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CHAP04. PLASMA DISPLAY PANEL

PDP

PDP

3

PDP

ADS(Address & Display Separation)

Reset period + Address period + Sustain(Display) period

Sub-field Method (Grey scale)

PDP

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What is PDP?

Definition: Plasma Display PanelPDP is the display device using the light emissioncharacteristics of glow discharge.(like a fluorescent lamp)

Array of few millions of micro florescent lamp

HgHgHg+Hg+ UV

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PDP

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What is Plasma?

Plasma is a quasi-neutral gas of charged and neutral particles which exhibits collective behavior

4 () () () ( )

1 eV = 11600K

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Plasma

:

: [(electrial arc welding), plasma torch,(electrical arc furnace), ,(thermionic conversion)

: [MHD , plasma propulsion]

: , (, , CVD)

:

FUSIONFUSION

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()

Metastable levelResonance level

3.8

4.4

10.2

20.7

0.56

(nsec)

12.163P28.31478.45Xe

14.053P2~19.91249.98Kr

15.843P2~1.311.510711.6Ar

21.633P270.816.674.416.5Ne

24.623S121S0

62X10-4

19.820.6

58.421.2He

Level

(sec)

(eV)

(nm)

(eV)

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Collision

+

(, , )

(, , )

()

()

&

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or

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Gas Discharge Reactions

Cathode Surface ReactionCathode Surface ReactionGas Volume ReactionGas Volume Reaction

NeNe, Xe, XeNe, XeNe, Xe

Ne, XeNe, Xe

UVUV

Ne, Xe + hNe, Xe + hNeNemm, , XeXemm

Gas volume reactions

Cathode surface reactions- Secondary electron emission- Sputtering

NeNeXeXe++

Ne*, Xe*Ne*, Xe*NeNemm, , XeXemm

IoniIoni

Ioni

Exci

Relx

NeNe++XeXe++++ Reco Ne, XeNe, Xe

NeNeXeXe++

Excitation

Ne*, Ne*, NeNemm

NeNe

Ne + hNe + h (light)(light)

XeXe

Ne + XeNe + Xe++

Penningionization

Relaxation

NeNe

NeNe

Ionization

NeNe

RecombinationC A

Sheath

21.6eV

16.6eV16.7eV18.7eV

.

.

.Sheath

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Ne Xe

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BombardingIonized Gas

Neutralized Gas

Sputtered Atom

Cathode Surface

Sputtered Atom

Gas

Implantation, Sputtering, Secondary electron emission

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& process

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Self-Sustaining Discharge

1 (N+1)

N

N

(2 )

:

N 1

cathode anode

cell

Collisions

electron- neutral

ion- neutral

recombination

chemistry

Plasma-Field interaction

Diffusion

Criterion of self sustain discharge : (ed-1)1

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)1ln(

)1ln()(

1min

1min

+=

+=

ABeV

AePd

Paschens minimum law

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P D PP D P

AC-PDPAC-PDP AC/DC HybridAC/DC Hybrid DC-PDPDC-PDP

RefreshRefresh MemoryMemory RefreshRefresh MemoryMemoryTriggerTrigger

MatrixMatrix Reflective3-electrodes

surface discahrge(Coplanar)

Reflective3-electrodes

surface discahrge(Coplanar)

AC : &

PDP

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DC PDP AC PDP

AC & DC PDP

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PDP(stripe & rectangular barrier type)

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( 3AC PDP)

Glass

ITO:

Bus electrode:

MgO: 2

Address electrode: Dielectric layer:

Barrier rib:

Phosphor: UV

Transparent dielectric layer: &

Visible emission

layer : 1) 2)()

XY

A

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Glass 2.8

1 14

2 28

ITO 260 100 60

B/S 60B/S 340

MgO 7000

ITO 1500

B/S 4

Bus 7

1080

42Wide PDP Cell

130

12

Glass 2.8

80

15

Address 100 260 360 120

42Wide PDP Cell

1080

Dimensions

B/S

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= +

+

++

++

+

Matrix

Sub-field method

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Time

SF1 SF2 SF3 SF4 SF5 SF6 SF7 SF8

1

.....2

480

128T64T32T16T8T4T2T1T

1TV field (time)

scan

line address

sustain

sub-field

Gray scale : Controlling width of sustain period in each sub-field

PDP TV

ADS Driving (Grey scale: )

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C = C = 00 rr(A/d(A/d); ); CC11 >> C>> C00C = QVC = QV1/C1/Ctottot 2/C2/C111/C1/C00CCtottot CC11CC00/(2 C/(2 C00CC11))VV11/2/2 VV00

C0C1 C1

VV11/2/2

2.

ee

ee

VV00 VVCC11/(2C/(2C0 0 CC11) )

VV11 VV2C2C00/(2C/(2C0 0 CC11) )

1.

VV00

VV11/2/2

VV00 VVCC11/(2C/(2C0 0 CC11))VV11 VV2C2C00/(2C/(2C0 0 CC11))

VV11/2/2

3.

VV00 VsVsVV11 V V VsVs

VV11/2/2

VV00

VV11/2/2

AC -

Dielectric layer

Gas

eeee

ee

eeee

:matrix

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AC ( 1usec )

-> -> ( ) ->

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: 1) (+)= 50V, (-)=-50V, 2) = 500V

3) = 400V

A

BAddress Sustain

Resetby low voltage(weak discharge)

Operation Principle

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20 21 20+21

22 20+22 21+22

20+ 21

+ 220 20

1 2 3

4 5 6

7 0 1

2020

2020

21

212121

22 22 22 22

Gray Scale() Subfield method

8(Gray scale) 3 (lines) X 3 (lines)

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Sub-field

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Discharges in AC PDP cell

Reset discharge: capacitor (AX & AY )Eliminating wall charge for address ( )

Weak discharge(by low voltage, narrow, exponential pulse)Between X(Common electrode) & Y(Scan electrode)

Strong discharge(by Self erasing discharge)Between X(Common electrode) & Y(Scan electrode)

Providing priming particles for addressing ( seed )

Address discharge: capacitor (AY )Between Y(Scan electrode) & A(address electrode)

Generating wall charge for sustain discharge ( ON/OFF )

Sustain discharge: capacitor (XY)Between X(Common electrode) & Y(Scan electrode) electrode

Light output for display ( )

Determined by previous state (Memory function)

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PDP (Ramp reset)

X

Y

A

reset address sustain

Ve=160V

Vset

Vsc=-90V

2nd reset

Vs=190V

1st sub-field 2nd sub-fieldReset : Address

Address : ON/OFF (ON)

Sustain :

Sub-field -> (Grey scale)

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PDP Module

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Fabrication Process of AC PDP

() ()()

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PDP()

+ + + Set

E-beam

Sputter

Ion plating

MgOMgO

coater ()

paste

()Black stripe

paste

Sputter/Photoetching

AgCr/Cu(Al)/Cr

Bus

Sputter/Photoetching

CVD/lift-off

ITOSnO2

paste

Dispenser

(R, G, B)

Sand blast

paste

Additive

+

Barrier rib

coater

Sheet laminator

()

paste

Sputter/Photoetching

Lift-off

Ag

Cr/Cu(Al)/Cr

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Fabrication Techniques

Coating techniquesThick film printing method (Screen printing)

Thin film deposition method (PVD, CVD)E-beam, Sputtering, PECVD

Dispense/ Green sheet/ Ink-jet printing/ Spin coating

Patterning techniquesPrinting method with stencil mask

Sand blast method

Lift-off (Additive) method

Photo process(FODEL) method

Chemical etch method (Wet etching, Dry etching)

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Film Formation Techniques

Screen PrintingScreen Printing

Address line, etc.

Photo PastePhoto PasteThin film depositionThin film deposition

Al

DCAlAlAl

Al

Ar+

Al

Ar+

TARGET

SPUTTERING

ITO

MgO

Photo PastePhoto Paste

UV

Photo PastePhoto Paste

Bus electrode

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Film Formation Technologies

SandblastingSandblasting

Barrier rib

Lift offLift off

SnO2, Barrier rib

Chemical EtchingChemical Etching

ITO

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Coating techniques

GlassPaste

Screen

X-Y- Table

Squeegee

Scraper

V

P

(Target

Thickness)Table

Slit Die

Paste Tank

Paste

Pump

PDP

V

Table

Applicator RollComma Roll

Coating Roll

PDP

(Target

Thickness)

Paste

Nozzle

Syringe

Syringe

NozzleNozzle

Paste

Paste

Glass Glass

Laser

Laser

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Screen printing machine

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Screen Printing vs. Photo Paste

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ITO

Load/Unload

Magnet

Baking Plate

Shutter

C/R

Target

Dark Shield

ITO

ITO ()

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DFR Laminating

ITO () ()

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Sand blast process

(1) (2) DFR Laminating (3)

(6) & (4) (5) Sand Blasting

NozzleSand

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PDP- ALIS & Waffle Rib

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PDP- Deep waffle & Meander Rib

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PDP- CCF &

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AnodeCathode

VISIBLE LIGHTIN PDP CELLPHOSPHOREXCITATION

ELECTRICINPUT POWER

DISCHARGE

VUV RADIATION

DISPLAY LIGHT

TOTALSTEP

70%

15%

50%

25%

70%

LOSS

100

70

10.5

5.3

1.33

1

Circuit Loss

Visible & IR RadiationGas Heating

Self-Absorption &Absorption by MgO

Internal Loss of Phosphors

Absorption by Wall & Bottom

Absorption by ITO& Dielectrics

PDP

LAMP90%

65%

95%

70%

100%40

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Effic

ienc

y(lm

/W)

1990 19911988 1989 1993 1994 20031992 1995 1996 1997 1998

2

3

4

DC PDP

Reflection type

Electrode optimize

AC PDP

1

PDP

- High Xe gas mixture- Deep Waffle structure

- New discharge mode(Long gap structure etc.)- Material improvement

(Phosphor etc.)

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PDP

PDP(2 lm/W) (80 lm/W)

- Positive column -

Positive columnNegative glow

- -

Large-dischargeMicro-discharge

- -

253, 354nm147, 174nm

PDP

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PDP

1.5-inch(35mm) 50 ultrathin PDP ()

(High contrast ratio) 50-inch PDP - (Crystal Emission Layer)

Pioneer()

32 PDP LG

50" Single scan FHD PDP SDI

150 4K2K PDP 24.7mm-thick 50 FHD PDP / 42 FHD PDP - Contrast ratio(30000:1), (5 lm/Watt)

()

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Flexible PDP (Shinoda Plasma)

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