DECEMBER 2004 HIGH-VOLTAGE,HIGH SLEW RATE, · PDF file• Maximum Input Bias Current: 100 pA distortion at high frequencies. Low current and voltage noise allow amplification of extremely

DGN−8DDA−8D−8

_

+

RF

CF

λ

−V(Bias)

RL

Photodiode Circuit

THS4631

www.ti.com SLOS451B –DECEMBER 2004–REVISED AUGUST 2011

HIGH-VOLTAGE, HIGH SLEW RATE, WIDEBANDFET-INPUT OPERATIONAL AMPLIFIER

Check for Samples: THS4631

1FEATURES DESCRIPTIONThe THS4631 is a high-speed, FET-input operational

2• High Bandwidth:amplifier designed for applications requiring wideband– 325 MHz in Unity Gain operation, high-input impedance, and high-power

– 210 MHz Gain Bandwidth Product supply voltages. By providing a 210-MHz gainbandwidth product, ±15-V supply operation, and• High Slew Rate:100-pA input bias current, the THS4631 is capable of– 900 V/µs (G = 2) simultaneous wideband transimpedance gain and

– 1000 V/µs (G = 5) large output signal swing. The fast 1000 V/µs slewrate allows for fast settling times and good harmonic• Low Distortion of –76 dB, SFDR at 5 MHzdistortion at high frequencies. Low current and• Maximum Input Bias Current: 100 pAvoltage noise allow amplification of extremely

• Input Voltage Noise: 7 nV/√Hz low-level input signals while still maintaining a largesignal-to-noise ratio.• Maximum Input Offset Voltage: 500 µV at 25°C

• Low Offset Drift: 2.5 µV/°C The characteristics of the THS4631 make it ideallysuited for use as a wideband photodiode amplifier.• Input Impedance: 109 || 3.9 pFPhotodiode output current is a prime candidate for• Wide Supply Range: ± 5 V to ± 15 Vtransimpedance amplification as shown below. Other

• High Output Current: 95 mA potential applications include test and measurementsystems requiring high-input impedance, ADC and

APPLICATIONS DAC buffering, high-speed integration, and activefiltering.• Wideband Photodiode AmplifierThe THS4631 is offered in an 8-pin SOIC (D), and• High-Speed Transimpedance Gain Stagethe 8-pin SOIC (DDA) and MSOP (DGN) with• Test and Measurement SystemsPowerPAD™ package.

• Current-DAC Output BufferRelated FET Input Amplifier Products• Active Filtering

SLEW VOLTAGE• High-Speed Signal Integrator VS GBWP MINIMUMDEVICE RATE NOISE(V) (MHz) GAIN(V/µS) (nV/√Hz)• High-Impedance BufferOPA656 ±5 230 290 7 1

OPA657 ±5 1600 700 4.8 7

OPA627 ±15 16 55 4.5 1

THS4601 ±15 180 100 5.4 1

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPad is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date. Copyright © 2004–2011, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.

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THS4631

SLOS451B –DECEMBER 2004–REVISED AUGUST 2011 www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled withappropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be moresusceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ABSOLUTE MAXIMUM RATINGSover operating free-air temperature range (unless otherwise noted) (1)

UNITS

VS Supply voltage, VS– to VS+ 33 V

VI Input voltage ±VS

IO(2) Output current 150 mA

Continuous power dissipation See Dissipation Rating Table

TJ Maximum junction temperature (2) 150°CTA Operating free-air temperature, continues operation, long-term reliability (2) 125°CTstg Storage temperature range –65°C to 150°C

HBM 1000 V

ESD ratings: CDM 1500 V

MM 100 V

(1) The absolute maximum ratings under any condition is limited by the constraints of the silicon process. Stresses above these ratings maycause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied.

(2) The maximum junction temperature for continuous operation is limited by package constraints. Operation above this temperature mayresult in reduced reliability and/or lifetime of the device.

PACKAGE DISSIPATION RATINGSPOWER RATING (1) (TJ =125°C)

PACKAGE θJC (°C/W) θJA (°C/W)TA ≤ 25°C TA = 85°C

D (8) (2) 38.3 95 1.1 W 0.47 W

DDA (8) 9.2 45.8 2.3 W 0.98 W

DGN (8) 4.7 58.4 2.14 W 1.11 W

(1) Power rating is determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase.Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance.

(2) This data was taken using the JEDEC standard High-K test PCB.

RECOMMENDED OPERATING CONDITIONSover operating free-air temperature range (unless otherwise noted)

MIN MAX UNITS

Dual Supply ±5 ±15VS Supply Voltage V

Single Supply 10 30

TA Operating free-air temperature -40 85 °C

2 Copyright © 2004–2011, Texas Instruments Incorporated


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1

2

3

4

8

7

6

5

NCVIN−VIN+

VS−

NCVS+VOUT−

NC

NC = No Internal Connection

TOP VIEW D, DDA, AND DGN

THS4631


PACKAGE / ORDERING INFORMATIONPACKAGE DEVICES (1) PACKAGE TYPE SOIC – 8 TRANSPORT MEDIA, QUANTITY

THS4631D Rails, 75SOIC – 8

THS4631DR Tape and Reel, 2500

THS4631DDA Rails, 75SOIC-PP – 8 (2)

THS4631DDAR Tape and Reel, 2500

THS4631DGN Rails, 100MSOP-PP – 8 (2)

THS4631DGNR Tape and Reel, 2500

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TIwebsite at www.ti.com.

(2) PowerPad™ is electrically isolated from all other pins. Connection of the PowerPAD to the PCB ground plane is recommended becausethe ground plane is typically the largest copper area on a PCB. However, connection of the PowerPAD to VS- up to VS+ is allowed ifdesired.

PIN ASSIGNMENTS

THS4631

Copyright © 2004–2011, Texas Instruments Incorporated 3


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THS4631


ELECTRICAL CHARACTERISTICSVS = ±15 V, RF = 499 Ω, RL = 1 kΩ, and G = 2 (unless otherwise noted)

TYP OVER TEMPERATUREPARAMETER TEST CONDITIONS 0°C to –40°C to MIN/25°C 25°C UNITS70°C 85°C MAX

AC PERFORMANCE

G = 1, RF = 0 Ω, VO = 200 mVPP 325

G = 2, RF = 499 Ω, VO = 200 mVPP 105Small signal bandwidth, -3 dB MHz

G = 5, RF = 499 Ω, VO = 200 mVPP 55

G = 10, RF = 499 Ω, VO = 200 mVPP 25

Gain bandwidth product G > 20 210 MHz

0.1 dB bandwidth flatness G = 2, RF = 499 Ω, CF = 8.2 pF 38 MHz

Large-signal bandwidth G = 2, RF = 499 Ω, VO = 2 VPP 105 MHz

G = 2, RF = 499 Ω, VO = 2-V step 550

Slew rate G = 2, RF = 499 Ω, VO = 10-V step 900 V/µs

G = 5, RF = 499 Ω, VO = 10-V step 1000

Rise and fall time 2-V step 5 ns

0.1%, G = -1, VO = 2-V step, CF = 4.7 pF 40Settling time ns

0.01%, G = -1, VO = 2-V step, CF = 4.7 pF 190

HARMONIC DISTORTION

RL = 100 Ω -65Second harmonic distortion dBc

G = 2, RL = 1 k Ω -76VO = 2 VPP,

RL = 100 Ω -62f = 5 MHzThird harmonic distortion dBc

RL = 1 kΩ -94

Input voltage noise f > 10 kHz 7 nV/√Hz

Input current noise f > 10 kHz 20 fA/√Hz

DC PERFORMANCE

Open-loop gain RL = 1 kΩ 80 70 65 65 dB Min

Input offset voltage (1) 260 500 1600 2000 µV MaxVCM = 0 V

Average offset voltage drift (1) 25°C to 85°C ±2.5 ±10 ±12 ±12 µV/°C Max

Input bias current 50 100 1500 2000 pA MaxVCM = 0 V

Input offset current 25 100 700 1000 pA Max

INPUT CHARACTERISTICS

-12.5 toCommon-mode input range -13 to 12 -12 to 11 -9 to 11 V Min11.5

Common-mode rejection ratio VCM = 10 V 95 86 80 80 dB Min

Differential input resistance Ω || pF109 || 3.9

Common-mode input resistance Ω || pF109 || 3.9

OUTPUT CHARACTERISTICS

RL = 100 Ω ±11 ±10 ±9.5 ±9.5Output voltage swing V Min

RL = 1 kΩ ±13.5 ±13 ±12.8 ±12.8

Static output current (sourcing) RL = 20 Ω 98 90 85 80 mA Min

Static output current (sinking) RL = 20 Ω 95 85 80 80 mA Min

Closed loop output impedance G = 1, f = 1 MHz 0.1 Ω

POWER SUPPLY

±15 ±16.5 ±16.5 ±16.5 V MaxSpecified operating voltage

±5 ±4 ±4 ±4 V Min

Maximum quiescent current 11.5 13 14 14 mA Max

Minimum quiescent current 11.5 10 9 9 mA Min

Power supply rejection (PSRR +) VS+ = 15.5 V to 14.5 V, VS– = 15 V 95 85 80 80 dB Min

Power supply rejection (PSRR –) VS+ = 15 V, VS– = -15.5 V to -14..5 V 95 85 80 80 dB Min

(1) Input offset voltage is 100% tested at 25°C. It is specified by characterization and simulation over the listed temperature range.



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_

+

THS463149.9 Ω

50 Ω Source

+15 V

953 Ω

499 Ω 499 Ω

−15 V

49.9 Ω

Test DataMesurement Point

50 Ω TestEquipment

CF

RFRG

0

1

2

3

4

5

6

7

8

9

10

100 k 1 M 10 M 100 M 1 G

VO = 200 mVPP

G = 2, RF = 499 Ω,RG = 499 Ω

105 MHz

f − Frequency − Hz

Sig

nal G

ain

− dB

CF = 5.6 pF

CF = 0 pF

CF = 8.2 pF

5.6

5.7

5.8

5.9

6

6.1

6.2

6.3

100 k 1 M 10 M 100 M


Sig

nal G

ain

− dB CF = 8.2 pF

38 MHz

−10

0

10

20

30

40

50

100 k 1 M 10 M 100 M 1 G

G = 100, RF = 11.3 kΩ, RG = 115 Ω

VO = 200 mVPP

G = 10, RF = 499 Ω,RG = 54.9 Ω

G = 5, RF = 499 Ω,RG = 124 Ω

G = 2, RF = 499 Ω,RG = 499 Ω

G = 1, RF = 0 Ω

105 MHz


Sig

nal G

ain

− dB

−5

−4

−3

−2

−1

0

1

2

3

4

5

100 k 1 M 10 M 100 M 1 G

G = −1, RF = 499 Ω,RG = 499 Ω

CF = 2.2 pF

CF = 0 pF

CF = 5.2 pF

VO = 200 mVPP


Sig

nal G

ain

− dB

102 MHz

−10

−8

−6

−4

−2

0

2

4

100 k 1 M 10 M 100 M 1 G

THS4631

+15 V

RL

RISO

−15 V0 Ω

50 ΩSource

G = 1,RF = 0 Ω,RL = 1 kΩ

RISO = 50 Ω,CL = 10 pF

RISO = 30 Ω,CL = 56 pF


Sig

nal G

ain

− dB

RISO = 20 Ω,CL = 100 pF

CL

0

1

2

3

4

5

6

7

8

100 k 1 M 10 M 100 M 1 G

VO = 0.5 VPP

VO = 2 VPP


Sig

nal G

ain

− dB

VO = 5 VPP

105 MHz

THS4631


TYPICAL CHARACTERISTICS (±15 V GRAPHS)TA = 25°C, G = 2, RF = 499 Ω, RL = 1 kΩ, Unless otherwise noted.

SMALL SIGNAL FREQUENCY SMALL SIGNAL FREQUENCYRESPONSE RESPONSE 0.1-dB FLATNESS

Figure 1. Figure 2. Figure 3.

FREQUENCY RESPONSESMALL SIGNAL FREQUENCY LARGE SIGNAL FREQUENCY vs

RESPONSE RESPONSE CAPACiTIVE LOAD




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-100

-95

-90

-85

-80

-75

-70

-65

-60

-55

-50

0 0.5 1 1.5 2 2.5 3 3.5 4

Harm

on

ic D

isto

rtio

n -

dB

VO - Output Voltage Swing - VPP

G = 2,RF = 499 ,W

CF = 8.2 pF,f = 4 MHz

HD3, RL = 100 W

HD2, RL = 1 kW

HD3, RL = 1 kW

HD2, RL = 100 W

−90

−80

−70

−60

−50

−40

−30

1 M 10 M 100 M

2nd

Ord

er H

arm

onic

Dis

tort

ion

− dB


Gain = 2RF = 499 Ω,CF = 8.2 pFVO = 2 VPP

RL = 100 Ω

RL = 1 kΩ

-1 10

-100

-90

-80

-70

-60

-50

-40

-30

1 M 10 M 100 M

f - Frequency - Hz

3rd

Ord

er

Ha

rmo

nic

Dis

tort

ion

- d

B

Gain = 2RF = 499 W

CF = 8.2 pFVO = 2 VPP

RL = 100 W

RL = 1 kW

−10

0

10

20

30

40

50

60

70

80

90

1 k 10 k 100 k 1 M 10 M 100 M 1 G


Ope

n−Lo

op G

ain

− dB

−200

−175

−150

−125

−100

−75

−50

−25

0

25

50

Pha

se −

0

200

400

600

800

1000

1200

0 2 4 6 8 10 12

VO − Output V oltage − V PP

G = 5,RF = 499 Ω,RG = 124 Ω

SR

− S

lew

Rat

e −

V/

µs

72

73

74

75

76

77

78

79

80

81

82

−40−30−20−10 0 10 20 30 40 50 60 70 80 90

TC − Case Temperature − °C

Ope

n-Lo

op G

ain

− dB

9

9.5

10

10.5

11

11.5

12

0 2 4 6 8 10 12 14 16

TA = 85°C

TA = 25°C

− Q

uies

cent

Cur

rent

− m

AI Q

VS − Supply V oltage − V

TA = −40°C

nV/

Hz

Inpu

t Vol

tage

Noi

se −

1

10

100

10 100 1 k 10 k 100 k


0

100

200

300

400

500

600

700

800

−40−30−20−10 0 10 20 30 40 50 60 70 80 90

I IB

− In

put B

ias

Cur

rent

− p

A

TA − Free-Air T emperature − °C

THS4631


TYPICAL CHARACTERISTICS (±15 V GRAPHS) (continued)TA = 25°C, G = 2, RF = 499 Ω, RL = 1 kΩ, Unless otherwise noted.

SECOND ORDER THIRD ORDERHARMONIC DISTORTION HARMONIC DISTORTION HARMONIC DISTORTION

vs vs vsFREQUENCY FREQUENCY OUTPUT VOLTAGE SWING


SLEW RATE OPEN-LOOP GAIN OPEN-LOOP GAIN AND PHASEvs vs vs

OUTPUT VOLTAGE TEMPERATURE FREQUENCY


INPUT VOLTAGE QUIESCENT CURRENT INPUT BIAS CURRENTvs vs vs

FREQUENCY SUPPLY VOLTAGE TEMPERATURE




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−300

−200

−100

0

100

200

300

25 35 45 55 65 75 85

Inpu

t Offs

et V

olta

ge −


V

D Package

DDA Package

DGN Package

Referred to 25°C

0

25

50

75

100

125

150

175

200

225

250

−40−30−20−10 0 10 20 30 40 50 60 70 80 90

I IO

− In

put O

ffset

Cur

rent

− p

A


13.2

13.25

13.3

13.35

13.4

13.45

13.5

13.55

−40−30−20−10 0 10 20 30 40 50 60 70 80 90

− O

utpu

t Vol

tage

− |V

|V O


VO+

VO−−

Out

put V

olta

ge −

mV

VO

−125

−100

−75

−50

−25

0

25

50

75

100

125

0 10 20 30 40 50 60 70 80

t − Time− ns

Gain = 2,CF = 8.2 pF,VI = 100 mVPP,RL = 1 kΩ

−1.2

−1

−0.8

−0.6

−0.4

−0.2

0

0.2

0.4

0.6

0.8

1

1.2

0 10 20 30 40 50 60 70 80

Gain = 2,CF = 8.2 pF,VI = 1 VPP,RL = 1 kΩ

t − Time − ns

− O

utpu

t Vol

tage

− V

VO

84

86

88

90

92

94

96

98

100

−40−30−20−10 0 10 20 30 40 50 60 70 80 90

Sink

Source

I O−

Out

put D

rive

Cur

rent

− |m

A|


-7

-5

-3

-1

1

3

5

7

0 20 40 60 80 100 120 140 180160

Gain = 5,

R = 499 ,

R = 1 k

F

L

W

W

10 VPP

t - Time - ns

- O

utp

ut

Vo

ltag

e -

VV

O

-12

-8

-4

0

4

8

12

10

6

2

-2

-6

-10

0 20 40 60 80 100 120 140 180160

t - Time - ns

- O

utp

ut

Vo

ltag

e -

VV

O

20 VPP

Gain = 5,

R = 499 ,W

R = 1 kW

F

L


− O

utpu

t Vol

tage

− V

VO

−2.5

−2

−1.5

−1

−0.5

0

0.5

1

1.5

2

2.5

0 25 50 75 100 125 150

t − Time− ns


THS4631



INPUT OFFSET CURRENT INPUT OFFSET VOLTAGE OUTPUT VOLTAGEvs vs vs

TEMPERATURE TEMPERATURE TEMPERATURE


STATIC OUTPUT DRIVE CURRENTvs SMALL SIGNAL TRANSIENT LARGE SIGNAL TRANSIENT

TEMPERATURE RESPONSE RESPONSE


LARGE SIGNAL TRANSIENT LARGE SIGNAL TRANSIENT LARGE SIGNAL TRANSIENTRESPONSE RESPONSE RESPONSE




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− O

utpu

t Vol

tage

− V

VO

t − Time − ns

−3

−2.5

−2

−1.5

−1

−0.5

0

0.5

1

1.5

2

2.5

3

0 5 10 15 20 25 30 35 40

Rising

Falling

G = −1,CF = 4.7 pF

− O

utpu

t Vol

tage

− V

VO

t − Time − ns

−1.5

−1.25

−1

−0.75

−0.5

−0.25

0

0.25

0.5

0.75

1

1.25

1.5

0 5 10 15 20 25 30 35 40

Rising

Falling

G = −1,CF = 4.7 pF

−20

−15

−10

−5

0

5

10

15

20

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1−4

−3

−2

−1

0

1

2

3

4Gain = 5,RF = 499 Ω,RG = 124 Ω

t − Time − s

− O

utpu

t Vol

tage

− V

VO

Input

Output − In

put V

olta

ge −

VV

I

−20

−15

−10

−5

0

5

10

15

20

−0.05 0 0.05 0.1 0.15 0.2 0.25 0.3 0.35−4

−3

−2

−1

0

1

2

3

4

Gain = 5,RF = 499 Ω,RG = 124 Ω

t − Time − s

− O

utpu

t Vol

tage

− V

VO

Input

Output

− In

put V

olta

ge −

VV

I

0

10

20

30

40

50

60

70

80

90

100

−15 −10 −5 0 5 10 15

VICR − Input Common-Mode Range − V

CM

RR

− C

omm

on-M

ode

Rej

ectio

n R

atio

− d

B

0

10

20

30

40

70

80

90

100

10 k 100 k 1 M 10 M 100 M


Rej

ectio

n R

atio

− d

B

50

60

CMRR

PSRR+

PSRR−

0.01

0.1

1

10

100

100 k 1 M 10 M 100 M 1 G


− O

utpu

t Im

peda

nce

−Z

oΩ

THS4631



SETTLING TIME SETTLING TIME OVERDRIVE RECOVERY


COMMON-MODE REJECTION RATIO REJECTION RATIOvs vs

OVERDRIVE RECOVERY INPUT COMMON-MODE RANGE FREQUENCY


OUTPUT IMPEDANCEvs

FREQUENCY

Figure 31.



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_

+

RF

CF

λ

−V(Bias)

RL

Photodiode Circuit

THS4631


APPLICATION INFORMATION

The large gain-bandwidth product of the THS4631INTRODUCTION provides the capability for simultaneously achievingboth high-transimpedance gain, wide bandwidth, highThe THS4631 is a high-speed, FET-input operationalslw rate, and low noise. In addition, the high-poweramplifier. The combination of: high gain bandwidthsupply rails provide the potential for a very wideproduct of 210 MHz, high slew rate of 1000 V/µs, anddynamic range at the output, allowing for the use oftrimmed dc precision makes the device an excellentinput sources which possess wide dynamic range.design option for a wide variety of applications,The combination of these characteristics makes theincluding test and measurement, optical monitoring,THS4631 a design option for systems that requiretransimpedance gain circuits, and high-impedancetransimpedance amplification of wideband, low-levelbuffers. The applications section of the data sheetinput signals. A standard transimpedance circuit isdiscusses these particular applications in addition toshown in Figure 32.general information about the device and its features

TRANSIMPEDANCE FUNDAMENTALS

FET-input amplifiers are often used intransimpedance applications because of theirextremely high input impedance. A transimpedanceblock accepts a current as an input and converts thiscurrent to a voltage at the output. The high-inputimpedance associated with FET-input amplifiersminimizes errors in this process caused by the inputbias currents, IIB, of the amplifier.

DESIGNING THE TRANSIMPEDANCEFigure 32. Wideband PhotodiodeCIRCUIT

Transimpedance AmplifierTypically, design of a transimpedance circuit is drivenby the characteristics of the current source that

As indicated, the current source typically sets theprovides the input to the gain block. A photodiode isrequirements for gain, speed, and dynamic range ofthe most common example of a capacitive currentthe amplifier. For a given amplifier and sourcesource that interfaces with a transimpedance gaincombination, achievable performance is dictated byblock. Continuing with the photodiode example, thethe following parameters: the amplifiersystem designer traditionally chooses a photodiodegain-bandwidth product, the amplifier inputbased on two opposing criteria: speed and sensitivity.capacitance, the source capacitance, theFaster photodiodes cause a need for faster gaintransimpedance gain, the amplifier slew rate, and thestages, and more sensitive photodiodes requireamplifier output swing. From this information, thehigher gains in order to develop appreciable signaloptimal performance of a transimpedance circuitlevels at the output of the gain stage.using a given amplifier is determined. Optimal is

These parameters affect the design of the defined here as providing the requiredtransimpedance circuit in a few ways. First, the speed transimpedance gain with a maximized flat frequencyof the photodiode signal determines the required response.bandwidth of the gain circuit. Second, the required

For the circuit shown in Figure 32, all but one of thegain, based on the sensitivity of the photodiode, limitsdesign parameters is known; the feedback capacitorthe bandwidth of the circuit. Third, the larger(CF) must be determined. Proper selection of thecapacitance associated with a more sensitive signalfeedback capacitor prevents an unstable design,source also detracts from the achievable speed of thecontrols pulse response characteristics, providesgain block. The dynamic range of the input signalmaximized flat transimpedance bandwidth, and limitsalso places requirements on the amplifier dynamicbroadband integrated noise. The maximized flatrange. Knowledge of the source output current levels,frequency response results with CF calculated ascoupled with a desired voltage swing on the output,shown in Equation 1, where CF is the feedbackdictates the value of the feedback resistor, RF. Thecapacitor, RF is the feedback resistor, CS is the totaltransfer function from input to output is VOUT = IINRF.source capacitance (including amplifier inputcapacitance and parasitic capacitance at the invertingnode), and GBP is the gain-bandwidth product of theamplifier in hertz.



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CF

1 RF G BP

1 RF G BP

2

4CS

RF G B P

2

F3dB GBP

2 RFCS CF

Gain AOL

20 dB/DecadeRate-of-Closure

GBP20 dB/Decade

Noise Gain

−20 dB/Decade

f

PoleZero

0

_

+CI(DIFF)

RF

CF

CP

CDI(DIODE)

CI(CM)

CS = CI(CM) + CI(DIFF) + CP + CD

THS4631


(1)

Once the optimal feedback capacitor has beenselected, the transimpedance bandwidth can becalculated with Equation 2.

(2)

Figure 34. Transimpedance Circuit Bode Plot

The performance of the THS4631 has beenmeasured for a variety of transimpedance gains witha variety of source capacitances. The achievablebandwidths of the various circuit configurations aresummarized numerically in Table 1. The frequencyresponses are presented in Figure 35, Figure 36, andFigure 37.

A. The total source capacitance is the sum of Note that the feedback capacitances do notseveral distinct capacitances. correspond exactly with the values predicted by the

Figure 33. Transimpedance Analysis Circuit equation. They have been tuned to account for theparasitic capacitance of the feedback resistor(typically 0.2 pF for 0805 surface mount devices) asWhere:well as the additional capacitance associated with the

CI(CM) is the common-mode input capacitance. PC board. The equation should be used as a startingCI(DIFF) is the differential input capacitance. point for the design, with final values for CF optimized

in the laboratory.CD is the diode capacitance.CP is the parasitic capacitance at the invertingnode.

Table 1. Transimpedance Performance SummaryThe feedback capacitor provides a pole in the noisefor Various Configurationsgain of the circuit, counteracting the zero in the noise

gain caused by the source capacitance. The pole is SOURCE TRANS- FEEDBACK -3 dBCAPACITANCE IMPEDANCE CAPACITANCE FREQUENCYset such that the noise gain achieves a 20-dB per

(PF) GAIN (Ω) (PF) (MHZ)decade rate-of-closure with the open-loop gain18 10 k 2 15.8response of the amplifier, resulting in a stable circuit.18 100 k 0.5 3As indicated, the formula given provides the feedback18 1 M 0 1.2capacitance for maximized flat bandwidth. Reduction

in the value of the feedback capacitor can increase 47 10 k 2.2 8.4

the signal bandwidth, but this occurs at the expense 47 100 k 0.7 2.1of peaking in the ac response. 47 1 M 0.2 0.52

100 10 k 3 5.5

100 100 k 1 1.4

100 1 M 0.2 0.37



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65

70

75

80

85

10 k 100 k 1 M 10 M 1 G


Tran

sim

peda

nce

Gai

n −

dB

VS = ±15 VRL = 1 kRF = 10 k

CS = 100 PFCF = 3 PF

CS = 18 PFCF = 2 PF

CS = 47 PFCF = 2.2 PF

50 50

RS

VS

C1

C2

IONetwork Analizer

IOVS

(s) 1

2RS1

C1C2

(Above the Pole Frequency)

IOVS

(s)

s

2RS 1C1C2

s 12 RS

C1C285

90

95

100

105

10 k 100 k 1 M 10 M 1 G


Tran

sim

peda

nce

Gai

n −

dB

VS = ±15 VRL = 1 kRF = 100 k

CS = 47 PFCF = 0.7 PF

CS = 100 PFCF = 1 PF

CS = 18 PFCF = 0.5 PF

12 RS (C1 C2)

1

2 RS1 C1

C2

95

100

110

120

10 k 100 k 1 M 10 M


Tran

sim

peda

nce

Gai

n −

dB

125

VS = ±15 VRL = 1 kRF = 1 M

115

105

CS = 18 PFCF = 0 PF

CS = 47 PFCF = 0.2 PF

CS = 100 PFCF = 0.2 PF

ZO(s) C1 C2C1 C2

s 12RS

C1C2

ss 12 RS C1

ZO 1

sC2

THS4631


Table 1. Transimpedance Performance Summary is difficult to measure the frequency response withfor Various Configurations (continued) traditional laboratory equipment because the circuit

requires a current as an input rather than a voltage.10-kΩ TRANSIMPEDANCE RESPONSESAlso, the capacitance of the current source has adirect effect on the frequency response. A simpleinterface circuit can be used to emulate a capacitivecurrent source with a network analyzer. With thiscircuit, transimpedance bandwidth measurementsare simplified, making amplifier evaluation easier andfaster.

Figure 35.A. The interface network creates a capacitive,

100-kΩ TRANSIMPEDANCE RESPONSESconstant current source from a networkanalyzer and properly terminates thenetwork analyzer at high frequencies.

Figure 38. Emulating a Capacitive Current SourceWith a Network Analyzer

The transconductance transfer function of theinterface circuit is:

(3)

The transfer function contains a zero at dc and a poleFigure 36.

1-MΩ TRANSIMPEDANCE RESPONSES at: . The transconductance is constant

at: , above the pole frequency,providing a controllable ac-current source. This circuitalso properly terminates the network analyzer with 50Ω at high frequencies. The second requirement forthis current source is to provide the desired outputimpedance, emulating the output impedance of aphotodiode or other current source. The outputimpedance of this circuit is given by:

Figure 37.(4)

Assuming C1 >> C2, the equation reduces to:MEASURING TRANSIMPEDANCEBANDWIDTH

, giving the appearance of a capacitiveWhile there is no substitute for measuring the source at a higher frequency.performance of a particular circuit under the exactconditions that are used in the application, the Capacitor values should be chosen to satisfy twocomplete system environment often makes requirements. First, C2 represents the anticipatedmeasurements harder. For transimpedance circuits, it capacitance of the true source. Second C1 is chosen



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REQ RF1 1 RF2

RF3

_

+

RF2

CF

λ

−V(Bias)

RL

RF1

RF3

1CFEQ

1CF11

CF3

CF2

_

+

RF2

CF

λ

−V(Bias)

RL

RF1

_

+

RF

CF2

λ

−V(Bias)

RL

CF1

CF3

THS4631


such that the corner frequency of thetransconductance network is much less than thetransimpedance bandwidth of the circuit. Choosing (5)this corner frequency properly leads to more accuratemeasurements of the transimpedance bandwidth. Ifthe interface circuit corner frequency is too close tothe bandwidth of the circuit, determining the powerlevel in the flatband is difficult. A decade or more offlat bandwidth provides a good basis for determiningthe proper transimpedance bandwidth.

ALTERNATIVE TRANSIMPEDANCECONFIGURATIONS

Other transimpedance configurations are possible.Three possibilities are shown below.

A. A resistive T-network enables highThe first configuration is a slight modification of the transimpedance gain with reasonablebasic transimpedance circuit. By splitting the resistor values.feedback resistor, the feedback capacitor value Figure 40. Alternative Transimpedancebecomes more manageable and easier to control. Configuration 2This type of compensation scheme is useful when thefeedback capacitor required in the basic configuration

The third configuration uses a capacitive T-network tobecomes so small that the parasitic effects of theachieve fine control of the compensation capacitance.board and components begin to dominate the totalThe capacitor CF3 can be used to tune the totalfeedback capacitance. By reducing the resistanceeffective feedback capacitance to a fine degree. Thisacross the capacitor, the capacitor value can becircuit behaves the same as the basicincreased. This mitigates the dominance of thetransimpedance configuration, with the effective CFparasitic effects.given by Equation 6.

(6)

A. Splitting the feedback resistor enables useof a larger, more manageable feedbackcapacitor.

Figure 39. Alternative TransimpedanceConfiguration 1

The second configuration uses a resistive T-networkA. A capacitive T-network enables fine controlto achieve high transimpedance gains using relatively

of the effective feedback capacitance usingsmall resistor values. This topology can be usefulrelatively large capacitor values.

when the desired transimpedance gain exceeds theFigure 41. Alternative Transimpedancevalue of available resistors. The transimpedance gain

Configuration 3is given by Equation 5.



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_

+

Rf

4kT = 1.6E−20Jat 290K

IBNEO

ERF

RS

ERS

IBIRg

ENI

4kTRS

4kTRg

4kTRf

EO E 2NI IBNRS

2 4kTRSNG2 IBIRf2 4kTRfNG

EN E 2NI IBNRS

2 4kTRS IBIR f

NG

2

4kTR f

NG

THS4631


SUMMARY OF KEY DECISIONS IN feedback resistors this large or anticipate using anTRANSIMPEDANCE DESIGN external compensation scheme to stabilize the circuit.

Using a simple capacitor in parallel with the feedbackThe following is a simplified process for basic resistor makes the amplifier more stable as shown intransimpedance circuit design. This process gives a the Typical Characteristics graphs.start to the design process, though it does ignoresome aspects that may be critical to the circuit. NOISE ANALYSISSTEP 1: Determine the capacitance of the source.

High slew rate, unity gain stable, voltage-feedbackSTEP 2: Calculate the total source capacitance, operational amplifiers usually achieve their slew rate

including the amplifier input capacitance, CI(CM) at the expense of a higher input noise voltage. Theand CI(DIFF). 7 nV/√Hz input voltage noise for the THS4631 is,

however, much lower than comparable amplifiersSTEP 3: Determine the magnitude of the possible while achieving high slew rates. The input-referred

current output from the source, including the voltage noise, and the input-referred current noiseminimum signal current anticipated and term, combine to give low output noise under a widemaximum signal current anticipated. variety of operating conditions. Figure 42 shows the

amplifier noise analysis model with all the noise termsSTEP 4: Choose a feedback resistor value such thatincluded. In this model, all noise terms are taken tothe input current levels create the desiredbe noise voltage or current density terms in eitheroutput signal voltages, andnV/√Hz or fA/√Hz.ensure that the output voltages can

accommodate the dynamic range of the inputsignal.

STEP 5: Calculate the optimum feedbackcapacitance using Equation 1.

STEP 6: Calculate the bandwidth given theresulting component values.

STEP 7: Evaluate the circuit to determine if all designgoals are satisfied.

SELECTION OF FEEDBACK RESISTORS

Feedback resistor selection can have a significantFigure 42. Noise Analysis Modeleffect on the performance of the THS4631 in a given

application, especially in configurations with lowclosed-loop gain. If the amplifier is configured for The total output noise voltage can be computed asunity gain, the output should be directly connected to the square root of all square output noise voltagethe inverting input. Any resistance between these two contributors. Equation 7 shows the general form forpoints interacts with the input capacitance of the the output noise voltage using the terms shown inamplifier and causes an additional pole in the Figure 42.frequency response. For nonunity gain configurations,low resistances are desirable for flat frequencyresponse. However, care must be taken not to loadthe amplifier too heavily with the feedback network if (7)large output signals are expected. In most cases, a

Dividing this expression by the noise gain [NG = (1+trade off is made between the frequency responseRf/Rg)] gives the equivalent input-referred spot noisecharacteristics and the loading of the amplifier. For avoltage at the noninverting input, as shown ingain of 2, a 499-Ωfeedback resistor is a suitableEquation 8:operating point from both perspectives. If resistor

values are chosen too large, the THS4631 is subjectto oscillation problems. For example, an invertingamplifier configuration with a 5-kΩ gain resistor and a5-kΩ feedback resistor develops an oscillation due to (8)the interaction of the large resistors with the input

Using high resistor values can dominate the totalcapacitance. In low gain configurations, avoidequivalent input-referred noise. Using a 3-kΩsource-resistance (RS) value adds a voltage noiseterm of approximately 7 nV/√Hz. This is equivalent tothe amplifier voltage noise term. Using higher resistor



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THS4631


values dominate the noise of the system. Although performance of the THS4631. Resistors should bethe THS4631 JFET input stage is ideal for a very low reactance type. Surface-mounthigh-source impedance because of the low-bias resistors work best and allow a tighter overallcurrents, the system noise and bandwidth is limited layout. Again, keep their leads and PC boardby a high-source (RS) impedance. trace length as short as possible. Never use

wirebound type resistors in a high frequencyapplication. Since the output pin and invertingSLEW RATE PERFORMANCE WITH VARYINGinput pins are the most sensitive to parasiticINPUT STEP AMPLITUDE AND RISE/FALLcapacitance, always position the feedback andTIMEseries output resistors, if any, as close as possible

Some FET input amplifiers exhibit the peculiar to the inverting input pins and output pins. Otherbehavior of having a larger slew rate when presented network components, such as input terminationwith smaller input voltage steps and slower edge resistors, should be placed close to therates due to a change in bias conditions in the input gain-setting resistors. Even with a low parasiticstage of the amplifier under these circumstances. capacitance shunting the external resistors,This phenomena is most commonly seen when FET excessively high resistor values can createinput amplifiers are used as voltage followers. As this significant time constants that can degradebehavior is typically undesirable, the THS4631 has performance. Good axial metal-film orbeen designed to avoid these issues. Larger surface-mount resistors have approximately 0.2amplitudes lead to higher slew rates, as would be pF in shunt with the resistor. For resistor values >anticipated, and fast edges do not degrade the slew 2.0 kΩ, this parasitic capacitance can add a polerate of the device. The high slew rate of the THS4631 and/or a zero that can effect circuit operation.allows improved SFDR and THD performance, Keep resistor values as low as possible,especially noticeable above 5 MHz. consistent with load driving considerations.

• Connections to other wideband devices on thePRINTED-CIRCUIT BOARD LAYOUT board may be made with short direct traces orTECHNIQUES FOR OPTIMAL through onboard transmission lines. For shortPERFORMANCE connections, consider the trace and the input tothe next device as a lumped capacitive load.Achieving optimum performance with high frequencyRelatively wide traces (50 mils to 100 mils) shouldamplifier-like devices in the THS4631 requires carefulbe used, preferably with ground and power planesattention to board layout parasitic and externalopened up around them. Estimate the totalcomponent types.capacitive load and determine if isolation resistors

Recommendations that optimize performance include: on the outputs are necessary. Low parasitic• Minimize parasitic capacitance to any ac ground capacitive loads (< 4 pF) may not need an RS

for all of the signal I/O pins. Parasitic capacitance since the THS4631 is nominally compensated toon the output and input pins can cause instability. operate with a 2-pF parasitic load. Higher parasiticTo reduce unwanted capacitance, a window capacitive loads without an RS are allowed as thearound the signal I/O pins should be opened in all signal gain increases (increasing the unloadedof the ground and power planes around those phase margin). If a long trace is required, and thepins. Otherwise, ground and power planes should 6-dB signal loss intrinsic to a doubly-terminatedbe unbroken elsewhere on the board. transmission line is acceptable, implement a

matched impedance transmission line using• Minimize the distance (< 0.25”) from the powermicrostrip or stripline techniques (consult an ECLsupply pins to high frequency 0.1-µF and 100-pFdesign handbook for microstrip and stripline layoutde-coupling capacitors. At the device pins, thetechniques). Aground and power plane layout should not be in50-Ω environment is not necessary onboard, andclose proximity to the signal I/O pins. Avoidin fact, a higher impedance environment improvesnarrow power and ground traces to minimizedistortion as shown in the distortion versus loadinductance between the pins and the de-couplingplots. With a characteristic board trace impedancecapacitors. The power supply connections shouldbased on board material and trace dimensions, aalways be de-coupled with these capacitors.matching series resistor into the trace from theLarger (6.8 µF or more) tantalum de-couplingoutput of the THS4631 is used as well as acapacitors, effective at lower frequency, shouldterminating shunt resistor at the input of thealso be used on the main supply pins. These maydestination device. Remember also that thebe placed somewhat farther from the device andterminating impedance is the parallel combinationmay be shared among several devices in theof the shunt resistor and the input impedance ofsame area of the PC board.the destination device: this total effective• Careful selection and placement of externalimpedance should be set to match the tracecomponents preserve the high frequency



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0.060

0.040

0.075 0.025

0.205

0.010vias

Pin 1

Top View

0.017

0.035

0.0940.030

0.013

0.140

0.060

0.060

0.010vias

Top View

0.035 0.080

0.050 0.176

0.030

0.026

0.0100.035

0.100

0.300

Pin 1

All Units in Inches

DIE

Side View (a)

DIE

End View (b)

ThermalPad

Bottom View (c)

THS4631


impedance. If the 6-dB attenuation of a doublyterminated transmission line is unacceptable, along trace can be series-terminated at the sourceend only. Treat the trace as a capacitive load inthis case. This does not preserve signal integrityor a doubly-terminated line. If the input impedanceof the destination device is low, there is somesignal attenuation due to the voltage dividerformed by the series output into the terminatingimpedance.

• Socketing a high-speed part like the THS4631 isnot recommended. The additional lead length andpin-to-pin capacitance introduced by the socketcreates a troublesome parasitic network whichmakes it almost impossible to achieve a smooth,stable frequency response. Best results areobtained by soldering the THS4631 part directlyonto the board. Figure 44. DGN PowerPAD PCB Etch and Via

PatternPowerPAD DESIGN CONSIDERATIONS

The THS4631 is available in a thermally-enhancedPowerPAD family of packages. These packages areconstructed using a downset leadframe upon whichthe die is mounted [see Figure 43 (a) and Figure 43(b)]. This arrangement results in the lead frame beingexposed as a thermal pad on the underside of thepackage [see Figure 43 (c)]. Because this thermalpad has direct thermal contact with the die, excellentthermal performance can be achieved by providing agood thermal path away from the thermal pad

The PowerPAD package allows for both assemblyand thermal management in one manufacturingoperation. During the surface-mount solder operation(when the leads are being soldered), the thermal padcan also be soldered to a copper area underneath thepackage. Through the use of thermal paths within thiscopper area, heat can be conducted away from thepackage into either a ground plane or other heat

Figure 45. DDA PowerPAD PCB Etch and Viadissipating device.Pattern

The PowerPAD package represents a breakthroughin combining the small area and ease of assembly ofsurface mount with the mechanical methods of PowerPAD PCB LAYOUT CONSIDERATIONSheatsinking. 1. PCB with a top side etch pattern is shown in

Figure 44 and Figure 45. There should be etchfor the leads and for the thermal pad.

2. Place the recommended number of holes in thearea of the thermal pad. These holes should be10 mils in diameter. Keep them small so thatsolder wicking through the holes is not a problemduring reflow.

3. Additional vias may be placed anywhere alongFigure 43. Views of Thermally Enhanced Packagethe thermal plane outside of the thermal padarea. This helps dissipate the heat generated by

Although there are many ways to properly heatsink the THS4631 IC. These additional vias may bethe PowerPAD package, the following steps illustrate larger than the 10-mil diameter vias directly underthe recommended approach. the thermal pad. They can be larger because

they are not in the thermal pad area to be



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PD max Tmax TA

JA

4

3.5

3

2.5

2

1.5

1

0.5

0−40 −20 0 20 40 60 80 100

− M

axim

um P

ower

Dis

sipa

tion

− W

P D


θJA = 58.4°C/W

θJA = 98°C/W

θJA = 158°C/W

TJ = 125°C

THS4631


soldered so that wicking is not a problem.4. Connect all holes to the internal ground plane. (9)

Although the PowerPAD is electrically isolatedwhere:from all pins and the active circuitry, connection

to the ground plane is recommended. This is due PDmax is the maximum power dissipation in theto the fact that ground planes on most PCBs are amplifier (W).typically the targets copper area. Offering the Tmax is the absolute maximum junctionbest thermal path heat to flow out of the device. temperature (°C).

5. When connecting these holes to the ground TA is the ambient temperature (°C).plane, do not use the typical web or spoke via θJA = θJC + θCAconnection methodology. Web connections have

θJC is the thermal coefficient from the silicona high thermal resistance connection that isjunctions to the case (°C/W).useful for slowing the heat transfer duringθCA is the thermal coefficient from the case tosoldering operations. This makes the soldering ofambient air (°C/W).vias that have plane connections easier. In this

application, however, low thermal resistance is NOTE:desired for the most efficient heat transfer.For systems where heat dissipation is moreTherefore, the holes under the THS4631critical, the THS4631 is offered in an 8-pin MSOPPowerPAD package should make theirwith PowerPAD package and an 8-pin SOIC withconnection to the internal ground plane with aPowerPAD package with better thermalcomplete connection around the entireperformance. The thermal coefficient for thecircumference of the plated-through hole.PowerPAD packages are substantially improved

6. The top-side solder mask should leave the over the traditional SOIC. Maximum powerterminals of the package and the thermal pad dissipation levels are depicted in Figure 46 for thearea with its via holes exposed. The bottom-side available packages. The data for the PowerPADsolder mask should cover the via holes of the packages assume a board layout that follows thethermal pad area. This prevents solder from PowerPAD layout guidelines referenced abovebeing pulled away from the thermal pad area and detailed in the PowerPAD application noteduring the reflow process. number SLMA002. Figure 46 also illustrates the

7. Apply solder paste to the exposed thermal pad effect of not soldering the PowerPAD to a PCB.area and all of the IC terminals. The thermal impedance increases substantially

which may cause serious heat and performance8. With these preparatory steps in place, the IC isissues. Be sure to always solder the PowerPADsimply placed in position and run through theto the PCB for optimum performance.solder reflow operation as any standard

surface-mount component. This results in a partthat is properly installed.

POWER DISSIPATION AND THERMALCONSIDERATIONS

To maintain maximum output capabilities, theTHS4631 does not incorporate automatic thermalshutoff protection. The designer must take care toensure that the design does not violate the absolutemaximum junction temperature of the device. Failuremay result if the absolute maximum junctiontemperature of 150°C is exceeded. For bestperformance, design for a maximum junctiontemperature of 125°C. Between 125°C and 150°C,damage does not occur, but the performance of the

Figure 46. Maximum Power Dissipationamplifier begins to degrade. The thermalvs. Ambient Temperaturecharacteristics of the device are dictated by the

package and the PC board. Maximum powerdissipation for a given package can be calculatedusing Equation 9.



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THS4631


Results are with no air flow and PCB size = 3" x 3 "θJA = 58.4°C/W for the 8-pin MSOP withPowerPAD (DGN).θJA = 98°C/W for the 8-pin SOIC high-K test PCB(D).θJA = 158°C/W for the 8-pin MSOP withPowerPAD, without solder.

When determining whether or not the device satisfiesthe maximum power dissipation requirement, it isimportant to not only consider quiescent powerdissipation, but also dynamic power dissipation. Oftentimes, this is difficult to quantify because the signalpattern is inconsistent, but an estimate of the RMSpower dissipation can provide visibility into a possibleproblem

DESIGN TOOLS EVALUATION FIXTURE,SPICE MODELS, AND APPLICATIONSSUPPORT

Texas Instruments is committed to providing itscustomers with the highest quality of applicationssupport. To support this goal an evaluation board hasbeen developed for the THS4631 operational Figure 48. EVM Layers 2 and 3, Groundamplifier. The board is easy to use, allowing forstraightforward evaluation of the device. Theevaluation board can be ordered through the TexasInstruments web site, www.ti.com, or through yourlocal Texas Instruments sales representative. Theboard layers are provided in Figure 47, Figure 48,and Figure 49. The bill of materials for the evaluationboard is provided in Table 2.

Figure 49. EVM Bottom Layer

Figure 47. EVM Top Layer



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THS4631


BILL OF MATERIALS

Table 2. THS4631DDA EVM

SMD REFERENCE PCB MANUFACTURER'SITEM DESCRIPTION SIZE DESIGNATOR QUANTITY PART NUMBER (1)

1 CAP, 2.2 µF, CERAMIC, X5R, 25 V 1206 C3, C6 2 (AVX) 12063D225KAT2A

4 CAP, 0.1µF, CERAMIC, X7R, 50 V 0805 C1, C2 2 (AVX) 08055C104KAT2A

OPEN 0805 R4, Z4, Z6 3

6 RESISTOR, 0 OHM, 1/8 W 0805 Z2 1 (KOA) RK73Z2ATTD

7 RESISTOR, 499 OHM, 1/8 W, 1% 0805 R3, Z5 2 (KOA) RK73H2ATTD4990F

8 OPEN 1206 R8, Z9 2

9 RESISTOR, 0 OHM, 1/4 W 1206 R1 1 (KOA) RK73Z2BLTD

10 RESISTOR, 49.9 OHM, 1/4 W, 1% 1206 R2 1 (KOA) RK73H2BLTD49R9F

11 RESISTOR, 953 OHM, 1/4 W, 1% 1206 Z3 1 (KOA) RK73H2BLTD9530F

13 CONNECTOR, SMA PCB JACK J1, J2, J3 3 (JOHNSON) 142-0701-801

JACK, BANANA RECEPTANCE, 0.25"14 J4, J5, J6 3 (SPC) 813DIA. HOLE

15 TEST POINT, BLACK TP1, TP2 2 (KEYSTONE) 5001

TEST POINT, RED TP3 1 (KEYSTONE) 5000

16 STANDOFF, 4-40 HEX, 0.625" LENGTH 4 (KEYSTONE) 1808

17 SCREW, PHILLIPS, 4-40, .250" 4 SHR-0440-016-SN

18 IC, THS4631 U1 1 (TI) THS4631DDA

19 BOARD, PRINTED CIRCUIT 1 (TI) EDGE # 6467873 Rev.A

(1) The manufacturer's part numbers are used for test purposes only.

EVM

Computer simulation of circuit performance using SPICE is often useful when analyzing the performance ofanalog circuits and systems. This is particularly true for video and RF-amplifier circuits where parasiticcapacitance and inductance can have a major effect on circuit performance. A SPICE model for the THS4631 isavailable through either the Texas Instruments web site (www.ti.com). These models help in predictingsmall-signal ac and transient performance under a wide variety of operating conditions. They are not intended tomodel the distortion characteristics of the amplifier, nor do they attempt to distinguish between the package typesin their small-signal ac performance. Detailed information about what is and is not modeled is contained in themodel file itself.



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THS4631


Figure 50. THS4631 EVM Schematic



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THS4631


ADDITIONAL REFERENCE MATERIAL• PowerPAD Made Easy, application brief (SLMA004)• PowerPAD Thermally Enhanced Package, technical brief (SLMA002)• Noise Analysis of FET Transimpedance Amplifiers, application bulletin, Texas Instruments Literature Number

SBOA060.• Tame Photodiodes With Op Amp Bootstrap, application bulletin, Texas Instruments Literature Number

SBBA002.• Designing Photodiode Amplifier Circuits With OPA128, application bulletin, Texas Instruments Literature

Number SBOA061.• Photodiode Monitoring With Op Amps, application bulletin, Texas Instruments Literature Number SBOA035.• Comparison of Noise Performance Between a FET Transimpedance Amplifier and a Switched Integrator,

Application Bulletin, Texas Instruments Literature Number SBOA034.

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the input and output voltage ranges as specified in the table providedbelow.

Input Range, VS+ to VS– 10 V to 30 V

Input Range, VI 10 V to 30 V NOT TO EXCEED VS+ or VS–Output Range, VO 10 V to 30 V NOT TO EXCEED VS+ or VS–

Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. Ifthere are questions concerning the input range, please contact a TI field representative prior to connecting theinput power.

Applying loads outside of the specified output range may result in unintended operation and/or possiblepermanent damage to the EVM. Consult the product data sheet or EVM user's guide (if user's guide is available)prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contacta TI field representative.

During normal operation, some circuit components may have case temperatures greater than 30°C. The EVM isdesigned to operate properly with certain components above 50°C as long as the input and output ranges aremaintained. These components include but are not limited to linear regulators, switching transistors, passtransistors, and current sense resistors. These types of devices can be identified using the EVM schematiclocated in the material provided. When placing measurement probes near these devices during operation, pleasebe aware that these devices may be very warm to the touch.

Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265



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http://www.ti.com/lit/pdf/SBOA060

http://www.ti.com/lit/pdf/SBBA002




THS4631


REVISION HISTORY

Changes from Original (December 2004) to Revision A Page

• Changed the Related FET Input Amplifier Products table .................................................................................................... 1

• Changed the Differential input resistance value From: 109 || 6.5 To: 109 || 3.9 ................................................................... 4

• Changed the Common-mode input resistance value From: 109 || 6.5 To: 109 || 3.9 ............................................................ 4

• Changed Figure 8 - From: RL = 499Ω To RF = 499Ω ........................................................................................................... 6

• Changed Figure 9 - From: RL = 499Ω To RF = 499Ω ........................................................................................................... 6

• Added Figure 23 ................................................................................................................................................................... 7

• Added Figure 24 ................................................................................................................................................................... 7

• Added Figure 50 ................................................................................................................................................................. 19

Changes from Revision A (March 2005) to Revision B Page

• Changed the Tstg value in the Absolute Maximum Ratings table From: 65°C to 150°C To: –65°C to 150°C ...................... 2



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PACKAGE OPTION ADDENDUM

www.ti.com 12-Aug-2017

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status(1)

Package Type PackageDrawing

Pins PackageQty

Eco Plan(2)

Lead/Ball Finish(6)

MSL Peak Temp(3)

Op Temp (°C) Device Marking(4/5)

Samples

THS4631D ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)

CU NIPDAU Level-2-260C-1 YEAR -40 to 85 4631

THS4631DDA ACTIVE SO PowerPAD DDA 8 75 Green (RoHS& no Sb/Br)

CU SN Level-2-260C-1 YEAR -40 to 85 4631

THS4631DE4 ACTIVE SOIC D 8 75 Green (RoHS& no Sb/Br)


THS4631DGN ACTIVE MSOP-PowerPAD

DGN 8 80 Green (RoHS& no Sb/Br)

CU NIPDAU |CU NIPDAUAG

Level-1-260C-UNLIM -40 to 85 ADK

THS4631DGNG4 ACTIVE MSOP-PowerPAD


CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 ADK

THS4631DGNR ACTIVE MSOP-PowerPAD


CU NIPDAU |CU NIPDAUAG

Level-1-260C-UNLIM -40 to 85 ADK

THS4631DGNRG4 ACTIVE MSOP-PowerPAD


CU NIPDAUAG Level-1-260C-UNLIM -40 to 85 ADK

THS4631DR ACTIVE SOIC D 8 2500 Green (RoHS& no Sb/Br)


(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

http://www.ti.com/product/THS4631?CMP=conv-poasamples#samplebuy








PACKAGE OPTION ADDENDUM

www.ti.com 12-Aug-2017

Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device PackageType

PackageDrawing

Pins SPQ ReelDiameter

(mm)

ReelWidth

W1 (mm)

A0(mm)

B0(mm)

K0(mm)

P1(mm)

W(mm)

Pin1Quadrant

THS4631DGNR MSOP-Power PAD

DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

THS4631DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Mar-2016

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

THS4631DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0

THS4631DR SOIC D 8 2500 367.0 367.0 38.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Mar-2016

Pack Materials-Page 2

GENERIC PACKAGE VIEW

Images above are just a representation of the package family, actual package may vary.Refer to the product data sheet for package details.

DDA 8 PowerPAD TM SOIC - 1.7 mm max heightPLASTIC SMALL OUTLINE

4202561/G

http://www.ti.com/lit/slma002








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Documents

DECEMBER 2004 HIGH-VOLTAGE,HIGH SLEW RATE, · PDF file• Maximum Input Bias Current: 100 pA distortion at high frequencies. Low current and voltage noise allow amplification of extremely