/platform-memory/ddr4-rdimm-xeon-e5-v3-validation-results.html


Intel® NVMe SSDs.

Data Center Storage Trends.

Today’s Data Storage Needs are

Evolving

IT CHALLENGES OPPORTUNITY

Limited IT Budgets

High IOPS per $ and IOPS per

watt vs. Hard Disk Drives

(HDDs) and SATA SSDs

SAN latency from HBAs,

Switches, Networks, and

Controllers restrict storage

performance while CPU

demands increase

Native NVMe*/PCIe* server-

based storage reduces latency,

removing bandwidth restrictions

Transactional data and

virtualization randomizes

workloads

High, consistent IOPS combined

with low latency accelerates

applications

Intel® Solid-State Drive Data Center P3700, P3600, and P3500 Series

Breakthrough Performance, Low Latency, Cost Effective

31

Intel® Solid-State Drive (SSD) Data

Center Family for PCIe*

Delivers breakthrough performance optimized for real-world applications

Consistently Amazing performance scalability

Mixed workload optimized

Modernizes data center storage efficiently utilizing Intel® Xeon® processor systems

Substantial storage bandwidth increase feeds Xeon® systems for higher throughput

Direct connection to Intel® Xeon processors reduces storage delay

Reduces BOM cost through elimination of HBA cards and SAS/SATA* controllers

Comprehensive product family ready for broad data center deployment

Intel enabled NVMe* ecosystem based on industry standards

Extensive multi-vendor platform validation, compatibility, and system availability * Other names and brands are property of their respective owners

32

Product Feature Comparison.

Intel® Solid-State Drive Data Center

Family for PCIe*

1 Intel® SSD DC P3700 data sheet specification, subject to change 33


P3700 Series. Consistently Amazing

Consistent, Native PCIe*

Performance

Up to 6X throughput, up to 2X latency reduction vs. SATA1

• 2800/1900 MB/s (Read/Write) • 460/180K 4K Random Read IOPS • 250K 4K 70/30 Read/Write Mixed Workload IOPS

• 20/20µs sequential latency (Read/Write)

Stress-Free Protection

Data storage with multiple checkpoints helps protect data

• End-to-end data path protection • Power loss protection with built in self-test

• 2.5” hot-plug capability • Uncorrectable Bit Error Rate (UBER): 1 sector per 1017 bits read • Mean Time Between Failures (MTBF): 2,000,000 hours, 230 yrs

High Endurance

Leading technology provides optimal price performance

• Intel® 20nm MLC NAND with High Endurance Technology • 10 full capacity drive writes per day over 5 years*

High Capacity

Broad range of capacities in a single volume

• 400/800 GB 1.6/2.0 TB

• 2.5” x 15mm, SFF-8639

• Add-In-Card (AIC) half-height, half-length card

Modernize Your Data Center Storage with Breakthrough Performance

* Other names and brands are property of their respective owners 34

Why NVM Express?*

Standardized interface for non-volatile

memory

SAS*

SATA*

Motherboard So

ftwa

re

Driv

er

• High Performance

Low latency (no HBA or protocol overhead)

Full duplex, multiple outstanding requests

• Low System Cost

Direct attach to CPU eliminates HBA cost

• Power Efficient

Direct attach to CPU eliminates HBA power

Link level power management

0

200000

400000

600000

100% Read 70% Read 0% Read

IOP

S

4K Random Workloads

PCIe/NVMe SAS 12Gb/s SATA 6Gb/s

NVMe* Provides Six Times the Throughput of 6Gb/s SATA

Results have been simulated and are provided for informational purposes only. Results were derived using simulations run on an architecture simulator or model. Any

difference in system hardware or software design or configuration may affect actual performance.

35

Intel® Solid-State Drive Data Center for

NVMe* Enables Cloud Performance and

TCO

Up to 1314 HDDs, 55 chassis

2.6 HDD Racks = 1 Intel® SSD DC P3700 Series with NVMe

HDD* Intel SSD DC P3700

Series (2TB)

Drives / Units 1314 1

Random IOPS Up to 460k Up to 460k

Power Total 16,000W Total 11W

Cost $634,000 $6,000

Up to 100X in Cost Savings and up to 1400X in Power Savings

Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors. Performance tests, such as SYSmark and

MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results

to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that

product when combined with other products. 36

Data Center Endurance Uses.


Family for PCIe*

37

Servers, Storage, and Workstations

• Replacement for IO intensive 15K RPM HDDs

• Direct Server Attach Storage removes HDD/SAN delay

• Storage Tiering – DRAM, SSDs and HDDs Uses DwPD

HPC

Scientific / Financial

• > Refresh rate of > 1TB per day per drive High

Embedded

Factory Control systems

• < 100 4k random write text IOs per second1 Low

Medical HD Imaging and Video

• 10.4TB written per day2 High

OLTP Database

B2B (Online Business to Business sales)

• < 1 million 4K IOs per hr3 Low

B2C (Online retail sales) > 1million 4K IOs per hr Mid

OLAP Database (Big Data Analytics)

Departmental DB

• < 200GB DB with 10GB refresh rate per day per drive Low

Distributed DB / Warehouse

• < 2TB DB with 200GB refresh rate per day per drive Mid

Big data / Hadoop

• 1TB or more refresh rate per day per drive High

Uses DwPD

Virtualization

Virtual desktops (VDI)

• Up to 50 task workers per server with up to 100 average IOPS per desktop user Low

Virtual Servers

• 15,000 8K Random IOPS per drive per day5 Mid

Large scale virtualization

• 100,000 8k random IOPS per drive per day5 High

Boot / OS

Boot Only Standard OS 90/10 Read/Write usage Low

Secure OS with volume logging

• 50/50 Read/Write usage Mid

Unique Workloads

Email

• Users generate less than 1 IOPS per mailbox6 Low

Machine Generated Data > 2 million 4K IOs per hr Mid

Content Delivery / Web Servers / Web Services

Static web content 1,000,000 hits per day7 Low

On-Demand Streaming media 50/50 Read/Write8 High

• Judged for workloads based on 100% utilization; 0.3 DWpD = 90 – 100% Reads (Read intensive), 3 DWpD = 60 -90% Reads (Mixed Workload), 10DWpD = 0 – 60% Reads (Write intensive)

• Intel is providing estimates of workload sizes only. Subject to change and verification of actual volume of data written. Refer to data sheet endurance specification for maximum level of data writes. 1 calculation for DW/d 1000 txn per second * 4,000 bytes * 86400 seconds per day = 345GB written per day assumes 400GB drive 2 Space specifications for HD imaging and video http://documentation.apple.com/en/finalcutpro/usermanual/index.html#chapter=13%26section=3%26tasks=true 3 calculation for DW/d 1,000,000 txn per hour * 4,000 bytes * 24hours = 96GB written per day assumes 400GB drive 4 Typical desktop client environment averages (full day) 10 to 25 IOPS, power users 25 IOPS and higher http://www.vmware.com/files/pdf/view_storage_considerations.pdf 5 Intel estimated IOPS numbers. Typical implementation would be SSD as a caching tier such as with VMWare VSAN http://www.vmware.com/products/virtual-san/ 6 Mail systems require low IOPS and low latencies. SSDs help mail systems because of low latency. Typical installations are capacity and management constrained, up to 10,000 mailboxes, per server. 7 Intel estimates – 90/10 Read/Write workload, a web page hit = a web page element (graphics, style text, or HTML text) at an average size of 10K. 1,000,000 web page hits * 10,000 bytes = 10GB per day 8 media files (i. e. HD Movies) are very large file sizes (20-30GB). On demand streaming systems are very implementation and refresh specific and based on demand needs could be write intensive. 37

http://documentation.apple.com/en/finalcutpro/usermanual/index.html

http://www.vmware.com/files/pdf/view_storage_considerations.pdf

http://www.vmware.com/products/virtual-san/



High-Performance Computing (HPC).

Improve System Utilization

HPC systems: Use parallel processing to run

applications exceptionally fast and reliably

Examples: CAE/CAD, oil and gas exploration, bio-simulation,

weather forecasting, climate research

Server

Node

High Bandwidth Network

Parallel Compute Visualization

Server

Node

Server

Node

Storage Node

Use Intel® Solid-State Drive Data Center

Family for PCIe* in compute nodes to

increase system utilization

• Direct-attach low latencies, full-duplex,

and tight IOPS distribution keep CPUs

busy

• Storage transfers to memory and I/O

devices speed up

Disk Drives

System utilization is bound by storage I/O

when solving exascale problems

Issue

Solution

Intel® Solid-State Drive

Family for PCIe*

38

Cloud Computing.

Reduce Impact of Demand Spikes in

Virtual Machines

Cloud computing: Delivery of applications and content

from off-site, hosted, and virtual servers

Examples: Software as a service, platform/infrastructure

as a service, and virtualization of apps

Use Intel® SSD Data Center Family for PCIe* as

primary performance storage

• Direct-attach low latencies, full-duplex, and

tight IOPS distribution means I/O performance

supports VMs

• High throughput keeps pace w today’s high-

performance CPUs and large memories

Intel® SSD DC P3700 Series10 DWPD1 means

endurance is not hindered

Virtualization randomizes guest sequential

workloads. Disk-drive storage doesn’t keep up with

virtual application storage needs.

Space and energy needs limit scalability.

Issue

Solution

VM

VM

VM VM

Intel® SSD DC P3700, P3600, and P3500 Series Proximity Storage

Intel® SSD DC P3700, P3600, and P3500 Series

Cache SAN

1 Abbreviations: DWPD – Drive Writes Per Day 39

Intel® SSD Data Center Family for PCIe*.

Broad Industry Support

Enabling the industry with NVMe* drivers and driver development

Validating with operation systems for compatibility:

*Windows baseline developed in collaboration by Intel, LSI*, IDT*

*VMware initial driver developed by Intel in collaboration with VMware*

*Linux reference driver accepted into the mainline kernel on kernel.org

Haswell CPU platform support

Windows* Windows Server 2012 R2, 2008 R2 x64 Server, Hyper-V, EFI

Vmware* VMware ESXi 5.5

Linux* Red Hat* EL 6.5

BIOS UEFI 2.3.1

Platform Family Market Segment CPU Family

Brickland Expandable E7

Grantley 4S/2S Efficient Performance E5

Denlow Workstation E3

Code names are internal project names used solely as identifiers and are not intended to be used as trademarks or publicly disseminated.’

40

41

Intel® SSD Data Center Family for PCIe*

https://www-ssl.intel.com/content/www/us/en/solid-state-

drives/intel-ssd-dc-family-for-pcie.html

https://www-ssl.intel.com/content/www/us/en/solid-state-drives/intel-ssd-dc-family-for-pcie.html


















Intel® 12Gb/s RAID Controllers

Intel® 12Gb/s RAID Controllers RS3 Product Family

• Significant performance improvement in IOPs for transaction intensive applications

• Significant throughput performance improvement for streaming applications

• SSD optimizations such as FastPath I/O included with Mainstream (ROC-based) products

• Backwards compatible with 3Gb/s and 6Gb/s devices

• Increased IO performance in existing 6Gb infrastructure

• Allows to increase the amount of enclosures in daisy-chain configurations with no

performance loss

• Support of SAS SSDs

More information you can find at http://www.intelraid.com/

Architectural Benefits of Intel12Gb/s SAS Capable RAID based on LSI* SAS3108

• 1.2 GHz dual core 12Gb/s ROC

• 1GB of Low latency DDR3-1866 RAID cache

• 8-lane PCI Express® (PCIe®) 3.0 bus interface

• Up to 8 individual SAS ports operating at 12Gb/s

43

http://www.intelraid.com/files/Intel-RAID-Controllers-RS3DC080-and-RS3DC040DarkCanyon_web-compressed2.pdf

http://www.intelraid.com/

http://www.intelraid.com/files/Intel-RAID-Controllers-RS3DC080-and-RS3DC040DarkCanyon_web-compressed2.pdf


**Performance tests and ratings are measured using specific computer systems and/or components and reflect the approximate performance of Intel products as

measured by those tests. Any difference in system hardware or software design or configuration may affect actual performance. Buyers should consult other sources of

information to evaluate the performance of systems or components they are considering purchasing. For more information on performance tests and on the performance

of Intel products, visit http://www.intel.com/performance/resources/limits.htm or call (U.S.) 1-800-628-8686 or 1-916-356-3104

44

Intel® RMS3CC080. 40xSAS 2.0 HDDs and 8xSAS 3.0 SSDs Sequential Read/Write Comparison.

http://www.intelraid.com/files/Performance-12Gbs-SAS-RAID-Controllers-WhitePaper.pdf 45

http://www.intelraid.com/files/Performance-12Gbs-SAS-RAID-Controllers-WhitePaper.pdf











Intel® RMS3CC080. 1xSAS 2.0 15k RPM HDD Common Enterprise Workloads Testing.













Intel® RMS3CC080. 1xSAS 3.0 SSD Common Enterprise Workloads Testing.













48

http://www.intelraid.com/12gb/


http://www.intelraid.com/files/RAID_Q414.pdf

http://www.intelraid.com/12gb/

http://www.intelraid.com/files/RAID_Q414.pdf

Опрос №2


49

www.depo.ru

Сергей Сенько

Руководитель направления по серверной

продукции компании DEPO Computers

Модельный ряд серверов DEPO Storm 3400 на процессорах Intel Xeon E5-2600 v3

http://www.depo.ru/

51

DEPO Storm 3400S1 сервер для консолидации и виртуализации

Устанавливается 1 или 2 процессора Intel Xeon E5-2600 v3

Материнская плата имеет 2 порта SATA 3.0 (оба c подведённым

питанием для DOM-модулей) с поддержкой RAID 0, 1 и 2 порта

HDmSAS (поддержка SATA) для подключения к бэкплейну

сервера (RAID 0, 1, 5, 10)

Имеется 24 слота под оперативную память DDR4

Максимальный поддерживаемый объём памяти – 3Tb

(24х128Gb LRDIMM; при этом суммарный объём памяти,

поддерживаемый двумя процессорами, составляет 1536Gb)

2 слота PCI-E 3.0 x16 (необходимо использовать 2 процессора)

Видео реализовано на интегрированном ядре (16Mb DDR3,

1600x1200 при 16bbp, 1280x1024 при 32bbp)

Опционально устанавливается привод DVD-RW

Поддержка операционной системы Windows Server 2012 R2

(сравнение версий)

Гарантия на сервер от 1 до 5 лет с возможностью обслуживания

на месте эксплуатации

http://www.depo.ru/article_a16273_r965.aspx

Модельный ряд Двухпроцессорные серверы для рабочих групп Серия DEPO Storm 3400 на процессорах Intel Xeon E5-2600 v3

Процессоры Один или два процессора Intel Xeon E5-2600 v3

Оперативная память От 512 до 768 GB DDR4-2133 ECC REG/16-24 слотов в зависимости от модификации

Форм-фактор Стоечный/1U Стоечный/2U Стоечный/4U Настольный или стоечный/4U

Системная логика

Поддержка SAS3 12Gbs Есть

Слоты расширения 2x PCI-E 3.0 x16

Дисковые отсеки с

горячей заменой

4HDD 3.5"

8HDD 3.5"

24HDD 3.5"

2HDD 2.5”

8HDD 3.5"

8HDD 2.5”

Количество и номинал

блоков питания

2x 700W;1x 600W

2x 740W;1x 740W

2x 920W

2x 920W; 1x 740W

Интегрированный LAN 2 или 4 порта 1GbE в зависимости от модификации

Аналоги DL360pG9 DL380pG9 ML350G9 ML350G9

Функциональные

преимущества

простота модернизации

встроенный модуль управления IPMI и KVMoLan

Большой объем дисковой

подсистемы

Гибкие возможности по

расширению дисками 2.5 и 3.5”

52

DEPO Storm 3400P1 DEPO Storm 3400V2 DEPO Storm 3400G4 DEPO Storm 3400K4

Модельный ряд Двухпроцессорные серверы для рабочих групп Серия DEPO Storm 3400 на процессорах Intel Xeon E5-2600 v3

Процессоры Один или два процессора Intel Xeon E5-2600 v3

Оперативная память От 512 до 768 GB DDR4-2133 ECC REG/16-24 слотов в зависимости от модификации

Форм-фактор Стоечный/1U Стоечный/2U Стоечный/3U Стоечный/2U

Системная логика С602

Поддержка SAS3 Есть

Слоты расширения 2x PCI-E 3.0 x16

4x PCI-E 3.0 x8

Дисковые отсеки с

горячей заменой

8HDD 2.5"

16HDD 2.5“

16HDD 3.5"

2HDD 2.5”

12HDD 3.5“

Количество и

номинал блоков

питания

2x 400W;1x 520W

2x 740W;1x 740W

2x 920W

2x 920; 1x 740W

Интегрированный

LAN 2 или 4 порта 1GbE в зависимости от модификации

Аналоги DL360pG9 DL380pG9 нет аналога DL380pG9

Функциональные

преимущества

простота модернизации

встроенный модуль управления IPMI и KVMoLan

Большой объем дисковой

подсистемы

встроенный модуль

управления IPMI и KVMoLan

DEPO Storm 3400D1 DEPO Storm 3400F2 DEPO Storm 3400C3 DEPO Storm 3400G2

53

Модельный ряд серверов Блейд-серверы DEPO Storm 5310Q7 для построения больших ферм виртуализации

Форм фактор шасси Стоечный 7U

Серверы-лезвия

до 10 лезвий DS3400QS (2x Intel® 64-bit Xeon® E5-2600 v3 (до 130W на процессор)

До 512GB DDR4-2133 ECC REG RAM, 6 HDD SAS/SSD 2.5”

Слот расширения PCI-E 3.0, 2 порта 10GbE, 2 порта 1GbE )

Коммутаторы Ethernet

До двух высокоскоростных коммутаторов с поддержкой горячей замены:

GEM-001 - Layer-2 switch, 10 внешних портов 1Gbit

GEM-X2S+ -Layer-2 / 3 switch, 2 внешних 1Gb RG45 ports, 3 x 10GB uplink port SFP+

XEM-X10SM – 10-Gigabit Ethernet L2/L3 коммутатор (14 внешних 10GB SFP+ , 10 внутренних 10Gb

downlink ports)

Система охлаждения 8 охлаждающих корпусных вентиляторов

Блоки питания до 4 блоков питания 3000Вт с поддержкой функций резервирования и "горячей" замены

Особенности KVMoLAN, удаленная инсталляция, единый интерфейс управления

Функциональные преимущества

DEPO Простота конструкции и удобство обслуживания

54

Блейд-сервер DEPO Storm 5310B7 Высокопроизводительный кластер на СPU и GPU

Форм-фактор 7U, до 10 серверов лезвий

Резервирование 10GbE и

IB FDR/QDR коммутаторов и БП

DEPO Storm 4370BQ

4х процессорный сервер

(Intel Xeon E5-4600 v2)

DEPO Storm 3400BP

Cервер 2xIntel Xeon E5-2600 v3

и 2 GPU/Intel Xeon Phi

55

DEPO Storm 3400BQ

2 сервера в одном лезвии

(Intel Xeon E5-2600 v3)

Как заказать?

56

Пример: www.depo.ru > Продукция > Продукция DEPO > Серверы > Storm 3000 > DEPO Storm 3400S1

http://www.depo.ru/

http://www.depo.ru/

Примеры построения серверной инфраструктуры на новых технологиях для компаний различного размера (от Cluster-In-A-Box на 100 пользователей, до частного облака на тысячи и 10 тысяч пользователей)

Пример решения DEPO «кластер в коробке» для организаций с размером IT инфраструктуры до 100 пользователей под управлением Microsoft Windows Server 2012R2

Серверы – 2 сервера DEPO Storm 3350S1 (c cередины февраля DEPO Storm 3400S1)

JBOD – на платформе Интел (c середины февраля DEPO Storage JBOD 63).

58

Пример решения с применением cерверов DEPO Storm 3400S1 для построения облака на платформе Microsoft Azure для инфраструктур от тысячи до 100000 пользователей

59

60

Современные варианты серверных и

инфраструктурных решений для ЦОД

различного масштаба

Количество

серверов 1 100 10 1000

Изолированный

коридор

Решения OpenRack Шкаф с

инфраструктурой

Компактный шкаф

или стойка

Основной тренд: консолидация и виртуализация ресурсов при модернизации ЦОД

Проблема: при консолидации плотность тепловыделения повышается

Задача: обеспечить наиболее эффективный набор серверного и инфраструктурного оборудования

Решение: зависит от размера консолидированной инфраструктуры

Дополнительно, энергоэффективность решения возможно повысить

при применении ПО управления электропитанием.

61

Проектирование, выбор оборудования и ПО

осуществляется после аудита инфраструктуры

и тестирования критических участков

Вся инфраструктура может быть

виртуализирована и предоставляться как

услуга

Управление ЦОД полностью

автоматизировано на программном уровне

Модульный, поэтапный проектный подход DEPO для создания единого пула ресурсов всего ЦОД с централизованным управлением

Перспективные разработки DEPO Computers и приглашение к сотрудничеству

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DEPO Rack 600 DCI – система изолированный холодный коридор, 3

секции по два шкафа с общей крышей и раздвижной входной дверью в

отсек.

Возможно передавать на тест в реальный ЦОД. Установка –

бесплатно

Четырехпроцессорный сервер масштаба предприятия DEPO Storm

4370E4 – на процессорах Intel Xeon E7-4800 v2 с оперативной памятью

768GB

Предоставляется на удаленное тестирование. Возможна установка

до 6ТБ оперативной памяти

Новая разработка – двухпроцессорный сервер DEPO Storm 3400S1

Virtualization c памятью DDR4 и накопителями NVMe – доступен для

удаленного тестирования

Кластер в коробке из двух DEPO Storm 3350S1 и JBOD Intel – доступен

для удаленного тестирования, так же возможна передача на

тестирование в инфраструктуру заказчика

Просим обращаться к персональным менеджерам для заказа

Количество ограничено

Широкий ассортимент продукции

Короткие сроки производства под заказ

Разветвленная транспортная сеть

Доставка по всей территории РФ

Включая труднодоступные регионы

Расширенное сервисное обслуживание

до 24 x 7 на месте эксплуатации

по единым стандартам на всей территории РФ

Разработка оборудования под требования

Проектирование комплексных решений

Выполнение монтажных и пусконаладочных работ

На всей территории РФ

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Сервис DEPO Computers

Специальные предложения

Распродажа модульных серверов и СХД DEPO Storage 4600 – цены снижены до конца марта, при покупке СХД или модульного сервера диск 2ТБ в подарок.

Акция «Поставка 80% серверных конфигураций за 3 рабочих дня» – до конца февраля.

Акция для участников семинара – при покупке от 100 лицензий Intel Datacenter Manager - сервер управления в подарок.

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Опрос №3


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Секция вопросов и ответов

Вы можете задать свои вопросы в чате вебинара

66

Опрос №4


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Спасибо за внимание!

Devices & Hardware

Cерверы Depo storm 3400 на базе новейших процессоров intel xeon e5 2600v3 fin