Circuit Description.pdf

Computer Systems Division

CONFIDENTIAL

August 3th, 2008

H/W (Circuit Descriptions) NC10 (Winchester)

Computer System R&D Group3

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1. System Block Diagram

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2. IC information (1)

2-1. Processor

: Intel ATOM N270 Processor N270(Code named Mobile Diamondville)

• New single-core processor for mobile devices • On-die, primary 32-kB instructions cache and 24-kB write-back data cache • 533-MHz source-synchronous front side bus (FSB) • 2-Threads support • On-die 512-kB, 8-way L2 cache • Support for IA 32-bit architecture • Intel® Streaming SIMD Extensions-2 and -3 (Intel® SSE2 and Intel® SSE3) support and Supplemental Streaming SIMD Extension 3 (SSSE3) support • Micro-FCBGA8 packaging technologies • Thermal management support via Intel® Thermal Monitor 1 and Intel Thermal Monitor 2 • FSB Lane Reversal for flexible routing • Supports C0/C1(e)/C2(e)/C4(e) • L2 Dynamic Cache Sizing • Advanced power management features including Enhanced Intel SpeedStep® Technology • Execute Disable Bit support for enhanced security

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2-2. Core Chipset : Intel 945GSE Chipset Processor Support

• Celeron M processor (Intel Core processor based), Celeron M processor ULV • 533-MHz FSB support only

System Memory Support• Maximum Memory supported 2 GB (1 GB per rank)

• Support for DDR2 at 400 MHz and 533 MHz • No support for Dual-Channel Interleaved mode of operation • Enhanced Addressing support (Swap only)

Internal Graphics• 166-MHz render clock

• 200-MHz and 133-MHz display clock at 1.05-V core voltage • Intel S2DDT not supported • Automatic Display Brightness

ICH Support• Support for Intel 82801GBM (base variant of ICH7M) only

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2-3 Intel® I/O Controller Hub 7 (ICH7M) The ICH7 provides extensive I/O support. Functions and capabilities:

• PCI Express* Base Specification, Revision 1.0a support • PCI Local Bus Specification, Revision 2.3 support for 33 MHz PCI operations(supports up to six Req/Gnt pairs; three pairs on Ultra Mobile).• ACPI Power Management Logic Support• Enhanced DMA controller, interrupt controller, and timer functions • Integrated Serial ATA host controller with independent DMA operation on two ports and AHCI support. (SATA not supported on Ultra Mobile)• Integrated IDE controller supports Ultra ATA100/66/33• USB host interface with support for eight USB ports; four UHCI host controllers;one EHCI high-speed USB 2.0 Host controller• Integrated LAN controller • System Management Bus (SMBus) Specification, Version 2.0 with additionalsupport for I2C devices • Supports Audio Codec ’97, Revision 2.3 Specification (a.k.a., AC ’97 ComponentSpecification, Revision 2.3) which provides a link for Audio and Telephony codecs(up to 7 channels) • Supports Intel High Definition Audio• Supports Intel® Active Management Technology • Low Pin Count (LPC) interface• Firmware Hub (FWH) interface support• Serial Peripheral Interface (SPI) support

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3. System Layout (1) 3-1. Top / Side Diagram

185.

5mm

30.3mm

159.

5mm

7.8mm261 mm

VGA

USB

3-In-1

BluetoothUSB

USB

LAN

DC

HDD

HSDPAWLAN

Mem

ory

MCH

CPU

SIM Card

MIC HP

Battery

LCD Conn.

LED

P/W

SW

ICH

SPK SPK

W/L

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3. System Layout (2)3-2. Cable Diagram

Bluetooth cable

Touchpad FFC

SPK-R Cable

SPK-L Cable

MIC Cable

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3. System Layout (3)3-3. Cable Diagram

W/L Main

W/L Aux

Wibro & HSDPA (Aux)

Wibro & HSDPA (Main)

Camera Cable

LCD Cable

B/T Conn.

MIC Conn. SPK Conn.

T/P FFC Conn.

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3. System Layout (4)3-4. LCD Diagram

259.2mm

HSDPA (Aux)H

inge

LCD (10.2”)

CameraW/LAN (Aux)

W/LAN (main)

HSDPAWIBRO

Hin

ge

159.

5mm

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3. System Layout (5)3-4-1. LCD ASSY1 Cable(WLAN + Wibro)

Camera Cable

LCD Cable

WIBRO(main)

WIBRO(aux)

W/L(main)

W/L(aux)

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3. System Layout (6)3-4-2. LCD ASSY1 Cable(WLAN + HSDPA)

Camera Cable

LCD Cable

HSDPA(Main)

W/L(Main)

W/L(aux)

HSDPA(aux)

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4. Board Component- M AIN Board Bottom

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4. Board Component- M AIN Board Bottom

1 VGA Connector(J506) 12 Battery Connector(J505)

2 USB Connector(J509) 13 Camera Connector(J504)

3 MIC Jack(J510) 14 LCD Connector(J507)

4 Headphone Jack(J511) 15 SIMcard Connector

5 Internal MIC Connector(J520) 16 DC Jack(J500)

6 80H Debug connector(J521) 17 RJ45 Connector(J503)

7 Internal Speaker connector(J519) 18 Fan Connector(J513)

8 Minicard Connector(Wireless LAN)(J516) 19 Bluetooth Connector(J514)

9 Minicard Connector(HSDPA/Wibro)(J515) 20 USB Connector(J512)

10 Touchpad Connector(J518) 21 USB Connector(J517)

11 SODIMM Connector(DDR500) 22 SATA HDD Connector(J1)

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4. Board Component- M AIN Board Top

23 Keyboard Connector(J1)24 RTC Battery Connector(J3)25 3-in-1 card connector(JMULTI1)

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Bl uet oot h Camer a Modul e

Wireless LAN 802.11BG(Atheros 2by1)Memory card

4. Board Component- Option

Documents

Circuit Description.pdf