ESD & EMI Product Presentation - - 北天星国际有限公司 · High Performance Analog Solutions for Digital World ESD & EMI Product Presentation Union Semiconductor Inc

High Performance Analog Solutions for Digital WorldHigh Performance Analog Solutions for Digital World

ESD & EMI Product Presentation

Union Semiconductor Inc.


UNION ESD Products


ØTrend: Chip size decreases to minimum

üGate thickness and chip size (channel length) decreases

üMaximum gate voltage decreases (e.g. for CMOS090<1.5V static)

üNew processes are optimized for area and performance, NOT for ESD performance!

ØImpact:

üVery ESD sensitive ICs which burn at low clamping voltages

üAdditional board level ESD protection for external interfaces becomes a must!

50nm

12.5nm

8nm

4.15nm3nm 1.6nm

Gate Oxide ThicknessESD Protechtion A

rea G

ate Oxide Thickness

IC Area

Required IC area to achieve 2KV HBM ESD Protection

1.5um 800nm 350nm 180nm 140nm 90nm 65nm

Chip size


Why Use External ESD Protection Devices?

§ Integrating simple protection on complex ICs is expensive and it is low level

§ IC gate oxides are thinner and are more vulnerable to ESD events

§ Protection circuits are most effective when placed farther from the major ICs and closer to the connectors

§ Designing in ESD/EMI protection up front is cost effective…..

• Avoid re-designs after a failure during certification tests

• Avoid cost of returned product from end customers

I/O Line Protection T1/E1 Line Card ProtectionUSB Protection


TVS vs. MOVTVS vs. MOV-- ESD PulseESD Pulse

Input: 8KV ESD Pulse, IEC 61000-4-2

Output: Varistor, VA-C1005-5R5E

Output: 6.1V TVS

High clamping Voltage (35V)

Low clamping Voltage (7V)

Conclusion: TVS diodes clamp surges at a lower voltage than a MOV!


ESD/Surge ConclusionsESD/Surge Conclusions

n IC’s must be protected because most of them cannot withstand ESD conditions higher than 2 kV

n PCB lay-out is critical to improve TVS protection andreduce parasitic effects (V = L di/dt)

n Avalanche TVS diodes have several technicaladvantages over competitive TVS devices

l Low clamping voltagel Low breakdown voltagel No change in electrical characteristics after ESD/surge event


Standard Capacitance ESD Protectors

P/N Configuration Application ChannelpF @ 0v Capacitance Package Size (mm)

UM5059 I/O Line 1 40 SOD882/FBP2/DFN2 1.0*0.6*0.5

UM5055 I/O Line 1 40 SOD523/SC79 1.6*0.8*0.65

UM5079/Q DC Plug 1 40 SOD882/FBP2/DFN2 1.0x0.6*0.5

UM5075 DC Plug 1 40 SOD523/SC79 1.6*0.8*0.65

SM05/G I/O Line 2 25 SOT23-3 2.9*2.4*1.0

UESD54B I/O Line 4 40 SC70-5/SC88A/SOT353 2.0*2.1*0.95 P0.65

UESD64B I/O Line 4 40 SC89-5/SOT553/SOT665 1.6*1.6*0.55 P0.5


UESD6V85CT36 I/O Line 5 40 SC70-6/SC88/SOT363 2.0*2.1*0.95 P0.65


UESD57B I/O Line 6 40 FBP1616P6 1.6*1.6*0.6 P0.5

UM5080 I/O Line 1 20 DFN2 1.0*0.6*0.5 P0.65


Low Capacitance ESD Protectors


UESD6V8L1F High Speed Data Line 1 20 SOD882/FBP2/DFN2 1.0x0.6*0.5

UESD6V8L4A High Speed Data Line 4 20 SC70-5/SC88A/SOT353 2.0*2.1*0.95 P0.65

UESD6V8L4B High Speed Data Line 4 20 SC89-5/SOT553/SOT665 1.5*1.5*0.55 P0.5

UESD6V8L5A6 High Speed Data Line 5 20 SC70-6/SC88/SOT363 2.0*2.1*0.95 P0.65

UESD6V8L5B High Speed Data Line 5 20 SC89-6/SOT563/SOT666 1.5*1.5*0.55 P0.5


Ultra Low Capacitance ESD Protectors


UM5204 High speed USB 4 2 SC70-6/SC88/SOT363 2.0*2.1*0.95 P0.65

UM5204 High speed USB 4 2 SC89-6/SOT563/SOT666 1.6*1.6*0.55 P0.5

UM5204 High speed USB 4 2 TSOP-6/SOT23-6 2.9*2.8*1.1 P0.95

UM5304 SIM Card or USB1.1 4 2 SC70-6/SC88/SOT363 2.0*2.1*0.95 P0.65

UM5304 SIM Card or USB1.1 4 2 SC89-6/SOT563/SOT666 1.6*1.6*0.55 P0.5

UM5304 SIM Card or USB1.1 4 2 TSOP-6/SOT23-6 2.9*2.8*1.1 P0.95


UNION EMI Products


Filter with Parasitic Inductance

NetworkattenuationdB -20

-40

fC

ZS Z0

C

R

Attenuation will decrease back up to 10dB(ie 3:1) when 3*2*[π]*f* LP = R If R = 33 ohm, this will occur when fC = 1.5GHz

The effect of parasitic inductance LP becomes noticeable when ZLp approaches ZCi.e. when 2*[π]*f* LP = 1/(2*[π]*f*C) If C = 50pF, and say LP = 1nH, fC = 500MHzOr for CSP, 2 bumps = 100pH, fC = 5GHz

Self-resonance

Lp

(esr of C is approx R/100)

esr

Undsirable response

Adequate response

Frequency


DFNDiscrete capacitor

Leaded package

Flip chip BGA

Importance of the parasitic inductance

RS

C

LS

C = 33 pFRs = 0.4 Ω

DFN package is designed to provide BEST IN CLASS Parasitic inductance enabling better filter performances. Equivalent circuit of

discrete capacitor

-45-40-35-30-25-20-15-10-50

1.E+06 1.E+07 1.E+08 1.E+09 1.E+10Frequency (Hz)

S21

(dB

)

DFN

Flip Chip

800 PH 500 PH 100 pH 50 pH


EMI Filters with ESD Protectors

P/N Configuration Application Channel CapacitancepF @ 0v Package Size (mm) Features

UM1002 Audio Line 2 57 SC70-6/SC88/SOT363 2.0*2.1*0.95 P0.65

UM1002 Audio Line 2 57 TSOP-6/SOT23-6 2.9*2.8*1.1 P0.95

UM1002L Audio Line 2 60 SC70-6/SC88/SOT363 2.0*2.1*0.95 P0.65

UM1002L Audio Line 2 60 TSOP-6/SOT23-6 2.9*2.8*1.1 P0.95

UM4411 Data Line Color LCD 4 20 DFN8 1.7*1.3*0.5 P0.4



UM4401 Data Line Color LCD 4 20 DFN8 2.1x1.6*0.575 P0.5

UM6401 Data Line Color LCD 6 20 DFN12 3x1.6*0.575 P0.5

UM8401 Color LCD Data Line 8 20 DFN16 4x1.6*0.575 P0.5


Applications


Battery Interface

Display

KeypadUSB Interface

Speaker

Memory Card

IO Connector

Where is ESD Protection Needed in Handset?


Cost Effective Audio ESD ProtectionCost Effective Audio ESD Protection• Typical application of bidirectional ESD protection• In compliant with IEC61000-4-2 level 4 with UESD55B: 15kv(air discharge) & 8kv(Contact discharge)

8/4

Ω

N/C

UESD55B used as 2 lines Bi-direcional Protection

4

6

5

4

3

21 6

4

5

4

3

21 4

6

5

4

3

21 6

4

5

4

3

21 4

6

5

4

3

21 6

4

5

4

3

21

N/C


Ø Function :- 2 lines uni directional protection against ESDØ Benefits :

- Easy orientation detection.- Unidirectinal device provide lowest negative breakdown voltage. - IEC61000-4-2 level 4 compliant- Smallest semiconductor package on the market- Replace varistor for improvemed performance.- Footprint compatible with Varistor- Exceed varistors performances- RoHs package

Ø Package : - Package size 1.4 X1.1X0.5 mm- PCB Area : 1.54 mm²

I/O1

GND

I/O2

GND3

1 22

UM5062

SLP1411


Ø Function :- 2 lines uni directional protection against ESDØ Benefits :

- Easy orientation detection.- Unidirectinal device provide lowest negative breakdown voltage. - IEC61000-4-2 level 4 compliant- Smallest semiconductor package on the market- Replace varistor for improvemed performance.- Footprint compatible with Varistor- Exceed varistors performances- RoHs package

Ø Package : - Package size 1.0 x 0.6 mm- PCB Area : 0.6 mm²

I/O1

GND

I/O2

GND3

1 22

UM5082

SOT883


Data Port Protection

UESD6V85CT36 [SC-88 Package]

UESD56B [SOT563 Package]

Union’s ESD/EMI Protection Product Offer

Interface

6 5 4

1 2 3

6 5 4

1 2 3


SIM and USB Interface Protection

UM5204 [ in SOT-363 or 563 package]，

ESD protection level greater than15KV，

UM5204 can be used to protect power、

reset、clock、data line of SIM interface



SD Memory Card Protection

UESD54B [ in SOT-353 package]，ESD

protection level greater than15KV



Multi Media Card Protection

UESD54B [ in SOT-353 package]，ESD

protection level greater than15KV



Keypad Protection

UM5055 [SOD-523]

UM5059 [SOD-882]

UESD54B [SC-88A]

UESD55B [SC-89]

UESD56B [SC-89]



Package Evolution-Thinner SOD882

0.52mm max. 0.40mm max.

I/O 1

I/O 2

I/O 1

I/O 2

UM5059

UM5059

Normal mobile phone Slim Phone

M/P UM5059T

FBP Thin SOD882


Power Supply Protection

SM05 [SOT-23-3]



D1

.

.

.

D8

.

UM4717

Vcc

D+ (USB)

D-(USB)

Botto

m C

onne

ctor

Protected

Interface

We are thinner

Bottom Connector

UM84018 channel filter [100 Ω]C line= 36pF@ 0 Volt

1.6X4.0 mmX 0.575mm

UM84118 channel filter [100 Ω]C line= 36pF@ 0 Volt1.3X3.3 mmX 0.5mm


1.6X3.0 mm X 0.575mm

UM64116 channel filter [100 Ω]C line= 36pF@ 0 Volt1.3X2.5 mm X 0.4mm


1.6X2.1 mm X0.575mm

UM44114 channel filter [100 Ω]C line= 36pF@ 0 Volt1.3X1.7 mm X0.5mm


New Generation EMI Filter

UM8411 SeriesUM8411 Series

400 microns pitch packages!!400 microns pitch packages!!

2*1.2 0.4 pitch

LCD I/OLCD I/O

3.3*1.3 0.4 pitch


PASSIVE EMI FILTERS Union QFN

Devices used on the Devices used on the baordbaord

Innochip samplesInnochip samples

100.0k 1.0M 10.0M 100.0M 1.0G-30.00

-20.00

-10.00

0.00

dB

f/Hz100.0k 1.0M 10.0M 100.0M 1.0G

-30.00

-20.00

-10.00

0.00

dB

f/Hz

Fc= 200MHz

-25 dB

>30dB17dBPassive device on Samsung board

15dB7dBInnochip (ICVE21184E070R100)

>25dB>25dBUnion Semi1.8GHz900MHzDevoices

Union = Union = Wide & Deep Wide & Deep Frequency RejectionFrequency Rejection

Advantage vs. Passive Device


LCD Monitor Protection

UM5204

UM5204

UM5304

UM5304UESD55B

UESD54B

UM8401

UM6401

UM4401

UM5204

UM5304

UM5204

UM5304

UM8401

UM6401UM4401

UM5204

UESD56BUESD6V85CT36

portable medical device

ESD Protection



Card Reader

LCD

Bar Code Reader

ESD

Card Reader ESD ProtectionSM05(SOT-23-3;2line

Printer

ESD

KEYPAD ESD Protection4*4 LINE TVS Array

UESD54B(SC-70;4 LineUESD64B(SC-89)

LCD ESD ProtectionUESD54B(SC-70;4 line)UESD64B(SC-89;4 Line)

UESD6V85CT36(SC-70;5 Line)UESD56B(SC-89;5 Line)

UESD57B(6 Line)

USB Low capacitanceESD ProtectionUM5204(4 Line)

(SOT-23/SC-70/SC-89)

USB

SIMCard Low capacitanceESD Protection

n*4 LINE TVS ArrayUM5204(4 Line)

(SOT-23/SC-70/SC-89)

POS


PC Protection

UM5204 UM5204UM5204UM5204UM5304 UM5304 UM5304 UM5304

UM8401UM6401UM4401

UM8401UM6401UM4401

UESD56BUESD55BUESD54B

UESD55BUESD54B


LVDS Protection

UM5204 [ in SOT-363 or 563

package]，ESD protection

level greater than15KV

Application：LCD、Hub、

Printer



S-Video/Audio Protection

UM5204

Application：NB、Motherboard、Audio/Video Card

UESD55B



DVI/HDMI Interface Protection

UM5204

Application：HDTV、Monitor、DVD

UM5204


Documents

ESD & EMI Product Presentation - - 北天星国际有限公司 · High Performance Analog Solutions for Digital World ESD & EMI Product Presentation Union Semiconductor Inc