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櫃買市場業績發表會 20110421鈺創科技股份有限公司 (股票代號:5351

鈺創科技股份有限公司 - Etron

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University of Florida IBM
Safe Harbor Notice This following presentation contains forward-looking statements, which involve known and unknown risks and are subject to uncertainties that could cause actual performance, financial results, or operation conditions to be materially different from those contained in the forward-looking statements.
Except as required by law, we undertake no obligation to update any forward-looking statement, whether as result of new information, future events, or otherwise.

- Buffer MemoryDRAM & KGDM - USB 3.0 Host Controller - Webcam Controller
Financial Status
7,560 7,297 8,124
10,000 12,000 14,000
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20


’91 ’92 ’93 ’94 ’95 ’96 ’97 ’98 ’99 ’00 ’01 ’02 ’03 ’04 ’05 ’06 ’07 ’08 ’09 ‘10
IC - 1991~199516Mb DRAM - 1996~2000 8Mb16Mb SGRAM* - 2001~2007KGDM*CEDRAM* - 2008~2010
DRAMUSB3.0 - 2011~


1991~2010 Etron’s CAGR 29% 1996~2010 Etron’s CAGR 15% (1996~2010 IC Industry’s CAGR 5%*)
*Source: WSTS (Nov. ’10)
Year*SGRAM: Synchronous Graphic Random Access Memory; KGDM: Know-Good- Die Memory; CEDRAM: Consumer Electronics Dynamic Random Access Memory
Heart-Touching Heart-Touching
Experience-Based Communication Networks
Biological Processing is an Increasingly Important Analogy for Inspiring New Technologies
Buffer Memory & KGDM: Storing Experiences
Webcam Controllers: Capturing Experiences
Etron Product Synergy is Aligned with Experience-Driven Mindsets
Memory Logic

- Buffer MemoryDRAM & KGDM - USB 3.0 Host Controller - Webcam Controller
Financial Status
IC

19911998 64 88 (2010) 121 273 491 (20113) -Santa Clara, Boston -, , - : Tokyo
Pacific Pacific OceanOcean
IC (Application-Driven Buffer Memory Business) DRAM (Known-Good-Die Memory Segment for 3D IC) -DRAM -DRAM
USB3.0
Webcam Controller
(Etron Technology, Inc.GTSM 5351)
- Wide-Bandwidth DDR I/II - Known-Good-Die DRAM - Enduring SDRAM - Low Power & Mobile DRAM
- Pseudo SRAM - Low Power SRAM
- USB3.0 Host Controller - Webcam Controller
SRAMSystem Chips
- Pseudo SRAMSRAM Embedded DRAMDRAM

3C
Computer - HDD - ODD - DVD - Printer 30%
35% 35%
2Gb
Developing Application Domain Knowledge in Design/Testing/Burn-in Optimization
Offer Field Service to Customers in Both Product Development and Production Phases
4Gb
Known-Good-Die Memory
Easy to Make Bare Die but Difficult to Guarantee Known- Good-Die Memory for Lifetime - High quality and reliability - Tailored services - Robust design
An Example of Etron’s KGDM Implementation
Main Chip DRAM
Main ChipMain Chip
DRAMsDRAMs++
Application Driven Buffer KGD Memory accelerates System- in-Package (SiP) transformation for the benefits of - Less noise and EMI radiation - Pin-count reduction : 216pins 144 pins - PCBA simplification : 4 layers 2 layers - ~30 less passive components in PCBA
Mastering Technologies for Robust Design
Low Voltage 3.3V → 1.8V → 1.2V
Low Power 1mA → 0.001mA
Mobility and PortabilityMobility and Portability
High Speed 400MHz → 1066MHz, DDR I/II
High Density 16Mb → 512Mb → 1Gb
High Integration SOC → Multi-Chip Stack
Video, Audio and MultimediaVideo, Audio and Multimedia
Large Wafer Size 8 inch → 12 inch
Low Cost and High Quality / ProductivityLow Cost and High Quality / Productivity
Multiple Foundry Alliance DRAM, SRAM, Logic
Advanced Process Technology DRAM: 0.11mm → 70nm → 63nm SRAM: 0.15mm → 0.11µm →70nm

- Buffer MemoryDRAM & KGDM - USB 3.0 Host Controller - Webcam Controller
Financial Status
Biological Processing is an Increasingly Important Analogy for Inspiring New Technologies
Buffer Memory & KGDM: Storing Experiences
Webcam Controllers: Capturing Experiences
Etron Product Synergy is Aligned with Experience-Driven Mindsets
Memory Logic
USB3.0? 10X Faster Speed than USB2.0
70 sec53.3 sec20 sec3.3 sec0.8 sec0.01 secUSB 3.0 Source: USB-IF
13.9 min8.9 min3.3 min33 sec8.5 sec0.1 secUSB 2.0 9.3 hr5.9 hr2.2 hr22 min5.7 min5.3 secUSB 1.0 25 GB16 GB6 GB1 GB256 MB4 MB
HD-MovieUSB FlashSD-MovieUSB Flash256 FlashSong/Pic
7280144Time needed to charge 1000mAh Li battery (min)
1,000 mA900 mA500 mACurrent provided USB 3.0 power-BUSB 3.0 normal USB 2.0
2X Higher Charging Current than USB2.0
Backward Compatible with USB2.0 and USB1.1
USB3.0
From 2009 External HDD
From 2010 PC PC Add-On Card Hub Pen Drive External SSD
From 2011 DSC Camcorder Blue Ray Player Media Player Monitor MFP
From 2012 Mobile Phone TV Set Top Box Game Console Web Cam
USB3.0(+)80% 370M in 2011, 700M in 2012 and 1250M in 2013
USB3.0/2.0/1.1/1.0 Shipment Trend
Million Set
USB3.0 USB3.03C
USB3.0EJ168
A Product Series of Webcam Controllers Contains Imaging Processor and USB Behind CMOS Sensors to Optimize Audio, Video and Image Performance and Quality eSP258 & eSP268 for PC Cam and NB Cam - Shipped more than 25 million units since 2009 - Provide the highest integrated solutions eSP568 Presents High Quality of Audio and Video Operation Based on a Single Chip Solution
Biological Processing is an Increasingly Important Analogy for Inspiring New Technologies
Buffer Memory & KGDM: Storing Experiences
Webcam Controllers: Capturing Experiences
Etron Product Synergy is Aligned with Experience-Driven Mindsets
Memory Logic

- Buffer MemoryDRAM & KGDM - USB 3.0 Host Controller - Webcam Controller
Financial Status
60%0%(15)(1%)(24)Income Tax Benefit (Expense)
139%1%943%225Income Before Tax
--(1%)(68)1%109Non-Operating Income (Loss)
(28%)2%1622%116Operating Income
3%(14%)(1,047)(13%)(1,079)Operating Expense
(1%)16%1,20915%1,195Gross Profit
14%(84%)(6,088)(85%)(6,929)COGS
11%100%7,297100%8,124Net Sales
YoY20092010 Amount: NT$M ()
2010
14.314.4BPS (NT$)
(39%)4,0012,444Total Liabilities
(11%)9,8978,830Total Assets
147%0.190.47EPS (NT$)
(1%)1,2091,195Gross Profit
11%7,2978,124Net Sales
YoY20092010Amount: NT$M ()
525 19
USB(USB-IF) (CES)(2011.01)

- Buffer MemoryDRAM & KGDM - USB 3.0 Host Controller - Webcam Controller
Financial Status
RF or Power
e.g. Memory + Logic
New System Chip Architecture: mD-IC (multi-Dimensional Die Integration Chip); m= 2, 2.5, 3, 4…
*After Nicky Lu, ISSCC 2004 Plenary Talk
Etron Proprietary & Copyright © 2007 All Rights Reserved, April 30
Stacked Die System Chip Needs Bare-Die Memory
Flash Memory Compact Flash
More HIs are Coming
RF or Power
e.g. Memory + Logic
HI (mD-IC) Moore’s Law + 3D ICs + More than Moore + Novel Functions Created by Non-Silicon Contents - Inspire More Inventions & Innovations - Generate Higher Value - Create Diversified System Products
IC
e.g. Taipei World Trade Center versus one-story range at Texas
Taipei World Trade Center
IC (I) Voice Triggered Electronics with Sharp Speech Recognition
Real-Time Translator to Allow an Universal Communication even with Different Languages
Hello~
~
Virtual Reality in Remote Touch, Play, and Shopping
Source: www.xbox.com/en-GB/kinect/
’80s Manufacturing & Automation: IDM*
’00s Diversified Applications: System Chip & Cluster Model
*IDM means Integrated Device Manufacturer
IC
’20s Fusion of Heart-Touching System into Life, Body, and Community: Heterogeneous Integrated Design & Architect
Biological Processing is an Increasingly Important Analogy for Inspiring New Technologies
Buffer Memory & KGDM: Storing Experiences
Webcam Controllers: Capturing Experiences
Etron Product Synergy is Aligned with Experience-Driven Mindsets
Memory Logic