AURIX MultiCore Lauterbach handout Market Positions* nNo. 2 in Automotive semiconductors worldwide nNo. 1 Europe nNo. 3 North America nNo. 1 APAC & RoW nNo. 1 Korea nNo. 3 China nNo

AURIX™MultiCore Microcontroller

Lauterbach Experts′ Forum, 19. Aug. 2015, Beijing

Dirk Geiger | 葛德克

Director Automotive Marketing, China (IFX CN ATV SMD AP M) | 市场总监Infineon Technologies (China) Co. Ltd., Automotive Electronics | 英飞凌科技(中国)有限公司,汽车电子

Agenda

› “AURIX™ Multicore”

– Trends in Automotive– IFX company introduction– AURIX™ product overview– AURIX™ MultiCore– Lauterbach and Infineon

2set date Copyright © Infineon Technologies AG 2015. All rights reserved.

InfineonCompany Presentation, 2015

17.1 17.6 18.6 21.3 23.1 24.9 26.7 28.1 29.2 30.0

19.0 20.2 19.3 19.5 20.0 20.3 20.8 21.6 22.4 22.611.9 13.1 15.416.2 17.0 17.4 17.9 18.4 18.7 18.9

9.1 7.9 9.49.0

9.2 8.5 8.0 8.0 7.8 7.9

4.2 4.64.5

4.54.5 4.4 4.4 4.2 4.2 4.0

13.0 13.414.3 14.3 13.8 14.8 15.9 16.9 17.9 18.9

74.4 76.981.5 84.7 87.6 90.4

93.897.2 100.3102.3

2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

China Europe N. America Japan S. Korea Others

229

428

435

461

362

219

287

481

481

498

404

234

China

Europe

N. America

Japan

S. Korea

Others

Car Production Growth is driven by China, South-East Asia and European recovery

CAGR(14-19) = 3.2%

Source: IHS, September 2014

[units m]

Global car production (cars ≤ 6t)

+3.5%

[USD per car – 2019 vs. 2014]

Worldwide2014 2019 CAGR

334 363 1.64%

Semiconductor Value per Car

Source: Strategy Analytics, July 2014

CAGR14-19 2.0%

CAGR14-19 2.4%

CAGR14-19 4.6%

CAGR14-195.3%

CAGR14-19 2.8%

CAGR14-19 1.6%

CAGR14-19 -3.0%

CAGR14-19 -1.5%

CAGR14-19

6.6%

CAGR14-19 2.3%

CAGR14-19 1.3%

CAGR14-19 1.6%

Page 42015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.

Market Growth Fuelled by Car Production Growth and Increasing Functions Enabled by Semiconductors

Source: IHS, September 2014

Global car production (cars ≤ 6t)

Source: Strategy Analytics, July 2014

Semiconductor market by segment

Semiconductor value per car

CAGR14-19

+6.4%

CAGR14-19

+6.4%CAGR14-19

+4.5%

CAGR14-19

+7.6%

[USD bn]

* Safety = “Safety” + “Chassis” according to SA definition.** Body = “Body” + “Security” according to SA definition.

19.0 20.2 19.3 19.5 20.0 20.3 20.8 21.6 22.4 22.6

11.9 13.1 15.4 16.2 17.0 17.4 17.9 18.4 18.7 18.917.1 17.6 18.6 21.3 23.1 24.9 26.7 28.1 29.2 30.010.8 11.5 12.8

12.7 12.6 13.3 14.0 14.6 15.3 15.8

9.1 7.99.4 9.0 9.2 8.5 8.0 8.0 7.8 7.9

6.4 6.66.0 6.0 5.7 5.9 6.3 6.5 6.8 7.1

74.4 76.981.5 84.7 87.6 90.4 93.8 97.2 100.3102.3

2010 2011 2012 2013 2014 2015 2016 2017 2018 2019

Europe North America China APAC ex China Japan ROW

CAGR14-19 = 3.2%

[units m]

+3.5%

CAGR14-19+2.8%

CAGR14-19+1.6%

CAGR14-19+5.3%

CAGR14-19+4.6%

CAGR14-19-3.0%

CAGR14-19+5.6%

CAGR14-19

+1.64%

[USD]

324334

363World

2019 2014 2013

6.0

7.4

9.4

6.5

8.6

9.3

12.9

8.9

Infotainment

Body**

Safety*

Powertrain

2019 2014


Market Trends

■ Dwindling energy resources■ Urbanization■ Stricter CO2 emission legislations■ Growing environmental awareness

Infineon's Opportunities

n Infineon components are key enabler for car manufacturers to meet challenging targets for CO2 emission reduction, e.g. in the EU 95g CO2/km in 2021

n We offer Hybrid and electric drivetrain products (HybridPACK™/HybridPACK™ DSC)

n No electric vehicle without semiconductors: electric drive and control, battery management, on-board battery charging and power grid communication

We Focus on Future TrendsMaking Cars Clean

Page 6May 5, 2015 Copyright © Infineon Technologies AG 2014. All rights reserved.

USA[2]: 133

USA[2]:103

EU: 95Japan: 105

China[1] :117

60

80

100

120

140

160

180

200

2010 2015 2020 2025

Gra

ms

CO

2/k

m n

orm

aliz

ed to

NE

DC

Tes

t Cyc

le

Semiconductors Are Indispensable in Reaching CO2 Emissions Targets

Two main trends drive reaching the CO2 emission goals – enabled by

semiconductors

Historical national fleet emissions performance and future targets

Source: The International Council for Clean Transportation

historical performanceenacted targets proposed targets

Higher efficiency of the‘classic’ ICE:n EPSn TPMSn Start-stopn Dual Clutchn Alternator

Electrification of theDrivetrain:n Main Invertern Auxiliary Invertern Onboard Chargern Battery Management


Smart Mobility

Page 81/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved

Infineon provides Mobilitysolutions for Smart Cars/CCAVs,

Electro-Mobility and Transportation Infrastructure

Electrification of Power train for Cars & Auxiliary Drives

Leadership in Autonomous Driving

Smart Traffic Management &Improved Road Safety

Automotive Safety & Security solutions

NEV Electric Drive Train & Charging Contactless Payment

Infineon's Opportunities

Infineon components covers the overall needs of the autonomous vehicle:

n AURIXTM microcontroller family enables dependable and secure processing

n Sensing technologies (e.g. Radar, Hall, 3D Imager) increase performance of ADAS systems

n Safe actuation solution (e.g. 3 phase Bridge Driver IC) and safe power supply enable dependable vehicle dynamics and control

We Focus on Future TrendsMaking Cars Safe

Key system requirementsMarket trends

ReliabilityAccident avoidance

Autonomous driving

Cyber-networked car

High Availability

Functional Safety (ISO26262)

Cybersecurity

Courtesy: Bosch


Automotive Cyber-Security

Page 1013.08.2015 Copyright © Infineon Technologies AG 2013. All rights reserved.

Infineon Technologies is leading the security industry for over 25 years

Market Leadership with Broadest Security Offering

Market Leadership with Broadest Security Offering

Innovation Leadershipwith Pioneering Innovation

Innovation Leadershipwith Pioneering Innovation

Leading in Smart Card Microcontrollers

Leading in Embedded Security

Highest security standards-compliant

First 32bit multi-application security µC

Best combination of Security, Performance and Multi-FunctionAward-

winning digital security

Most innovative packaging technology

Enable world’s fastest contactless ePassport

>20bn security

chips shipped

Payment MobileCommunication

GovernmentID Transport

Authentication TPM Mobile Security

Page 111/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved

Secure Flexible Fast Mask

CC EAL5+EMVCo

PBOC 3.0CIPURSE™

Infineon is the right partner for addressing security in automotive

311

34

56

2010 2013 2016 2019

Secure Elements for Telematics & V2xSLI 76SLI 97

Microcontrollers with Integrated Security Trust AnchorAUDOMAXAURIXTM

Scalable HW & SW Security Solution

Threat & Attack Scenario Analysis

Security-Certified Concept, Design and DevelopmentProcess

Large Portfolioof Common Criteria Certified Products

Security-Certi-fied ProductionSecure Persona-lization

Infineon's system offering

Source: Strategy Analytics; active and inactive systems, cumulative

Automatictoll collection

NavigationE-Call

Power ondemand

Local-basedservices &

advertisement

Internet

Traffic alerts / V2V

Maintenanceupdates

[units m]

Applications subject to hacker attacks

Forecast for cars with eCall


Page 13

Next Level of Zero Defect: A Continuous and Sustainable Approach of Quality Improvement

PLAN

DO

CHECK

ACT

Pareto analysis of systemic root causes based on FARs, audit findings, severe incidents and internal spills

Basis: Leadership and Motivated People

The IFX houses of quality match the systemic root causes

KPI FE BE ATV PMM IPC CCS

# 1

Par

tner Customer

Satisfaction

Number of returns (FAR)

No

spils

Spills

100%

st

abili

ty

Internal Stability Indicators

The Quality KPI system controlsthe progress of the program

Corrective actions are systematically rolled out and rollout is verified

FE Villach Regens-burg

Dresden Kulim

Measure 1

Measure 2

BE PowerMAL

Power Batam

DS SENS Logic High Power

Measure 1

Measure 2

ATV ASIC BP SENS STD µC EDT

Measure 1

Measure 2

Lifecycle Stability

Quality Leadership

Deviation Culture

Maintenance

Equipment Stability

Unit Process Stability

Supplier Stability

Deviation management

Firewall

Deviation Handling

Detectability

Risk management

Pipeline management

Zero Defect CultureGaps in:

Wire Problem (Team 1)

Package Crack/Chipped

Die Crack

Top Defect Modes Common BE SRC Projects

OJTI with TWI Cu@BE

Robust Pre-assembly

Equipment Excellence

Quality Firewall

NLoZD @ BE

Methodology and Tools, Organization

Zero Defect Culture and Leadership

Design for Green Line

Supplier Excellence (L/F)

Design for Manufacturability

Wire Problem (Team 2)

Manufacturing in a Green Line

Incomplete Mould

Mixed Device

ATV Division FE Operations BE Operations


We focus on three major areas relevant to today’s societal needs

Energy EfficiencyEnergy Efficiency MobilityMobility SecuritySecurity

Industrial Power Control

Automotive

Power Management & Multimarket

Chip Card & SecurityPage 141/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved

Automotive Overview

Product Range

n Sensors: pressure, magnetic, radarn Microcontrollers: 32-bit for Powertrain, Safety and

ADASn Power: MOSFETs, IGBTs, smart power ICs: voltage

regulators, bridges, driver ICs, CAN / LIN / FlexRay™ transceiver**, DC-DC converters, power system ICs, system-on chip, embedded power ICs

n Hybrid & Electric Vehicle: IGBT HybridPACK™, HybridPACK™ Double Sided Cooling (DSC) modules, gate driver ICs

Core Competencies/Value Proposition

n Automotive commitment: More than 40 years of automotive system and application expertise

n Complete automotive system providern Hybrid and Electro mobility: industry leading

expertise and product portfolion Functional Safety (ISO26262) and Security

enabling car solutionsn Worldwide development, production and support

sites for automotive semiconductorsn Next Level of Zero Defect: most comprehensive

quality program of the industry

Market Positions*

n No. 2 in Automotive semiconductors worldwiden No. 1 Europen No. 3 North America n No. 1 APAC & RoW

n No. 1 Korean No. 3 China

n No. 4 Japan

n No. 1 in automotive power semiconductors (24.8%) Source: Strategy Analytics (April 2015)

**FlexRay is a trademark licensed by FlexRay Consortium GbR*incl. International Rectifier


n Clean Combustion Engines

n Efficient Energy Management

n Electrified Drivetrain

n Occupant and Pedestrian Protection

n Collision Avoidancen Advanced driver

assistance

n Individual Conveniencen Secure Connectivity,

Data Integrity and Privacy

n Autonomous Driving

Smart

Infineon Automotive Makes Cars: Clean, Safe and Smart

With innovative products for the highest growth applications in:

Clean Safe

Powertrain

Safety

BodyPage 162015-Q1 Copyright © Infineon Technologies AG 2014. All rights reserved.

High Power

Infineon Automotive Division Broad and Competitive Product Portfolio

Total Revenue: € 1’’965 for FY1314

TransceiversDC&DC ConvertersIndustrial productsVoltage Regulators

Airbag ICsEPS - ICsLi/Ion BMS ICsAlternator ICsMultichannel SwitchesEngine Management ICsTransmission ICs

SPOCTM - SPI Power ControllerPROFETTM – Smart High Side SwitchHITFET™ – Smart Low Side SwitchPower PROFETTM/Connect FET –Smart High Side Power Switch SPI Driver for Relay ControlInfineon® Auto LED DriverMotor Control - BridgesSystem Basis ChipsEmbedded Power IC

HybridPACK™- Inverter ModulesEiceDRIVER™ - IGBT Driver ICEasyPackBare Die IGBT, DiodesAutomotive MOSFETs

Magnetics SensorsPressure/TPMS SensorsRadar

High-End (32-bit)Mid-Range (16-bit)Low-End (8-bit)AutoSAR Software

Microcontroller

Sense & Control

Body Power

PowertrainSafety & ASICs

StandardPower


ATV focuses on powertrain, safety and body applications

I

Powertrain

Safety

Body

Revenue split FY2014 by application


Infineon is global #2, #1 in Europe & Korea, #5 in China with strongest regional growth

Korea($2.0bn)

Japan($4.9bn)

Europe($8.7bn)

APAC & others($6.7bn)

World($25.1bn)

North America($4.8bn)

China($3.5bn)

1. Renesas 13.3%2. Infineon 9.6%3. STMicro 7.9%4. Freescale 7.4%5. NXP 6.5%

1.2. Infineon 9.7%3.4.5.

Source: Strategy Analytics, April 2014.The main vehicle production markets driving "others"/ROW for 2013 are Brazil, India, Taiwan, and Indonesia.

1. Infineon 13.1%2.3.4.5.

1.2.Infineon 8.6%3.4.5.

1.Infineon 13.3%2.3.4.5.

1.2.3.4.5.Infineon 8.2%

1.2.3.Infineon 4.3%4.5.

(+0.3%)

(+0.1%)

(+0.2%)

(+0.6%)

(+1.2%)

(-0.4%)

(+0.5%)

1


I

Europe accounts for half of Infineon Automotive Revenue. Importance of APAC is Growing

Germany

Europe, Middle East and

Africa(w/o Germany)

APAC

Americas

Japan

Revenue Split FY2014 by Region


Xi’anXi’an

1/20/2015 Copyright © Infineon Technologies AG 2015. All rights reserved

Infineon’s Footprints in China

ShanghaiHeadquarter of Infineon

China

ShanghaiHeadquarter of Infineon

ChinaChengduChengdu

WuxiWuxi

HongkongHongkong ShenzhenShenzhen

ChangchunChangchun

BeijingBeijing

ChongqingChongqing

WuhuWuhu

XiamenXiamen

Page 21

*w/o International Rectifier

WuhanWuhan


Infineon China at a Glance

LOCATIONS12

LOGISTIC HUB

1

IP/PATENTSFilings

>2000PEOPLE

>1700

JOINT LABS>10APPLICATION

& SYSTEM ENG

~100

TECHNICAL CENTER

2

REVENUE mio €868

MANUFACTURING

2

Page 22*w/o International Rectifier


Key accountsApplication

Key Customers in China (by Segment)

Chip Card & Security

Automotive

Industrial Power Control

Power Management & Multimarket

Page 23*w/o International Rectifier

AURIX™Introduction and MultiCoreAugust 2015

AUtomotive Realtime Integrated neXt Generation

Safety& advanced connectivity MCU Roadmapfuture proof roadmap guarantees joint success story

(X)C164/740MHz,0.2M

Typ. Applications

› 4-6 cyl. GDI/DDI/MPI› Full feature ESC› Hybrid Ctrl. / E-Drive› Chassis Domain Ctrl.› Sensor Fusion Box› RADAR› Camera (front)

› 4 cyl. GDI/DDI› Transmission

(DCT/ECAT)› E-Drive› Integrated Airbag› Vehicle Stability Ctr.› Connected Gateway› Truck BCM › 4 cyl. MPI› Battery Management› Airbag with Sensor

Clusters› Active Power Steering› ESC premium› Suspension Systems› BCM premium› 1-2 cyl. MPI› Starter-Generator› DC/DC Converter› Airbag› ESC basic› ABS› Power Steering (EPS)› 24GHz RADAR› BCM/Gateway› Airbag basic› Steering lock› Park brake& Companion ICs

Production 2014 2015

Production Development Concept IdeaxxTechnology

Pre

miu

mFu

ll fe

atu

re

Bas

icEn

try

XC20x0 U/L40/66MHz, 0.1/0.3M

90

TC1762/3666/80MHz, 1M

65AURIX™

XC20x0 M/N66/80MHz, 0.5/0.8M

TC1387/67/37150/180MHz, 1-3M

TC1796/97180MHz, 2-4M

XC20x0 H/I100/120MHz, 1.6/1M

CIC61508Safety IC

XC8xx HOT8-32k

TC270T200MHz, 4MBare DieTC1766/67

80/133MHz, 1.5-2M

TC1746180MHz, 2.5MTransmission

130

XC2000

40TC1793/98300MHz, 4M

TC1782/84180MHz, 2.5M

TC1724/28133MHz, 1.5M

TC260D200MHz, 2.5MBare Die

TC1791240MHz, 4M

AURIX™ PLUS

CIC310FlexRay IC

2016 2017 2018 2019

TC27xT200MHz, 4M

TC24xS180MHz, 2M

AUDOMAX

TC22xL133MHz, 1M

TC23xL200MHz, 2M

TC290T300MHz, 8MBare Die

TC29xT300MHz, 8M

TC26xD200MHz, 2.5M

TC21xL133MHz, 0.5M

AURIX™ TC3x

252014-12-15 Copyright © Infineon Technologies AG 2015. All rights reserved.

Infineon Microcontroller focus areasLeading in key automotive innovation areas

› Power Steering› Vehicle Stability Control, Braking› Chassis/Safety Domain Control› Airbag› Suspension› Sensor Fusion Box› RADAR› Vision

› Engine Management (GDI/DDI/MPI)› Transmission (DCT/ECAT/AMT)› Hybrid & Electric Vehicle Inverter › DC/DC Converter› Battery Management› Starter-Generator› 48V

POWERTRAINPOWERTRAIN

CHASSIS, SAFETY, ADASCHASSIS, SAFETY, ADAS

SA

FETY

:Com

plet

e Sol

utio

n fo

r Saf

ety

up t

o ASIL

-D

SEC

UR

ITY

:In

tegr

ated

har

dwar

e su

ppor

t fo

r Sec

urity

› Connected Gateway › Full Feature BCM› V2V / V2X

ADVANCED CONNECTIVITYADVANCED CONNECTIVITY


One Family - scalable across applicationMost scalable 32-bit MCU portfolio on the market

SA

FETY

:Com

plet

e Sol

utio

n fo

r Saf

ety

up t

o ASIL

-D

SEC

UR

ITY

:In

tegr

ated

har

dwar

e su

ppor

t fo

r Sec

urity


One Family - scalable across applicationMost scalable 32-bit MCU portfolio on the market

SA

FETY

:Com

plet

e Sol

utio

n fo

r Saf

ety

up t

o ASIL

-D

SEC

UR

ITY

:In

tegr

ated

har

dwar

e su

ppor

t fo

r Sec

urity


AURIXTM scalable family - next generation µCOne family supporting multiple applications

9x Seriesup to 8 MB

7x Seriesup to 4 MB

6x Seriesup to 2.5 MB

4x Seriesup to 2 MB

3x Seriesup to 2 MB

2x Seriesup to 1 MB

1x Seriesup to 512 KB

TQFP-80 TQFP-100 LQFP-144TQFP-144 LQFP-176 LFBGA-292 BGA-416 LFBGA-516

TC212L/S133 MHz

TC223L/S133 MHz

TC233S/L200 MHz

TC234S/L200 MHz

TC224L/S133 MHz

TC213L/S133 MHz

TC244S180 MHz

TC277T200 MHz

TC275T200 MHz

TC265D200 MHz

TC264D200 MHz

TC299T300 MHz

TC298T300 MHz

TC297T300 MHz

TC267D200 MHz

TC237S/L200 MHz

TC222L/S133 MHz

MCU Scalablility§ # of TricoreTM 1.6 cores

§ Clock rate 133-300MHz

§ Up to 2.7MB SRAM

§ Package/Pin compatibility

Latest connectivity§ 6x CAN/CAN FD

§ Ethernet (AVB support)

§ FlexRay

Safety/Security Concept§ HW/SW safety features

§ ISO26262 compliance

§ Programmable 32bit hardware security module

Power Consumption§ On-chip DC/DC high-

efficiency power supply

§ Standby control unit

§ Pretended networking

TC214L/S133 MHz

Support of ISO26262 ASIL-D and related safety standards across the entire AURIXTM family

Hardware security enabled

Broad portfolio of fully compatible devices ranging from 512kB to 8MB flash and from TQFP80 to LFBGA516 packages

Broad portfolio of fully compatible devices ranging from 512kB to 8MB flash and from TQFP80 to LFBGA516 packages

With up to 1300DMips, 8MB flash and 640kB SRAM, AURIX™ matches the most performance hungry applications

With up to 1300DMips, 8MB flash and 640kB SRAM, AURIX™ matches the most performance hungry applications

Scalability

Performance

Rich set of peripherals to address the growing demands of in-vehicle networkingRich set of peripherals to address the growing demands of in-vehicle networkingNetworking

Innovative multicore safety concepts following ISO26262 standard, enabling ASIL-D levelInnovative multicore safety concepts following ISO26262 standard, enabling ASIL-D levelSafety

2nd generation Hardware supported security functions2nd generation Hardware supported security functionsSecurity

Best-in-class supply security concept, 2nd FabconceptBest-in-class supply security concept, 2nd Fabconcept

SupplySecurity

AURIX™ ™The Automotive Microcontroller for Tomorrow


AURIX™ Core Architecturesfrom single core to triple core lockstep w/ clock delay

Core

Triple Core Lockstep -„T“ Marking

Checker Core

Core

Main bus

Core

Peripheral bus

Flash

Main bus

Flash

Main bus

Core

Peripheral bus

Flash

Lockstep -„L“ Marking

Single Core -„S“ Marking

Dual Core Lockstep-„D“ Marking

Main bus

Core

Peripheral bus

Flash

Checker Core

Checker Core

Core Core

Peripheral bus

Checker Core *

* 2nd checker core only in TC27x


7x Series – Umbrella DeviceSAK-TC27xTP-64F200

Feature Set 7x Series

TriCore1.6P

# Cores / Checker 2 / 1

Frequency 200 MHz

TriCore1.6E

# Cores / Checker 1 / 1 2)

Frequency 200 MHz

Flash Program Flash 4 MB

EEProm @ w/e cycles

64 KB @ 500k

SRAM Total (DMI , PMI) 472 KB

DMA Channels 64

ADC Modules 12bit / DS 8 / 6

Channels 12bit / DS 60 / 6 diff

Timer GTM Input / Output 32 / 88 channels

CCU / GPT modules 2 / 1

Interfaces FlexRay (#/ch.) 1 / 2

CAN-FD3)

(nodes/obj)4 / 256

QSPI / ASCLIN / I2C 4 / 4 / 1

SENT / PSI5 / PSI5S 10 / 3 / 1

HSCT / MSC / EBU 1 / 2 diff LVDS / -

Other Ethernet MAC

Safety SIL Level ASIL-D

Security HSM Optional

Power EVR Yes

Standby Control Unit

Support

FCE

HSCT

SCU

DS-ADCx

ADCx

PLL

&PL

L ER

AY

Flex

Ray

Mul

tiCAN

+FD

QSPI

x

ASCLI

Nx

SEN

T

MSCx

STM

Ethe

rnet

I²C

TriCore™1.6P

PMI DMIOverlay

FPU

SRI Cross Bar

PSI5

(S)

HSM

GTM

CCU

6x

TriCore™1.6P

PMI DMIOverlay

FPU

Checker Core

TriCore™1.6E

PMIDMI

Standby Overlay

FPU

Checker Core 2)

BCU

Package Variants

Ports

OCDS

GPT

12x

IOM

System Peripheral Bus

PMU

Data FlashBROM

HSM DFlash

Progr.Flash

Progr.Flash

LFBGA-2920.8mm

-40°C to +125°C 1)

60 ADC inputs

LQFP-1760.5mm

-40°C to +125°C 1)

48 ADC inputs

Bare Die

Tjmax 170°C60 ADC inputs

RAM

LMU

EVR

5V or 3.3Vsingle supply

SDMA

1) HOT option available with limited functionality >Ta=125°C 2) not available on TC29x/TC26x – to be considered in SW family concept3) Option: CAN-FD

Sys

tem

Per

iphe

ral B

us

Bridge


7x Series – Umbrella DeviceSAK-TC27xTP-64F200

FCE

HSC

T

SC

U

DS-ADCx

ADCx

PLL

&PL

L ER

AY

Flex

Ray

Mul

tiCAN

+FD

QSPI

x

ASCLI

Nx

SEN

T

MSCx

STM

Ethe

rnet

I²C

TriCore™1.6P

PMI DMIOverlay

FPU

SRI Cross Bar

PSI5

(S)

HSM

GTM

CCU

6x

TriCore™1.6P

PMI DMIOverlay

FPU

Checker Core

TriCore™1.6E

PMIDMI

Standby Overlay

FPU

Checker Core 2)

BCU

Package Variants

Ports

OCDS

GPT

12x

IOM

System Peripheral Bus

PMU

Data FlashBROM

HSM DFlash

Progr.Flash

Progr.Flash

LFBGA-2920.8mm

-40°C to +125°C 1)

60 ADC inputs

LQFP-1760.5mm

-40°C to +125°C 1)

48 ADC inputs

Bare Die

Tjmax 170°C60 ADC inputs

RAM

LMU

EVR


SDMA

Sys

tem

Per

iphe

ral B

us

Bridge


3x TriCore™ 1.6

› Application and I/O processing

Up to 2x Lockstep cores

› ISO26262 ASIL D support

4x programmable GTM sequencer

› Realtime timed I/O processing

1x 32bit security processor

› Programmable security functions

› Hardware acclerators

1x 32bit FFT Engine

› FFT and windowing hardware support

1x 8bit Standby controller

› Low power standby functions

9 user-programmble Cores

RAMM-JPEG/CIFFFT engine

Why Multi-Core?Address the challenges of tomorrow

› Total power limit - Flash single-core processors have peaked at appr. 300MHz@90nm - more power would add system cost (e.g. cooling)

› Further performance enhancements mainly enabled by additional cores – with less power and more flexibility, enabling advanced applications (e.g. safety dedicated tasks)

› Functional standardization allows introduction of highly efficient dedicated accelerator blocks – enabling more optimized devices to save on BOM.

› Microcontroller power modes and power management become more important - only use the performance that is required to enable energy efficient automotive systems.

Set date Page 3410/04/2013 Copyright © Infineon Technologies 2013. All rights reserved.

AURIX™ TriCoreTM based Multi-Core architecturefor Efficient Performance

The Task

› Provide 1.5 times the application perfor-mance compared to previous generation

› Increase performance-power ratio by more than 30%

› Provide means for stronger software encapsulation

Solution

› Introduction of TriCore™ 1.6 multicore architecture

› Efficiency and performance CPU variant› 1000 DMIPS and more application

performance› Advanced power management

technologies, e.g. integrated DC/DC converter, clock gating, low power modes, standby controller

Performance

Po

wer

Dis

sip

atio

n P

d

Single CoreController

Single CoreController

Dual/Multi CoreController

Dual/Multi CoreController

Pd~C∙U2∙f

TC16P

RAM

TC16P

RAM

300MHz 300MHz 200MHz

TC16P

RAM

TC16P

RAM

TC16E

RAM

TC16E

RAM

Crossbar

300MHz

TC16P

RAM

TC16P

RAM

Crossbar

TC1798 AURIX™ High End

PD trend: flat


TriCore™ OverviewTC 1.3 TC 1.3.1 TC 1.6 TC 1.6Performance

(version TC 1.6.1)TC 1.6Efficiency(version TC 1.6 Scalar)

Architecture 32-bit superscalar Harvard

32-bit superscalar Harvard



32-bit scalar Harvard

Max. Frequency 150 MHz 180 MHz 300 MHz 300 MHz 200 MHz

Pipeline stages 4 4 6 6 4

DMIPS / MHz 1,55 1,68 1,7 1,7 – 2,3 1.4 – 1,7

Instruction cache Two way set associative,256-bit cache line length

Two way set associative,256-bit cache line length

Four way set associative, 256-bit cache line length

Two way set associative, 256-bit cache line length

Two way set associative, 256-bit cache line length

Data cache Not in Automotive Products

Two way set associative128-bit cache line length



4 line read buffer or Two way set associative128-bit cache line length

HW int. division unit

No No Yes Yes Yes

MAC units dual 16x16 multipliers dual 16x32 multipliers dual 16x32 multipliers dual 16x32 multipliers dual 16x32 multipliers

FPU Single precision (32-bit) Single precision (32-bit) Single precision (32-bit) Single precision (32-bit) Single precision (32-bit)

FPU performance 0,66 FLOPs/cycle 0,66 FLOPs/cycle 2 FLOPs/cycle (pipelined)

2 FLOPs/cycle (pipelined)

2 FLOPs/cycle (pipelined)

User modes Supervisor, user 1, user 0

Supervisor, user 1, user 0




Memory protection

2 protection sets (overlaid HW breakpoints)

4 protection sets (overlaid HW breakpoints)

4 protection sets (separate HW breakpoints)



Instruction set 16/32 bit instructions 16/32 bit instructions 16/32 bit instructions 16/32 bit instructions 16/32 bit instructions

Compatibility TC1.2 compatible TC1.3 compatible TC1.3.1 compatible TC1.6 compatible TC1.6 compatible

Other features n static branch predictor n dynamic branch predictor

n Enhanced branch pre-diction (branch history and target buffers)

n Dual core support

n Safety support

n Dual core capable

n Power consumption optimized

n Safety support

Status Production (Audo-NG) Production (AudoFuture) Production (AUDO MAX) Production (AURIX) Production (AURIX)

Page 362014-12-15 Copyright © Infineon Technologies AG 2014. All rights reserved.

Monaco

e200z335@80Mhz

Andorra

e200z4@150MHz

Mamba

e200z7@266Mhz

SH7286

SH2A@100Mhz

Estimation

SH2A@200Mhz

TC1767/24

TC1.3.1@80Mhz

TC1797/82

TC1.3.1@180Mhz

TC179x

TC1.6@300Mhz

152%

100%

46%

81%

45%

113%

80%

28%

Freescale Renesas Infineon

TC179x

TC1.6@200Mhz

113%

TC1767/28

TC1.3.1@133Mhz

74%

Performance benchmark based on the application code for a 4 cylinder direct injection engine management system

Estimation1.5x

TC1.6P@300Mhz

228%

TC29

xT

Estimation1.5x

TC1.6P@200Mhz

170%

TC27

xT

Exceptional Performance


AURIX™ safety system architecture exampleEPS (electric power steering)

Sense Compute Actuate

Supply

Communicate

Rotor PositioniGMR SensorTLE 5009/12

Torque SensorTLE 4998 32-bit

LockstepMCU

AURIX™

TC233L

CAN TransceiverTLE 6251D / TLE7250G

FlexRayTransceiver (opt.)

VMCU

VSens VLogicVTx

3-PhaseDriver

IC

TLE9180

MotorCurrent

М

OptiMOS™-T2 40V7x IPB180N04S4-01

VBAT VBAT

TLF35584Safety Power Supply

Failure Protection Failure Diagnosis Redundancy Diverse Implementation382014-12-03 Copyright © Infineon Technologies AG 2015. All rights reserved.

AURIX™ safety system architecture exampleEPS (electric power steering)

Sense Compute Actuate

Supply

Communicate

Rotor PositioniGMR SensorTLE 5009/12

Torque SensorTLE 4998 32-bit

LockstepMCU

AURIX™

TC233L

CAN TransceiverTLE 6251D / TLE7250G

FlexRayTransceiver (opt.)

VMCU

VSens VLogicVTx

3-PhaseDriver

IC

TLE9180

MotorCurrent

М

OptiMOS™-T2 40V7x IPB180N04S4-01

VBAT VBAT

TLF35584Safety Power Supply

Failure Protection Failure Diagnosis Redundancy Diverse Implementation392014-12-03 Copyright © Infineon Technologies AG 2015. All rights reserved.

AURIX™ –HW measures supporting safety

System

Micro-controller

B

A AA AA

Inte

rrup

t co

ntro

ller

Redundant, spatially separated peripherals

A

Bus Monitoring UnitB

Safe DMAC

C

Safe SRIDD

SRAM ECC (DECTED with enhancements to detect multi bit failures)

E

E E EE

Flash ECC (SECDED with enhancements to detect multi bit failures)

F

F

Lockstep coreG

G

Memory protection coreH

Memory protection peripheralsII I I I I I I I I I I I

I III

Safe Interrupt ProcessingJ

J

Flexible CRC Engine (FCE)K

K

IO MonitorL

L

Clock MonitoringM

M

CPU self tests (90% Latent Fault Metric)N

N N N

GTM

E

I

H H H


Exemplary processing of a safety critical task

SensorActuator

1

2

3

4

5

6

9

1 Analog to digital conversion

2 Sensor data pre-conditioning

3 Data transfer to SRAM

Fetching of data and/or code from flash

4

Data processing 5

6 Derived data transfer to timer

7 Timer data processing

8 Timer data transfer to communication interface

9 Communication to actuator

System

Micro-controller

Lockstep core domain

Lockstep cores support the safe processing of data, but many additional features are required to build a safe system!

GTM7

8


Hardware Security Module (HSM)

• A highly flexible and programmable solution

• AES128 HW accelerator matching performance for automotive protocols

• Crypto- and Algorithm Agility by Software

• AIS31 compliant True Random Number Generator (TRNG) with high Random Entropie over Lifetime

Secure Platform HSM: 32 bit CPUAES AcceleratorSecurity

CPU

SecAPP

SecAPPþ

SecAPP

AESRNG

ÏsecAPP HSM

ECCRSA

Embedded µC Security - AURIX™ Security Hardware

Page 422014-12-15 Copyright © Infineon Technologies AG 2014. All rights reserved.

AURIX™ kits and toolsavailable

http://free-entry-toolchain.hightec-rt.com


http://free-entry-toolchain.hightec-rt.com

TLF35584QVVS1/VS2 plus AURIX™ TriBoardEvaluation Environment

TLF35584-Evaluation-Boards (Green)› TLF35584-Evaluation-Boards (Green)

– Equipped either with 3V3- or 5V-variant

– Can be adapted to high- and low-switching frequency

› AURIX™ TriBoard (Red)

– For TLF35584-configuration

– Stack-concept

– GUI – Parameter setting – Monitoring functions– SPI-communication logging – Register modification – Flag control


Infineon AUTOSAR offeringLow level driver (MCAL) ISO26262 compliant


Integrated CompilerEnvironments

Emulators/DebuggerDevelopment Systems

Simulation/Virtual Prototyping

Embedded Software SolutionsAUTOSAR suites

OperatingSystems

Auto CodeGeneration Tools

Data Measurement, Calibration& Rapid Prototyping

Timing/Scheduling Analysis

dSPACE Etas

Hitex iSYSTEM Lauterbach PLS

dSPACE Etas Vector

Synopsys

AbsInt GLIWA

TASKING GNU GCCDiab Compiler

Symtavision

Programmer /Flash Tools

Training /Services

VectorInformatic

elektrobit

elektrobit Etas VectorHightec

Software Verification

Data IO Hitex PLS Promik SMH

The MathworksBTC GAIOAbsInt

HTVGöpel Hitex MicroConsult

Timing Architects

KPIT

AccurateTechnologies

Etas

AURIX™ Tool Chain


3x TriCore™ 1.6Application and I/O processing

Floating Point Unit

Up to 3 instructions/cycle

Set datePage 47

FCE

HSS

L

SCU DS-ADC

ADC

SCR

Flex

Ray

Mul

tiCAN

+

QSP

I

ASC

LIN

SEN

T

MSC

STM

Ethe

rnet

I²C

TriCore™

1.6PPMI DMI

FPU

HSM

GTM

CC

U6x

TriCore™

1.6P

PMI

FPU

TriCore™

1.6P

PMI DMI

FPU

Checker Core

BC

U

GPT

12x

IOM

Program

Flash

Sys

RAM

DMI

EVR


SDMAPS

I5(S

)Data

FlashFFT

Crossbar

Peripheral Bus

Bridge

1x 32bit 1x 32bit 1x 32bit

10/04/2013 Copyright © Infineon Technologies 2013. All rights reserved.

Per

form

ance

Saf

ety/

Sec

uri

ty

TriCore™ 1.6 LockstepSafety Management (SCU)Safe DMA (SDMA)I/O Monitor (IOM)CRC unit (FCE)Hardware Security Module (HSM)

1x 32bit

Con

nec

tivi

ty 1x Fast Ethernet (AVB supported)1x Flexray4x MultiCAN + FD1x HSSL

Pow

er 1x Single Supply EVR DC/DCSamples and kits available for the TC27x: June 2014

Early sampling already on request

AURIXTM Product Features - SummaryMultiCore - Making the difference

AURIXTM useful links

Product home page AURIXTM: www.infineon.com\AURIX

AURIXTM forum for technical information exchange: www.infineon.com\tricore-forum

AURIXTM Documentation access: www.myinfineon.com

Free tool chain AURIXTM: http://free-entry-toolchain.hightec-rt.com/


http://www.infineon.com

http://www.infineon.com

http://www.myinfineon.com

http://free-entry-toolchain.hightec-rt.com/

Infineon in China

Infineon Official Website www.infineon.com/cn

Infineon Official Website www.infineon.com/cn

Infineon China

Official Wechat

Wechat Account：InfineonChina

Wechat QR Code：

Infineon Tech

Community (Chinese)

http://www.infineonic.org/

Infineon Automotive ecosystem

official website

http://www.infineon-

ecosystem.org/

Infineon power

management and RF tech community

http://www.infineon-power-rf.org

Infineon Automotive ecosystemWechat QR

Code

Weibohttp://weibo.com/inf

ineonecosystem

Page 492014年6月27日 © 英飞凌科技股份公司版权所有，2014年。保留所有权利。

http://www.infineon.com/cn

http://www.infineon.com/cn

http://www.infine

http://www.infine

http://www.infine

http://weibo.com/inf

Lauterbach Infineon

Support infineon targets

Debug Tools


OCDS-L1/DAP Interface

Onchip Trace for TriCore™ ED

Support forPXB4260, TC10GP, TC1100, TC1115,TC1124, TC1128, TC1130, TC1161, TC1162, TC1163, TC1164, TC1165, TC1166, TC1167, TC1182, TC1184, TC1191, TC1193, TC1197, TC1198, TC11IA, TC11IB, TC11IC, TC1337, TC1367, TC1387, TC1724, TC1728, TC1736, TC1746, TC1762, TC1764, TC1765, TC1766,TC1767, TC1768, TC1775, TC1782, TC1784, TC1791, TC1792, TC1793, TC1796, TC1796L, TC1797, TC1798, TC1910, TC1912, TC1920

Support forTC1287ED, TC1736ED, TC1724ED, TC1728ED, TC1766ED, TC1767ED, TC1782ED, TC1784ED, TC1791ED, TC1793ED, TC1796ED, TC1797ED, TC1798ED

Trace32 for TriCore™


Debug Tools

› AURIX™ Family

2014-02 All supported

2013-02

2012-02 First Aurix support


Multi-Core Debugging and Tracing

› Multicore debugging for up to three TriCore™ cores, HSM core and GTM

› Ready-to-use FLASH programming scripts

› On-chip trace as well as serial off-chip trace

› Start and stop synchronisation


AMP Multi-Core Debugging


Thank You!


Documents

AURIX MultiCore Lauterbach handout Market Positions* nNo. 2 in Automotive semiconductors worldwide nNo. 1 Europe nNo. 3 North America nNo. 1 APAC & RoW nNo. 1 Korea nNo. 3 China nNo