슬라이드 1 Manual... · PPT file · Web view2018-04-14 · NBR-Rubber. Nitrile Butadiene Rubber. Rubber. CR-Rubber. Chloroprene Rubber. Rubber. EPDM. Ethylene Propylene Diene

SMIS 작성 매뉴얼Samsung electronics Material Information Sheet

Ver.1.1

2

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SMIS Install Guide

①-① ①-②

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신규 설치시

이미 설치되어 있는 경우

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[ 컴퓨터에 Java 프로그램이 없을 경우 , Java download 진행 ]

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SMIS Install Guide

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⑩

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⑫ ⑬ Select language

그림의 화면이 보이면 설치 성공 !!

SMIS Install Guide

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예 ) Company1 에서 IC( MMXXX123 ) 에 대한 정보를 직접 작성할 경우

Step 1 ) 대상 부품의 구성 Item 분류Step 2 ) 구성재질을 균일재질 기준으로 나눈다 . Step 3 ) 균일재질別 사용수량 및 부품구성 중량을 산출한다 .

EMC

Wire

Chip

Adhe-sive

PCB

Solder Ball

Sub Item Qty Material Wt(g) Sub-

stanceEMC 1 Epoxy 0.13Wire 1 Au 0.0003Chip 1 Si 0.0379

Adhe-sive 1 Adhe-

sive 0.16Solder

Ball 1 Pb free solder 0.0287

PCB 1Epoxy 0.0332

Ink 0.006Cu 0.0032

SMIS 작성 근거 Data 준비

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Step 4 ) 균일재질別 MSDS 또는 성분표 또는 Mil sheet 를 준비한다 .

EMC

Wire

ChipAdhe-sive

PCB

Sol-der Ball

Sub Item Qty Material Wt(g) Substance

EMC 1 Epoxy 0.13 Antimony Trioxide(1309-64-4) : 3%

Wire 1 Au 0.0003 -Chip 1 Si 0.0379 -

Adhe-sive 1 Adhe-

sive 0.16 -Solder

Ball 1 Pb free solder 0.0287 -

PCB 1Epoxy 0.0332 Bisphenol A(80-05-7) : 5%

Ink 0.006 -Cu 0.0032 -Epoxy Resin

MSDS

Bisphenol A 80-05-7 1~5%

1) 관리 화학물질 ( 부속서 참조 ) 을 함유하고 있을 경우 , 그 함유률을 확인한다

2) 함유률이“최소값 ~ 최대값”으로 표현되어 있을 경우 , 최대값을 확인한다 .

SMIS 작성 근거 Data 준비

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■ 기본정보 입력【 회사정보 , 부품정보 】

① 본 Sheet 작성 회사명 입력 ( 예 : ABC Company, XXXX 주식회사 등 )② 본 Sheet 작성자 이름 입력 ( 예 : 홍길동 , 홍두깨 등 )③ 작성자의 직급 입력 ( 예 : 사원 , 대리 , 과장 등 ) / ④ 작성자 연락처 또는 회사의 대표전화 번호

⑤ 작성자 또는 회사의 e-mail 입력 / ⑥ 본 Sheet 정보작성 부품명 ( 전해콘덴서 , 탄탈저항 등 )⑦ 해당 부품의 Company 부품코드 또는 고객사 부품코드

⑧ 해당 부품의 공급단위 선택 ( PC 또는 m ) - 반도체 칩 , 저항 등과 같이 PC(Piece) 단위로 공급 時 PC 선택 - Wire 등과 같이 m 단위로 공급 時 m 선택

⑨ 부품 중량은 자동 계산됨

⑩ 본 Sheet 의 SVHC Version 정보

① ② ③ ④ ⑤

⑥ ⑦ ⑧ ⑨

SMIS 작성 매뉴얼

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■ 부품구성 정보 작성【 구성 Item 정보 】Sub Item Qty Material Wt(g) Substance

EMC 1 Epoxy 0.13 Antimony Trioxide(1309-64-4) : 3%Wire 1 Au 0.0003 -


Ink 0.006 -Cu 0.0032 -

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② ③ ④ ⑤⑥

①

① 최초 입력 時 조립부품 또는 원부품의 "+" 버튼을 클릭하여 입력 행추가

② 조립부품명 입력 / ③ 조립부품의 개수 입력 / ④ 조립부품을 구성하고 있는 원부품명 입력

⑤ 사용된 원부품의 개수 입력 / ⑥ 원부품 구성재질 Category 를 Combo box 에서 선택

⑦ 클릭하여 세부재질 명칭 선택

⑧ 재질 선택 後 선택 버튼 클릭

⑨ 해당 재질이 재활용재질인 경우 , “Recycled” 박스에 체크 후 선택 버튼 클릭 ※ 주의 : 폐제품 등에서 수거한 자원을 가공한 자재를 재활용이라함 . 공정 중 발생 Scrap 사용은 재활용이라 하지 않음 .

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재질별 Organic, Inorganic 이 지정되어 있음


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■ 부품구성 정보 작성【 재질정보 】

① ② ③

④

Sub Item Qty Material Wt(g) SubstanceEMC 1 Epoxy 0.13 Antimony Trioxide(1309-64-4) : 3%Wire 1 Au 0.0003 -


Ink 0.006 -Cu 0.0032 -

① 재질이 모재로 사용되었는지 , 표면처리로 사용되었는지 선택

② 해당 원부품 1 개에 사용된 해당 재질의 중량 입력 ※ 부품의 중량 ( ④ ) = Sum( 조립부품 개수 * 원부품 개수 * 재질중량 ) : 자동 계산됨

따라서 , 원부품의 개수가 2 이상일지라도 재질중량 ( ② ) 에는 원부품 개수 1 에 대한 중량을 입력해야 함 .

③ 재질선택 時 자동 생성됨

EMC

Wire

ChipAdhe-sive

PCB

Sol-der Ball


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■ 부품구성 정보 작성【 화학물질 정보 】

③④

Sub Item Qty Material Wt(g) SubstanceEMC 1 Epoxy 0.13 Antimony Trioxide(1309-64-4) : 3%Wire 1 Au 0.0003 -


Ink 0.006 -Cu 0.0032 -

① 스크롤을 이동시켜 나머지 정보 입력

② 해당 재질에 삼성전자 관리 화학물질 함유 時 화학물질 Class 선택 ( Reach 추가 , 부속서 참조 )③ 물질 종류 선택

④ 클릭하여 세부 화학물질 선택 ( 다음 페이지 참조 ) ※ ②, ③ 을 선택하지 않고 클릭 時 관리 화학물질 full list 에서 선택 가능

※ ②, ③ 을 선택한 後 , 클릭 時 선택된 Category 의 화학물질 List 에서 선택 가능

⑤ 해당 재질 內 함유된 화학물질 함유율 입력 ( % 단위 입력 ) ※ ppm 단위는 % 환산 後 입력 ( 예 : 300ppm → 0.03% )

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②⑤

⑤ 함유률 입력 時 함유량 정보는 자동 생성됨


EMC

Wire

ChipAdhe-sive

PCB

Sol-der Ball

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■ 부품구성 정보 작성 – 화학물질 선택 Popup 화학물질의 Class, Category 를 선택하지 않고 클릭 時 , 관리 화학물질 full list 에서 선택 가능

화학물질의 Class, Category 를 선택한 後 , 클릭 時 , 선택된 Category 의 화학물질List 에서 선택 가능SVHC 물질인 경우 SVHC Ver 정보 표시되며최신 변경 List Color 구분되어 먼저 조회됨

① 해당 화학물질 선택

② 화학물질을 직접 찾기 어려운 경우 , CAS No 입력 후 검색하여 찾기③ SVHC 물질인 경우 SVHC Ver 정보 표시

①

②


③

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■ 부품구성 정보 작성【 예외사항 선택 】

① 클릭하여 예외사항 선택

② 해당 화학물질의 예외 조항 선택

③ 해당 화학물질의 특정 용도입력 ( 난연제 , 가소제 등 )

① ③

②


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■ 구성부품 추가Sub Item Qty Material Wt(g) Substance

EMC 1 Epoxy 0.13 Antimony Trioxide(1309-64-4) : 3%Wire 1 Au 0.0003 -Chip 1 Si 0.0379 -

Adhesive 1 Adhesive 0.16 -Solder

Ball 1 Pb free solder 0.0287 -


Ink 0.006 -Cu 0.0032 -

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① 부품이 두개 이상의 하위 부품으로 구성되어 있을 경우 , 상위 원부품 명칭 앞의 "+" 버튼 클릭으로 원부품 행 추가 後 정보 입력


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① "+" 클릭 時 바로 아래 행 신규 생성 ( 행과 행 사이에 행 추가 가능 )

①

①

①

① 원부품이 두개 이상의 균일재질로 구성되어 있을 경우 , 상위 재질종류 앞의 "+" 버튼 클릭으로 재질 행 추가 後 정보 입력

■ 행 추가


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■ 행 삭제

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②

① 삭제하고자 하는 행의 체크박스 체크 ※ 주의 : 하위 부품 또는 재질 , 화학물질의 정보가 있을 경우 , 모든 하위정보가 삭제됨

② " 예 (Y)" 선택 時 삭제 됨


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Sub Item Qty Material Wt(g) SubstanceWire

Jacket 1 PVC 3.5 DEHP(117-81-7) : 25%PVC(9002-86-2) : 67%

Wire 도체 1 Cu 2.2 -

Wire Jacket

Wire 도체

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① “m” 단위로 구매되는 자재는 Unit 을 “ m” 로 선택

② “m” 단위에서는 Sub Item 부터 입력 가능③ “m” 단위에서는 Qty 가 1 로 고정 , 단위 m 당 구성 재질 및 화학물질 정보를 입력

②③

SMIS 작성 매뉴얼 – 자재구매 단위 “ m”

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■ 부품무게 확인

최종 완성된 부품정보의 무게정보와 실측무게가 오차범위 +- 5% 이내인지 확인


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■ 메뉴설명① 신규 작성

② 임시저장 (Save) 된 파일 열기

③ 작성한 Data 인쇄 출력

④ 자재 Maker 로부터 입수한 XML 파일 병합 ( 다음 페이지 참조 )⑤ 작성 中 Data 임시저장 ( 파일명 .smis ) 저장된 파일은 " 열기 " 로 파일 open 後 수정가능 ※ 주의 : SMIS 사용자는 Data 백업을 위해 반드시 저장할 것을 권합니다 . 파일명에 기호문자가 있을 경우 저장 불가

⑥ 고객사에게 부품정보 전달 時 XML 로 저장된파일 송부 ( 파일명 .xml )

※ XML 파일은 " 데이터병합 " 으로만 사용 가능하며 임의 수정 불가능 ※ 주의 : 파일명에 기호문자가 있을 경우 저장 불가

⑦ 작성한 Data 엑셀파일로 만들기

⑧ SMIS 종료

⑨ 입력한 화학물질 정보 요약정보

⑩ 관리 화학물질 Full list 조회

⑪ 입력한 부품구성정보 초기화

①②③④⑤⑥⑦⑧

⑧⑥⑤②⑨④ ⑩ ⑪


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Memory chip

XML

MLCC

XML

PCB

XML

XML 병합

■ 데이터 병합

Company4Memory Module

Company1

Company2

Company3

Company5Board Unit

XML

Memory Module

■ Company4 에서 Company1, 2, 3 으로부터 Memory chip, MLCC, PCB 를 각각 구매하여 Memory Module 을 조립할 경우 .

■ Company 1, 2, 3 으로부터 각 Memory chip, MLCC, PCB 에 대한 SMIS XML file 을 입수하여 데이터병합 기능을 이용하여 Memory Module 에 대한 정보를 완성한다 .

Memory Module 구성자재 QtyMemory Chip 36

MLCC 12PCB 1

: :

SMIS 작성 매뉴얼 – 데이터 병합

http://www.germes-online.com/direct/dbimage/50187243/4_Layer_PCB.jpg

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■ 데이터 병합 기능 사용 時 주의사항

SMIS 의 데이터 병합 기능을 이용하여 “불러오기”한 XML 파일의“부품 구성정보”는 수정하는 것이 불가능합니다 .

만약 , 자재 공급사에서 입수한 XML 파일의 정보에 오류가 있을 경우 , 자재 공급사에 정보수정 요청바랍니다 .

- 복합 성형품 , 완성품의 제조에 사용되는 부자재 (솔더 , 접착제 등 ) 는

먼저 SMIS 를 이용하여 XML file 을 작성한 後 데이터 병합하여 주시기 바랍니다 .

- 데이터 병합 時 조립부품 (Assy Item)란의 명칭은 “ 최근 상위 부품명 / 최초 조립부품명”으로 자동 변경됩니다 .


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① Company4 의 회사정보 및 Memory Module 에 대한 정보 작성

② ② 데이터병합 버튼 클릭 ( 다음페이지 )


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①

②

② 해당 부품을 구성하고 있는 자재의 XML 파일을 선택


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②

③

① Import 자재의 SVHC Ver 이 최신버전이 아닐 경우 안내 메시지② 해당 부품을 구성하고 있는 자재의 구매단위가 PC 인 경우 , 사용수량을 입력③ 해당 부품을 구성하고 있는 자재의 구매단위가 m 인 경우 , 소요량과 사용수량을 입력

예 ) Wire 를 m 단위로 구매하여 0.5m 로 자른 Wire 를 해당 부품에 1 개 사용할 경우 , 소요량 (Used Amount) 에 0.5, 사용수량 (Quantity) 에 1 을 입력

④ 체크박스 체크 後 , ⑤ Delete 클릭하여 선택된 자재 삭제

⑥ 불러온 Data 병합

⑦ Supplier 로부터 입수한 XML 파일의 세부 내용 확인

④

⑤ ⑥

⑦


①

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①

① 최종 완성한 부품 전체에 함유된 화학물질 요약정보 확인


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조립업계 1(Article)

가공 · 부품업계 (Article)

검정 커넥터 백색 커넥터

XML

XML

XML

XML XML

Black Wire

Yellow Wire

Red Wire

Company5Board Unit

XML

Power Cable

Company1

Company2

XML 병합

Company3Power Cable

■ 복합 성형품을 구성하는 Item 기준으로 구분한다 .

■ Company 1, 2 로부터 각 Wire, 커넥터에 대한 SMIS XML file 을 입수하여 데이터병합 기능을 이용하여 Memory Module 에 대한 정보를 완성한다 .

■ “m” 단위로 구매되는 자재를 잘라 사용할 경우 , 소요량과 사용수량을 입력

Power Cable Used amount Qty

Yellow Wire 0.2 m 1Red Wire 0.2 m 1

Black Wire 0.2 m 2Black connector - 1White connec-

tor - 1

SMIS 작성 매뉴얼 – 데이터 병합 ( m 단위 )

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“m” 단위로 구매되는 자재의 사용량 입력

자재 사용개수 입력

사용량과 사용개수의 입력이 완료되면 데이터병합 실시

① ②

③

SMIS 작성 매뉴얼 – 데이터 병합 ( m 단위 )

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SMIS 작성 매뉴얼 – 조립 공정 중 사용 부자재 (Preparation)

Memory chip

MLCC

XML

PCB

XML

Company5Memory Module

Company1

Company2

Company3

Company6Board Unit

XML

Memory Module

Company4Solder Cream

Solder creamXML

XML

■ 복합 성형품 , 완성품 제조공정 중 사용 부자재 (Preparation : solder, 접착제 등 ) 의 경우 , 부자재를 직접 사용하는 완성품 제조업체에서 해당 부자재에 대한 SMIS 를 작성 後 Data 병합을 진행 .

예 ) Memory module 제조업체에서 Solder cream 을 구매하여 직접 SMD 작업을 할 경우 .( SMD : Surface Mount Devices )

MSDS

※ 부자재에 대한 SMIS XML file 을 부자재 사용

제조업체 (Company5) 에서 직접 작성 후 Data 병합 時

사용

XML 병합

http://www.germes-online.com/direct/dbimage/50187243/4_Layer_PCB.jpg

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부자재가 완제품에 최종 사용되어지는 위치

구매 Part code 입력

1)Data 병합할 최종 완제품의 단위 가 PC 인 경우 , 구매단위 PC

선택 . 2) 최종 완제품의 단위가 M 인 경

우 , 구매단위 M 선택

부자재가 완제품에 최종 사용되어지는 위치

부자재의 재질정보 입력

재질 중량 입력

작성 완료 후 XML 파일 저장

작성시의 SVHC Ver 정보

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Data 병합 時 작성한 부자재의 SMIS XML 파일을 다른 Part 와 함께

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부속서Ⅰ. 재질 ListⅡ. 관리화학물질 ListⅢ. 예외 List

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Ⅰ. 재질 List

재질분류 재질명 세부

Plastic ABS Acrylonitrile-Butadiene-Styrene

Plastic ABS+G/F ABS Glass FiberPlastic ABS+PMMA ABS+PMMAPlastic Acryl AcrylPlastic EPE Expanded PEPlastic EPP Expanded PPPlastic EPS Expanded PSPlastic EPU Expanded PolyurethanePlastic EVA Ethylene-Vinyl AcetatePlastic EPOXY EpoxyPlastic GPPS General Purpose PSPlastic HIPS High Impact PSPlastic MIPS Midium Impact PSPlastic HDPE High Density PEPlastic LDPE Low Density PEPlastic Nylon NylonPlastic PA PolyamidePlastic PA+G/F PA + Glass FiberPlastic PBT Poly butylene terephthalatePlastic PBT+ABS PBT+ABSPlastic PBT+G/F PBT + Glass FiberPlastic PC Poly CarbonatePlastic PC+ABS PC + ABSPlastic PC+G/F PC Glass FiberPlastic PC+PBT PC + PBTPlastic HT-PC High Thermo PCPlastic PET Poly Ethylene TerephthaltePlastic PET blended PET blendedPlastic PET+G/F PET + G/FPlastic PMMA Poly Methyl Meth AcrylatePlastic POM Polyacetal

■ Plastic재질분류 재질명 세부

Plastic PP PolypropylenePlastic PP+G/F PP + G/FPlastic PPE PolyphenyleneetherPlastic PPT PPTPlastic PUR PolyurethanePlastic PVC Poly Vinyl ChloridePlastic SAN Styrene Acrylon NitrilePlastic Tefron TefronPlastic PE PolyethylenePlastic LCP Liquid Crystal PolymerPlastic Poron

Plastic MBS Methylmethacrylate–Butadiene–Styrene

Plastic PI PolyimidePlastic PCM(PC+PCT) PCT Alloy

Plastic Plastic oth-ers

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■ Metal재질분류 재질명 세부

Metal Iron FeMetal Carbon steel Carbon Steel

Metal Stainless steel(STS, SUS) Stainless steel

Metal Other Steel Steel alloy

Metal Al Aluminium and Aluminium al-loys

Metal Al alloys Aluminium and Aluminium al-loys

Metal Cu CopperMetal Cu alloys Copper alloys

Metal Mg, Mg alloys Magnesium and Magnesium al-loys

Metal Ni, Ni alloys Nickel and Nickel alloysMetal Ti,Ti alloys Titanium and Titanium alloysMetal Ta,Ta alloys Tantalum and Tantalum alloysMetal Zn,Zn alloys Zinc and Zinc alloysMetal Sn + Pb solder Sn + Pb solderMetal Pb free solder Pb free solderMetal Au GoldMetal Pt PlatinumMetal Pd PalladiumMetal Ag SilverMetal Sn Tin

Metal GA,GA alloys Galvanium and Galvanium al-loys

Metal W, W alloys Tungsten and Tungsten alloysMetal Ferrite 　Metal Metal others 　

■ Glass재질분류 재질명 세부

Glass Tempered Glass 　

Glass Glass others

■ Paper재질분류 재질명 세부

Paper PB PaperboardPaper CB Corrugated CardboardPaper CFB Corrugated FiberboardPaper Pulpmold 　

Paper Paper others 　

■ Wood재질분류 재질명 세부

Wood Plywood 　

Wood MDF Midium Density Fiber board

Wood PB Particle board

Wood Natural wood 　

Wood Wood others 　

■ Rubber재질분류 재질명 세부

Rubber NBR-Rubber Nitrile Butadiene RubberRubber CR-Rubber Chloroprene Rubber

Rubber EPDM Ethylene Propylene Diene Monomer

Rubber TPE Thermoplastic elastomerRubber TPSIV Thermoplastic ElastomerRubber Latex LatexRubber Rubber others 　

Ⅰ. 재질 List

33

■ GAS재질분류 재질명 세부

Gas HCFC-22 　

Gas HFC-134a 　

Gas R407C 　

Gas R410A 　

Gas R600a 　

Gas C-pentane 　

Gas Perfluorohexane 　

Gas Gas others 　

재질분류 재질명 세부

Others Sponge 　

Others Cement 　

Others Ceramic 　

Others Glass Filber 　

Others Ink, Paint 　

Others Adhesive 　

Others Leather 　

Others Magnet 　

Others NaCl water 　

Others Oil 　

Others Silicon 　

Others Textile 　

Others SiO2 　

Others Carbon Black 　

Others ITO Indium Tin OxideOthers ACF Anisotropic Conductive FilmOthers Polarizer 　

Others Glue 　

Others Flux 　

Others Heterocyclic Heterocyclic compoundOthers Olefin 　

Others Others(Chemical) 　

Others Others(Organic) 　

Others Others(Inorganic) 　

■ Others

Ⅰ. 재질 List

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Ⅱ. 관리화학물질 List■ Substance List

Classifica-tion Substance Category

Class1

Benzyl butyl phthalateBis(2-ethylhexyl) phthalateCadmium and its compoundsDibutyl phthalateDiisobutyl phthalateHexavalent chromium compoundsLead and its compoundsMercury and its compoundsPolybrominated BiphenylsPolybrominated Diphenyl Ethers

Class2

Arsenic acid and its saltsAsbestosAzocolourants and azodyes which form certain aro-matic aminesBiocide dimethylfumarateBisphenol ADiarsenic PentoxideDiarsenic TrioxideDibutyltin (DBT) compoundsDioctyltin (DOT) compoundsFluorinated Green House Gas Compounds PFC, SF6 etcFormaldehydeHexabromo cyclododecaneNickelNonylphenol,Nonylphenol EthoxylateOzone Depleting SubstancesPentachlorophenolPerfluoroctane SulfonatesPhthalatePolychlorinated bipheyls(PCB), Polychlorinated ter-pheyls(PCT), Polychlorinated naphtalenes(PCN)

Classifica-tion Substance Category

Class2

Polychlorinated bipheyls(PCB), Polychlorinated ter-pheyls(PCT), Polychlorinated naphtalenes(PCN)Polycyclic Aromatic HyShortchain Chlorinated ParaffinsTributyl tin (TBT), Triphenyl tin (TPT), Tributyl tin oxide (TBTO)perfluorooctanic acid and individual salts and es-ters of PFOA

Class3

Antimony TrioxideAntimony and its compoundsBeryllium and its compoundsBrominated flame retardantChlorinated fire retardantsCobalt dichloridePhthalatePolyvinyl ChlorideTetrabromo bisphenol A

ReachREACH Authorization ListREACH Restriction ListREACH SVHC Candidate List

Others

2-(2H-benzotriazol-2-yl)-4,6-di-tert-butylphenol4,4 - Diaminodiphenylmethane AnthraceneDiboron TrioxideMedium-chain chlorinated paraffins, C14-C17PerchloratePersistent Free RadicalsRadioactive SubstancesTGICTriclosanTriphenyl phosphateTris (2-chloroethyl)phosphate

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Ⅱ. 관리화학물질 List■ Substance List – Class 1Substance Cate-

gory Substance Name CAS No SVHCBenzyl butyl phtha-late Benzyl butyl phthalate (BBP) 85-68-7 YBis(2-ethylhexyl) ph-thalate Bis (2-ethylhexyl)phthalate (DEHP) 117-81-7 Y

Cadmium and its compounds

Cadmium 7440-43-9 YCadmium alloys - NCadmium carbonate 513-78-0 NCadmium chloride 10108-64-2 Y

Cadmium fluoride 7790-79-6 Y

Cadmium nitrate 10325-94-7 NCadmium nitrate tetrahydrate 10022-68-1 NCadmium oxide 1306-19-0 YCadmium stearate 2223-93-0 N

Cadmium sulphate 10124-36-4, 31119-53-6 Y

Cadmium sulphide 1306-23-6 YOther cadmium compounds - N

Dibutyl phthalate Dibutyl phthalate (DBP) 84-74-2 YDiisobutyl phthalate Diisobutyl phthalate (DIBP) 84-69-5 Y

Hexavalent chromium compounds

Acids generated from chromium trioxide and their oligomers - YAmmonium chromate 7788-98-9 NAmmonium dichromate 7789-09-05 YBarium Chromate 10294-40-3 NCalcium chromate 13765-19-0 NCalcium dichromate 14307-33-6 NChromic acid 7738-94-5,

13530-68-2 YChromium trioxide 1333-82-0 YCopper chromate 13548-42-0 N

Copper chromite 12053-18-8 N

Substance Category Substance Name CAS No SVHC

Hexavalent chromium compounds

Dichromic acid 7738-94-5, 13530-68-2 Y

Lead chromate( 오렌지색 안료 ) 1344-38-3 NLithium chromate 14307-35-8 NMagnesium chromate 13423-61-5 NOligomers of chromic acid and dichromic acid - Y

Other chromium compound - NPatassium chlorochromate 16037-50-6 NPotassium chromate 7789-00-6 YPotassium dichromate 7788-50-9 NPotassium dichromate 7778-50-9 YSodium chromate 7775-11-03 Y

Sodium dichromate 10588-01-9, 7789-12-0 Y

Strontium chromate 7789-06-02 Y

Zinc chromate12018-19-8, 13530-65-9, 14018-95-2

N

Zinc dichromate - N

Lead and its com-pounds

Acetic acid, lead salt, basic 51404-69-4 YCalcium plumbate 12013-69-3 NDilead trioxide - NDioxobis(stearato)trilead 12578-12-0 YFatty acids, C16-18, lead salts 91031-62-8 YLead antimonite 13510-89-9 NLead bis(tetrafluoroborate) 13814-96-5 YLead carbonate 598-63-0 NLead chromate 7758-97-6 YLead chromate molybdate sulphate red (C.I. Pigment Red 104) 　　

This substance is identified in the Colour Index by Colour Index Constitution Number, C.I. 77605.

12656-85-8 Y　

Lead cyanamidate 20837-86-9 Y

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■ Substance List – Class 1

Ⅱ. 관리화학물질 ListSubstance Category Substance Name CAS No SVHC

Lead and its com-pounds

Lead( )chlorideⅡ 7758-95-4 NLead( )cyanideⅡ 592-05-2 NLead( )fluorideⅡ 7783-46-2 NLead( )iodideⅡ 10101-63-0 NLead( )metaborateⅡ 10214-39-8 NLead( )sulfideⅡ 1314-87-0 NLead( )acetateⅣ 546-67-8 NLead( )chlorideⅣ 13463-30-4 NLead( )oxideⅣ 1309-60-0 NLead/Tin alloy - NLead; metal 7439-92-1 NOrange lead (lead tetrox-ide) 1314-41-6 Y

Other Lead compounds - NPentalead tetraoxide sul-phate 12065-90-6 Y

Pyrochlore, antimony lead yellow 　　

This substance is identi-fied in the Colour Index by Colour Index Constitution Number, C.I. 77588.

8012-00-8 Y

Silicic acid (H2Si2O5), barium salt (1:1), lead-doped

　　

with lead (Pb) content above the applicable generic concentration limit for ’toxicity for reproduc-tion’ Repr. 1A (CLP) or category 1 (DSD); the sub-stance is a member of the group entry of lead com-pounds, with index number 082-001-00-6 in Regulation (EC) No 1272/2008

68784-75-8 Y

Silicic acid, lead salt 11120-22-2 YSulfurous acid, lead salt, dibasic 62229-08-7 Y

Tetraethyllead 78-00-2 YTetralead trioxide sulphate 12202-17-4 YTetramethyl lead 75-74-1 NTrilead bis(carbonate)dihydroxide 1319-46-6 Y

Trilead diarsenate 3687-31-8 YTrilead dioxide phosphonate 12141-20-7 Y[Phthalato(2-)]dioxotrilead 69011-06-9 Y


Lead and its compounds

Lead di(acetate) 301-04-2 YLead diazide, Lead azide 13424-46-9 Y

Lead dinitrate 10099-74-8 YLead dipicrate 6477-64-1 YLead fluosilicate 25808-74-6 NLead hydrogen arsen-ate 7784-40-9 Y

Lead hydroxcarbonate 1344-36-1 NLead molybdate 10190-55-3 NLead monoxide (lead oxide) 1317-36-8 Y

Lead oleate 1120-46-3 NLead oxide sulfate 12036-76-9 YLead perchlorate 13637-76-8 NLead selenide 12069-00-0 NLead stearate 1072-35-1, 7428-48-0 NLead styphnate 15245-44-0 YLead sulfate, sul-phuric acid, lead salt

15739-80-7 N

Lead sulfochromate yellow (C.I. Pigment Yellow 34)

　　

This substance is identified in the Colour Index by Colour Index Consti-tution Number, C.I. 77603.

1344-37-2 Y

Lead thiocyanate 592-87-0 NLead titanium triox-ide 12060-00-3 Y

Lead titanium zirco-nium oxide 12626-81-2 Y

Lead(II) bis(methanesulfonate) 17570-76-2 Y

Lead( ) phosphateⅡ 7446-27-7 N

Lead( ) sulfateⅡ 7446-14-2, 15739-80-7 N

Lead( )acetate, triⅡ -hydrate 6080-56-4 N

Lead( )arseniteⅡ 10031-13-7 N

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Ⅱ. 관리화학물질 List

Substance Cate-gory Substance Name CAS No SVHC

Polybrominated Biphenyls

P,P''-DIBROMOBIPHENYL (PBB) 92-86-4 NPOLYBROMINATED BIPHENYL MIXTURE (PBB) 67774-32-7 NPOLYBROMINATED BIPHENYLS (PBB) 59536-65-1 N

Pentabrphenyl 56307-79-0 NTETRABROMOBIPHENYL (PBB) 40088-45-7 NTribromobiphenyl 59080-34-1 N

Polybrominated Diphenyl Ethers

4-BROMODIPHENYL ETHER (PBDE) 101-55-3 NBis(pentabromophenyl) ether (decabromodiphenyl ether) (DecaBDE)

1163-19-5 Y

DIBROMODIPHENYL ETHER (PBDE) 2050-47-7 NHEPTABROMODIPHENYL ETHER (PBDE) 68928-80-3 NHEXABROMODIPHENYL ETHER (PBDE) 36483-60-0 NNONABROMODIPHENYL ETHER (PBDE) 63936-56-1 NOCTABROMODIPHENYL ETHER (PBDE) 32536-52-0 N

Other PBDEs compounds - NPENTABROMODIPHENYL ETHER (PBDE) 32534-81-9 NTETRABROMODIPHENYL ETHER (PBDE) 40088-47-9 NTRIBROMODIPHENYL ETHER (PBDE) 49690-94-0 N

Substance Cate-gory Substance Name CAS No SVH

C

Mercury and its compounds

Dialkylmercury - NDiphenylmercury 587-85-9 NEthylmercury salts - NMercuric chloride 33631-63-9 NMercuric sulfide 1344-48-5 NMercury 7439-97-6 NMercury alloys;amalgam - NMercury(Ⅰ)chloride 10112-91-1 NMercury(Ⅰ)oxide 15829-53-5 NMercury(Ⅰ)sulfate 7783-35-9 NMercury(Ⅱ)acetate 1600-27-7 NMercury(Ⅱ)chloride 7487-94-7 NMercury(Ⅱ)fulminate 628-86-4 NMercury(Ⅱ)nitrate 10045-94-0 NMercury(Ⅱ)oxide 21908-53-2 NMethoxyethyl-mercury salts - NMethylmercury salts e.g. 22967-92-6 NOther mercury compounds - NPhenylmercury salts - NPropylmercury salts - N

Polybrominated Biphenyls

2,2'',4,4'',5,5''-HEXABRO-MOBIPHENYL (PBB) 59080-40-9 N2-BROMOBIPHENYL (PBB) 2052-07-05 N3-BROMOBIPHENYL (PBB) 2113-57-7 N4-BROMOBIPHENYL (PBB) 92-66-0 NDECABROMOBIPHENYL (PBB) 13654-09-6 NHEXABROMOBIPHENYL (PBB) 36355-01-8 NHeptabromobiphenyl 35194-78-6 NNonabiphenyl 27753-52-2 NOctabromobiphenyl 61288-13-9 NOther PBBs compounds - N

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Arsenic acid and its salts

Arsenic 7440-38-2 NArsenic acid 7778-39-4 YArsenic acid disodium salt, Heptahydrate 10048-95-0 N

Arsenic acid, copper salt 10103-61-4 NArsenic acid, diammonium salt 7784-44-3 N

Arsenic acid, magnesium salt 10103-50-1 N

Arsenic trichloride 7784-34-1 NArsenic trihydride 7784-42-1 NArsenious acid, copper(II) salt 10290-12-7 N

Arsenious acid, potassium salt 10124-50-2 N

Calcium arsenate 7778-44-1 YDiarsenic pentaoxide 1303-28-2 YDiarsenic trioxide 1327-53-3 YOther Arsenic acid and its salts - N

Triethyl arsenate 15606-95-8 Y

Asbestos

Actinolite 77536-66-4 NAmosite (Grunerite) 12172-73-5 NAnthophyllite 77536-67-5 NAsbestos 1332-21-4 NChrysotile 12001-29-5 NCrocidolite 12001-28-4 NOther Asbestos and its compounds - N

Tremolite 77536-68-6 N

Azocolourants and azodyes which form cer-tain aromatic amines

2,2'-dichloro-4,4'-methylenedianiline 101-14-4 Y

2,4,5-trimethylaniline 137-17-7 N

2,4-diaminoanisole 615-05-4 N

2,4-xylidine 95-68-1 N


Azocolourants and azodyes which form cer-tain aromatic amines

2,6-xylidine 87-62-7 N

2-Methoxyaniline; o-Anisidine 90-04-0 Y

2-naphthylamine 91-59-8 N

3,3-dichlorobenzidine 91-94-1 N

3,3-dimethlbenzidine 119-93-7 N

3,3-dimethoxybenzidine 119-90-4 N4,4'- Diaminodiphenylmethane (MDA) 101-77-9 Y

4,4'-methylenedi-o-toluidine 838-88-0 Y

4,4'-oxydianiline 101-80-4 Y

4,4'-oxydianiline and its salts - Y

4,4-thiodianiline 139-65-1 N

4-Aminoazobenzene 1960-09-03 Y

4-chloro-o-toluidine 95-69-2 N4-methyl-m-phenylenediamine (toluene-2,4-diamine) 95-80-7 Y

5-nitro-o-toluidine 99-55-8 N6-methoxy-m-toluidine (p-cresi-dine) 120-71-8 Y

Benzidine 92-87-5 N

Biphenyl-4-ylamine 92-67-1 Y

Other Azo and its compounds - N

o-Toluidine 95-53-4 Y

o-aminoazotoluene 97-56-3 Y

p-chloroaniline 106-47-8 NBiocide dimethylfumarate Biocide dimethylfumarate 624-49-7 N

Bisphenol A Bisphenol A 1980-05-07 N

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Ⅱ. 관리화학물질 ListSubstance Cate-

gory Substance Name CAS No SVHC

Dibutyltin (DBT) compounds

Bis (acetato) dibutyltin 17523-06-7 NDi-n-butyltin bis(methyl maleate) 15546-11-9 N

Di-n-butyltin di(monobutyl)maleate 15546-16-4 N

Dibutyl tin (DBT) 1002-53-5 NDibutyltin S,S'-bis (isooctyl mercaptoacetate)

26636-01-1 N

Dibutyltin bis(benzyl maleate) 7324-74-5 N

Dibutyltin bis(isooctylmaleate) 25168-21-2 N

Dibutyltin bis(octylthioglycolate) 2781-09-01 N

Dibutyltin diacetate 1067-33-0 NDibutyltin dibenzoate 5847-54-1 NDibutyltin dibutoxide 3349-36-8 NDibutyltin dibutyrate 28660-63-1 NDibutyltin dichloride (DBTC) 683-18-1 Y

Dibutyltin dihexanoate 19704-60-0 NDibutyltin diisostearate 59963-28-9 NDibutyltin dilaurate 77-58-7 NDibutyltin dilauryl mer-captide 1185-81-5 N

Dibutyltin dimaleate 10192-92-4 NDibutyltin dioctanoate 4731-77-5 NDibutyltin dioleate 13323-62-1 NDibutyltin dipalmitate 13323-63-2 NDibutyltin disalicylate 14214-24-5 NDibutyltin distearate 5847-55-2 NDibutyltin hydrogen bo-rate 75113-37-0 N

Dibutyltin isooctanoate 85702-74-5 NDibutyltin linoleate 85391-79-3 NDibutyltin linolenate 95873-60-2 NDibutyltin maleate 1978-04-06 NDibutyltin mercaptoac-etate 78-20-6 N

Dibutyltin mercaptopropi-onate 1978-06-08 N

Dibutyltin oxide (DBTO) 818-08-6 N


Dibutyltin (DBT) compounds

Dibutytin di(2-ethylhexyl maleate) 15546-12-0 N

Diisobutyltin oxide 61947-30-6 NOther Dibutyltin (DBT) com-pounds - N

2-ethylhexyl 10-ethyl-4,4-dioctyl-7-oxo-8-oxa-3,5-dithia-4-stannatetrade-canoate (DOTE)

15571-58-1 Y

Dioctyl tin (DOT) 26401-97-8 NDioctyltin (DOT) compounds - NDioctyltin bis(isooctyl maleate) (DOT) 33568-99-9 N

Dioctyltin dichloride (DOT) 3542-36-7 NDioctyltin dilaurate (DOT) 3648-18-8 NDioctyltin maleate (DOT) 16091-18-2 NDioctyltin oxide (DOT) 870-08-6 N

Fluorinated Green House Gas Com-pounds PFC, SF6 etc

Carbon tetrafluoride (Per-fluoromethane) 75-73-0 N

HFC-125 (C2HF5) 354-33-6 NHFC-134 (C2H2F4) 359-35-3 NHFC-134a (CH2FCF3) 811-97-2 NHFC-143 (C2H3F3) 430-66-0 NHFC-143a (C2H3F3) 420-46-2 NHFC-152a (C2H4F2) 75-37-6 NHFC-227ea (C3HF7) 431-89-0 NHFC-23 (CHF3) 75-46-7 NHFC-236cb (CH2FCF2CF3) 677-56-5 NHFC-236ea (CHF2CHFCF3) 431-63-0 NHFC-236fa (C3H2F6) 690-39-1 NHFC-245ca (C3H3F5) 679-86-7 NHFC-245fa (CHF2CH2CF3) 460-73-1 NHFC-32 (CH2F2) 1975-10-05 NHFC-365mfc (CF3CH2CF2CH3) 406-58-6 NHFC-41 (CH3F) 593-35-3 NHFC-43-10mee (C5H2F10) 138495-42-8 N

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Fluorinated Green House Gas Com-pounds PFC, SF6 etc

Other GHGs - NPerfluorobutane (De-cafluorobutane) 355-25-9 N

Perfluorocyclobutane 115-25-3 NPerfluoroethane (Hex-afluoroethane) 76-16-4 N

Perfluorohexane (Te-tradecafluorohexane) 355-42-0 N

Perfluoropentane (Dode-cafluoropentane) 678-26-2 N

Perfluoropropane (Octafluoroproane) 76-19-7 N

Sulfur Hexafluoride (SF6) 2551-62-4 N

Formaldehyde

Formaldehyde 50-00-0 NFormaldehyde, Polymer with Bromophenol and (Chloromethyl)Oxirane

68541-56-0 N

Formaldehyde, oligomeric reaction products with aniline

25214-70-4 Y

Formaldehyde, reaction products with Butylphe-nol

91673-30-2 N

Other Formaldehydes and its compounds - N

Hexabromo cy-clododecane

1,2,5,6,9,10-hexabromo-cyclodecane 3194-55-6 Y

Alpha-hexabromocyclodo-decane 134237-50-6 Y

Beta-hexabromocyclodo-decane 134237-51-7 Y

Gamma-hexabromocyclodo-decane 134237-52-8 Y

Hexabromocyclododecane (HBCDD) 25637-99-4 Y

Hexabromocyclododecane (HBCDD) 　　

and all major di-astereoisomers identi-fied:

- Y

Nickel

Nickel 7440-02-0 NNickel Sulfammate solu-tion 13770-89-3 N

Nickel Sulfate 7786-81-4 NNickel( )oxideⅡ 1313-99-1 NOther Nickel and its compounds - N


Nonylphenol,Nonylphenol Ethoxy-late

Nonylphenol 25154-52-3 N

Nonylphenol,Nonylphenol Ethoxy-late

Nonylphenol Ethoxylates

9016-45-9, 26027-38-3, 37205-87-1, 68412-54-4, 127087-87-0

N

Ozone Depleting Substances

1-bromopropane (n-propyl bro-mide) (C3H7Br) 106-94-5 Y

Bromochloromethane (CH2BrCl) 74-97-5 NCFC-11 (CFCl3) 75-69-4 NCFC-111 (C2FCl5) 354-56-3 NCFC-112 (C2F2Cl4) 28605-74-5 NCFC-113 (C2F3Cl3) 76-13-1 NCFC-114 (C2F4Cl2) 1320-37-2 NCFC-115 (C2F5Cl) 76-15-3 NCFC-12 (CF2Cl2) 75-71-8 NCFC-13 (CF3Cl) 75-72-9 NCFC-211 (C3FCl7) 135401-87-5 NCFC-212 (C3F2Cl6) 3182-26-1 NCFC-213 (C3F3Cl5) 2354-06-05 NCFC-214 (C3F4Cl4) 2268-46-4 NCFC-215 (C3F5Cl3) 1652-81-9 NCFC-216 (C3F6Cl2) 662-97-2 NCFC-217 (C3F7Cl) 422-86-6 NCarbon tetrachloride (CCl4) 56-23-5 NEthyl bromide (C2H5Br) 74-96-4 NHBFC-121B4 (C2HFBr4) 306-80-9 NHBFC-122B3 (C2HF2Br3) - NHBFC-123B2 (C2HF3Br2) 354-04-1 NHBFC-124B1 (C2HF4Br) 124-72-1 NHBFC-131B3 (C2H2FBr3) - NHBFC-132B2 (C2H2F2Br2) 75-82-1 NHBFC-133B1 (C2H2F3Br) 421-06-7 NHBFC-141B2 (C2H3FBr2) 358-97-4 N

41





HBFC-142B1 (C2H3F2Br) - NHBFC-151B1 (C2H4FBr) 762-49-2 NHBFC-21B2 (CHFBr2) 1868-53-7 NHBFC-221B6 (C3HFBr6) - NHBFC-222B5 (C3HF2Br5) - NHBFC-223B4 (C3HF3Br4) - NHBFC-224B3 (C3HF4Br3) - NHBFC-225B2 (C3HF5Br2) 431-78-7 NHBFC-226B1 (C3HF6Br) - NHBFC-22B1 (CHF2Br) 1511-62-2 NHBFC-231B5 (C3H2FBr5) - NHBFC-232B4 (C3H2F2Br4) - NHBFC-233B3 (C3H2F3Br3) - NHBFC-234B2 (C3H2F4Br2) - NHBFC-235B1 (C3H2F5Br) 460-88-8 NHBFC-241B4 (C3H3FBr4) - NHBFC-242B3 (C3H3F2Br3) 70192-80-2 NHBFC-243B2 (C3H3F3Br2) 70192-83-5 NHBFC-244B1 (C3H3F4Br) 679-84-5 NHBFC-251B1 (C3H4FBr3) 75372-14-4 NHBFC-252B2 (C3H4F2Br2) 460-25-3 NHBFC-253B1 (C3H4F3Br) 421-46-5 NHBFC-261B2 (C3H5FBr2) 51584-26-0 NHBFC-262B1 (C3H5F2Br) - NHBFC-271B1 (C3H6FBr) 352-91-0 NHBFC-31B1 (CH2FBr) 373-52-4 NHCFC-121 (C2HFCl4) 354-14-3 NHCFC-122 (C2HF2Cl3) 354-21-2 NHCFC-123 (C2HF3Cl2) 306-83-2 NHCFC-124 (C2HF4Cl) 2837-89-0 NHCFC-131 (C2H2FCl3) 134237-34-6 NHCFC-132 (C2H2F2Cl2) 25915-78-0 NHCFC-133 (C2H2F3Cl) 75-88-7 NHCFC-141 (C2H3FCl2) 25167-88-8 NHCFC-141b (CH3CFCl2) 1717-00-6 NHCFC-142 (C2H3F2Cl) 25497-29-4 N



HCFC-142b (CH3CF2Cl) 75-68-3 NHCFC-151 (C2H4FCl) 1615-75-4 NHCFC-21 (CHFCl2) 75-43-4 NHCFC-22 (CHF2Cl) 75-45-6 NHCFC-221 (C3HFCl6) 134237-35-7 NHCFC-222 (C3HF2Cl5) 134237-36-8 NHCFC-223 (C3HF3Cl4) 134237-37-9 NHCFC-224 (C3HF4Cl3) 134237-38-0 NHCFC-225 (C3HF5Cl2) 128903-21-9 NHCFC-225ca (CF3CF2CHCl2) 422-56-0 NHCFC-225cb (CF2ClCF2CHClF) 507-55-1 NHCFC-226 (C3HF6Cl) 134308-72-8 NHCFC-231 (C3H2FCl5) 134190-48-0 NHCFC-232 (C3H2F2Cl4) 134237-39-1 NHCFC-233 (C3H2F3Cl3) 134237-40-4 NHCFC-234 (C3H2F4Cl2) 127564-83-4 NHCFC-235 (C3H2F5Cl) 134237-41-5 NHCFC-241 (C3H3FCl4) 134190-49-1 NHCFC-242 (C3H3F2Cl3) 134237-42-6 NHCFC-243 (C3H3F3Cl2) 134237-43-7 NHCFC-244 (C3H3F4Cl) 134190-50-4 NHCFC-251 (C3H4FCl3) 134190-51-5 NHCFC-252 (C3H4F2Cl2) 134190-52-6 NHCFC-253 (C3H4F3Cl) 134237-44-8 NHCFC-261 (C3H5FCl2) 134237-45-9 NHCFC-262 (C3H5F2Cl) 134190-53-7 NHCFC-271 (C3H6FCl) 134190-54-8 NHCFC-31 (CH2FCl) 593-70-4 NHalon-1202 (CBr2F2) 75-61-6 NHalon-1211 (CF2BrCl) 353-59-3 NHalon-1301 (CF3Br) 75-63-8 NHalon-2402 (C2F4Br2) 124-73-2 NMethyl bromide (CH3Br) - NMethyl chloride (CH3Cl) 74-87-3 NMethylchloroform (C2H3Cl3) 71-55-6 NOther Ozone depleting sub-stances and its compounds - N

Trifluoromethyl iodide (CF3I) 2314-97-8 N

42




PentachlorophenolOther Pentachlorophenol and its salts - N

Pentachlorophenol 87-86-5 N

Perfluoroctane Sulfonates

Perfluoroctane Sulfonates (PFOS) C8F17SO2X, where X = OR, NR or other derivative

- N

Perfluorooctane sulfonic acid and its salts 1763-23-1 N

Perfluorooctane sulfonyl fluoride 307-35-7 N

Phthalate

Di-n-octyl phthalate (DNOP) 117-84-0 N

Diisodecyl phthalate (DIDP) 68515-49-1 N

Diisononyl phthalate (DINP)28553-12-0, 68515-

48-0N

Polychlorinated bipheyls(PCB), Polychlorinated terpheyls(PCT), Polychlorinated naphtalenes(PCN)

Monomethyl-dibromo-diphenyl meth-ane (DBBT)

99688-47-8 N

Monomethyl-tetrachloro-diphenyl methane (Ugilec 141)

76253-60-6 N

Octachloronaphthalenes 2234-13-1 N

Other PCBs, PCTs, PCNs and its compounds - N

Pentachloronaphthalenes 1321-64-8 N

Polychlorinated bipheyls(PCB) 1336-36-3 N

Polychlorinated naphtalenes(PCN) 70776-03-3 N

Polychlorinated terpheyls(PCT) 61788-33-8 N

Tetrachloronaphthalenes 1335-88-2 N

Trichloronaphthalenes 1321-65-9 N

Polycyclic Aro-matic Hy

Acenaphthen 83-32-9 NAcenaphthylen 208-96-8 NAnthracene 120-12-7 YAnthracene oil 　　A complex combination of poly-cyclic aromatic hydrocarbons ob-tained from coal tar having an approximate distillation range of 300°C to 400°C (572°F to 752°F). Composed primarily of phenan-threne, anthracene and carbazole.

90640-80-5 Y

Anthracene oil, anthracene paste 90640-81-6 Y


Polycyclic Aro-matic Hy

Anthracene oil, anthracene paste, anthracene fraction 91995-15-2 Y

Anthracene oil, anthracene paste,distn. lights 91995-17-4 Y

Anthracene oil, anthracene-low 90640-82-7 Y

Benzo[a]anthracen 56-55-3 NBenzo[a]pyren 50-32-8 YBenzo[b]fluoranthen 205-99-2 NBenzo[e]pyren 192-97-2 NBenzo[ghi]perylen 191-24-2 NBenzo[j]fluoranthen 205-82-3 NBenzo[k]fluoranthen 207-08-9 NChrysen 218-01-9 NDibenzo[a,h]anthracen 53-70-3 NFluoranthen 206-44-0 NFluoren 86-73-7 NIndeno[1,2,3-cd]pyren 193-39-5 NNaphthalin 91-20-3 NPhenanthren 1985-01-08 NPyren 129-00-0 N

Shortchain Chlo-rinated Paraf-fins

ALKANES, C10-12, CHLORO 108171-26-2 NALKANES, C10-14, CHLORO 85681-73-8 NALKANES, C10-21, CHLORO 84082-38-2 NALKANES, C10-26, CHLORO 97659-46-6 NALKANES, C10-32, CHLORO 84776-06-7 NALKANES, C12-13, CHLORO 71011-12-6 NALKANES, C12-14, CHLORO 85536-22-7 NALKANES, C6-18, CHLORO 68920-70-7 NALKANES, CHLORO 61788-76-9 NAlkanes, C10-13, chloro (Short Chain Chlorinated Paraffins)

85535-84-8 Y

Other Alkane 10-13 Carbon chain and its compounds - N

43




Tributyl tin (TBT), Triph-enyl tin (TPT), Tributyl tin oxide (TBTO)

Bis(tributyltin)oxide (TBTO) 56-35-9 YCoplymer of alkyl(c=8) acry-late,methyl methacrylate and tributyltin methacrylate

67772-01-4 N

Methyl Methacrylate and trib-utyl tin methacrylate - N

Other Organic tin and its com-pounds - N

Tributyl 2,3-dibromosuccinate 31732-71-5 NTributyl tin (TBT) 56573-85-4 NTributyl tin acetate 56-36-0 NTributyl tin bromide 1461-23-0 N

Tributyl tin chloride 1461-22-9, 7342-38-3 N

Tributyl tin fluoride 1983-10-04 NTributyl tin fumarate 6454-35-9 NTributyl tin laurate 3090-36-6 NTributyl tin naphthenate 85409-17-2 NTributyl tin phthalate 4782-29-0 NTributyl tin rosin salts 26239-64-5 NTributyl tin sulfamate 6517-25-5 NTributyltin cyclopentane car-bonate=mixture 5409-17-2 N

Tributyltinmethacrylate 2155-70-6 NTriphenyl tin (TPT) 668-34-8 NTriphenyl tin N, N'' -dimethyldithiocarbamate 1803-12-9 N

Triphenyl tin acetate(fentin acetate) 900-95-8 N

Triphenyl tin chloride 639-58-7 NTriphenyl tin chloro acetate 7094-94-2 NTriphenyl tin fluoride(fentin fluoride) 379-52-2 N


Tributyl tin (TBT), Triphenyl tin (TPT), Tributyl tin oxide (TBTO)

Triphenyl tin hydroxide 76-87-9 N

Triphenyltin fatty acid((9-11) salt)

18380-71-7, 18380-72-8, 47672-31-1, 94850-90-5

N

Trivutyl tin maleate 14275-57-1 N

perfluorooctanic acid and individual salts and esters of PFOA

Ammonium pentadecafluorooc-tanoate (APFO) 3825-26-1 Y

Ethyl perfluorooctanoate 3108-24-5 N

Methyl perfluorooctanoate 376-27-2 N

Other PFOAs - N

Pentadecafluorooctanoic acid (PFOA) 335-67-1 Y

Perfluorooctanoic acid potas-sium salt 2395-00-8 N

Perfluorooctanoic acid sodium salt 335-95-5 N

Perfluorooctanoyl fluoride 335-66-0 N

Silver perfluorooctanoate 335-93-3 N

44




Antimony and its compounds

Antimony 7440-36-0 NAntimony Trioxide 1309-64-4 NAntimony oxide 1327-33-9 NAntimony pentachloride 7647-18-9 NAntimony pentoxide 1314-60-9 NAntimony tetroxide 1332-81-6 NAntimony trichloride 10025-91-9 NAntimony trifluoride 7783-56-4 NAntimony trisulfide 1345-04-6 NAntimony(111) bromide 7789-61-9 NAntimony(V) sulfide 1315-04-4 NIndium antimony 1312-41-0 NOther Antimony and its com-pounds - N

Sodium antimonate 15432-85-6 N

Beryllium and its compounds

Beryllium carbonate 66104-24-3 NBeryllium chloride 7787-47-5 NBeryllium fluoride 7787-49-7 NBeryllium hydroxide 13327-32-7 NBeryllium metal 7440-41-7 NBeryllium nitrate 13597-99-4 NBeryllium oxide 1304-56-9 NBeryllium phosphate 13598-15-7 NBeryllium sulfate 13510-49-1 NBeryllium sulphate tetrahy-drate 7787-56-6 N

Other Beryllium and its com-pounds - N

Brominated flame retardant

1,2-Bis(2,4,6-tribromo-phe-noxy) ethane 37853-59-1 N

1,2-Dibromo-4-(1,2 dibromo-methyl)-cyclo-hexane 3322-93-8 N

1,3-Butadiene homopolymer,brominated 68441-46-3 N

2,3-Dibromo-2-butene-1,4-diol ####### N

2,4,6-Tribromo-phenyl-allyl-ether 3278-89-5 N

2,4,6-tribromo-phenol 118-79-6 N

2,4-Dibromo-phenol 615-58-7 N



2-Hydroxy-propyl-2-(2-hy-droxy-ethoxy)-ethyl-TBP 20566-35-2 N

Bis(2-ethylhexyl)tetrabromo-phtalate 26040-51-7 N

Bis(methyl)tetrabromo-phta-late 55481-60-2 N

Brominated epoxy resin end-capped with tribromophenol 135229-48-0 N

Brominated epoxy resin end-capped with tribromophenol 139638-58-7 N

Brominated flame retardant which comes under notation of ISO 1043-4 code number FR(14) [Aliphatic/alicyclic bromi-nated compounds]

- N

Brominated flame retardant which comes under notation of ISO 1043-4 code number FR(15) [Aliphatic/alicyclic bromi-nated compounds in combina-tion with antimony compounds]

- N

Brominated flame retardant which comes under notation of ISO 1043-4 code number FR(16) [Aromatic brominated com-pounds excluding brominated diphenyl ether and biphenyls)]

- N

Brominated flame retardant which comes under notation of ISO 1043-4 code number FR(17) [Aromatic brominated com-pounds excluding brominated diphenyl ether and biphenyls) in combination with antimony compounds]

- N

Brominated flame retardant which comes under notation of ISO 1043-4 code number FR(22) [Aliphatic/alicyclic chlori-nated and brominated com-pounds]

- N

Brominated flame retardant which comes under notation of ISO 1043-4 code number FR(42) [Brominated organic phospho-rus compounds]

- N

Brominated polystyrene(BRPS) 57137-10-7 NBromo dichloromethane 75-27-4 NBromo-/Chloro-alpha-olefin 82600-56-4 NBromo-/Chloro-paraffins 68955-41-9 N

45





Chlorinated and brominated phosphate ester 125997-20-8 N

Decabromo-diphenyl-ethane 84852-53-9 N

Dibromo-neopentyl-glycol 3296-90-0 N

Dibromo-propanol 96-13-9 N

Dibromo-styrene grafted PP 171091-06-8 N

Ethylene-bis(5,6-dibromo-nor-bornane-2,3-dicarboximide) 52907-07-0 N

N,N''-Ethylene bis-(tetra-bromo-phthalimide) 32588-76-4 N

Other BFRs, Brominated Flame Retardants and its compounds - N

Pentabromo-benzyl bromide 38521-51-6 N

Pentabromo-benzyl-acrylate, monomer 59447-55-1 N

Pentabromo-benzyl-acrylate, polymer 59447-57-3 N

Pentabromo-phenol 608-71-9 N

Pentabromo-toluene 87-83-2 N

Poly(2,6-dibromo-phenylene oxide) 69882-11-7 N

Poly-dibromo-styrene 31780-26-4 N

TBBS-bis-(2,3-dibromo-propyl-ether) 42757-55-1 N

TBPA Na salt 25357-79-3 N

TBPA, glycol-and propylene-oxide esters 75790-69-1 N

Tetra-decabromo-diphenoxy-benzene 58965-66-5 N



Tetrabromo phthalic anhydride(TBPA) 632-79-1 N

Tetrabromo-bisphenol S 39635-79-5 NTetrabromo-chyclo-octane 31454-48-5 NTribromo-bisphenyl-maleinimide 59789-51-4 NTribromo-neopentyl-alcohol 36483-57-5 NTribromo-phenyl-allyl-ether, unspecified 26762-91-4 N

Tribromo-styrene 61368-34-1 NTris(2,4-Dibromo-phenyl) phos-phate 49690-63-3 N

Tris(tribromo-neopentyl) phos-phate 19186-97-1 N

Tris-(2,3-dibromo-propyl)-iso-cyanurate 52434-90-9 N

Vinyl bromide 593-60-2 N

Chlorinated fire retardants

(S)-2-CHLOROPROPIONIC ACID 29617-66-1 N1,4-BIS((1-(2,5-DICHLOROPHENY-LAZO)-2-HYDROXY-3-NAPHTHOYAL)AMINO)BENZENE

3905-19-9 N

1,4:7,10-DIMETHANODIBENZO(A,E)CYCLOOCTENE

13560-89-9 N

1-(3,4-DICHLOROPHENYL)-3,3-DIMETHYLUREA 330-54-1 N

1-(4-CHLORO-O-SULFO-5-TOLY-LAZO)-2-NAPHTHOL, BARIUM SALT ####### N

1-PROPENE, HOMOPOLYMER, CHLO-RINATED 68442-33-1 N

1H-BENZIMIDAZOLE, 2-(2-CHLOROPHENYL)- 3574-96-7 N

1H-ISOINDOLE-1,3(2H)-DIONE, 4,5,6,7-TETR 30125-47-4 N

2-(2 -HYDROXY-3 -TERT-BUTYL-5 -METHYLPHENYL)-5-CHLOROBENZO-TRIAZOLE

####### N

2-(4-CHLOROBENZYL)-BENZIMIDA-ZOLE 5468-66-6 N

2-BUTANONE, 3-CHLORO- 4091-39-8 N

46





2-BUTENAMIDE, 2-((4-CHLORO-2-NITROPHENYL)AZO)-3-HYDROXY-N-(2-METHOXYPHENYL)-

13515-40-7 N

2-BUTENAMIDE, N-(4-CHLORO-2,5-DIMETHOXYPHENYL)-2-((2,5-DIMETHOXY-4-((PHENYLAMINO)SULFONYL)PHENYL)AZO)-3-HYDROXY-

12225-18-2 N

2-CHLORO-6-NITROANISOLE 80866-77-9 N2-NAPHTALENECARBOXAMIDE, 3-HYDROXY-4-((2-METHOXY-5-((PHENYLAMINO)CARBONYL)PHENYL)AZO)-N-(2-METHOXY-5-CHLOROPHENYL)-

67990-05-0 N

2-NAPHTHALENECARBOXAMIDE COM-POUND 5280-78-4 N

2-NAPHTHALENECARBOXAMIDE, 4-[(2,5-DICHLOROPHENYL)AZO]-3-HYDROXY-N-PHENYL-

6041-94-7 N

2-NAPHTHALENECARBOXYLIC ACID, 4-((5-CHLORO-4-METHYL-2-SUL-FOPHENYL)AZO)-3-HYDROXY-

7585-41-3 N

2-NAPHTHALENECARBOXYLIC ACID, CHLORO-AZO 7023-61-2 N

2-NAPHTHANILIDE, 4 -CHLORO-3-HYDROXY-2 ,5 -DIMETHOXY-4-((2-METHOXY-5-(PHENYLCAR-BAMOYL)PHENYL)AZO)-

5280-68-2 N

2-PYRAZOLIN-5-ONE, 4,4 -(3,3 -DICHLORO-4,4 -BIPHENY-LYLENEBISAZO)-

3520-72-7 N

3-(4-((2,6-DICHLORO-4-NITRO-PHENYL)AZO)-N-(2-HYDROX-YETHYL)ANILINO)PROPIONITRILE,ACETATE (ESTER)

5261-31-4 N

3-(4-CHLOROPHENYL)-1,1-DIMETHYLUREA 150-68-5 N

4(2-CHLOROETHYL)MORPHOLINE HYDROCHLORIDE 3647-69-6 N

4,5-DICHLORO-2-N-OCTYL-3-ISOTHIAZOLONE 64359-81-5 N

4-CHLOROTOLUENE 106-43-4 N5-CHLORO-2-METHYL-4-ISOTHIA-ZOLIN-3-ONE 26172-55-4 N

ACETIC ACID VINYL ESTER, POLYMER WITH CHLOROETHYLENE AND VINYL ALC.

25086-48-0 N

ACETOACETAMIDE, 2-((4-CHLORO-2-NITROPHENYL)AZO)-N-(2-OXO-5-BENZIMIDAZOLINYL)-

12236-62-3 N



ANILINE HYDROCHLORIDE 142-04-1 NBARIUM CHLORIDE (BACL2), DI-HYDRATE 10326-27-9 N

BASIC PIGMENT VIOLET 23 PICCS CARBAZOLE 215247-95-3 N

BENZAMIDE, 2,6-DICHLORO- 2008-58-4 NBENZAMIDE,-CHLORO -AZO-TRI-FLUOROMETHYL 57971-97-8 N

BENZENE, 1,2,4-TRICHLORO- 120-82-1 NBENZENE, 1,2-DICHLORO- 95-50-1 NBENZENE, 1-CHLORO-3-NITRO- 121-73-3 NBENZENE, 1-CHLORO-4-ETHENYL- 1073-67-2 NBENZENESULFONIC ACID, 4-CHLORO-2-((2-HYDROXY-3-(((2- 73263-37-3 N

BENZOIC ACID, 2-(6-(ETHY-LAMINO)-3-(ETHYLIMINO)-2,7-DIMETHYL-3H-XANTHEN-9-YL)-

3068-39-1 N

BUPIVACAINE HYDROCHLORIDE 14252-80-3 NBUTANAMIDE, N,N -(3,3 -DIMETHYL(1,1 -BIPHENYL)-4,4 -DIYL)BIS(2-((2,4-DICHLOROPHENYL)AZO)-3-OXO-

5979-28-2 N

BUTENAMIDE, 2-((4-CHLORO-2-NITROPHENYL)AZO)-N-(2-CHLOROPHENYL)-3-OXO-

6486-23-3 N

BUTYL 2,4-DICHLOROPHENOXYAC-ETATE 94-80-4 N

C.I. 20055 CROMOPHTAL RED 68259-05-2 NC.I. PIGMENT GREEN 7 1328-53-6 NC.I. PIGMENT YELLOW 55 6358-37-8 NC.I. PIGMENT YELLOW 83 5567-15-7 NCARBONIC DICHLORIDE 75-44-5 NCHLORENDIC ANHYDRIDE 115-27-5 NCHLORIDE 16887-00-6 NCHLORINATED NATURAL RUBBER 9006-03-05 NCHLORINATED PARAFFINS 63449-39-8 NCHLORINE 22537-15-1 NCHLORINE 7782-50-5 NCHLOROANILINE 27134-26-5 NCHLORODIHYDROQUINOACRIDINE-DIONE 3089-17-6 N

47





CHLORODIPHENYL 37324-23-5 NCHLOROENDRIC ACID 115-28-6 NCHLOROMETHYL PIVALATE (POM) 18997-19-8 NCHLOROMETHYL THIAZOLONE 55965-84-9 NCHLOROPENTANES, MIXTYRE OF ISOMERS 29656-63-1 NCHLOROTOLURON 15545-48-9 NCHROMATE(3-), BIS(5-CHLORO-3-((4,5-DIHYD 73324-05-7 N

CHROMATE, CHLOROPHENYL, AZO 31714-55-3 NCOBALT CHLORIDE (COCL2), HEXAHY-DRATE 7791-13-1 N

COPPER MONOCHLOROPHTHALOCYANINE 12239-87-1 NCOPPER PERCHLOROPHTHALOCYANINE 14832-14-5 NCYCLOPROPANECARBOXYLIC ACID, 3-(2-CHLORO-3,3,3-TRIFLUORO-1-PROPENYL)-2,2-DIMETHYL-, (2-METHYL(1,1 -BIPHENYL)-3-YL)METHYL ESTER, (1.ALPHA.,3.ALPHA.(Z))-

82657-04-3 N

DIARYLANILIDE YELLOW 6358-85-6 NDICHLORO-2,2-P-CYCLOPHANE 28804-46-8 NDICHLORODIMETHYLSILANE REACTION PRODUCT WITH SILICA 68611-44-9 N

DICHLOROMETHANE 1975-09-02 NDYE 26 76871-75-5 NEPICHLOROHYDRIN 106-89-8 NETHANAMINIUM, N-(6-(DIETHYLAMINO)-9-(2-(METHOXYCARBONYL)PHENYL)-3H-XANTHEN-3-YLIDENE)-N-ETHYL-, CHLO-RIDE

39393-39-0 N

HYDROCHLORIC ACID 7647-01-0 NISOINDOLE-TETRACHLORO-QUINOLINYL 56731-19-2 NLITHIUM CHLORIDE (LICL) 7447-41-8 NLithium perchlorate 7791-03-09 NMETHYLAMINE HYDROCHLORIDE 593-51-1 NMETHYLPHOSPHONIC DICHLORIDE 676-97-1 NNICKEL CHLORIDE (NICL2) 　　Nickel chloride 7718-54-9 NNICKEL CHLORIDE (NICL2), HEXAHY-DRATE 7791-20-0 N

Other Chlorinated Flame Retardants - NPARA-DICHLOROBENZENE 106-46-7 NPHENOL, 2,4-DICHLORO- 120-83-2 NPHOSPHONOUS DICHLORIDE, PHENYL- 644-97-3 NPHOSPHOROUS TRICHLORIDE 7719-12-02 N



PHOSPHORUS OXYCHLORIDE 10025-87-3 NPHOSPHORUS PENTACHLORIDE 10026-13-8 NPOLYCHLOROPRENE 9010-98-4 NPOLYOLEFINS SULFONIC ACIDS 68037-39-8 NPYRROLO(3,4-C)PYRROLE-1,4-DIONE COMPOUND 84632-65-5 N

SODIUM CHLORIDE 7647-14-5 NTETRACHLORO-U-HYDROXY(U-METHACRYLATO-O:O)DICHROMIUM 15096-41-0 N

TETRACHLOROETHYLENE 127-18-4 NTETRACHLOROPHTHALIC ANHYDRIDE(TCPA) 117-08-8 N

THIOSULFAN 115-29-7 NTRICHLORO DI-P-XYLYLENE 29716-49-2 NTRICHLOROVINYLSILICON 75-94-5 NTRIETHYLAMINE HYDROCHLORIDE 554-68-7 NTRIS(CHLOROETHYL) PHOSPHATE 29716-44-7 NTrichloroethylene 1979-01-06 YTris(2-chloroethyl)phosphate 115-96-8 YVINYL CHLORIDE 1975-01-04 NVINYL CHLORIDE COPOLYMER 25037-78-9 NVINYL CHLORIDE-VINYL ACETATE COPOLYMERS 9003-22-9 N

ZINC CHLORIDE 7646-85-7 NCobalt dichloride Cobalt dichloride 7646-79-9 Y

Phthalate

1,2-Benzenedicarboxylic acid diisodecyl ester (DIDP) 26761-40-0 N

1,2-Benzenedicarboxylic acid, di-C6-8-branched alkyl esters, C7-rich

71888-89-6 Y

1,2-Benzenedicarboxylic acid, di-C7-11-branched and linear alkyl esters

68515-42-4 Y

1,2-Benzenedicarboxylic acid, dipentylester, branched and linear

84777-06-0 Y

Bis(2-methoxyethyl) phthalate 117-82-8 YDiethyl phthalte(DEP) 84-66-2 NDihexyl phthalate 84-75-3 YDiisopentylphthalate 605-50-5 Y

48




Phthalate

Dimethyl phthalate (DMP) 131-11-3 NDipentyl phthalate (DPP) 131-18-0 YN-pentyl-isopentylphthalate 776297-69-9 Y

Other phthalate compounds 　 N

Polyvinyl Chlo-ride

Other PVC compounds - NPolyvibyl Chloride(PVC) 93050-82-9 NPolyvibyl Chloride(PVC) 9002-86-2 NPolyvinylidene Chloride(PVC) 9002-85-1 NPolyvinylimidazolinium Chlo-ride(PVC) 81517-61-5 N

Tetrabromo bisphenol A

3,5,3’,5’-Tetrabromo-bisphenol A (TBBA) 79-94-7 N

TBBA bis-(2-hydroxy-ethyl-ether) 4162-45-2 N

TBBA carbonate oligomer 28906-13-0 N

TBBA carbonate oligomer, 2,4,6-tribromo-phenol terminated 71342-77-3 N

TBBA carbonate oligomer, phe-noxy end capped 94334-64-2 N

TBBA, 2,2-Bis(4-(2,3-Epoxypropyloxy)dibromophenyl) propane polymer

68928-70-1 N

TBBA, unspecified 30496-13-0 N

TBBA-(2,3-dibromo-propyl-ether) 21850-44-2 NTBBA-TBBA-diglycidyl-ether oligomer 70682-74-5 N

TBBA-bis-(allyl-ether) 25327-89-3 NTBBA-bisphenol A-phosgene poly-mer 32844-27-2 N

TBBA-dimethyl-ether 37853-61-5 N

TBBA-epichlorhydrin oligomer 40039-93-8 N

TBBA-polycarbonate 156042-31-8 N

49

■ Substance List – Reach



REACH SVHC Can-didate List

1,2,3-Trichloropropane 96-18-4 Y1,2-Benzenedicarboxylic acid, di-C6-10-alkyl esters 68515-51-5 Y1,2-Benzenedicarboxylic acid, di-hexyl ester, branched and linear 68515-50-4 Y1,2-Benzenedicarboxylic acid, mixed decyl and hexyl and octyl diesters

68648-93-1 Y

1,2-Diethoxyethane 629-14-1 Y1,2-benzenedicarboxylic acid, di-C6-10-alkyl esters; 1,2-ben-zenedicarboxylic acid, mixed de-cyl and hexyl and octyl diesters with ≥ 0.3% of dihexyl phthalate (EC No. 201-559-5)

- Y

1,2-bis(2-methoxyethoxy)ethane (TEGDME; triglyme) 112-49-2 Y1,2-dichloroethane 107-06-2 Y1,2-dimethoxyethane; ethylene glycol dimethyl ether (EGDME) 110-71-4 Y1,3,5-Tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione (T-GIC)

2451-62-9 Y

1,3,5-tris[(2S and 2R)-2,3-epoxypropyl]-1,3,5-triazine-2,4,6-(1H,3H,5H)-trione (β-TGIC)

59653-74-6 Y

1,3-propanesultone 1120-71-4 Y1-Methyl-2-pyrrolidone 872-50-4 Y2,4-Dinitrotoluene 121-14-2 Y2,4-di-tert-butyl-6-(5-chloroben-zotriazol-2-yl)phenol (UV-327) 3864-99-1 Y2-(2H-benzotriazol-2-yl)-4,6-ditertpentylphenol (UV-328) 25973-55-1 Y2-(2H-benzotriazol-2-yl)-4-(tert-butyl)-6-(sec-butyl)phenol (UV-350)

36437-37-3 Y

2-Ethoxyethanol 110-80-5 Y2-Ethoxyethyl acetate 111-15-9 Y2-Methoxyethanol 109-86-4 Y2-benzotriazol-2-yl-4,6-di-tert-butylphenol (UV-320) 3846-71-7 Y


REACH SVHC Candi-date List

4,4'-bis(dimethylamino)-4''-(methy-lamino)trityl alcohol with ≥ 0.1% of Michler's ketone (EC No. 202-027-5) or Michler's base (EC No. 202-959-2)

561-41-1 Y

4,4'-bis(dimethylamino)benzophenone (Michler’s ketone) 90-94-8 Y4-(1,1,3,3-tetramethylbutyl)phenol 140-66-9 Y4-(1,1,3,3-tetramethylbutyl)phenol, ethoxylated [covering well-defined substances and UVCB substances, polymers and homologues]

- Y

4-Nonylphenol, branched and linear [substances with a linear and/or branched alkyl chain with a carbon number of 9 covalently bound in posi-tion 4 to phenol, covering also UVCB- and well-defined substances which in-clude any of the individual isomers or a combination thereof]

- Y

4-Nonylphenol, branched and linear, ethoxylated [substances with a linear and/or branched alkyl chain with a carbon number of 9 covalently bound in position 4 to phenol, ethoxylated covering UVCB- and well-defined sub-stances, polymers and homologues, which include any of the individual isomers and/or combinations thereof]

- Y

5-sec-butyl-2-(2,4-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane - Y5-sec-butyl-2-(2,4-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane [1], 5-sec-butyl-2-(4,6-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane

- Y

5-sec-butyl-2-(4,6-dimethylcyclohex-3-en-1-yl)-5-methyl-1,3-dioxane - Y5-tert-butyl-2,4,6-trinitro-m-xylene (musk xylene) 81-15-2 YAcrylamide 1979-06-01 Y3-ethyl-2-methyl-2-(3-methylbutyl)-1,3-oxazolidine 143860-04-2 Y

50





Aluminosilicate Refractory Ce-ramic Fibres are fibres covered by index number 650-017-00-8 in Annex VI, part 3, table 3.1 of Regulation (EC) No 1272/2008 of the European Parliament and of the Council of 16 December 2008 on classification, labelling and packaging of substances and mixtures, and fulfil the three following conditions: a) oxides of aluminium and silicon are the main components present (in the fibres) within variable concentration ranges b) fibres have a length weighted geometric mean di-ameter less two standard geo-metric errors of 6 or less mi-crometres (µm) c) alkaline ox-ide and alkali earth oxide (Na2O+K2O+CaO+MgO+BaO) content less or equal to 18% by weight

- Y

Ammonium salts of perfluo-rononan-1-oic-acid 4149-60-4, 　

Bis(2-methoxyethyl) ether 111-96-6 YBoric acid 10043-35-3 YBoric acid - YBoric acid, crude natural 11113-50-1 YCobalt(II) carbonate 513-79-1 YCobalt(II) diacetate 71-48-7 YCobalt(II) dinitrate 10141-05-6 YCobalt(II) sulphate 10124-43-3 YCyclohexane-1,2-dicarboxylic anhydride 85-42-7 YCyclohexane-1,2-dicarboxylic anhydrideall possible combina-tions of the cis- and trans-iso-mers

- Y

Diazene-1,2-dicarboxamide (C,C'-azodi(formamide)) (ADCA) 123-77-3 YDiboron trioxide 1303-86-2 Y



Dichromium tris(chromate) 24613-89-6 YDiethyl sulphate 64-67-5 YDimethyl sulphate 77-78-1 YDinoseb (6-sec-butyl-2,4-dinitro-phenol) 88-85-7 YDisodium 3,3'-[[1,1'-biphenyl]-4,4'-diylbis(azo)]bis(4-aminonaphtha-lene-1-sulphonate) (C.I. Direct Red 28)

573-58-0 Y

Disodium 4-amino-3-[[4'-[(2,4-di-aminophenyl)azo][1,1'-biphenyl]-4-yl]azo] -5-hydroxy-6-(phenylazo)naphthalene-2,7-disulphonate (C.I. Direct Black 38)

1937-37-7 Y

Disodium tetraborate, anhydrous1303-96-4, 1330-43-4, 12179-04-3

Y

Formamide 1975-12-07 YFuran 110-00-9 YHenicosafluoroundecanoic acid 2058-94-8 YHeptacosafluorotetradecanoic acid 376-06-7 YHexahydro-1-methylphthalic an-hydride 48122-14-1 YHexahydro-3-methylphthalic an-hydride 57110-29-9 YHexahydro-4-methylphthalic an-hydride 19438-60-9 YHexahydromethylphthalic anhy-dride 25550-51-0 Y

Hexahydromethylphthalic anhy-dride including cis- and trans- stereo isomeric forms and all pos-sible combinations of the isomers

- Y

Hydrazine 302-01-2, 7803-57-8 Y

Imidazolidine-2-thione (2-imidazo-line-2-thiol) 96-45-7 YMethoxyacetic acid 625-45-6 Y

51




REACH SVHC Can-didate List

Methyloxirane (Propylene ox-ide) 75-56-9 YN,N,N',N'-tetramethyl-4,4'-methylenedianiline (Michler’s base)

101-61-1 Y

N,N-dimethylacetamide 127-19-5 YN,N-dimethylformamide 1968-12-02 YN-methylacetamide 79-16-3 YNitrobenzene 98-95-3 YPentacosafluorotridecanoic acid 72629-94-8 YPentazinc chromate octahydrox-ide 49663-84-5 YPerboric acid, sodium salt 11138-47-9 YPerfluorononan-1-oic-acid 375-95-1 Y

Perfluorononan-1-oic-acid and its sodium and ammonium salts - Y

Phenolphthalein 1977-09-08 YPitch, coal tar, high temp. 65996-93-2 YPotassium hydroxyoctaoxodiz-incatedichromate 11103-86-9 Y

Sodium perborate 15120-21-5 YSodium perborate; perboric acid, sodium salt - Y

Sodium peroxometaborate 7632-04-04 YSodium salts of perfluorononan-1-oic-acid 21049-39-8, 　

Tetraboron disodium heptaox-ide, hydrate 12267-73-1 Y

Tricosafluorododecanoic acid 307-55-1 Y

Trixylyl phosphate 25155-23-1 Y


EACH SVHC Candi-date List

Zirconia Aluminosilicate Refrac-tory Ceramic Fibres are fibres covered by index number 650-017-00-8 in Annex VI, part 3, table 3.1 of Regulation (EC) No 1272/2008 of the European Par-liament and of the Council

- Y

[4-[4,4'-bis(dimethylamino) benzhydrylidene]cyclohexa-2,5-dien-1-ylidene]dimethylammonium chloride (C.I. Basic Violet 3) with ≥ 0.1% of Michler's ketone (EC No. 202-027-5) or Michler's base (EC No. 202-959-2)

548-62-9 Y

[4-[[4-anilino-1-naphthyl][4-(dimethylamino)phenyl]methylene]cyclohexa-2,5-dien-1-yli-dene] dimethylammonium chlo-ride (C.I. Basic Blue 26) with ≥ 0.1% of Michler's ketone (EC No. 202-027-5) or Michler's base (EC No. 202-959-2)

2580-56-5 Y

is-cyclohexane-1,2-dicarboxylic anhydride 13149-00-3 Yreaction mass of 2-ethylhexyl 10-ethyl-4,4-dioctyl-7-oxo-8-oxa-3,5-dithia-4-stannatetrade-canoate and 2-ethylhexyl 10-ethyl-4-[[2-[(2-ethylhexyl)oxy]-2-oxoethyl]thio]-4-octyl-7-oxo-8-oxa-3,5-dithia-4-stannate-tradecanoate (reaction mass of DOTE and MOTE)

- Y

trans-cyclohexane-1,2-dicar-boxylic anhydride 14166-21-3 Yα,α-Bis[4-(dimethylamino)phenyl]-4 (phenylamino)naphthalene-1-methanol (C.I. Solvent Blue 4) with ≥ 0.1% of Michler's ketone (EC No. 202-027-5) or Michler's base (EC No. 202-959-2)

6786-83-0 Y

52

■ Substance List – Others



Medium-chain chlori-nated paraffins, C14-C17

Medium-chain chlorinated paraf -fins, C14-C17 85535-85-9 N

Perchlorate Other perchlorate compounds - N

Persistent Free Radi-cals

Other PFRs, Phosphorus Flame Retardants and its compounds 　 N

Triphenyl phosphate - N

Radioactive Sub-stances

Americium-241 14596-10-2 N

Cesium (Radioactive Isotopes only)

7440-46-2 (Cs-137 010045-

97-3)N

Other radioactive substances - N

Radon 10043-92-2 N

Strontium (Radioactive Isotopes only)

7440-29-6 (Sr-90 10098-97-

2)N

Thorium-232 7440-29-1 N

Uranium-238 7440-61-1 N

Triclosan Triclosan 3380-34-5 N

53

Ⅲ. 예외 List■ Exemptions List – Class 1Sub-

stance

Category

Excep-tion

CodeException_KR Exception_EN

CD CD001 one shot pellet형태의 열차단기에 사용된 카드뮴 및 그 화합물 Cadmium and its compounds in one shot pellet type thermal cut-offs

CD CD002 전기접점에 사용된 카드뮴 및 그 화합물 Cadmium and its compounds in electrical contacts

CD CD003 필터용 유리 및 Reflectance standard 용 유리에 함유된 납과 카드뮴 Cadmium and lead in filter glasses and glasses used for re-flectance standards

CD CD004 붕규산유리와 소다석회유리 위의 에나멜 인쇄 잉크에 함유된 납과 카드뮴 Lead and cadmium in printing inks for the application of enam-els on glasses, such as borosilicate and soda lime glasses

CD CD005100dB(A) 이상의 음압레벨의 고출력 Loudspeaker 에 사용하는 변환기 내의 Voice coil에 직접 부착되는 전기 도체를 전기 , 기계적으로 접합하기위해 사용되는 카드뮴 합금 솔더

Cadmium alloys as electrical/mechanical solder joints to elec-trical conductors located directly on the voice coil in trans-ducers used in high-powered loudspeakers with sound pressure levels of 100 dB (A) and more

CD CD007 산화베릴륨이 부착된 알루미늄 위에 사용된 thick film paste 내 카드뮴 및 산화카드뮴

Cadmium and cadmium oxide in thick film pastes used on alu-minium bonded beryllium oxide

CD CD008 고체 조명 또는 디스플레이 시스템에 사용되는 색변환 II-VI LEDs(<10ug/mm2 light-emitting area) 내 카드뮴

Cadmium in colour converting II-VI LEDs (< 10 μg Cd per mm 2 of light-emitting area) for use in solid state illumination or display systems

CD CD009

다음의 경우 glass packaging 은 기준농도 초과를 예외 인정 (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufac-turing process · The packaging material may only exceed the concentration limits because of the addition of recycled mate-rials

Glass packaging is allowed to exceed where it complies with all the conditions established in (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be in-tentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits be-cause of the addition of recycled materials

CD CD011 휴대용 X 선 형광분석기의 카드뮴 동위원소 방사선원 Radioactive cadmium isotope source for portable X-ray fluores-cence spectrometers

CD CD012 pH 전극의 유리를 포함하는 이온선택성 전극에서 카드뮴 Sensors, detectors and electrodes : 1a. cadmium in ion selec-tive electrodes including glass of pH electrodes

CD CD013 적외선 광 검출기에서 카드뮴 1c. cadmium in infra-red light detectorsCD CD014 헬륨 -카드뮴레이저에서 카드뮴 Cadmium in helium-cadmium lasers.CD CD015 원자흡수분광램프에서 카드뮴 cadmium in atomic absorption spectroscopy lamps.

CD CD016 자기공명영상과 초전도양자간섭계 검출기내의 초전도 재료의 금속 결합에서 카드뮴 cadmium in metallic bonds to superconducting materials in MRI and SQUID detectors.

CD CD017 X선 측정 필터에서 카드뮴 Cadmium in X-ray measurement filters.CD CD018 전리방사선 검출기에서 카드뮴 Cadmium in detectors for ionising radiation.

CD CD019 이미지에 대한 영상강화기 내의 형광코팅 내의 카드뮴 -2020년 1월 1일 전 시장에 출시된 서비스 자재

Cadmium in phosphor coatings in image intensifiers for X-ray imagesX-ray until 31 December 2019 and in spare parts forX-ray systems placed on the EU marketbefore 1 January 2020

CD CD0202014년 7월 22 일 이전에 시장에 출시된 의료기기로 부터 재생된 재사용 서비스 자재 , 2021년 7월 22 일 이전에 출시된 카테고리 8 에 사용된 서비스 자재 내의 카드뮴은 기업내 회수 시스템으로 확인가능하다면 고객에게 공지된 후 사용될수 있다 .

cadmium in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is noti-fied to the consumer

CR CR001 흡수식 냉각장치의 탄소강 냉각배관내의 흡수제에 포함된 부식 방지제로서 0.75%이하 함유된 육가크롬

Hexavalent chromium as an anticorrosion agent of the carbon steel cooling system in absorption refrigerators up to 0,75 % by weight in the cooling solution

54

■ Exemptions List – Class 1

Ⅲ. 예외 List

Sub-stance

Category

Excep-tion


CR CR002

다음의 경우 glass packaging 은 기준농도 초과를 예외 인정 (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufac-turing process · The packaging material may only exceed the concentration limits because of the addition of recycled mate-rials

Glass packaging is allowed to exceed where it complies with all the conditions established in (Commission Decision 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be in-tentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits be-cause of the addition of recycled materials

CR CR003x-ray 영상강화기 내의 광음극생성에 사용되는 알칼리 디스펜서 내의 6 가 크롬은 2019년 12월 31 일까지 , 그에대한 서비스자재는 2020년 1월 1일 전에 출시되어야 한다 .

Hexavalent chromium in alkali dispensers used to create photo-cathodes in X-ray image intensifiers until 31 December 2019 and in spare parts for X-ray systems placed on the EU market before 1 January 2020

CR CR0042014년 7월 22 일 이전에 시장에 출시된 의료기기로 부터 재생된 재사용 서비스 자재 , 2021년 7월 22 일 이전에 출시된 카테고리 8 에 사용된 서비스 자재 내의 6가크롬은 기업내 회수 시스템으로 확인가능하다면 고객에게 공지된 후 사용될수 있다 .

hexavalent chromium in reused spare parts, recovered from medi-cal devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in auditable closed-loop business-to-business return systems, and that the reuse of parts is notified to the consumer.

HG HG001 단일덮개가 씌워진 형광램프 내 다음을 초과하지 않는 수은 ( 버너 마다 ) Mercury in single capped (compact) fluorescent lamps not exceeding (per burner):










HG HG011 이중덮개가 씌워진 일반용 직선형광램프 내 다음을 초과하지 않는 수은 ( 램프마다 ) Mercury in double-capped linear fluorescent lamps for general lighting purposes not exceeding (per lamp):




55


Ⅲ. 예외 List

Sub-stance

Category

Excep-tion








HG HG021 그 외 형광램프 내 다음을 초과하지 않는 수은 Mercury in other fluorescent lamps not exceeding (per lamp):






HG HG027 특수용 냉음극형광램프와 외부전극형광램프 (CCFL, EEFL) 내 다음을 초과하지 않는 수은

Mercury in cold cathode fluorescent lamps and external electrode fluores-cent?lamps (CCFL and EEFL) for special purposes not exceeding (per lamp):









56

■ Exemptions List – Class 1Sub-

stance

Category

Excep-tion




HG HG033 그 외 저압방전램프 내 다음을 초과하지 않는 수은 Mercury in other low pressure discharge lamps (per lamp)HG HG034 그 외 저압방전램프 내 다음을 초과하지 않는 수은 Mercury in other low pressure discharge lamps (per lamp)

HG HG035 일반용 연색성 Ra 60 이상의 고압나트륨램프 내 다음을 초과하지 않는 수은Mercury in High Pressure Sodium (vapour) lamps for general lighting pur-poses not exceeding (per burner) in lamps with improved colour rendering index Ra >?60:






HG HG041 그 외의 일반용 연색성 고압나트륨램프 내 다음을 초과하지 않는 수은 Mercury in other High Pressure Sodium (vapour) lamps for general lighting purposes not exceeding (per burner):






HG HG047 고압수은램프 내 수은 (HPMV) Mercury in High Pressure Mercury (vapour) lamps (HPMV)

Ⅲ. 예외 List

57


stance

Category

Excep-tion


HG HG048 금속할라이트램프 내 수은 (MH) Mercury in metal halide lamps (MH)

HG HG049 그 외의 언급되지 않은 ? 특수용 방전램프 내 수은 Mercury in other discharge lamps for special purposes not specifically mentioned

HG HG050 디스플레이 당 30mg까지 DC 플라즈마 디스플레이 내 음극 불꽃 발생억제제(cathode sputtering inhibitor) 로 사용된 수은

Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display

HG HG051

다음의 경우 glass packaging 은 기준농도 초과를 예외 인정 (Commission Deci-sion 2001/171/EC) · No lead, cadmium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only exceed the concentration limits because of the addition of recycled materials

Glass packaging is allowed to exceed where it complies with all the condi-tions established in (Commission Decision 2001/171/EC) · No lead, cad-mium, mercury or hexavalent chromium shall be intentionally introduced during the manufacturing process · The packaging material may only ex-ceed the concentration limits because of the addition of recycled materials

HG HG052 전리방사선 검출기에서 수은 Mercury in detectors for ionising radiation.

HG HG053 적외선 광 검출기에서 수은 1c. mercury in infra-red light detectors

HG HG054 기준 전극에서 수은 : 저염 염화 수은 , 황산 수은 그리고 산화 수은 1d. Mercury in reference electrodes: low chloride mercury chloride, mer-cury sulphate and mercury oxide.

HG HG055 고정밀용량과 손실측정브리지에서 수은 그리고 개폐기 또는 중계기 당 수은 20mg을 초과하지 않는 감시 및 통제기기의 고주파 RF 개폐기 및 중계기에서 수은

Mercury in very high accuracy capacitance and loss measurement bridges and in high frequency RF switches and relays in monitoring and control in-struments not exceeding 20 mg of mercury per switch or relay.

HG HG056 일반용도의 30W 이하 , 2 만시간또는 그 이상의 수명을 가진 조명기기는 3.5mg For general lighting purposes < 30 W with a lifetime equal or above 20 000 h: 3,5 mg

HG HG059 램프당 5mg 이 넘지 않는 LCD 후면발광에 사용되는 냉음극 경광등에 사용되는 수은

Mercury in cold cathode fluorescent lamps for back-lighting liquid crystal displays, not exceeding 5 mg per lamp, used in industrial monitoring and control instruments placed on the market before 22 July 2017

HG HG060 고주파로 작동하는 혈관 초음파 영상 시스템에 사용되는 전기 회전 커넥터 내의 수은Mercury in electric rotating connectors used in intravascular ultrasound imaging systems capable of high operating frequency (> 50 MHz) modes of operation.Expires on 30 June 2019.

PB PB001 음극선관 유리 내 납 Lead in glass of cathode ray tubes

PB PB002 0.2% 무게를 초과하지 않는 형광튜브 유리 내 납 Lead in glass of fluorescent tubes not exceeding 0.2 % by weightPB PB003 아연 도금강 및 기계가공용 철합금 내 0.35% 이하 함유된 납 Lead as an alloying element in steel for machining purposes and in galva-

nized steel containing up to 0,35 % lead by weightPB PB004 알루미늄 합금 내 0.4% 이하 함유된 납 Lead as an alloying element in aluminium containing up to 0.4 % lead by

weight

Ⅲ. 예외 List

58


stance

Category

Excep-tion


PB PB005 구리 합금 내 4% 이하 함유된 납 Copper alloy containing up to 4 % lead by weight

PB PB006 고융점온도 솔더 내 85% 이상 함유된 납 Lead in high melting temperature type solders (i.e. lead- based alloys con-taining 85 % by weight or more lead)

PB PB007 서버 , 스토리지 , 스토리지 배열시스템 , 스위칭을 위한 네트워크 기반장치 , 시그널링 , 전송 , 통신을 위한 네트워크 관리장치에 사용되는 솔더에 함유된 납

Lead in solders for servers, storage and storage array systems, network in-frastructure equipment for switching, signalling, transmission, and network management for telecommunications

PB PB008 세라믹 ( 압전소자나 세라믹 혼합물과 같은 Capacitor 내 유전세라믹 제외 ) 내 납Electrical and electronic components containing lead in ceramic other than dielectric ceramic in capacitors,?e.g. piezoelectronic devices, or ceramic matrix compound

PB PB009 전기 · 전자 부품의 유리 내 납 Electrical and electronic components containing lead in a glass.

PB PB010 전압 125V AC 이상 또는 250V DC 이상의 콘덴서 내 유전체세라믹에 함유된 납 Lead in dielectric ceramic in capacitors for a rated voltage of 125 V AC or 250 V DC or higher

PB PB011 전압 125V AC 미만 또는 250V DC 미만의 콘덴서 내 유전체세라믹에 함유된 납 Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC

PB PB012 발열 , 환기 , 에어컨디션 , 냉각 (HVACR) 을 위한 압축기의 베어링 셀과 부싱에 함유된 납

Lead in bearing shells and bushes for refrigerant-containing compressors for heating, ventilation, air conditioning and refrigeration (HVACR) applica-tions

PB PB013 C-press compliant pin connector 시스템에 사용된 납 Lead used in C-press compliant pin connector systemsPB PB014 C-press compliant pin connector 시스템 이외에 사용된 납 Lead used in other than C-press compliant pin connector systemsPB PB015 열전도모듈 C-ring 의 코팅물질로 사용된 납 Lead as a coating material for the thermal conduction module C-ring

PB PB016 광학적용을 위한 백색 유리 내 납 Lead in white glasses used for optical applications

PB PB017 필터용 유리 및 Reflectance standard 용 유리에 함유된 납과 카드뮴 Cadmium and lead in filter glasses and glasses used for reflectance stan-dards

PB PB018 마이크로프로세서의 핀과 패키지의 접합을 위해 사용되는 2 개 이상의 원소으로 구성된 솔더에 80~85% 함유된 납

Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight

PB PB019 집적회로 플립칩 패키지 내부 반도체 Die 와 캐리어의 확실한 전기접속에 필요한 솔더에 함유된 납

Lead in solders to complete a viable electrical connection between semi-conductor die and carrier within integrated circuit flip chip packages

PB PB020 규산염으로 코팅된 튜브를 가진 ? 직선형 백열램프 내 납 Lead in linear incandescent lamps with silicate coated tubesPB PB021 업무용복사기기에 사용되는 고강도방전램프 내의 발광물질로 사용되는 할로겐화납 Lead halide as radiant agent in high intensity discharge (HID) lamps used

for professional reprography applications

Ⅲ. 예외 List

59


Ⅲ. 예외 List

Sub-stance

Category

Excep-tion


PB PB022SMS((Sr,Ba)2MgSi2O7:Pb) 와 같은 형광체를 사용한 포충기 , 디아조복사 , 리소그래피 , 광화학 및 경화처리용 특수 램프로 사용되는 방전램프의 형광파우더 내에 활성제로 사용되는 납 ( 중량비율 1% 이하 )

Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as speciality lamps for diazoprinting reprogra-phy, lithography, insect traps, photochemical and curing processes con-taining phosphors such as SMS ((Sr,Ba) 2 MgSi 2 O 7 :Pb)

PB PB023 BSP(BaSi2O5:Pb) 와 같은 형광체를 사용한 Sun tanning 램프로 사용되는 방전램프

Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps containing phosphors such as BSP (BaSi 2 O 5 :Pb)

PB PB024 ESL( 초소형 에너지 절약 램프 ) 에 주아말감으로써 PbBiSn-Hg 와 PbInSn-Hg 및 보조아말감으로써 PbSn-Hg 에 특수하게 함유된 납

Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgam and with PbSn-Hg as auxiliary amalgam in very compact energy saving lamps (ESL)

PB PB025 LCD 에 사용하는 평면형광램프의 전후 기판 접합에 사용하는 유리에 함유된 납 Lead oxide in glass used for bonding front and rear substrates of flat fluo-rescent lamps used for Liquid Crystal Displays (LCDs)

PB PB026 붕규산유리와 소다석회유리 위의 에나멜 인쇄 잉크에 함유된 납과 카드뮴 Lead and cadmium in printing inks for the application of enamels on glasses, such as borosilicate and soda lime glasses

PB PB027 광통신 시스템에 사용하는 RIG 의 불순물로서의 납 Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic communications systems.

PB PB028 0.65mm pitch 이하 커넥터의 마무리용으로 사용되는 납 Lead in finishes of fine pitch components?other than connectors with a pitch of 0,65 mm and less

PB PB029 기계가공으로 구멍 (Hole) 이 뚫린 원반 (discoidal)형 및 평면 배열 (Planar array)형 세라믹 다층 콘덴서의 pin 고정용 솔더에 함유된 납

Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors

PB PB030 표면 전도 전자 방출 디스플레이 (SED) 내의 구성요소인 Seal frit, frit ring 에 사용되는 산화납

Lead oxide in surface conduction electron emitter displays (SED) used in structural elements, notably in the seal frit and frit ring

PB PB031 Black light blue 램프의 유리봉합에 사용되는 산화납 Lead oxide in the glass envelope of black light blue lamps

PB PB032 고출력 (125dB SPL 이상의 기본출력으로 일정시간 작동 ) 확성기 내 변환기용 납합금 솔더

Lead alloys as solder for transducers used in high-powered (designated to operate for several hours at acoustic power levels of 125 dB SPL and above) loudspeakers

PB PB033 상임위원회 지침 69/493/EEC 부속서 I(카테고리 1,2,3,4) 에 정의된 크리스탈유리 내 납

Lead bound in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) of Council Directive 69/493/EEC ( 1 )

PB PB034 무수은 평판형광램프의 솔더에 함유된 납 (e.g. LCD, 설계 또는 산업조명에 사용되는 램프 )

Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used for liquid crystal displays, design or industrial lighting)

PB PB035 아르곤과 크립톤 레이저 튜브의 Window assembly 제작에 사용되는 Seal frit 내 산화납

Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser tubes

PB PB036 전기변압기 내 직경 100um 이하의 ???얇은 구리선의 솔더링을 위한 솔더에 함유된 납

Lead halide as radiant agent in high intensity discharge (HID) lamps used for professional reprography applications

PB PB037 Cermet-based 반고정형 가변저항기 내 납Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge lamps when used as sun tanning lamps con-taining phosphors such as BSP (BaSi 2 O 5 :Pb)

60


stance

Category

Excep-tion


PB PB042 X 선관 (官 ) 에서 산출되는 납 Lead bearings in X-ray tubes.

PB PB043 전자방사선 증폭기에서 납 : 마이크로 채널 판형과 모세관 판형 Lead in electromagnetic radiation amplification devices: micro-channel plate and capillary plate.

PB PB044 X 선관과 광증폭기의 유리원료에서 납 그리고 전자방사선을 전자로 변환하는 진공관과 기체레이저의 조립품을 위한 유리원료 접합제에서 납

Lead in glass frit of X-ray tubes and image intensifiers and lead in glass frit binder for assembly of gas lasers and for vacuum tubes that convert elec-tromagnetic radiation into electrons.

PB PB045 전리방사선의 차폐물에서 납 Lead in shielding for ionising radiation.PB PB046 X 선 피험 (被驗 ) 물질에서 납 Lead in X-ray test objects.PB PB047 스테아르산 납 X 선 회절 결정체 Lead stearate X-ray diffraction crystals.

PB PB048 pH 전극의 유리를 포함하는 이온선택성 전극에서 납 Sensors, detectors and electrodes : 1a. Lead in ion selective electrodes in-cluding glass of pH electrodes

PB PB049 전기화학식 산소 센서에서 납 양극 1b. Lead anodes in electrochemical oxygen sensors.PB PB050 적외선 광 검출기에서 납 1c. Lead in infra-red light detectorsPB PB051 원자흡수분광램프에서 납 Lead in atomic absorption spectroscopy lamps.

PB PB052 자기공명영상내의 초전도체 및 열전도체 합금에서 납 Lead in alloys as a superconductor and thermal conductor in MRI.

PB PB053 자기공명영상과 초전도양자간섭계 검출기내의 초전도 재료의 금속 결합에서 납 Lead in metallic bonds to superconducting materials in MRI and SQUID de-tectors.

PB PB054 평형추에서 납 Lead in counterweights.PB PB055 초음파 변환기의 단결정 압전체에서 납 Lead in single crystal piezoelectric materials for ultrasonic transducers.PB PB056 초음파 변환기의 접합을 위한 솔더에서 납 Lead in solders for bonding to ultrasonic transducers.PB PB057 휴대용 응급 제세동기의 솔더에서 납 Lead in solders in portable emergency defibrillators.PB PB058 8-14 μ.m 범위내에서 검출하는 위한 고성능 적외선 영상 모듈의 솔더에서 납 Lead in solders of high performance infrared imaging modules to detect in

the range 8-14 μ.m.PB PB059 실리콘 액정표시장치에서 납 Lead in Liquid crystal on silicon (LCoS) displays.PB PB060 전리방사선 검출기에서 납 Lead in detectors for ionising radiation.PB PB061 산업용 모니터링 및 제어기기용 125V AC 또는 25V DC 이하 정격전압 콘덴서의

유전체 세라믹 납Dielectric ceramic in capacitors for a rated voltage of less than 125V AC or 250V DC for industrial monitoring and control instruments

PB PB069 감마빔이나 입자치료기가 시스템내에 위치한 CT 나 MRI 에 사용되는 정위두부프레임 (stereotactic head frames) 내 사용되는 아세트산 납

Lead acetate marker for use in stereotactic head frames for use with CT and MRI and in positioning systems for gamma beam and particle therapy quipment

Ⅲ. 예외 List

61


Ⅲ. 예외 List

Sub-stance

Category

Excep-tion


PB PB070 이온화 방사선에 노출된 의료기기내의 베어링과 wear surface 에 대한 합금성분으로써의 납

Lead as an alloying element for bearings and wear surfaces in medical equipment exposed to ionising radiation

PB PB080 X-ray 영상강화기 내의 알루미늄과 철사이의 진공을 가능하게 하는 타이트 커넥션에서의 납

Lead enabling vacuum tight connections between aluminium and steel in X-ray image intensifiers

PB PB081영하 -20 도 아래에서 보통의 운전과 보관 상태를 견디며 사용되는 비자성 컨넥터(nonmagnetic connectors) 를 필요로 하는 핀 컨넥터 시스템 (pin connector sys-tems) 내의 납

Lead in the surface coatings of pin connector systems requiring nonmag-netic connectors which are used durably at a temperature below – 20 °C under normal operating and storage conditions

PB PB082인쇄회로기판 내의 납 , 전기전자 부품과 인쇄회로기판의 최종 코팅 내의 납 , wire 와 케이블의 연결부위의 땜납 , 변환기와 센서 연결부위의 납 : 이 장치들은 영하 20 도 이하에서 보통운전 및 보관조건으로 사용되어 지는 것들만 해당함

Lead in solders on printed circuit boards, termination coatings of electrical and electronic components and coatings of printed circuit boards, solders for connecting wires and cables, solders connecting transducers and sen-sors, that are used durably at a temperature below – 20 °C under normal operating and storage conditions.

PB PB083

땜납 안의 납 , 전기전자 부품과 인쇄회로기판 의 최종 코팅 내의 납 , 전기전선 커넥션 , 절연된 커넥터들에 사용되는 (a) 의료용 자기공명영상장비의 isocentre 반경 1 미터 영역내의 자기영역과 이 영역내에서 사용되도록 디자인된 환자용 모니터를포함한 영역 또는 (b) 싸이클트론 자석의 외부표면으로부터 1 미터내의 자기영역 , 입자치료에 적용되는 빔 디렉션 컨트롤과 빔 트랜스포트에 대한자석내의 자기영역의 납

Lead in solders,termination coatings of electrical and electronic compo-nents and printed circuit boards, connections of electrical wires, shields and enclosed connectors, which are used in (a) magnetic fields within the sphere of 1 m radius around the isocentre of the magnet in medical mag-netic resonance imaging equipment, including patient monitors designed to be used within this sphere, or (b) magnetic fields within 1 m distance from the external surfaces of cyclotron magnets, magnets for beam trans-port and beam direction control applied for particle therapy.

PB PB084 디지털 어레이 디텍터의 카드뮴 텔룰라이드와 카드뮴아연 텔룰라이드를 증가시키기위한 인쇄회로기판 땜납 내의 납

Lead in solders for mounting cadmium telluride and cadmium zinc telluride digital array detectors to printed circuit boards

PB PB085(카테고리 8) 에서의 의료기기와 산업용 감시통제 장비에서 극저운등전위 결합시스템 , 극저온 콜드 프로브 , 극저온 콜드 헤드의 초전도체 또는 열전도체로서 사용되는 합금내의 납

Lead in alloys, as a superconductor or thermal conductor, used in cryo-cooler cold heads and/or in cryo-cooled cold probes and/or in cryo-cooled equipotential bonding systems, in medical devices (category 8) and/or in industrial monitoring and control instruments

PB PB0862014년 7월 22 일 이전에 시장에 출시된 의료기기로 부터 재생된 재사용 서비스 자재 , 2021년 7월 22 일 이전에 출시된 카테고리 8 에 사용된 서비스 자재 내의 납은 기업내 회수 시스템으로 확인가능하다면 고객에게 공지된 후 사용될수 있다 .

Lead in reused spare parts, recovered from medical devices placed on the market before 22 July 2014 and used in category 8 equipment placed on the market before 22 July 2021, provided that reuse takes place in au-ditable closed-loop business-to-business return systems, and that the re-use of parts is notified to the consumer

PB PB087 디텍터의 인쇄회로기판의 땜납 , MRI 장비 내에서 통합되어진 양전자방출 단층촬영법에 대한 데이터 획득 장치 내의 납

Lead in solders on printed circuit boards of detectors and data acquisition units for Positron Emission Tomographs which are integrated into Magnetic Resonance Imaging equipment

PB PB088 의료기기지침 (93/42/EEC) 의 ClassⅡa 의 이동식 의료장비와 휴대용 긴급 제세동기 내에 사용된 일반적인 인쇄회로기판 땜납 내의 납

Lead in solders on populated printed circuit boards used in Directive 93/42/EEC class IIa mobile medical devices other than portable emergency defibrillators

PB PB089 의료기기지침 (93/42/EEC) 의 Class Ⅱb 이동식 의료장비와 휴대용 긴급 제세동기 내에 사용된 일반적인 인쇄회로기판 땜납 내의 납

Lead in solders on populated printed circuit boards used in Directive 93/42/EEC class IIb mobile medical devices other than portable emergency defibrillators

62


Ⅲ. 예외 List

Sub-stance

Category

Excep-tion


PB PB090 BSP 인을 함유한 체외 포토페레시스 램프가 사용되어 질때 방전램프의 형광파우더내에서 활성체로서의 납

Lead as an activator in the fluorescent powder of discharge lamps when used for extracorporeal photopheresis lamps containing BSP (BaSi 2 O 5 :Pb) phosphors

PB PB091 산업용 모니터링 및 제어기기용 C- 프레스 호환핀 커넥터 시스템에 사용 되는 납

Lead used in other than C-press compliant pin connector systems for in-dustrial monitoring and control instruments. Expires on 31 December 2020. May be used after that date in spare parts for industrial monitoring and control instruments placed on the market before 1 January 2021.

PB PB092

다음 조건 중 최소 하나 이상을 적용하는 경우전도성 측정에 사용하는 백금화 백금 전극의 납 , a) 농도를 알 수 없는 경우 실험실 용도로 102 을 포괄하는 전도성 범위( 예 , 0.1mS/m 과 5 mS/m 사이 범위 ) 를 가진광범위한 측정 , (b) 다음 중 하나에 대해 +/-1% 정확도의샘플범위와 전극의 높은 부식성 저항이필요한 경우의 용액 측정 , (i) 산성도가 pH 1 미만인 용액 , (ii ) 알칼리도가 pH 13 을 초과하는 용액 , (ii i) 할로겐 가스를 포함하는 부식성 용액 , (c) 휴대용 계측기로 수행하는 100 mS/m 이상 전도성에 대한 측정

Lead in platinized platinum electrodes used for conductivity measurements where at least one of the following conditions applies:(a) wide-range mea-surements with a conductivity range covering more than 1 order of magni-tude (e.g. range between 0,1 mS/m and 5 mS/m) in laboratory applications for unknown concentrations;(b) measurements of solutions where an accu-racy of +/– 1 % of the sample range and where high corrosion resistance of the electrode are required for any of the following: (i) solutions with an acidity < pH 1; (ii) solutions with an alkalinity > pH 13; (iii) corrosive solu-tions containing halogen gas;(c) measurements of conductivities above 100 mS/m that must be performed with portable instruments.

PB PB093X 선 시스템과 컴퓨터 단층 촬영의 X 선 감지기에서사용하는 인터페이스당 상호 연결이 500 을초과하는 다이 성분이 쌓여서 포개진 넓은지역의 인터페이스에서 납땜용 납

Lead in solder in one interface of large area stacked die elements with more than 500 interconnects per interface which are used in X-ray detec-tors of computed tomography and X-ray systems. Expires on 31 December 2019. May be used after that date in spare parts for CT and X-ray systems placed on the market before 1 January 2020.

PB PB094

다음 특성 중 최소 하나 이상이 존재하는장비에서 사용하는 마이크로채널플레이트(MCP) 의 납 (a) 감지기 공간이 최소 3mm/MC (감지기두께 + MCP 설치 공간 ), 합계하여최대 6 mm 로 제한되고 감지기 설치공간을 확장하는 대체 설계가 기술과학적으로 거의 실현 불가능한 경우소형 크기의 전자 또는 이온용 감지기 (b) 다음 중 최소 한 가지 이상을 적용하는경우 전자 또는 이온을 감지하기 위한 2 차원 공간 해상도 (i) 25ns 미만의 응답 시간 (ii ) 149 mm2 이상의 샘플 감지 영역 (ii i) 1.3 × 103 보다 큰 증배계수 (c) 전자 또는 이온 감지의 경우 5ns 미만의응답 시간(d) 전자 또는 이온 감지의 경우 314 mm2 이상의 샘플 감지 영역 (e) 4.0 × 107 보다 큰 증배 계수

Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:(a) a compact size of the detector for electrons or ions, where the space for the detector is limited to a maxi-mum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;(c) a response time shorter than 5 ns for detecting electrons or ions;(d) a sample detection area larger than 314 mm 2 for detecting electrons or ions;(e) a multiplication factor larger than 4,0 × 10 7 .

PB PB095

다음 특성 중 최소 하나 이상이 존재하는장비에서 사용하는 마이크로채널플레이트(MCP) 의 납 (a) 감지기 공간이 최소 3mm/MC (감지기두께 + MCP 설치 공간 ), 합계하여최대 6 mm 로 제한되고 감지기 설치공간을 확장하는 대체 설계가 기술과학적으로 거의 실현 불가능한 경우소형 크기의 전자 또는 이온용 감지기 (b) 다음 중 최소 한 가지 이상을 적용하는경우 전자 또는 이온을 감지하기 위한 2 차원 공간 해상도 (i) 25ns 미만의 응답 시간 (ii ) 149 mm2 이상의 샘플 감지 영역 (ii i) 1.3 × 103 보다 큰 증배계수 (c) 전자 또는 이온 감지의 경우 5ns 미만의응답 시간(d) 전자 또는 이온 감지의 경우 314 mm2 이상의 샘플 감지 영역 (e) 4.0 × 107 보다 큰 증배 계수

Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:(a) a compact size of the detector for electrons or ions, where the space for the detector is limited to a maxi-mum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;(c) a response time shorter than 5 ns for detecting electrons or ions;(d) a sample detection area larger than 314 mm 2 for detecting electrons or ions;(e) a multiplication factor larger than 4,0 × 10 7 .

63


stance

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Excep-tion


PB PB096

다음 특성 중 최소 하나 이상이 존재하는장비에서 사용하는 마이크로채널플레이트(MCP)의 납 (a) 감지기 공간이 최소 3mm/MC (감지기두께 + MCP 설치 공간 ), 합계하여최대 6 mm 로 제한되고 감지기 설치공간을 확장하는 대체 설계가 기술과학적으로 거의 실현 불가능한 경우소형 크기의 전자 또는 이온용 감지기 (b) 다음 중 최소 한 가지 이상을 적용하는경우 전자 또는 이온을 감지하기 위한 2차원 공간 해상도 (i) 25ns 미만의 응답 시간 (ii ) 149 mm2 이상의 샘플 감지 영역(ii i) 1.3 × 103 보다 큰 증배계수 (c) 전자 또는 이온 감지의 경우 5ns 미만의응답 시간 (d) 전자 또는 이온 감지의 경우 314 mm2 이상의 샘플 감지 영역(e) 4.0 × 107 보다 큰 증배 계수

Lead in micro-channel plates (MCPs) used in equipment where at least one of the following properties is present:(a) a compact size of the detector for electrons or ions, where the space for the detector is limited to a maximum of 3 mm/MCP (detector thickness + space for installation of the MCP), a maximum of 6 mm in total, and an alternative design yielding more space for the detector is scientifically and technically impracticable;(c) a response time shorter than 5 ns for detecting electrons or ions;(d) a sample detection area larger than 314 mm 2 for detecting electrons or ions;(e) a multiplication factor larger than 4,0 × 10 7 .

PB PB097 산업용 모니터링 및 제어 계측기의 경우 125 VAC 또는 250 VDC 미만의 정격전압용 콘덴서의 유전체 세라믹에 함유된 납

Lead in dielectric ceramic in capacitors for a rated voltage of less than 125 V AC or 250 V DC for industrial monitoring and control instruments. Expires on 31 December 2020. May be used after that date in spare parts for industrial monitoring and control instruments placed on the market before 1 January 2021.

Ⅲ. 예외 List

64


stance

Category

Excep-tion


PFOS PF001 사진평판 공정용 포토레지스트 혹은 반사방지 코팅 Photoresists or anti reflective coatings for photolithography pro-cesss

PFOS PF002 필름 /종이 / 인쇄 평판용 사진코팅 Photographic coatings applied to filmsPFOS PF003 비장식성 6가 크롬 도금 mist 방지제 Mist suppressants for non-decorative hard chromium (VI)

Sub-stance

Category

Excep-tion


ANTTR AT001 세라믹 부품의 첨가제 Added in ceramics for certain electronic components

ANTTR AT002 폴리머 재질 제조에 사용되는 촉매제 Used as a catalyst in polymeric materials for certain electronic components

ANTTR AT003 기포방지 및 이물제거를 위한 광학 유리 내 첨가제 Additives in Opticla glass for preventing air bubbles and removing impurities.

ANTTR AT004 Resistor Chip 내부 Resistive layer 에 특성 구현을 위해 사용 Resistive layer inside Resistor Chip for technical reason

ANTTR AT005 PC 제품 CPU Substrate 에 LSC(Land Side Capacitor) 장착시 사용되는 SnSb paste

SnSb paste used for installation of LSC(Land Side Capacitor) on CPU Substrate of PC

ANTTR AT006 열전자소자 부품에 사용되는 n형 반도체 (Bi2(Te, Se)3) 와 p형 반도체((Bi, Sb)2 Te3) 열전도 사용된 첨가제

Additives for thermal conduction on N type semiconductor(Bi2(Te, Se3) and P type semiconductor((Bi, Sb)2 Te3) Used in Thermal Elec-tronic devices

BERYL BE001 특정 성능 발휘를 위해 커넥터 등에 사용되는 베릴륨 합금 Beryllium alloy used in connectors and certain electronic compo-nents

PVC PVC01혈액 등 체액 및 체내 가스 분석용 체외진단용의료기기에 이용되는 전류 , 전위차 , 전도성 전기화학 센서의 기본 물질로 사용되는 PVC 내 열적안정 장치로서의 납

Lead as a thermal stabiliser in polyvinyl chloride (PVC) used as base material in amperometric, potentiometric and conductometric electrochemical sensors which are used in in-vitro diagnostic medi-cal devices for the analysis of blood and other body fluids and body gases. Expires on 31 December 2018.


Ⅲ. 예외 List

Documents

슬라이드 1 Manual... · PPT file · Web view2018-04-14 · NBR-Rubber. Nitrile Butadiene Rubber. Rubber. CR-Rubber. Chloroprene Rubber. Rubber. EPDM. Ethylene Propylene Diene