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第三章 TCP接合技術 - eshare.stust.edu.tweshare.stust.edu.tw/EshareFile/2009_11/2009_11_0e14c7a1.pdf · tcp •tcp是在銅片表面形成不導電膜以連接半導體元 件，用在第一層次與第二層次的構裝上。
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TCP
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300~500um
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TCP
TCP
PolyimidePolyesterTeflon
TCPICIC
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DIP
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TCP
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IC
Incoming wafer
Wafer bumping
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CP (Circuit probing) Inking
Grinding Die saw
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Die sawPick & Place
ILBEncapsulation
Packing
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EncapsulationMarking
Final Testing Packing
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LCM TCPIC
LSI
ACFLCD IC
ITO ICPCBACF
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ILB
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ILB
ILB
(1) (2) (3) (4) (5)
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TCP
354870mm20~60m
(35~70 m)(50~70m)(75~125m)
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TCP
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ILB(3L)W=35mm
24.6mm
(PI)
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ILB
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()
70m1.25~1.75m1m1/3
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(15~20m)(ILB)
ILB
ILB()
(0.5m)
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1
(0.25~0.35m)280~350oC5~15 /0.2~0.7
(0.5m)300~380 oC8~22 /0.2~0.7
(50m0.5)
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2
()(30~200)
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2
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IC
(a)
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(b)
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(c)1
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IC
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(burn in)
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TCP
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OLB
ICLCD(PCB)
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PCB1.5~2.0m
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0.3mm
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PCB
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ACFACFPCB
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ACF
ACF(Binder)15~45m1.2~3mm50100m
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ACF
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(Thermosetting)(Thermoplastic)
(Rework)
(Epoxy)
(ACA)(ACF) ACF3m
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3~10m
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()()
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: :
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: :
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: :
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ACF
20%~80%
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(UV Glue)
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10m
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(50m)
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LCM
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OLBACF
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OLBACF OLBACF
(Plasma) ACF (Punching)IC LCD
(Pre-bonding) (Main-bonding) ACFOLBPCB
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TCP SXGA+TCP
40mTCP0.540m0.5TCP
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IC
4833512
5235480
5940420
6242400
6545384
(m) (m)
