無鉛化電子產品可靠度試驗 Reliability Testsfor Lead-free …cca.yuntech.edu.tw/cca/Activities/94綠色師資研習/雲科... · Dye & Pry 37 37 Reliability Testsfor Lead-free

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Reliability Tests for Lead-free E&E Products

Environmental Testing & Reliability LabSGS Confidential

環測及可靠度實驗室―黃三泰Environmental Testing & Reliability Lab- Jockey Huang

Jockey Huang

Asst. Supervisor

t: 02-2298-3355 ext. 3763

f: 02-2299-9558

e: [email protected]

無鉛化電子產品可靠度試驗Reliability Tests for Lead-free E&E Products

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電子產品無鉛化會遇到什麼問題？

迴焊溫度最適化

表面處理變更：沾錫性、相容性及可靠度須行評估

焊錫材料標準化、疲勞耐久及可靠度須行評估

表面處理變更：沾錫性、相容性及可靠度須行評估

選擇合適的電路板材

料件耐熱溫度須提升

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隨各部件選用材料的變更，製程對材料本身及不同材料間的物理、化學特性的影響需重新評估

傳統錫鉛製程無鉛製程

Pb Components

SnPb Solder

Lead Free Components

Lead Free Solder

今後3~5年間在電子產品生產過程中需解決下列問題

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無鉛標示

According JEDEC Standard- JESD 97 : Marking, Symbols and Labels for Identification of Lead (Pb) Free Assemblies, Components and Devices.

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相圖─Pb-Sn合金系統

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相圖─Sn-Ag-Cu合金系統

Source: http://www.metallurgy.nist.gov/phase/solder/agcusn.html

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無鉛焊錫合金之選用

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各類焊錫合金比較Base

materialMeltingpoint(℃)

Addedmaterial

Feature Issues

Sn-Ag 190～210210～220

Bi(Lower T)Cu(Wettab.)Zn,In(Th. Fat.)

Good for thermalStrong pull strengthGood elongation

High melting temperatureExpensive(ＳｎＰｂ x 2 to 3）Poor wettability

Sn-Bi 190～210 Ag,Cuetc.

Lower melting temp. is possibleStrong pull strengthGood wettability

Hard and fragileDifficult to machiningShort thermal fatigue life

Sn-Zn 190～200Bi(Wettab.)In(Th. Fat.)AgCu

Same profile as PbSn solderLow cost（ＳｎＰｂ x 1.5）Strong pull strengthGood elongation

Short thermal fatigue lifePoor wettability

(N2 reflow is necessary）

Sn-In 117(52%In) Ag etc. Lower melting temp. is possible

Good elongation

ExpensiveProperty of paste is

easy to changeSmall pull strength

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迴焊(Reflow)製程比較-例

SnPb Profile Reflow @ 183C

Peak Temp. = 205 to 220C

SnAgCu (Pb-free) ProfileReflow @ 217C

Peak Temp = 235 to 245C

Time above liquidous: 40-120 s

Ramp rate: 3oC/s

Time in Minutes

Tem

pera

ture

, Deg

C

Reflow Profile Comparisons (Sample) SnPb versus Pb-free

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端子／焊墊沾錫能力

濕氣／迴焊敏感性（耐錫熱能力）

錫鬚形成的可能性

焊點可靠度

與傳統鉛錫合金產品比較具備相同特性與功能(產品的環測與可靠度試驗規格要求應一致甚至更好)

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端子／焊墊沾錫能力

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端子／焊墊沾錫能力 Case Study- MobilPhone

All components should be evaluated.

PCB, R/ C Chip, ICs, Connectors.

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端子／焊墊沾錫能力 Case Study- MobilPhone

Reference: IPC A610D.

Reliability Concern.

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IPC A 610D

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沾錫能力試驗—蒸氣老化

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沾錫能力試驗—沾錫天平法J-STD-002B Method E/ F

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沾錫能力評估_J-STD-002B Method Ewww.jedec.org

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沾錫能力優劣示意圖

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Lead Free Temp. Profile

Heating Time

Temp. （℃）

Peak：260℃

Soldering Zone

Pre-heating Zone

3℃ ～ 6℃/s

濕氣／迴焊敏感性&耐錫熱試驗

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耐錫熱試驗- 浸焊(Dip Soldering)MIL-STD 202G, Method 210F：Axial/ Radial/ Insertion ComponentsTest Condition B, Solder Dip

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耐錫熱試驗- 浸焊(Dip Soldering)SS-00254-4 Solder Heat Resistance Test for TMDs, Lead-free Soldering

Flow soldering with solder bath[Flow] → [Left at a room temperature] → [Flow] Flow soldering condition: 260 ℃, 5 seconds

Hand soldering (with soldering iron): 380 ℃, 3 seconds

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耐錫熱試驗- 手焊(Iron Soldering)MIL-STD 202G, Method 210F：Axial/ Radial/ Insertion Components or Hand Soldering SMD

Test Condition B, Solder Iron Temp. 400ºC

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耐錫熱試驗- 迴焊(Reflow Soldering)MIL-STD 202G, Method 210F：Non Moisture Sensitivity SMD Components，Chip C/R or other tape / bulk/ tube carriage devices.

Test Condition K, Solder Iron Temp. 260ºC, 10~ sec Temp. Rate: 1°C/s - 4ºC/s ; time above 217ºC/s, 90s – 150 s

1°C/s - 4ºC/s ; time above 217ºC/s, 90s – 150 s

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塑膠部件無法承受製程高溫-耐錫熱試驗

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SGS

濕氣/迴焊敏感性-MSL_J-STD-020C

濕氣/迴焊敏感性試驗是用以鑑定在包裝、儲存及操作時對濕氣誘發應力敏感的表面實裝零部件(SMD) 的等級以避免在組裝迴焊及／或修補操作期間損壞

J-STD-020C濕氣敏感等級（Moisture Sensitivity Level,ＭＳＬ）共有８級

Initial Electrical Test

Initial Inspection Bake Moisture Soak

ReflowFinal External Visual

Final Electrical Test

Scanning Acoustic Microscopy: Perform before/ after MSL Evaluation if Necessary

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濕氣/迴焊敏感性-MSL_J-STD-020C

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濕氣/迴焊敏感性-迴焊(Reflow)_J-STD-020C

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驗證峰值溫度

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濕氣敏感性零件操作 J-STD-033

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錫鬚形成的可能性

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錫鬚觀察參考方法

Odd-Shaped Eruptions (OSE)

Hillocks (Lumps)

Whiskers

Reference: Tin Whisker Acceptance Test Requirements-NEMI Temp. Cycle.: -55℃/ 85℃, 1000 cyclesTemp./ Humidity Storage: 60℃/ 95%RH & Room Ambient, 1000 Hrs

Suggested Criteria: 50μm Max.

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錫鬚觀察範例

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電子零組件焊點可靠度

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電子零組件焊點強度

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電子零件焊點強度及耐久度試驗- 例

Assembly PCBAs at Optimum Conditions

Non Rework/ Rework

Visual Inspection-Ref. IPC A610C

X- Section Analysis

C-SAM Inspection

X- Ray

Functionality Verify

Thermal Cycling Test: 0℃/ 100℃1000 Cycles

Assembly, Visual Inspection & Functionality Verify

X- Section AnalysisNotes: X-Section/ C-SAM/ X-Ray Inspection/ Solder Joint Strength/ Dye & Pry only are applied on Selected PCBAs/ Components

Solder Joint Strength

Solder Joint Strength

Dye & Pry

Dye & Pry

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電子零件焊點強度試驗-拉力

45° Pull for Gull Wing SMD DevicePull for Dip Component

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Shear Test for SMD Chip

電子零件焊點強度試驗-推力

Shear Test for J/ L Lead SMD Device

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電子零件焊點強度試驗-彎曲

Bending Test for BGA/ CSP Device

Press jig

45 45

100

Support

mm

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PCB

BGA/ CSP

Ohm Meter

電子零件焊點強度試驗- Daisy Chain

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電子零件焊點可靠度試驗

Operating/ Environment

Mechanical Operating

Ship/ Environment

Operating/ Ship

熱衝擊震動

彎折衝擊及落下

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分析- 切片觀察

BGA/ CSP Chip R/ C IC Package

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分析- 超音波探傷/ X-Ray

Delamination

Internal Crack by Heat Stress

Void

Solder Thieving

Bridge

Open

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分析- Dye & Pry 紅墨水浸透 BGA/ CSP

Dye

Void

Pad on Ball

Bridge

Open

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常用試驗規格

Temp. Cycling Test• High Temp.: 105℃• Low Temp.: -35℃• Temp. Retaining Time: 15 min • Cycle: 500• Evaluation at 250 Cycle Interval

Tin Whisker SS00254-8 2’nd edition• Temp. Cycle.: -40℃/ 85℃,

Retaining Time: 7 min 1500 cycles

• Temp./ Humidity Storage: 60℃/ 95%RH/ Room Ambient, 1000 or 2000 Hrs

Temp. Cycling Test• D4559 Level 2• High Temp.: 100℃• Low Temp.: 0℃• Temp. Retaining Time: 10 min• Cycle: 1000• Evaluation at 200 Cycle

Interval

Halt Test

Vibration/ Shock Test

Tin Whisker Test

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可靠度及品質問題?Temp. Environmental Simulation• Heat• Cold• Humidity• Thermal Shock

Mechanical Environmental Simulation• Vibration• Shock

DurabilityWeather Simulation• Rain (Water Proof)• Salt Spray• UV/ Solar

Corrosion Test- Mixed Flowing Gases

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噪音量測

Sound Pressure Level/ Sound Power Level

Standard： ISO3744/ ISO7779

Background Noise： < 10 dBA( Air Conditioner On)

Cut-off Frequency： 100 Hz

Dimension： 5 m x 5 m x 2.8 m

TCO99- Mandatory

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Q & A

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Thank You!!

黃三泰Jockey Huangt: 02-2298-3355 ext 3763

f: 02-2299-9558


謝哲宏Terence Hsieht: 02-2298-3355 ext 3760

f: 02-2299-9558


環測及可靠度實驗室Environmental Testing & Reliability Laboratory

Documents

無鉛化電子產品可靠度試驗 Reliability Testsfor Lead-free …cca.yuntech.edu.tw/cca/Activities/94綠色師資研習/雲科... · Dye & Pry 37 37 Reliability Testsfor Lead-free