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CMS Tracking Workshop, Fermilab, 8/3/04, R. Demina 1

CMS TrackerCMS Tracker

CMS Tracking Workshop

Fermilab8/3/04

R. Demina

University of Rochester


OutlineOutline

• Overview

• Production model and parts flow

• Sensors

• Hybrids

• Alignment

• Test beam

• Summary


Bat 40Bat 40


Civil Engineering and MagnetCivil Engineering and Magnet


TOBTOB

TIDTIDTIBTIB

TECTEC

PDPD

Inner TrackerInner Tracker

2-3 pixels + 10-14 strip hits


CMS TrackerCMS Tracker


ModulesModules

Full flex kapton circuit from CicorelFull flex kapton circuit from Cicorel

500 m Sensors fromST MicroElectronics500 m Sensors fromST MicroElectronics

CF frames assembled in PakistanCF frames assembled in Pakistan

~20 cm

~5,600 Tracker Outer Barrel (TOB) modules

constructed at FNAL & UCSB

FNAL and UCSB will have equal capabilities and capacity

CMS Tracker Organization

ROD INTEGRATION

AachenKarlsruheStrasbourgZurichWien

PETALS INTEGRATION Aachen

Brussels Karlsruhe

Louvain

Lyon Strasbourg

BrusselsWien Lyon

TEC assemblyTEC assembly

CERN

Frames:

BrusselsSensors:factories

Hybrids:Strasbourg

Pitch adapter:Brussels

Hybrid:CF carrier

TK ASSEMBLYCERN

LouvainStrasbourg

Pisa Perugia Wien

BariPerugia

Bari FirenzeTorinoPisaPadova

TIB-TID INTEGRATION

FNAL

UCSB

TOB assembly TIB-ID assemblyCERN Pisa Aachen Karlsruhe. --> Lyon

Karlsruhe

FNAL Pisa

Sensor QAC

Moduleassembly

Bonding &testing

Sub-assemblies

UCSB

FNAL

US CMS in the overall tracker organization

Integrationinto mechanics UCSB

UR


OverviewOverview

Layers Quantity APV/mod. Pitch phi Pitch stereo Microbond Wires

SS6 TOB5,6 1,800 6 122 - 4,147,200

SS4 TOB3,4 1,450 4 183 - 2,227,200

DS - rphi TOB1,2 1,150 4 183 - 1,766,400

DS - stereo TOB1,2 1,150 4 183 183 1,766,400

5,550 9,907,200

Type

• FNAL and UCSB will have equal capabilities and capacities FNAL production line

• Gantry operational – made ~20 operational TOB modules.• 2 of 4 DAQ and 2 of 4 ARCS

UCSB Production line• Gantry operational –made 4 operational TOB modules• 1 of 3 DAQ and 2 of 5 ARCS

UCR module diagnostics and repair • 0 of 1 DAQ and 0 of 1 ARC

TOB Module Summary Table


Module Construction -PipelineModule Construction -Pipeline35193519: hybrids delivered : hybrids delivered 19391939: modules assembled : modules assembled

16461646: modules delivered to bonding centers: modules delivered to bonding centers

14891489: bonded : bonded 14231423: Tested with ARC : Tested with ARC 13441344: are good (94%): are good (94%)

TIB: TIB: 10551055 Assembled Assembled 886886 Tested Tested 855855 are good are good (96%)(96%)

TOB: TOB: 294294 Assembled Assembled 291291 Tested Tested 253253 are good are good (87%)(87%)

TEC: TEC: 590590 Assembled Assembled 246246 Tested Tested 229229 are good are good (93%)(93%)Thin sensors : TIB+TID 1055 of 3558 Thin sensors : TIB+TID 1055 of 3558

(30%)(30%)

TEC 500 of 2512 TEC 500 of 2512 (20%)(20%)

Thick sensors : TOB 294 of 5208 Thick sensors : TOB 294 of 5208

TEC 90 of 3888TEC 90 of 3888


Silicon SensorsSilicon Sensors

• Original plan: Inner region TIB – thin (300um) sensors – HPK Outer region TEC, TOB– thick (500um) sensors – ST

Microelectronics

• Inner region – consistently high quality, occasional drift of resistivity (resolved)

• Outer region – x7 higher current, vacuum, stress, humidity dependency, higher number of bad channels, some channels go into early breakdown and saturate APV (Microdischarge)

• July 2004 – decision to cancel the production order with ST (after a year of deliberations)


Hybrid Production OverviewHybrid Production Overview

• This plot still includes the rejected batches

• The gap between ‘bonded’ and ‘shipped’ are the hybrids bonded in the US

• The gap between ‘shipped’ and ‘assembled’ are the hybrids in the processing pipeline and the assembled hybrids from rejected batches that were not shipped.

1450/month ( 8.5% 1450/month ( 8.5% /month)/month)

Need ~ Need ~ 1700017000

35%35%

Bonded : 700/month Bonded : 700/month


New hybrid problemNew hybrid problem

• On April 19th it was reported that two TOB modules had an anomalous behavior of the pedestals after several ( 10-20 ) minutes of tests. It was quickly traced back to an open in the via to a calibration pad of the APV. This open escapes the FIT test ( < 1 min) but should not escape the QC at Cicorel. The via opened AFTER the hybrid left Cicorel.

• The Via affected is a long via: i.e. from layer 1 to layer 4

• A new test was designed to identify this fault in a short ( 10”) amount of time and many hybrids were tested with this method.

• We had a number of cases with multiple faults in the same hybrid

• Cicorel was alerted and cuts have been made on bad hybrids


A NORMAL AND “GOOD” VIA

The circuit is made with 2 plates of kapton (K) with 18 microns layers of copper on each side (CK). These 2 plates areglued together (G). The via is drilled using a laser beam, which is focused and defocused when it goes through the kapton, copperor glue. And after this drilling about 15 microns of copper is deposited (CS), and a thin layer of Nickel (Ni) – seethe different color – is also chemically deposited. What is observed is an “overetching” of the glue layer due to a differentbehaviour under the laser beam and (to a lesser extend) at the plasma cleaning stage.

CK

K

G

CS

Ni

The new Hybrid ProblemThe new Hybrid ProblemA “so A “so called” called”

good viagood via


On this via,the overetching is so large than the copper is almost absent.Picture taken from one hybrid sendback to CICOREL (probably from CERN last week, maybe from Strasbourg)

Ceramic

Bottom layer

Isotac

A bad viaA bad via


Actions Actions • Cicorel restarts the production with new settings. The new Cicorel restarts the production with new settings. The new hybrids should be delivered to CERN ~ middle of July.hybrids should be delivered to CERN ~ middle of July.

• Implement more strict quality control at Cicorel during hybrid Implement more strict quality control at Cicorel during hybrid productionproduction

• Evaluate the quality of the existing batches on batch to batch Evaluate the quality of the existing batches on batch to batch bases. This is a difficult task since we have no full informationbases. This is a difficult task since we have no full information

• Perform aging tests with thermal cycles on existing batches Perform aging tests with thermal cycles on existing batches to assess the long term reliability of the delivered hybridsto assess the long term reliability of the delivered hybrids

•Preliminary results show that the failure rate on the hybrids of Preliminary results show that the failure rate on the hybrids of the bad TOB batch is larger ( ~ 10) than on the other batches.the bad TOB batch is larger ( ~ 10) than on the other batches.


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FNAL Gantry Random ErrorsFNAL Gantry Random Errors

Original 5 m spec not always met.

10 m is ok

May be improved…


Test beam X5Test beam X5TOB set up with 6 (2DS, 3 SS4, 1 SS6)rods mounted in a TOB set up with 6 (2DS, 3 SS4, 1 SS6)rods mounted in a TOB-Like StructureTOB-Like Structure

1 full control ring – Read out with Final FED and FEC .1 full control ring – Read out with Final FED and FEC .


Test beam at X5Test beam at X5FED9U works Zero suppression works

Internal pedestal + common mode noise subtraction

Zero suppression being studied – first results encouraging

Read 512 strips/module Read 512 strips/module Clusters done offlineClusters done offline

Cluster are done in the FED Cluster are done in the FED and read only clustersand read only clusters

S/N=36


SummarySummary

• CMS tracker- all silicon system : 2-3 pixels + 10-14 strip hits

• Production distributed over Europe and US

• Silicon sensors – July 2004 - place full production order with HPK Still working out the legalities with ST

• Potentially dangerous problem with Hybrids – “bubble” via Working with company to improve QA

• Gantry alignment <10 um

• Test beam performance S/N=36

• 2004-2005 – critical year


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