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シシシシシシシシシシシシシシシ シシシシシシシシシシシシシMagnetic structures in cross-shaped nano permalloy pattern-arrays embedded in silicon substrates シシシシ シシシシシ シシシシシ シシシシシ シシシシシ シシシ 、、、、、 シシシシ K.Sato, T.Tezuka, T. Yama moto, K.Machida, T. Ishibashi, Y. Morishita and A. Koukitu マママママママ マママママママママママママママママママママママ 2003.10.29

マグネティック・ナノイメージングと次世代磁気応用に関する研究会  2003.10.29

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マグネティック・ナノイメージングと次世代磁気応用に関する研究会  2003.10.29. 「シリコン埋め込みパーマロイ微細 十字パターン配列の磁気構造」 Magnetic structures in cross-shaped nano permalloy pattern-arrays embedded in silicon substrates. 佐藤勝昭、手塚智之、山本尚弘、町田賢司、石橋隆幸、森下義隆、纐纈明伯 K.Sato, T.Tezuka, T. Yamamoto, K.Machida, T. Ishibashi, Y. Morishita and A. Koukitu. - PowerPoint PPT Presentation

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  • Magnetic structures in cross-shaped nano permalloy pattern-arrays embedded in silicon substratesK.Sato, T.Tezuka, T. Yamamoto, K.Machida, T. Ishibashi, Y. Morishita and A. Koukitu2003.10.29

  • IntroductionVSM, MFM150nm100nm300nm100nm1000nmMFM

  • Clean Room LaboratoryElectron beam lithography

  • EB-patterning processDot sizesquare(1m 1m)rectangular(300nm100nm)circular(100 nm)cross(200nm3m, 100nm 1.5m) Patterned area: 3mm3mm4mm4mmEB-resist thickness: 300 nmby spin-coating with 5000 rpm rotationBaking16020minSpin coating of resistEB exposureSi substrateDevelopment

  • Dry-etching

  • Etching gas:CF4Vacuum3.010-3PaGas pressure 9.2PaRF power:400WEtching rate: 0.1m/minSilicon surface after etchingDry etching process

  • LaboratoryEB depositionRF magnetron sputtering

  • Embedding of permalloyEmbedding of permalloy film by electron beam depositionmaterial:permalloyNi80Fe20Vacuum3.010-6TorrAccelerating voltage 4kV Deposition rate 1.0/secPolishing chemicals: Polished by Kent3(Nanofactor)SlurryGRANZOX sp-15(Al2O3 powder)grain-size20nmpH11polishing rate:60nm/minflatteningChemical mechanical polishing (CMP)

  • Observation/MFMFE-SEM

  • SEM observation 300nm100nmsquare dot, 300 nm space

  • Cross sectional SEM observation

  • 1m square dot arrayAFMMFM

  • VSM measurement

  • LLG simulationBy K. Machida

  • Hy = 10 kOe 0 Oe Dot modeldivMdivMy

    Saturation magnetization (Ms)800 emu/cm3Exchange field (A)110-6 erg/cm3Anisotropic constant (Ku)1000 erg/cm3Gyro magnetic constant)-1.76107 rad/(sOe)Damping constant0.2Easy axisY directionDot Size200 nm200 nm100 nmNumber of dot1Mesh size10 nm10 nm10 nm

  • Hy = 10 kOeHy = 5 kOeHy = 3 kOeHy = 2 kOeHy = 1 kOeHy = 0 Oe

  • AFM observationCircular dotsRectangular dotsAFM Line scan Surface roughness~10nm

  • Rectangular dots VSM measurement

  • Pattern variations for different scan directionScanning directionMFM images

  • MFM image of 300nm x 100nm dot with a low-moment probe tipAFMMFM

  • L=3m, d=200nm s=3mL=1.5 m, d=100nm s=1.5 mLds

  • AFMMFMCROSS3 (200nm3000nm cross dots)

  • Initial stateProbe-sampleAntiparallel 20kOeprobe-sampleParallel 20kOenmnm cross dots(wide scan)

  • Initial stateProbe-sampleParallel 20kOeProbe-sample Parallel 20kOe200nm3000nm cross dots(narrow scan)

  • MFM and AFM images of CROSS3

  • Kerr microscope image

  • InitializedProbe-sampleParallel 20kOeProbe-sample Antiparallel 20kOe100nm1500nm cross dots(wide scan)

  • InitialProbe-sampleParallel 20kOeProbe-sampleParallel 20kOenmnm cross dots(narrow scan)

  • LLG simulationCross-pattern model Hz = 20 kOe 0 Oe divMdivMz

  • Hz = 1 kOeHz = 0 OeHz = 5 kOeHz = 10 kOeHz = 20 kOe

  • Cross1(empty dots)1.5cmcamerascreen30

  • Cross1(permalloy embedded)30

  • 90Cross3 (permalloy embedded)30

  • Cross, no magnetic material embedded, H=0PinPoutSinPoutPinSoutSinSout

  • Cross, permalloy embeddedH=2kOe appliedPinPout1st2nd3rdRepeated measurement

  • Summary1mLLGMFMLLG

  • Summary contdKerrSHGSHGMSHG

  • ProposalMFMLLG1mMO-SNOMMO200nm100nm

  • AcknowledgementCOE