Career_Profil Latest

Career Profile

1

Mehul Shivadatta Dhonde

Self introduction

2

• Current Title: Test Engineering Manager, Quality

• Back Ground: Belong to Indian origin , Mumbai.38 year old married man.

• Bachelor of Engineering in Electronics and Telecommunication (University of Mumbai, India).

• Diploma in Industrial Electronics (Board of Technical Examinations, Mumbai, India)

• Skills –

Product Design Testing, Verification and Validation;

Failure Analysis;

Quality Assurance;

Experience

Has been working in China / Hong Kong for more than 6 years in an Electrical, Electronics and Telecommunication products related Industry with various roles.

Engineer or Leader Level experience of about 7+ Years.

Supervisory or Middle Management Experience of about 5 Years.

• Specific Roles of career –

Failure Analysis & Reliability Test Engineer ( Dongguan Elcoteq Electronics Ltd.)

Assistant Quality Assurance Manager (Chung Nam Electronics – Positioned in Hong Kong).

Group Quality Leader for supplier quality management (Newell Rubbermaid).

Senior Failure Analysis Engineer (Philips Solid State Lighting Solutions).

Current - Test Engineering Manager (Green Mountain Coffee Roasters – Electrical Appliances Technical Consultancy Shenzhen Ltd. Subsidy of Keurig Green Mountain , US).

Self introduction

3

• Highlights of Important Projects accomplished in career-----

Functional Test Yield Improvement (60% to 80%) on Set Top Box (Electronics and Telecom) Product;

Design and Implement Lab View based software for environmental test temperature chamber;

Green Belt Six Sigma Projects of improving common failure modes in mobile phone products (Average

defects reduced from 20% to 3% for LCD, Keypad, Small DC Electric Motor etc…);

Black Belt Six Sigma Project Support to peers for failure analysis & Design of Experiment

Touch LCD Gasket failures improvement (Especially from process contamination etc.)

(Average defect reduced from 10% to 2%);

Poly Carbonate Lens environmental stress cracks for lighting fixtures;

(Average defect reduced from 15% to 5%)

Wire Bond Process Improvement for Chip On Bond on LED Driver PCBAs;


Plastic Housing Cracks @Screw Boss for mobile phones, Lighting Fixtures;


Small DC Electric Motor used in Radio Frequency based Receiver for base station failed to operate

occasionally;


Current products

4

Involved with following products for providing design verification, validation and failure analysis services.

Set top boxes and its accessories

LED Lamps

LED Luminaries

Various Electrical Products and its sub assemblies

Solar panel chargers

GPS Bracelet

Mobile Phones

Remote Control

LCD’s

Coffee Brewers or Machines

Products Display –Set top boxes and

Accessories

SD & HD video reception

Supports MPEG-2 &

MPEG-4/H.264 AVC

Latest silicon offering

advanced performance &

features

High-quality HDMI™

output & USB connector

SPDIF output for high

quality audio loop through

such as Dolby ®Digital

Built in networking

capability

Optional support for HDD

upgrade to DVR

5

Products Display – LED Lamps

6

Products Display – LED Luminaries

7

Products Display – Mobile Phones

8

Products Display – Solar Strap Chargers

9

Products Display – GPS Bracelet

10

Products Display – Phone Accessories

11

Products Display – Telecom Network

12

Products Display – Mobile Phone

Mobile phones with normal features

Supports GSM 800/900

USB interface with computers

Text messaging

Call forwarding / call awaiting /

Talk time 180 to 480 minutes

Standby time 420 to 620 hours

13

Products Display – LED Luminaires

LED Luminaires with different LED Luminance

and Output Power Specifications.

Refer to www.colorkinetics.com

14

http://www.colorkinetics.com/



















Innovative Coffee Brewers or Machines.

Refer to www.keurig.com or www.gmcr.com

15

Products Display – Coffee Brewers

http://www.keurig.com/








http://www.gmcr.com/

15

Generic Testing and Validation Map Followed in Career

No. Items Brand Discription Model Qt'y Ref. Photo Reference

Unit Price

Sub

Tota l Reference Information

Availabilty in

Engineering

Lab

Sharing Possibility Insta lla tion Phase

Acquisition and

1 Oscilloscope Lecroy 200MHz, 4 channels,

.5GS/s, 5Mpst/CH

W aveSurfer

24Xs-A 1 44617 44617

es.aspx?mseries=49&capid

http://www.lecroy.com/Os Y

cilloscope/OscilloscopeSeri

=102&mid=504

Minimum 1st Phase

2 Current Probe Lecroy 50MHz, 30A, 7ns CP030 1 17850 17850 modelid=1130&categoryid= Y

http://www.lecroy.com/Op

tions/ProductDetails.aspx?

3&groupid=7&capid=102&m

id=508

Minimum 1st Phase

3 High-Voltage

Differential Probe Lecroy

1400Vpeak, 20MHz

and 100MHz ADP305 1 8480 8480

tions/ProductDetails.aspx? Y


modelid=300&categoryid=3

&groupid=148

Minimum 1st Phase

4 Portable

multimeter Fluke Digital multimeter FLK-289 1 6385 6385 cs_id=37737%28FlukeProdu Y

http://www.fluke.com.cn/cnzh

/products/specifications.htm-

cts%29&category=HMA%28

FlukeProducts%29.htm

Minimum 1st Phase

5 DC Power supplier Agilent

80W Power Supply,

35V/2.2A or 60V/1.3A, E3645A

1 output

1 6513 6513 35489.384192.00&cc=US&lc

Y

http://www.home.agilent.com/

agilent/product.jspx?nid=-

=eng

Minimum 1st Phase

6 Power Meter YOKOGA

W A

26A, 0.1%,

0.5Hz~100kHz W T210 1 18600 18600 analyzers/digital-power-

http://tmi.yokogawa.com/prod

ucts/digital-power-

analyzers/wt210wt230-digital-

power-meters/

Y Minimum 1st Phase

7 AC Power Source

IDRC 500VA, 0~300V 2.1A CF-500T 1 9300 9300 http://www.idrc.com.tw/big5_v

Y er/products/cf_t/cf_t.htm

Minimum 1st Phase

8 Desktop

Multimeter Agilent

Industry Standard

Digital Multimeter, 6½

Digits: dc & ac voltage,

dc & ac current, 2 & 4

wire resistance,

frequency & period,

continuity, diode test

34401A 1 7258 7258 agilent/product.jspx?nid=-


536902435.536880933.00&cc

=US&lc=eng

Y Minimum 1st Phase

9 IR Thermometer Ryobi Measure surface

tempearure ZRIR001 1 1500 1500 /catalog/accessories/electr N

http://www.ryobitools.com

onic_hand_tools/IR001

NA 1st Phase

10 clamp meter

Leakage current 1 3500 3500 N NA 1st Phase

Sub Tota l

(1st Phase) 124004

16

Electronic Equipments utilized in career for testing and validation

http://www.lecroy.com/Os



































































































http://www.idrc.com.tw/big5_v

































http://www.ryobitools.com/

















Electronic Equipments for testing and validation

18

Lab Equipments for testing and validation

Note: Comprehensive knowledge of material characterization techniques such as FTIR, SAM, SEM, EDX, Cross Section,

Dye and Pry 19

1

6

Microscopes 300X to 1000X

high

magnification

microscopes

required

Leica

M3Z or

MZ6

1 271

74

271

74 http://www.leica-

microsystems.com/

product s/stereo-

microscopes-

macroscopes/routi

ne-

manual/details/pro

duct/lei ca-mz6/

N NA 2nd Phase

1

7

IV Tracer To measure

current voltage

charcteristics of

LED @ PCBA

2nd Phase

1

8 Extrusion

Plastometer

Melt Flow

Rate Test

Tini

us

Ols

en

Advanced melt

indexing

Extrusion

Plastometer

System

MP60

0 or

MP12

00

(http://

ww

w.tinius

ols

en.com/

pdf

1 759

40

759

40 http://www.tinius

olsen.co

m/tiniusimages/TD

914- MP600.pdf

N NA 2nd Phase

/TD-985-

4lr.pdf)

Sub

Total:

1031

14

http://ww/

http://ww/

http://ww/

http://ww/

http://ww/

http://ww/

http://ww/

http://www.tiniusolsen.co/



















№ Items Brand Discription PN Qt'y Ref. Photo Reference Sub Tota l

Unit Price Availabilty in

Engineering Lab

Sharing

Possibility

Acquisition and

Insta lla tion Phase

1 Hammer W iha No rebounding, 25x288 02092 7 1 236.00 236.00 N NA 1st Phase

2 File K it Cromwell

(Kennedy) 6 items - 1 162.00 162.00 N NA 1st Phase

3 W rench Cromwell

(Kennedy) FINISH ADJUSTABLE

150mm/6" PHOSPHATE - 1 88.00 88.00 N NA 1st Phase

4 Hammer Cromwell 16oz CLAW HAMMER

(Kennedy) STEEL TUBE SHAFT - 1 107.00 107.00 N NA 1st Phase

5 Hole Gauge SK 0.100-0.290mm - 1 N NA 1st Phase

6 Hole Gauge SK 0.300-1.525mm - 1 N NA 1st Phase

7 Filler Gauge Mi tutoyo 0.05-1.0mm - 1 380.00 380.00 N NA 1st Phase

8 Drilling & M illing

Kit Pro'sk it

E lectric (220V), drilling 5, -

mill ing 6 1 258.00 258.00 N NA 1st Phase

9 Tens ile testing

machine

Press ing, bending and

twis ting test 1 500.00 500.00 N NA 1st Phase

10 Tool Box Cromwell

(Kennedy) 450x250x325mm

PROFESSIONAL 4

DRAW ER, - 1 394.00 394.00 N NA 1st Phase

Sub Total (1st

Phase) 3445.00

1320.00 1320.00

19

Mechanical Equipments for testing and validation

R e p l y

F a i l u r e C o m p l a i n t

R e p l y

H a lt S h i p m e n t

R e p l y R o o t C a u s e

&

E n g i n e e r i n g

I n s t r u c t i o n s

C o r r e c t i v e A c t i o n

R e q u e s t f o r E n g i n e e r i n g M a n u f a c t u r e P r o b l e m C o r r e c t e d

C o u n t e r m e a s u r e

C u s t o m e r

S Q E

Q A D e p a r t m e n t

F a i lu r e A n a ly s i s

M a n u f a c t u r i n g

D e p a r t m e n t

E n g i n e e r i n g

D e p a r t m e n t D i s t r i b u t i o n

D e p a r t m e n t

P r o d u c t i o n , Q u a li t y , P r o c e s s ,

T e s t

C o m m e n t s :

T e s t a n d F a ilu r e A n a ly s is t e a m s a r e in t e r r e la t e d b y t h a t ; T e s t s v e r if y t h e f a ilu r e m e c h a n is m s t h a t h a p p e n a s e x p e c t e d ; T e s t s id e n t if y n e w f a ilu r e m e c h a n is m s w h ic h a r e n o t e x p e c t e d ; T e s t s v e r r f y t h e e f f e c t iv e n e s s o f a c t io n s t h a t p r e v e n t f a ilu r e ;

Failure Analysis Relationships with Other Teams

21

Basic Terms of Failure Analysis

22

Logical Approach

23

Generic Failure Analysis Process Followed

Failure Analysis Actions to be executed

Bad Sample Good Sample

A) Analytical Test --- Localization of failure using bench testing.

B) Identify failure component.

a) Test product.

b) Reproduce failure using highly accelerated life time test.

C) Test Mode --- FESEM, FTIR, MFR, SEM, SAM, DSC, etc… c) Analytical Test --- Analyze crack propagation and obtain surface analysis through fracto-graph

D) Task 1: Record results in tabular format both test modes Task 2: Both test mode tabular results comparison to be documented in analysis report.

d) Test Mode --- FESEM, FTIR, MFR, SEM, SAM, DSC,etc… e) Determine failure mechanisms.

f) Task 1: Record results in tabular format both test modes

Task 2: Both test mode tabular results comparison to be documented in analysis report.

SEM – Scanning Electron Microscope

FESEM – Field Emission Scanning Electron Microscope

FTIR – Fourier Transform Infrared Spectroscopy

MFR – Melt Flow Rate, DSC – Differential Scanning Calorimetry for Plastics failures

SAM – Scanning Acoustic Microscope

23

Logical Flow Diagram Failure Analysis Process

Bad Sample

25

Good Sample

A

B

C

a

b

c

d

Compare Results

& Analysis

Reporting

D e f

Die

Package

Examples

Die Scratch

Ball Lifting

Pictures Product Related

Optical SEM

Ball Lifting

Failure Modes Analyzed

26

Failure Modes, Technique and Equipments

V a r io u s F a i lu r e M o d e s

T e c h n i q u e : V is u a l &

M ic r o s c o p y T e c h n i q u e : F u n c t i o n a l T e s t i n g

i ) P a c k a g e d e la m in a t io n ;

i i ) P a c k a g e C r a c k in g ;

i i i ) M is s a l l ig n m e n t ;

i v ) S o ld e r b r id g e , c r a c k ;

i ) E S D / E O S ;

i i ) D ie c r a c k in g ;

i i i ) C o r r o s io n ;

i v ) E le c t r o m ig r a t io n ;

T e c h n i q u e :

M e c h a n i c a l

T e s t i n g

J e t E tc h e r fo r

D e c a p p i n g :

O u t S o u r c i n g

H i g h E n d M ic r o s c o p e

P l a n fo r In H o u s i n g

P h a s e 1

C r o s s S e c t i o n i n g E q u i p m e n t

In h o u s e ( E lc o te q B e i j i n g ) S c a n n i n g A c o u s t ic M ic r o s c o p e

P l a n fo r In h o u s i n g

P h a s e 2

C u r v e T r a c e r


P h a s e 2

P r o b i n g S ta t i o n


P h a s e 2

X - R a y

P l a n : O u ts o u r c i n g

S o l d e r a b i l i t y T e s t

S y s te m

P l a n : O u ts o u r c i n g

27

i) Corrosion;

ii) Deformation;

iii) Package Cracks;

iv) Damaged Joints;

i) Short Circuit;

ii) Open Circuit;

iii) Functional Failure;

iv) Contact Resis;

i) Broken bond wires;

ii) Missing solder ball;

iii) Miss allignment;

iv) Solder bridge, crack;

v) Solder Joints

Technique: X Ray &

Solderability Test

System Technique: Scanning Acoustic

Microscopy

i) Intermetallic Growth;

ii) Short Joints Cracking;

iii) PCB Cracks & Delamination;

Technique: Cross

Sectioning

i) W ire Pull;

ii) Die Shear;

iii) Ball Shear;

Technique :

Decapsulation

Failures resolved, Quality Improved No Product Component Failure Location Analysis Improvement

1 Coffee Brewer Exit Metal Needle 4%

(5000 DPPM)

• Consumer Simulation Test

/ Warranty claims.

Slide 28 to 32 <0.2%

(100 DPPM)

2 Display LCD 5 %

(6000 DPPM)

• Product Line.

• Consumer Simulation

Test.

Note: LCD condensed /

Electric Over stress.

Slide 33 to 37 <1%

(500 DPPM)

3 LED Product Control PCBA 3%

(3500 DPPM)

• PCBA Mfg. Lines.

Note: LED fast shutdown or

failures @ customers.

Slide 38 to 41 <0.5%

(600 DPPM)

4 LED Product Power PCBA 2%

(2900 DPPM)

• PCBA Mfg. Lines.

Note: Capacitor failed in

Accelerated Life Test.

Slide 42 to 45 < 0.2 %

(100 DPPM)

5 Coffee Brewer Micro-switch 19%

(20000 DPPM)

• Field failure returns for

warranty claims. Puncture

mechanism does not

activate for Brew.

Slide 46 to 50 < 0.3%

(200 DPPM)

6 LED Product Power Connector 10%

(4000 DPPM)

• Field failure returns Slide 51 to 54 <0.1% (100

DPPM)

7 LED Product Chip on Bond 7% (3000 DPPM) • Field failure returns Slide 55 to 63 < 0.2% (150

DPPM)

8 LED Product Plastics 11% (3400 DPPM) • Field failure returns Slide 64 to 76 <1% (500 DPPM)

9 LED Product Power Cord 2%

(2800 DPPM)

• Product Line. Slide 77 to 78 < 0.1%

(90 PPM)

10 Set Top Box Power PCBA 1.5%

(2300 DPPM)

• PCBA functional and life

test.

Slide 79 < 0.2%

(150 DPPM)

11 Coffee Brewer Boiling section 3%

(3200 DPPM)

• Consumer Simulation Test. Slide 80 to 81 < 0.1%

(90 DPPM)

28

Clogged Needle Needle Plate Check Valve Analysis

29

Vacuum created due to pressure difference between Exit Needle and Umbrella Valve. Coffee Grounds suck back to exit needle and clog.

Keurig Clogged Needle

Needle Plate Check Valve Analysis

30

Keurig Clogged Needle


31

Keurig Clogged Needles

• Verify the check valve function on 2.0 brewers returned for needle clogs in Triage

• Determine root cause of poor welds on check valve seats at CM’s. The needle plate/CV assy.

are functionally checked during manufacture.

• Verify Test Plans and Stage gate of tests after ultrasonic welding and induction welding for

puncture mechanism assembly.

Slow leakers escaped during testing after welding process. Did analysis pressure decay curves.

• Dimensional analysis of all parts/cavities.

• Review welding and post weld pressure test process at CM’s.


32

Failures resolved - LCD

Product: Flat panel display, that uses the light modulating properties of liquid crystals.

Product Construction: The displays are constructed with a reflector on the back, a polarizer, glass with electrodes on the inside,

a seal with liquid crystal, glass, and top polarizer.

Failure Mode: Light display fading issues closest to the seal.

Failure Location: Closest to the seal @ LCD Assembly between glass layers.

Failure Analysis Test: Moisture Ingress Analysis Test.

Failure Mechanism: Moisture Ingress. Liquid Crystal had lost interfacial wetting. The seals were cut to open the sandwiched

LCDs, and SEM-EDS analysis was performed. The black spots occurred the LC had lost contact with the interface of

the glass. It is most likely that moisture in very low quantities, was the cause of the problem. Water vapor, however,

will not show in SEM-EDS or FTIR in a single digit ppm level. There was definitely a contamination or moisture issue

inside the LCD, which could be analyzed with mass spectrometry. Note: EDS of Micrograph can be referred at next slide. Failure Cause: Moisture Ingress. Cause for the fading is inherently inside the liquid crystal or ingress through the seal

over time. Resolution: Liquid Crystal with better high viscosity and process optimization of controls such as pressure sealant

coating.

Good LCD SEM Micrograph Black Spots in LCD

33


34


Product: LCD controller/drivers mounted directly on glass and connected via a 24 pad polyimide flex circuit to a FRU controller

card

Product Construction: The displays are constructed with a reflector on the back, a polarizer, glass with electrodes on the inside, a seal with liquid crystal, glass, and top polarizer.

Failure Mode: Short Circuit.

Failure Location: Chip with blown I/O.

Failure Analysis Test: Cross Section / SEM .

Failure Mechanism: Electric Over Stress. There is a direct correlation between the failures and the EOS found on the die

at the test point pads. The good die had no EOS on any of the test point pads with the same date code. Since these

test points are output pins, this would imply the circuitry associated with these test pads have seen too much power

also. This would inherently raise a concern over reliability and latent damage on the die prior to use. Since these test

pins are not connected in any way to the application and a connection must have been made to make them fail, then

the testing must have occurred at the manufacturer.

Resolution: Not Applicable as it showed some malfunction by manufacturer during testing.

Interconnects to Chip Chip with blown I/O

35


Material Analysis: Thinner Multi-layer materials and polymers (especially the adhesive layers in polymer laminates). Failure

Analysis Technique: Micro and Macro Attenuated Total Reflection Focal Plane Array (FPA) imaging system. Analytical

Information: Chemical information about product failure of functional films in LCD screens. A high spatial resolution from

several small beads and their surroundings providing a comprehensive means of troubleshooting product defects in the

manufacturing process.

Critical Analysis: 3 micron adhesive layers in multilayer laminates, the orientation of surface -bound monolayer species on

silicon, or the identification of contaminants such as METAL CONTAMINATION.

Resolution: Process Optimization for Silk Printing and / or Etching.

36


Material Analysis: Thinner Multi-layer materials and polymers (especially the adhesive layers in polymer laminates). Failure

Analysis Technique: Micro and Macro Attenuated Total Reflection Focal Plane Array (FPA) imaging system. Analytical

Information: Chemical information about product failure of functional films in LCD screens. A high spatial resolution from

several small beads and their surroundings providing a comprehensive means of troubleshooting product defects in the

manufacturing process.

Critical Analysis: METAL CONTAMINATION as Skin Flake during Etching and / or Screen Printing.

Resolution: Process optimization and controls for Etching and Screen Printing.

37

Failures Resolved – LED Defect

38

Failures Resolved – LEDs Fast Shut Down or LEDs Out

39

Failures Resolved – LEDs Fast Shut Down or LEDs Out

40

Material Characterization Analysis Processed through SGS and LED Suppliers such as NICHIA,

Samsung, CREE. Usually such defects result of

Failure Mode: Crack or damage to Epitaxial Layer, MESA structure damaged.

Failure Mechanism: mechanical stress, inherent defect to LED Chip

Failure Location: Hi-pot Testing, Field Installations etc…

Failure Cause: Pick and Place force @ SMT Process >>> 3 Newton's (General). When Reflow Profile

not meet optimization under

heat zone could cause stress @ LEDs during thermal cycles in reflow oven. If Reflow oven process is

air reflow based it would be much easier to avoid stress and inherent defect s to LED chip getting

worst and prolong the LED performance in the field.

Quality Control Test: Environmental Testing of LED Fixtures @ AQL under stringent temperature /

humidity conditions to see effectiveness of corrective actions.

Failures Resolved – LEDs Fast Shut Down or

LEDs Out

41

Failures Resolved – Ceramic Capacitor

42


43


44


45

Electrical Circuit failed in burn in test with full resistive load.

Bench level diagnosis depicted some semiconductor JFET’s as well as critical location ceramic

capacitor found short in every inspected.

Further fault isolation as per design analysis ceramic capacitor crack is root cause of failure.

Designed and executed Highly Accelerated Life Test “High Temperature Testing” using

temperature chamber to reproduce defect.

Determine “Mean Time Between Failure (MTBF)”.

Locate same symptoms of failures.

Evaluate product design using “Design for Reliability” Software.

Failure Mechanism identified as BaTiO3 as ceramic ferroelectric material inside capacitor

which will always tend to develop impurities at various temperature of operations, tending to

create possibility of increment in leakage current inside capacitor walls.

Suggested the design changes from 1206 to 1210 package size of capacitor component

reduce defect percentage.

Design changes resulted in considerable increment in First Pass Yield from 68% to 95% @

burn in test.

All these actions are conceived by my self and leaded by myself. Physical activities done by

support team.

M o b i l e C o n t a c t o f S w i t c h F i x e d C o n t a c t o f S w i t c h

A b o v e & B e l o w i n s p e c t i o n a f t e r 1 0 8 C y c l e s u n d e r h o t s w i t c h i n g o f 3 V / 1 0 M i c r o A m p o p e r a t e d u n d e r 2 0 0 M i c r o N f o r c e

S c a n n i n g E l e c t r o n M i c r o s c o p i c I n s p e c t i o n f o r G o l d / S i l v e r c o a t e d c o n t a c t s

S c a n n i n g E l e c t r o n M i c r o s c o p i c I n s p e c t i o n f o r R u t h e n i u m c o a t e d c o n t a c t s

1

2

M o b i l e C o n t a c t o f S w i t c h F i x e d C o n t a c t o f S w i t c h

- - - B l a c k c i r c l e s o b s e r v e d m o s t l y o n t h e e d g e s o f c o n t a c t . B l a c k t r a c e s o r c i r c l e s c a l l e d " F r i c t i o n a l P o l y m e r s " g e n e r a t e d w h e n c a t a l y t i c c o n t a c t m a t e r i a l s s u c h a s R u t h e n i u m a r e b r o u g h t i n t o c o n t a c t i n p r e s e n c e o f

c a r b o n a c e o u s c o n t a m i n a t i o n . - - - T h e s e f r i c t i o n a l p o l y m e r s a r e r e s i s t i v e c a n d e v e l o p r e s i s t a n c e > 1 0 K O h m r e s u l t i n g i n t o s t i c t i o n f a i l u r e o f m i c r o s w i t c h . - - - S c a n n i n g E l e c t r o n i c M i c r o s c o p i c i n s p e c t i o n a t e n d o f h o t s w i t c h i n g t e s t i n g s h o w s R u t h e n i u m c o n t a c t s a r e b e s t s u i t e d d e v e l o p i n g l e s s f r i c t i o n a l p o l y m e r s .

C o n c l u s i o n - - - G o l d , S i l v e r o r i t s a l l o y s p l a t e d / c o a t e d c o n t a c t s a r e p r o n e t o s t i c t i o n f a i l u r e o v e r p e r i o d o f t i m e

a n d u s a g e e s p e c i a l l y i n f i e l d a s h i g h c o n t a c t r e s i s t a n c e i s d e v e l o p e d i n t e r m s o f f r i c t i o n a l p o l y m e r s

I n d u s t r y s t a n d a r d s s u g g e s t c o m b i n e d m e t a l c o a t i n g / p l a t i n g s u c h a s g o l d a n d r u t h e n i u m 46

Micro Switch Advanced Failure Analysis

(Reference: A Practical Guide for Component Manufacturers of Electronic Components and Systems--- Page 275 to 278 @ link in this box in F5 Run Slide Show m ode

http://books.google.com.hk/books?id=mUhuglLyFf8C&pg=PA287&lpg=PA287&dq=micro%2Bswitch%2Bfailure%2Banalysis&source=bl&ots=Emfg0AnLLL&sig=VNM3JKyvgFFFKd2lR0iNsSEAtRU&hl=en&sa=X&ei=x64TUKKNDYqbiQetroHYCQ&ved=0CGUQ6AEwBQ


















































































































































47

Fishbone Diagram for Micro Switch Failure

Cause Effect Analysis

Electro performance of base

material or plating material

(Silver) degrades over time

No contact

resistance

measurement @

IQC or in

functional testing

@ assembly level

No system to make sure silve plated contacts are

degraded or contaminated from foreign particles such

as dust, etc...

Process Materials

Process

Personnel

Degrade the silver plated contacts

such that and lower the electro

performance of the silver plated and

the base material contacts

Defect

Switch Failure e.g. Stiction

Failure

Measurement

Enviornment

No Passivation in the electro-

plate process. Silver plated

surfaces are not protected, will

act with Sulfate，Chloride ion

and Hydrogen sulfide. Electro

performance of silver

sulfate and silver sulfide is poor

Performance of

passivation

oxidation film is

poor for silver

plated contacts

1

2

3

4

5 6

(√-) Not likely to cause failure

(√) Likely to cause failure

(√+) Most Likely to cause

failure

48

Fishbone Rating for Micro Switch Failure

Cause and Effect Rating Target Materials - performance of base material or plating material (Silver) degrades over time such that fails 90 90

Materials - Degrade the silver plated contacts such that and lower the electro performance 90 90

Process - No Passivation in the electro-plate process. 70 90

Process - Performance of passivation oxidation film is poor for silver plated contacts 70 90

Measurement - No contact resistance measurement @ IQC or in functional testing 20 90

Environment - No system to make sure silver plated contacts are degraded or contaminated 20 90

Note: Rating provided is an assumption, there is no any mathemetical calculations involved

Rating of each failure factor has no calculations but follows an approach similar to “Risk Priority Number Calculations as in FMEA”

49

Fishbone Chart for Micro Switch Failure

30 20 10

0

40

100

90

80

70

60

50

Materials -

performance of base material or plating

material (Silver)

degrades over time such that fails

Materials - Degrade the Process - No silver plated contacts such that and lower

the electro

performance

Passivation in the electro-plate process.

Process - Performance of passivation

oxidation film is poor measurement @ IQC or silver plated contacts for silver plated

contacts

Measurement - No contact resistance

in functional testing

Environment - No system to make sure

are degraded or

contaminated

Target

Rating

50

Micro Switch Supplier Visit Observations

No. Observations and Corrective Actions from visit @ Micro Switch Supplier

Red Factor 1 Electro performance of base material or plating material (Silver) degrades over time such that

fails.

Corrective Action - Define the electro performance for base material and plate material. Add the

testing of electro performance of material including base material and plate material into the

Quality control process.

Red Factor 2 Degrade the silver plated contacts such that and lower the electro performance.

Corrective Action - To silver plating, base should be pre-plated by some other metal whose plate

voltage is less than silver and then plate silver. And add the test of the pre -plate's material's

performance into the Quality control process.

Red Factor 3 No Passivation in the electro-plate process. Silver plate is not protected and It will act with

Sulfate，Chloride ion and Hydrogen sulfide. Electro performance of silver sulfate and silver

sulfide is very poor.

Corrective Action – Add passivation process into the plate process.

Red Factor 4 Performance of passivation oxidation film is poor for silver plated contacts.

Corrective Action - identify what kind of passivation file is and test its electro performance.

Yellow Factor 5 No contact resistance measurement @ IQC or in functional testing.

Corrective Action – Electronic tests to implement contact resistance (should be < 0.5 Ohms).

Yellow Factor 6 No system to make sure silver plated contacts are degraded or contaminated.

Corrective Action – Same as in Red Factor 3

Out Put Connector View - On the connector edge, there seems to be material that may possibly obstruct with fully mating of the connector

The fixture looked new with no signs of use nor overheating

Input Connector - It looks like the female receptacle has spread open more than normal.

Failures Resolved – Power Cable bringing on safety hazard fire incidents

51

Cross Section of Distorted Output (Male) Connector

The burned pin is the LINE connection Here it is shown Male connector mated with the female connector. Looks like misalignment

It appears the LINE pin is pushed into the connector and is visibly burned. The pin does not appear to be broken. Suspect the female connector is only making partial contact with the mating male pin

52

Failures Resolved – Power Cable bringing on safety hazard fire incidents

The burned pin is the LINE connection – Cross Section Here it is shown Male connector mated with the female connector. Looks like misalignment

It appears the LINE pin is pushed into the connector and is visibly burned. The pin does not appear to be broken. Suspect the female connector is only making partial contact with the mating male pin

53

Manufacturing Process Pictorial Presentation – Improvement through Molding Process

5/31/2013 ©2007 PHILIPS

SOLID STATE LIGHTING

SOLUTIONS. ALL RIGHTS Pag

RESERVED. PRIVATE AND e 48

CONFIDENTIAL

54

Failures Resolved – Chip on Bond

55

55

Concept of Advanced Failure Analysis Tests for Chip on Bond

56

Non Destructive 3D X-Ray Failure Analysis

57


58


59

IC Destructive Failure Analysis (De-Capsulation / Scanning Electron Microscope)

(Please click on picture below for further details)

60

Peculiar Observations

(Please click on picture below for further observations)

61

5 Why Analysis

I C o lor C ov e Q LX F ixtures

1) W hy U nits found to be inoperativ e 1 s t W hy

N o LE D Illum ination

2) W hy no LE D Illum ination for R ed or B lue LE D ’s 2 nd W hy

P C B A inac tiv e in ternally @ c ritical com ponents

3) W hy P C BA inac tiv e inside 3 rd W hy

IC U 2 output v oltage or current fall short of th resho ld lev el

4) W hy IC U 2 output fall short of th resho ld lev el 4 th W hy

IC U 2 fails e lec tronically

5) W hy IC U 2 fails e lec tron ically 5 th W hy

S igna ls of ov erheating incidents possib ly constitu ing failu re during therm al perform ance.

F ailu re Code – N o R e d or B lue LE D Illum ination or U nits are inoperativ e .

F ailu re M ode – IC U 2 fails e lectronically due to wire bonds open @ pads for respec tiv e LE D failu re .

F ailu re E ffect – O pen circuit @ bond pads for respec tive LE D failu re .

F ailure M echanism – 1st W ire bonds suffer sev ere frac ture or cracks @ heel of bonds .

P o ssible cau se s :

1 ) S igna ls of ov erheating incidents possib ly constitu ting failu re of bonded wires @ wafer ch ip.

P ro b able/Ro o t cau se :

1 ) S am e as abov e. T h is is just a hypothetical assum ption, no prov en fac t. DO E is under conception phase to v erify th rough v arious product sam ples suc h as forward /bonded rev erse bonded, short w ire bonds e tc. D eta ils of DO E with resu lts to be dec lared at la ter stage s..

(T entativ ely resu lts w ill be av ailab le by W k 2 3).

62

Proposed Corrective Actions for Contract Manufacturer

63

1) Confirm wire bonding setup is correct. Wire bond machine should be calibrated.

2) Confirm wire in the spool or machine is of correct size and alloy.

3) Confirm secured and not corrupted copy of wire bond program in machine.

4) Using calibrated thermometer verify heated stage has correct temperature.

5) Bond surfaces must be smooth , clean (no – contamination).

6) PCBA must be held rigidly (not allowed to move) during wire bonding.

7) Check consistency of free wire bond related free air balls, diameter is 1.5 X wire diameter.

Failures resolved – Water Ingress due to Poly Carbonate Lens crack demonstration

@ LED Luminaires

Prone to crack due to various factors

1) Environmental Stress Corrosion Cracking, 2) Severe Chemical Attack 3) Lens Manufacturing due to

improper molding process or no annealing. Extensive analysis done by PCK Burlington and SZ FAE Team.

64

Node of LED Fixture

Above cracks are random and propagate through the length or width of Back Clip

Cracks analyzed due to ---

a) Plastics molding process and b) Polymers break @ different temperatures during storage of finished goods in ware house

c) Moisture effect

Back Clip Crack

Cracked PC Plastic chipped off

Back Clip

Failures resolved - PC Plastic Cracks @ Back Clip

65

Failures resolved – PC Plastic Cracks @ Screw Boss

Separation

Above cracks are random and propagate through the length or width of Back Clip

Cracks analyzed due to ---

66

a) b)

c)

Plastics molding process and Polymers break @ different temperatures during storage of finished goods in ware house

Moisture effect

Failure Reproduction: Results of Accelerated Testing (Vibration Testing)

67

Failure Reproduction: Results of Accelerated Testing (Vibration Testing)

68

Material Analysis --- FTIR and SEM Results

1)The FTIR analysis indicates that the materials of the cracked or good, housing are highly similar

with BPA as one of key Plasticizer.

2)Micro cracks were not found in the selected cracked housings. However cracked screw bosses

were severe.

3)The cracks are not necessarily located near the main crack. It may lie independently on the surface

away from the edge. The length is in the order of tens of micrometer.

69

Material Analysis --- MFR and DSC Report for failure samples

1) Few comments from SGS Report --- a) Environmental Stress Cracks. b) Plastic material not dried or have moisture. c) Plastic material storage malpractice as partially opened bags. d) Plastic material contains brittle transparent thermoplastic (PMMA) amounting to about

2%.

e) Plastic molding over processed or over-cooked. f) Melt screw position and weight of molding shot every cycle.

g) Average Molecular Weight reduction of plastic housing.

70

Material Analysis --- MFR Results for failure samples

e x t e n d e d r e s i d e n c e t i m e , a n d i n s o m e c a s e s i n a d e q u a t e m o i s t u r e r e m o v a l p r i o r t o p r o c e s s i n g .

R F H

Sample No. Test

item

Test

method

Test

condition

Result Specs of Melt Flow

Rate

Date

code

Sample Description Material of

housing

Result

#1 Melt ASTM D1238-

10

Drying

condition:

17.7g/10min > 15 g/10min 1135 No crack RFH Fail

Specs

#2 10.4g/10min < Specs 15 g/10min 1212 Crack RFH Pass

#3 10.7g/10min within Specs 10-12 g/10min 1217 No crack RFG Pass

#4 12.6g/10min > Specs 10-12 g/10min 1214 No crack RFG ---

#5 17.7g/10min > 15 g/10min 1134 Crack RFH Fail

Specs

#6 17.9g/10min > 15 g/10min 1134 No crack RFG Fail

Specs

mass Procedure 1 to 6 Extracted from Finished Goods of V-Tech Warehouse. Fixtures housing manufactured in Gold Asia

Test

flow A and

#7 rate 8.83g/10min<Specs 10-12 g/10min NA Resin of Top Housing (W H) Resin and

Housing samples

collected from

Good View from

product line (RFG

Material)

Fail 250℃,

requirement

2.16kg #8 8.13g/10min<Specs 10-12 g/10min NA Resin of Housing (GR) Fail

#9 (10.5+/-0.8)g / 10

min

10-12 g/10min NA Top Housing (W H) ---

#10 10.5+/-0.2)g / 10

min

10-12 g/10min NA Top Housing (GR) ---

#11 10.8+/-0.7)g / 10

min

10-12 g/10min NA Bottom Housing (GR) Pass

#12 12.2+/-0.5)g / 10

min

10-12 g/10min NA Bottom Housing (W H) ---

Yellow colored

shows f ailed test

Indications –

“---“Very close to specs that cannot be concluded, “WH” – White, “GR” – Gray Implications –

a) The basic property measured is the melt viscosity or flow resistance of the polymer at a particular shear stress (related to the applied load) and temperature. b) Polymer chains of short length and simple geometry “slide” past one another relatively easily and offer little flow resistance. In contrast, long chains of high

molecular weight and more complex structure yield greater flow resistance or viscosity. E.g. The MFR, an indicator of average molecular weight and is inversely related to it. A resin with an MFR of 50 g/10 min indicates a lower molecular weight than one with an MFR. of 10 g/10 min. While a higher MFR material may be easier to process, physical properties related to molecular weight, such as impact resistance, are often lower…

Conclusion -

1) Every failure sample tested for MFR has lower molecular weight…

2) This indicates material is prone to degrade over period of time which usually is the case when material is over cooked or over processed.

3) The most common cause of brittle behavior is polymer degradation, the reduction in the average

71

Material Analysis --- FTIR Results for failure samples

N o T e s t I t e m T e s t

M e t h o d

T e s t

C o n d i t i

o n

M a jo r C o m p o s i t i o n

D a t e c o d e S a m p l e

D e s c r i p t i o n

M a t e r i a l o f

h o u s in g

1 M a jo r

C o m p o s i t

i o n

Q u a l i t a t i v

e

A n a l y s i s

F T I R a n d

P G C - M S

N A P o l y c a r b o n a t e ( P C ) a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e

( C o p o l y m e r A B S ) 1 1 3 5 N o c r a c k R F H

2 P o l y c a r b o n a t e ( P C ) , P o l y ( M e t h y l M e t h a c r y l a t e ) ( P M M A )

a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e c o p o l y m e r ( A B S ) 1 2 1 2 C r a c k R F H


a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e c o p o l y m e r ( A B S ) 1 2 1 7 N o c r a c k R F G


a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e c o p o l y m e r ( A B S ) 1 2 1 4 N o c r a c k R F G

5 P o l y c a r b o n a t e ( P C ) a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e

( C o p o l y m e r A B S ) 1 1 3 4 C r a c k R F H

6 P o l y c a r b o n a t e ( P C ) a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e

( C o p o l y m e r A B S ) 1 1 3 4 N o c r a c k R F H

1 t o 6 E x t r a c t e d f r o m F i n i s h e d G o o d s o f V - T e c h W a r e h o u s e . F i x t u r e s h o u s i n g m a n u f a c t u r e d i n G o l d A s i a


a n d a c r y l o n i t r i l e - b u t a d i e n e - s t y r e n e c o p o l y m e r ( A B S ) N A

R e s in o f T o p

H o u s i n g ( W H )

R e s i n a n d

H o u s i n g

s a m p l e s

c o l l e c t e d f r o m

G o o d V i e w

f r o m p r o d u c t

l i n e ( R F G

M a t e r i a l )



R e s in o f

H o u s i n g ( G R )



T o p H o u s in g

( W H )

1 0 P o l y c a r b o n a t e ( P C ) , P o l y ( M e t h y l M e t h a c r y l a t e ) ( P M M A )


T o p H o u s in g

( G R )



B o t t o m

H o u s i n g ( G R )



B o t t o m

H o u s i n g ( W H )

Y e l l o w c o l o r e d i n d i c a t e s s a m p l e s t e s t e d c o n t a i n P M M A , W H = W h i t e , G R = G r a y

C o n c l u s i o n –

1 ) Y e l l o w c o l o r e d t e s t e d s a m p l e s i n d i c a t e F T I R S p e c t r a o f P M M A .

2 ) P M M A - - - i s a t r a n s p a r e n t t h e r m o p l a s t i c , o f t e n u s e d a s a l i g h t w e i g h t o r s h a t t e r - r e s i s t a n t a l t e r n a t i v e t o g l a s s . P M M A i s a n e c o n o m i c a l a l t e r n a t i v e t o p o l y c a r b o n a t e ( P C ) w h e n e x t r e m e

s t r e n g t h i s n o t n e c e s s a r y . A d d i t i o n a l l y , P M M A d o e s n o t c o n t a i n t h e p o t e n t i a l l y h a r m f u l b i s p h e n o l - A s u b u n i t s f o u n d i n p o l y c a r b o n a t e

3 ) P M M A h e a t r e s i s t a n c e i s n o t g o o d e n o u g h . T h e t h e r m a l d e f o r m a t i o n t e m p e r a t u r e i s b e t w e e n

( 7 4 ~ 1 0 2 ) ℃ . 4 ) T h e m e l t v i s c o s i t y i s h i g h , p o o r l i q u i d i t y ; c o o l i n g s p e e d i s t o o f a s t , e a s y t o h a v e t h e i n t e r n a l

s t r e s s o f p r o d u c t .

5 ) P M M A p r o d u c t s i n s t o r e d a n d d u r i n g t h e u s e w i t h e a s y t o o c c u r s i l v e r s t r e a k s ;

S i l v e r s t r e a k s a r e g l a s s s t a t e p o l y m e r b r i t t l e f r a c t u r e o f t h e p r e r e q u i s i t e s , s i l v e r s t r e a k s o f

m a t e r i a l i n t h e c r a c k c a u s e d b y a c r a c k i n g a n d e x p a n s i o n , s o t h a t l e a d t o c r a c k i n g .

6 ) A s p e r M S D S o f R F G a n d R F H m a t e r i a l s P M M A i s n o t m e n t i o n e d . H e n c e t h i s i s a n a d d i t i o n a l

o r e x t e r n a l l y a d d e d s u b s t a n c e .

RFG

72

Material Analysis --- DSC Results for failure samples

o T e

s t

I t e

m

T e s t

M e t h o

d

T e s t C o n d i t i o n R e s u l t ( d e g r e e C ) < S p e c s o f 1 5 0 d e g r e e C

D a t e

c o d e

S a m p l e

D e s c r i p t i o n

M a t e r i a l o f

h o u s i n g R e s u l t

G l

a s

s

T r a

n s i

t i o

n

T e

m p

e r a

t u r

e

( T g

)

W i t h r e f e r e n c e t o

A S T M D 3 4 1 8

- 0 8 , a n a l y s i s w a s

p e r f o r m e d b y

E n d o t h e r m i c D S C

T e m p e r a t u r e

R a n g e :

0 t o 2 0 0

d e g r e e C

R a m p : 2 0

d e g r e e C / m i n

N 2 : 5 0 m l / m i n

F i r s t h e a t s c a n 1 0 7 . 8

S e c o n d h e a t s c a n 1 0 3 . 7 1 1 3 5 N o c r a c k R F H F a i l

F i r s t h e a t s c a n 1 1 3 . 1

S e c o n d h e a t s c a n 1 1 1 . 9 1 2 1 2 C r a c k R F H P a s s

F i r s t h e a t s c a n 1 1 3 . 9

S e c o n d h e a t s c a n 1 1 2 . 0 1 2 1 7 N o c r a c k R F G P a s s

F i r s t h e a t s c a n 1 1 1 . 2

S e c o n d h e a t s c a n 1 0 6 . 5 1 2 1 4 N o c r a c k R F G - - -

F i r s t h e a t s c a n 1 0 8 . 0

S e c o n d h e a t s c a n 1 0 5 . 9 1 1 3 4 C r a c k R F H F a i l

F i r s t h e a t s c a n 1 0 6 . 8

S e c o n d h e a t s c a n 1 0 5 . 6 1 1 3 4 N o c r a c k R F H F a i l

1 t o 6 E x t r a c t e d f r o m F i n i s h e d G o o d s o f V - T e c h W a r e h o u s e . F i x t u r e s h o u s i n g m a n u f a c t u r e d i n G o l d A s i a

F i r s t h e a t s c a n T g 1 = 1 0 3 . 1 , T g 2 = 1 1 5 . 0

S e c o n d h e a t s c a n = 1 1 1 . 7 N A

R e s i n o f T o p

H o u s i n g ( W H ) R e s i n a n d

H o u s i n g

s a m p l e s

c o l l e c t e d

f r o m

G o o d

V i e w f r o m

p r o d u c t

l i n e ( R F G

M a t e r i a l )

F a i l

F i r s t h e a t s c a n = 1 1 0 . 6


R e s i n o f

H o u s i n g ( G R ) F a i l

F i r s t h e a t s c a n = 1 1 2 . 6


T o p H o u s i n g

( W H ) - - -

0 F i r s t h e a t s c a n = 1 1 0 . 2


T o p H o u s i n g

( G R ) - - -

1 F i r s t h e a t s c a n = 1 1 2 . 2


B o t t o m

H o u s i n g ( G R ) P a s s

2 F i r s t h e a t s c a n = 1 1 1 . 6


B o t t o m

H o u s i n g ( W H ) - - -

Y e l l o w c o l o r e d s h o w s T g l o w e r t h e n s p e c i f i c a t i o n , W H = W h i t e , G R = G r a y

I m p l i c a t i o n s –

1 ) D i f f e r e n t i a l S c a n n i n g C a l o r i m e t r y ( D S C ) m e a s u r e s t h e t e m p e r a t u r e s a n d h e a t f l o w s a s s o c i a t e d w i t h T r a n s i t i o n s i n m a t e r i a l s a s a f u n c t i o n o f t i m e a n d t e m p e r a t u r e i n a c o n t r o l l e d a t m o s p h e r e .

2 ) T h e s e m e a s u r e m e n t s p r o v i d e q u a n t i t a t i v e a n d q u a l i t a t i v e i n f o r m a t i o n a b o u t p h y s i c a l a n d c h e m i c a l C h a n g e s t h a t i n v o l v e e n d o t h e r m i c o r e x o t h e r m i c p r o c e s s e s o r c h a n g e s i n h e a t c a p a c i t y .

3 ) D S C c a n m e a s u r e G l a s s T r a n s i t i o n s , M e l t i n g a n d B o i l i n g P o i n t s , C r y s t a l l i z a t i o n t i m e a n d t e m p e r a t u r e , P e r c e n t C r y s t a l l i n i t y , H e a t s o f F u s i o n a n d R e a c t i o n s , S p e c i f i c H e a t , O x i d a t iv e / T h e r m a l S t a b i l i t y , R a t e a n d D e g r e e o f C u r e R e a c t i o n K i n e t i c s , P u r i t y .

4 ) A c a l o r i m e t e r m e a s u r e s t h e h e a t i n t o o r o u t o f a s a m p l e . A d i f f e r e n t i a l c a l o r i m e t e r m e a s u r e s t h e h e a t o f a s a m p l e r e l a t i v e t o a r e f e r e n c e . A d i f f e r e n t i a l s c a n n i n g c a l o r i m e t e r d o e s a l l o f t h e a b o v e a n d h e a t s t h e s a m p l e w i t h a l i n e a r t e m p e r a t u r e r a m p . E n d o t h e r m i c h e a t f l o w s i n t o t h e s a m p l e . E x o t h e r m i c h e a t f l o w s o u t o f t h e s a m p l e .

5 ) A m o r p h o u s p o l y m e r u s u a l l y h a s t h r e e p h y s i c a l f o r m s : G l a s s y s t a t e , H i g h - e l a s t i c s t a t e a n d t h e v i s c o u s f l o w s t a t e , f r o m t h e G l a s s y s t a t e t r a n s i t i o n t o t h e H i g h - e l a s t i c , t h e t e m p e r a t u r e p o i n t i s c a l l e d G l a s s t r a n s i t i o n t e m p e r a t u r e .

C o n c l u s i o n – 6 ) E v e r y f a i l u r e s a m p l e t e s t e d f o r D S C h a s l o w e r G l a s s T r a n s i t i o n T e m p e r a t u r e t h e n

s p e c i f i c a t i o n … 7 ) D i f f e r e n t i a l S c a n n i n g C a l o r i m e t r y ( D S C ) m e a s u r e d l o w e r t e m p e r a t u r e s a n d h e a t f l o w s

a s s o c i a t e d w i t h t r a n s i t i o n s i n m a t e r i a l s a s a f u n c t i o n o f t i m e a n d t e m p e r a t u r e i n a c o n t r o l l e d a t m o s p h e r e . T h i s i n d i c a t e s f o r t e s t e d s a m p l e s s o f t e n i n g , m e l t i n g a n d r e c r y s t a l l i z a t i o n c a n

h a p p e n a t T g < S p e c s .

73

Fishbone Diagram

74

Fishbone Diagram Rating

75

Cause and Effect Rating Target Environment - Environment Stress Cracks 90 90

Plastic material not dried or have moisture 70 90

Plastic material storage malpractice as partially opened bags 40 90

Plastic material contains brittle transparent thermoplastic (Such as PMMA) 70 90

Screw Boss has micro cracks after manufacturing 1 90

Machines - Plastic Molding over processed or Over Cooked 90 90

Plastic Molding Machine - Melt Screw Position and weight of molding shot every cycle 80 90

Plastic Housing are highly stressed due to design 20 90

Average Molecular Weight reduction of Plastic Housing 40 90

Good and Cracked samples have different chemical compositions (Recycled or fake materials used) 1 90

Storage conditions of finished good cause cracks 10 90

Personnel - Screw Assembly Process - Operators not trained enough for assembly 2 90

Process & Methods - Screw Assembly Process exerts force to produce cracks 2 90

Note: Rating provided is an assumption, there is no any mathemetical calculations involved

Fishbone Diagram Chart

76

NIKON ECLIPSE LV 150 Microscope Zoom In for contamination

It emphasizes on failure mechanism as “Blooming”. Viscous liquidity deposits on PVC materials is often results of plasticizers blooming to the surface. (Refer next slide for “Blooming”) The blooming out of adipate plasticizers from PVC Cable insulation is commonly observed especially in warm operating environments… Since blooming leads to an increase in the surface concentration of additive surface IR Technique called ATR (Attenuated Total Reflectance) FTIR could be most applicable to find out failure causes…

PVC Cable Contamination Advanced Failure Analysis

77

PVC Cable Contamination Advanced Failure Analysis

Logical Explanation of Blooming an excerpt from “Compositional and Failure Analysis of Polymers: A

Practical Approach” Page No. 485, 486 78

Failures resolved - PCB Cold Solder Joint

Broken Metal Lines

Metal Traces – Thorough process quality auditing and

highlighting critical malpractices in PCB helped

reductions in defect %

79

Higher Magnification of Metallographic Cross Section of corroded part of material.

Corrosion is due to ---Improper Electropolishing > pitting > stress > crack >leakage.

Pitting and Stress Corrosion Cracking between Tank and Baffle Clip. Between spot

welds of Clip and Tank body.

HOT WATER TANK comprising SS304 Material - Stress CORROSION Cracks and

leakage during consumer simulation testing.

Energy Dispersive Spectroscopy Chemical Analysis of Corrosion Failure: High

Concentration of Oxides.

Failures resolved - Corrosion

80

Failures Resolved – Corrosion

81

Metallographic Cross Sectional Analysis of Stainless Steel which corrodes @ Hot Water Tank Body

Failure Mode: Stress Corrosion Cracking

Failure Mechanism: Improper Electro polish causing

--- > Critical areas of Tank not benefiting (i.e. Not polished area act as anode, polished area act as

cathode, exacerbating corrosion)

--- > Phosphoric acid trapped between critical joints left over due to Electro-polishing process.

Failure Location: Hot Water Tank Body

Failure Cause: Stainless Steel Material used is SS 304 and not L Grade. Should be SS 316Lor above.

Quality Control Test: Exaggerated Salt-Spray Testing (e.g. Hot Water Tanks subjected to 50 degree

c conditions and salt water conditions for > 75 Hrs.

Corrective Actions:

1) Modify design of Hot Water Tank to avoid stress.

2) Change material to SS316L

3) Long term testing with metallurgical assessment that includes periodic checks on pitting /

corrosion / stress corrosion cracking.

General Failure Analysis Role @ Organization

APAC Team: Mehul and one more engineer.

USA / Europe Team: Based in Various Locations.

CM

SM

QM

82

5 0

10

15

20

25

Complaints Reported

30

Complaints Responded at 1st Line (CM)

35

40

45

50

Oct-11 Nov-11

Quarter 4 - 2011

Dec-11 Jan-12 Feb-12

Quarter 1 - 2012

Mar-12

No

. Of

Co

mp

lain

ts /

Ave

rag

e T

AT

(da

ys

)

Month

Complaints Responded at 2nd Line (SM)

Complaints Responded at 3rd Line QM

Average Turn Around Time (TAT) in Days for QM

to SM

Target Turnt Around Time (TAT) in Days for QM

to SM

Vaya Flood flicker failure @ Batumi Russia. Complaint ‘s massive time

line (to respond back) was dependant on replacement of reworked

products from China to site as well as first satisfactory performance.

Achievements --- Failure Analysis / Quality Improvement Cycle Improvement @

Philips

Complaints Reported Vs. Responded (QM to SM)

PC Lens Crack failure for

Color Graze 4 FT @

Singapore

83

Pag

e

77

0.00

2.00

6.00

Average Turn Around Time (TAT)

Target Turn Around Time (TAT) 4.00

8.00

10.00

12.00

Quarter 4 - 2011

Quarter 1 - 2012

Month

Total till date

Tu

rn A

rou

nd

Tim

e in

da

ys


Philips

Turn Around Time (to respond QM to SM) Vs. Month

84

Pag

e

78

performance results took long time to realize. Service Management

did not want to accept complaint back until results declared.

0.00%

20.00%

40.00%

60.00%

80.00%

100.00%

120.00%

Oct-11 Nov-11

Quarter 4 - 2011

Dec-11 Jan-12 Feb-12

Quarter 1 - 2012

Mar-12

Eff

icie

nc

y in

Pe

rce

nta

ge

Month

Complaints resolving (Responding QM to SM) efficiency

Target efficiency

Vaya Flood flicker failure @ Batumi Russia. Complaint ‘s took down

efficiency to valley point. Responding time line affected as

reworking of units and replacement @ site and first hand

Color Blast 12 Power Core failure from New Zealand. Time line

was affected on response as necessary info from customer care

did not arrive first hand.

PC Lens crack failure for Color Graze 4 Ft due to chemical

attacks, environmental stress etc..@ Singapore OUB.

Complaint took efficiency down to 2nd Vale y Point until

70% replacements arrived @ site.


Philips

85

Recognition --- Nomination for Key Award “I-Rock” by Director Of Quality Assurance

86

Recognition --- Nomination for Key Award “I-Rock” by Sr. Manager of Engineering

87

Recognition --- PHILIPS Certified Corporate Team Auditor for Mfg. Sites

88

Keurig Green Mountain --- Milestone Achievement.

89

To Replace contract manufacturers based expensive consumer tests : • Outsource and setup a Multi-Million Dollar Consumer Simulation Test Center. • Realize 1.6 M USD cost savings for FY2014.

74

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