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    Analytics with

    Scanning Electron Microscopy

    A. Danilewsky

    Energy Dispersive X-Ray Analysis EDX

    Electron Back Scatter Diffraction EBSD

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    Depth of Signals

    Auger - elektrons

    Secondary electrons SE

    Back scatter electrons BSE

    X rays:

    - Characteristic X - rays

    - Continuum X- rays

    Sample surface

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    Topographic contrast

    Electron beam

    Electron beam

    Many

    secondary

    electrons

    leave the

    sampleFew

    secondary

    electrons

    leave thesample

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    Characteristic X - Rays

    k 1: LIII Kk 2: LII K

    k : MIII K

    keV

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    Relative Intensity of Characteristic X - Rays

    L shell consists of 3 subshells with quantum numbers n, l, j and spin m:

    lI: 2s orbital n = 2, l = 0, j = , m = max. 2 electrons

    => forbidden transition

    lII: 2p orbital n =2, l = 1, j = , m = => max. 2 electrons=> k2 line

    lII: 2p orbitals n = 2, l = 1, j = 3/2, m = , 3/2 max. 4 electrons=> k1 - line

    Intensity k

    1

    : k

    2

    = 2 : 1

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    Characteristic X - Rays

    Characteristic X rays Continuum X- rays

    k : L K

    k : M K

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    X Ray Detector

    Si crystal drifted by Li with

    FET (field effect transistor)

    Be window

    collimator

    cooling by liquid N2 (77 K)

    dewar

    liq. N2

    Be - window

    collimator

    Si - crystal

    cold finger

    distance

    adjustment

    preamplifier

    sensor

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    X Ray Detector: Si crystal drifted by Li

    X-ray photons generate

    electron hole pairs

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    Semiconductor X Ray Detector

    Valence band of an intrinsic semiconductor is fully occupied Conduction band of an intrinsic semiconductor is largely unoccupied

    X-rays raise electrons from valence to conduction band (photo- and

    Auger electrons)

    Electron hole pairs move free in the crystal during their lifetime

    Bias voltage across the detector moves charge carriers to opposite

    electrodes

    => signal/pulse

    The number of electron hole pairs is proportional to the energy of

    X-ray photons

    Minimum energy is the energy gap of the semiconductor (Si: 1.1 eV)

    + energy of lattice vibrations + other physical effects => about 3.8 eV

    Multi-channel analyser: 1024 channels set to 10 eV/channel

    => 0.5 10 keV

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    Semiconductor X Ray Detector:

    Silicon drifted by Li

    Low leakage current => high resistivity Si (ultra pure)

    Li as a donor compensates p-type conduction of Si at low temperature

    Li stabilises the Si structure against X- ray radiation damage

    p n - junction from undoped to Li doped area

    Only one pulse is is processed at a time. To many X-ray photons during the

    anlyser is busy:

    => dead time: no other photons are counted ! Timescale: nano seconds

    e.g. 30 seconds counting time at 10% dead time needs

    33 seconds real time measurement

    X-rays generated in the Si detector crystal it-self: escape peak

    Ti Si = 2.77.keV

    Si = 1.74 keV

    Ti = 4.51 keV

    keV

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    L - linesK 1 K 2

    X Ray Spectra

    Energy of of photons: Characteristic X-ray lines

    Number of photons: Concentration of element

    M -lines

    L -lines

    K lines at 80.8. keV

    keV

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    X Rays:

    Absorption and Fluorescence

    e.g. Fe - Mn

    electron beam

    Fek

    Mnk

    SE

    SE

    ZAF Correction:

    Z = atomic numberA = absorption

    F = fluorescence

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    X Rays: Background Corrections

    Continuum spectrum:

    Calculation from elements

    Subtraction

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    Energy dispersive X-ray analysis (EDX)

    Oxford - Link System ISISat Zeiss DSM 960

    Acceleration voltage: 20 kV

    Magnification: x200 x1000

    Detector: Si:Li

    Qualitative mapping of elements:

    Al, Si, Ti, Ca, Fe, Mn

    BSE

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    Energy dispersive X-ray analysis (EDX)

    200 m

    200 m

    Si

    200 m

    200 m 200 m

    AlFe

    Ti

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    Geometrie EBSD

    Bragg: n = 2d sin

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    Electron Backscatter Diffraction EBSDOxford - Link System

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    Crystal

    Homogenous, anisotropic discontinuum with three-dimensional

    periodical arrangement of lattice elements

    Crystal Lattice

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    Crystal Lattice

    br

    cr

    231

    r

    straight line through the points 000 and 231: [231]

    c1b3a2cwbvaur

    r

    rr

    r

    rr

    ++=++=

    ar

    [231]

    ,,Angles

    ,,sBasevector cba r

    r

    r

    Atomic Plane

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    Atomic Plane

    ar

    br

    cr

    Indices to Wei reciprocal Miller

    plane I 111 111 (111)

    plane II 122 1 (211)

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    Zone and Zone Axis

    Zone axis

    Plain of the

    surface normal

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    Crystal Structure

    Gitter

    Basis

    Lattice

    Base

    Crystal

    structure

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    Crystal Systems

    Cubic

    Hexagonal

    Tetragonal

    Rhombohedral

    Orthorhombic

    Monoclinic

    Triclinic

    C b i

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    14 Bravais

    Lattices

    C u b i c

    H e x a g o n a l T e t r a g o n a l

    O r t h o r h o m b i c

    M o n o c l i n i c T r i c l i n i c

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    Unit CellSmallest assembly, which expresses the metric and includes all

    symmetry elements

    z.B.: F 4 3 m,

    Zinkblende structure

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    Symmetry

    Deckoperationen

    im

    Kontinuum

    Diskontinuum

    Symmetry elements in two-dimensions

    Mirror plane m

    Rotation axis

    2-fold 4-fold

    3-fold6-fold

    Glide reflection

    Translation

    Symmetry

    Transformations:

    Continuum

    and

    Discontinuum

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    Space Groups

    Tabulated in:

    International Tables

    for

    Crystallography, Vol A

    Asymmetric unit:

    Smallest portion of a crystal

    structure to which crystallo-

    graphic symmetry can be

    applied to generate one unit cell.By application of all symmetry

    operations of the space group,

    the whole space is filled.

    11 Laue - Groups

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    11 Laue - Groups

    Due to the phase problem, all diffraction patterns include an inversion center.

    => Centro- and noncentrosymmetric groups can not be distinguished

    Crystal system Laue - Group Acentric subgroups

    triclinic 1

    monoclinic 2/m 2, m

    orthorhombic mmm 222, mm2

    tetragonal 4/m

    4/mmm

    4, 4

    4mm, 4m2, 422

    trigonal

    m

    3

    3m, 32hexagonal 6/m

    6/mmm

    6, 6

    6mm, 6m2, 622

    cubic m

    m m

    23

    43m, 432

    1

    3

    3

    3

    3

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    Structure Data

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    Information of EBSD Pattern

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    Information of EBSD - Pattern

    EBSD of Ge

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    EBSD of Ge

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    Demonstration of Sample Orientation

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    Demonstration of Sample Orientation

    Projection of the

    surface normal in atwo-dimensional

    plain occurs analog-

    ous to the stereo-

    graphic projection:

    => Pole Figure

    Pole Figure Corresponding to ~ [111]

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    Pole Figure Corresponding to [111]

    with Slightly Tilt and Rotation

    Inverse Pole Figure

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    Polycrystalline Sample

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    y y pFew Alignment of Crystallites

    Polycrystalline SampleAli t f C t llit C di t [101]

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    Alignment of Crystallites Corresponding to [101],

    Inverse Pole Figure

    Polycrystalline Sample

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    Alignment of Crystallites, Inverse Pole Figure

    Reference System

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    Reference System

    Demonstration of Orientation

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    Euler angleOrientation:

    Rotation of the sample-fixed coordinate system (Cartesian!) into the crystal-

    fixed system of the discrete crystallite.

    a) Sample orientation

    1 - Rotation on perpendicular direction

    - Rotation on longitudinal direction

    2 - Rotation on transversal direction

    b) Crystal orientation

    1 - Rotation in (001)

    - Rotation on [100]

    2 - Rotation in (001)

    Convention according to Bunge:

    Mechanical Sample Preparation

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    Mechanical Sample Preparation

    Mechanochemical Sample Preparation

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    Sample Preparation

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    Sample Preparation

    Depth of penetration 10 - 100 nm

    Good polish Bad polish

    Sample Preparation by Ion Abrasion

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    Polycrystalline Si

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    rolling directionback scatter electrons (BSE)quality pattern

    transverse directionnormal direction

    x 200 pixel size 24 m

    Polycrystalline Si:

    Preferential growth direction

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    Preferential growth direction

    5 - 7 deviation from [110]

    Literature to Scanning Electron Microscopy

    L. Reimer, G. Pfefferkorn: "Rasterelektronenmikroskopie", Springer 1977

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    H. R. Wenk (Ed.): "Electron Microscopy in Mineralogy", Springer Verlag 1976

    L. Reimer: "Scanning Electron Microscopy", Springer 1983

    L. Reimer: "Elektronenmikroskopische Untersuchungs- und Prparationsmethoden",

    Springer 1967

    Schmidt, Peter FritzPraxis der Rasterelektronenmikroskopie und Mikrobereichsanalyse / Peter

    Fritz Schmidt - Renningen-Malmsheim : Expert-Verlag, 1994 (Kontakt &

    Studium ; 444 : Metechnik)

    Joy et al.: "Electron Channeling Pattern in the Scanning Electron Microscope",J. Appl. Phys. Vol 53, No 8 (1982) 439 - 461

    U. Holzhuser: "Charakterisierung von Einkristallen mittels Electron Channeling

    Pattern", Diplomarbeit Universit@t Freiburg 1992 Flegler, Heckmann, Klomparens, Elektronenmikroskopie, Spektrum

    Akademischer Verlag Berlin und Heidelberg, 1993

    Humphreys, "Reviw: Grain and subgrain characterisation by electron backscatter

    diffraction, J. of Mat. Sci. 36 (2001), 3833 3854

    Literature to Scanning Electron Microscopy

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    and online:

    "Grundlagen der Raster-Elektronenmikroskopie" http://www.reclot.de

    by Alexander Fels

    "SEM Electron Backscattered Diffraction" by Dr Geoff Lloyd

    "Crash Kurs Textur" http://www.texture.de/Multex-Dateien/crash.htm

    by Kurt Helming