" Practical MEMS & Case Studies * Drawing MEMS Structures * Some theoretical problems and their solutions * Case Studies: - The Inkjet, TIs DMD " Drawing MEMS Structure Microsample Testing Lab. Chung-Seog Oh 04/09/2002 " MUMPs Process MUMPs Process Design Rules 14 mandatory rules Light field vs. Dark field Light field: Draw the feature-the object you want left behind after the etch. Poly0, Poly1, Poly2, Metal Dark field: Draw the holes-the areas you want to etch away. Anchor1, Dimple, Poly1_Poly2_Via, Anchor2, Hole0, Hole1, Hole2, Holem " Very Important By LinkCAD " Using AutoCAD for MEMS Basic procedures Sketch your own structure in the graph paper Get the (x, y) coordinates of your drawing Draw it by AutoCAD Save it in the format of DWG Standard file format for saving vector graphics within AutoCAD Save it in the format of DXF An ASCII or binary file format of an AutoCAD drawing file for exporting AutoCAD drawings to other applications or for importing drawings from other applications. Drawing Interchange Format Convert from DXF to GDS by LinkCAD View the final GDS file by CleWin and correct the original DWG file by AutoCAD " Layer setting " Example : Thermal Actuator 1) MUMPs 2) Surface Micromachining Single thickness structure: 2 m Poly1 " Introduction to LinkCAD Role LinkCAD converts all of the following formats: GDS-II Stream GDS-TXT DXF (AutoCAD compatible) Gerber RS-274X CIF PostScript (suitable for mask generation) IE3D Electromagnetic Simulator LASI TLC, Compass, ASCII, Binary Die Format Calma GDS-II TM format GDS II is the standard file format for transferring / archiving 2D graphical design data. " Free demo version available: limited time(15 days) File converting example Launch AutoCAD and open a file and save it as DXF format Launch LinkCAD Select DXF to GDS-II 1DXF unit = 1 mm Set mnemonic level name into GDS level number Convert Youll get the GDS-II File " Introduction to CleWin Role View graphic files Identify wrong points Directions Easy to use Very straightforward File formats CIF(.cif), GDS-II(.gds), AutoCAD DXF(.dxf), Useful key Right mouse button: toggle the selected layer Free demo version available: unlimited time " Some Theoretical Problems & Their Solutions 1. Design a process flow and mask set to fabricate a cantilever beam. You should use one dark field mask, and one clear field mask. The finished cross section should look like this: Kristofer S.J. Pister Berkeley Sensor and Actuator Center UC Berkeley Solution: " Case Study I: TI s DMD " Case Study II Micro-Inertial Sensor: Design, Development, Fabrication and Performance General: N. Yazdi, F.Ayazi, K. Najafi:Micromachined Inertial Sensors Proc. IEEE, Vol.86, August 1998, pp.1640 Present Topic: O. Degani, D. Seter, E. Socher, S. Kaldor and Y.Nemirovsky, Optimal Design and Noise Consideration of Micromachined Silicon Vibrating Rate Gyroscope with Modulated Integrated Optical Sensing, IEEE J. MEMS, Vol.7 No.3, September 1998, pp O. Degani, D. Seter, E. Socher, S. Kaldor and Y. Nemirovsky, Micromachined Accelerometer with Modulated Integrative Differential Optical Sensing, Elec. Letters, April 1998, 34(7), pp O. Degani, E. Scher, A. Lipson, T. Leither, Y. Nemirovsky, D. Seter and S. Kaldor, Pull-In Study of an Electrostatic Torsion Micro- Actuator, IEEE J. MEMS, Vol. 7, No. 4, December 1998, pp Seter D. J., Degani O., Socher E., Kaldor S., Scher E. and Nemirovsky Y.,Characterization of a Novel Micromachined Optical Vibrating Rate- Gyroscope, AIP-Review of Scientific Instruments, Vol. 70, No.2, February D. Seter, S. Kaldor, Micro Rate Sensors in CMOS Technology, 4th Kolloquium Mikro-und-Nanotechnologie", 26 November 1997, Technical University of Wien. Also published in Automation und MeStechnik, 4/1998, pp S. Kaldor and D. Seter,Micromechanics - Challenges in an Emerging Technology, The 27th Conference on Mechanical Engineering, May , 1997, Technion, I.T.T. D. Seter, M. Hershkovitz and S. Kaldor, On the Gap Between Design and Implementation of MEMS, CIRP General Assembly, August 24-26, 1998, Athens (Greece), CIRP Annals, Vol 47/1. D. Seter, S. Kaldor, E. Scher, J. Rosenberg, O. Degani and Y. Nemirovsky,Micromechanical Vibrating Inertial Sensors with Integrated Optical Sensing, Symposium Gyro Technology, September, 15-16, 1998, Universitat Stuttgart, Stuttgart (Germany). Degani-Bochobza O., Seter D.J., Socher E., Kaldor S., Scher E., Nemirovsky Y., Comparative Study of Novel Micromachined Acceleromers Employing MIDOS, IEEE MEMS-99 International Meeting, Orlando USA, January O. Bochobza-Degani, D.J. Seter, E. Socher and Y. Nemirovsky,A Novel Micromachined Vibrating Rate-Gyroscope with Optical Sensing and Electrostatic Actuation,Proc. Transducers 99, 7-11 June, 1999, Sendai - Japan. " - Physical Model MicromechanicalRealizationMicrosystem Model &Performance Cost Estimation Microsystem Packaging Tolerance Model Noise Considerations Performance Model Fabrication Technology Actuation Method Sensing Method Energy Source, Mechanical, Electronical Numerical- Interface Dynamics Results " KzKz CzCz KxKx CxCx Input Rate Output X Z mzmz Actuation Z(t) " X 0 =W d /2 - " O. Degani:Investigation of microelectromechanical Systems Incroporating Modulated Integrative Differential Optical Sensing Msc Thesis, Technion, May 1999 : VLSI Bulk Micromachining Anizotropic Etching : VLSI Bulk Micromachining Anizotropic Etching P75 " e0e0 e F emem r ocg r Fcg r oF cg M, I FeFe TeTe KiKi CjCj i=1N b j=1N d e Pi e Fi PiPi FiFi Investigation of the Dynamics of Microdevices as a Design Tool D. J. Seter *, O. Degani **, S. Kaldor *, E. Scher * and Y. Nemirovsky ** " " - - " : , , : , : : , , : , : ' * * MSc Thesis Mr. Arie Elka x y h0h0 L y(t) " " " : PI mrad] V PI [V] Calculation Simulation Deviation % 6.41 n [ KHz [ ny [KHz] Measured ADAMS Present Model " DC=3 [Volt] DC=1 [Volt] DC=3 [Volt] 2 " : : Down Axis Up Axis "