1
グラフィックスカード GeForce RTX™ 3070 VENTUS 2X OC © 2021 Micro-Star Int'l Co.Ltd. MSI is a registered trademark of Micro-Star Int'l Co.Ltd. All rights reserved.© 2021 NVIDIA, the NVIDIA logo, GeForce, SHIELD, and NVIDIA G-SYNC are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. SPECIFICATIONS 製品型番 GeForce RTX™ 3070 VENTUS 2X OC 搭載GPU NVIDIA ® GeForce RTX™ 3070 インターフェース PCI Express ® Gen 4 コア数 5888 Units コアクロック(MHz) 1755 MHz メモリタイプ ※2 8GB GDDR6 メモリスピード 14 Gbps メモリバス幅 (bit) 256-bit HDCPサポート Y 消費電力 (W) 220W 補助電源コネクタ ※3 8-pin x 2 推奨電源ユニット容量 (W) 650W カードサイズ (mm) 232 x 124 x 52 mm 重さ (g) 832g / 1255g DirectX対応バージョン 12 API OpenGL対応バージョン 4.6 最大同時出力画面数 4 映像出力端子 DisplayPort x 3 (v1.4a) / HDMI 2.1 x 1 VR Ready Y G-SYNC™ technology Y Adaptive Vertical Sync Y 最大画面解像度(デジタル) 7680x4320 CONNECTIONS 1. DisplayPort 2. HDMI FEATURES Afterburner Take full control with the most recognized and widely used graphics card overclocking software in the world. Core Pipe Precision-machined heat pipes ensure max contact and spread heat along the full length of the heatsink. Dragon Center MSI's exclusive Dragon Center software lets you monitor, tweak and optimize MSI products in real-time. Dual Fan Two fans and a huge heatsink ensure a cool and quiet experience for you. TORX FAN 3.0 The award-winning MSI TORX Fan 3.0 design creates high static pressure and pushes the limits of thermal performance. Custom PCB The custom PCB has been engineered with hardened circuits and optimized trace routing for performance and reliability. Thermal Padding An abundance of thermal pads use any chance for additional heat transfer directly from the components. Generated 2021-02-15, check for the latest version www.msi.com/datasheet. The information provided in this document is intended for informational purposes only and is subject to change without notice.

GeForce RTX™ 3070 VENTUS 2X OC · 2020. 12. 15. · 製品型番 GeForce RTX™ 3070 VENTUS 2X OC 搭載GPU NVIDIA® GeForce RTX™ 3070 インターフェース PCI Express® Gen

  • Upload
    others

  • View
    6

  • Download
    0

Embed Size (px)

Citation preview

  • グ ラ フ ィ ッ ク ス カ ー ド

    GeForce RTX™ 3070 VENTUS 2X OC

    © 2021 Micro-Star Int'l Co.Ltd. MSI is a registered trademark of Micro-Star Int'l Co.Ltd. All rights reserved.© 2021 NVIDIA, the NVIDIA logo, GeForce, SHIELD, and NVIDIA G-SYNC are trademarks and/orregistered trademarks of NVIDIA Corporation in the U.S. and other countries.

    SPECIFICATIONS製品型番 GeForce RTX™ 3070 VENTUS 2X OC搭載GPU NVIDIA® GeForce RTX™ 3070インターフェース PCI Express® Gen 4コア数 5888 Unitsコアクロック(MHz) 1755 MHzメモリタイプ※2 8GB GDDR6メモリスピード 14 Gbpsメモリバス幅 (bit) 256-bitHDCPサポート Y消費電力 (W) 220W補助電源コネクタ※3 8-pin x 2推奨電源ユニット容量 (W) 650Wカードサイズ (mm) 232 x 124 x 52 mm重さ (g) 832g / 1255gDirectX対応バージョン 12 APIOpenGL対応バージョン 4.6最大同時出力画面数 4映像出力端子 DisplayPort x 3 (v1.4a) / HDMI 2.1 x 1VR Ready YG-SYNC™ technology YAdaptive Vertical Sync Y最大画面解像度(デジタル) 7680x4320

    CONNECTIONS

    1. DisplayPort2. HDMI

    FEATURES

    Afterburner

    Take full control with the most recognized and widely usedgraphics card overclocking software in the world.

    Core Pipe

    Precision-machined heat pipes ensure max contact and spreadheat along the full length of the heatsink.

    Dragon Center

    MSI's exclusive Dragon Center software lets you monitor, tweakand optimize MSI products in real-time.

    Dual Fan

    Two fans and a huge heatsink ensure a cool and quiet experiencefor you.

    TORX FAN 3.0

    The award-winning MSI TORX Fan 3.0 design creates high staticpressure and pushes the limits of thermal performance.

    Custom PCB

    The custom PCB has been engineered with hardened circuits andoptimized trace routing for performance and reliability.

    Thermal Padding

    An abundance of thermal pads use any chance for additional heattransfer directly from the components.

    Gene

    rate

    d 20

    21-0

    2-15

    , che

    ck fo

    r the

    late

    st v

    ersio

    n w

    ww

    .msi.

    com

    /dat

    ashe

    et. T

    he in

    form

    atio

    n pr

    ovid

    ed in

    this

    docu

    men

    t is

    inte

    nded

    for i

    nfor

    mat

    iona

    l pur

    pose

    s on

    ly a

    nd is

    sub

    ject

    to c

    hang

    e w

    ithou

    t not

    ice.