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Silan 士兰微电子
Company Confidential, don’t copy
诚信 忍耐 探索 热情Faith Endurance Exploration Enthusiasm
Hangzhou Silan Microelectronics Co., Ltd
www.silan.com.cn
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Quality Control
Customer & Supplier
Product & Technology
Subsidiaries
Company Overview
Agenda
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Mission
To be one of the most excellent semiconductor
devices and integrated circuits design and
manufacturing companies.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Profile
• Silan was founded in Oct.
1997 with head office in
Hangzhou, China.
• In March 2003, Silan made
an IPO as the first IC design
company on the Shanghai
Stock Exchange (SSE) .
• At the end of the third
quarter of 2010, Silan had a
total assets of more than
300M US$.
• The total share capital of
Silan amounted to 434.08
million shares.
• Engaged in semiconductor IC
design and manufacturing,
Silan provides high quality
ICs and semiconductor
devices to customers.
• During 13-year development,
Silan has become a
comprehensive company in IC
design, manufacturing and
marketing and joined the front
ranks of IC industry in China.
• Silan has become unique in
the high voltage &high power
special IC process developed
in IDM mode.
• Silan’s present three core
business:
ICs and discrete devices
based on Silan’s own special
process of high voltage, high
power and high frequency;
Digital audio/video SOC
based on Disc servo
technology;
High-brightness LED chips
and devices;
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Location & Subsidiaries
Silan R&D Center in USA
Shenzhen ShenlanMicroelectronics
Silan Microelectronics (Korea office)
Silan Microelectronics (Taiwan office)
Silan Microelectronics(headquarters)
Silan-IC Co.,Ltd
Silan Azuer Co.,Ltd
Silan Test Factory in BinjiangYouwang Microelectronics
Chengdu
Hangzhou
Chengdu Silan Semiconductor Manufacturing Ltd
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Milestones
Hangzhou Multi-Color Optoelectrical Co., Ltd was founded in July 2009 for LED packaging.
Silan Azure was founded in Dec. 2004 for high brightness LED manufacturing.The test factory in Binjiang was put into operation the same year.
Silan was founded in Sep.1997.
Silan completed a private placement of 30 million additional shares in Sep. 2010.
New fab of Silan Azure was completed In Oct.2007.
Silan-IC was founded in Jan. 2001.Start the silicon chip manufacturing.
Salan was founded in Jan. 2000.Expand South China and Hong Kong markets.
600460
Power module packaging was launched in Dec. 2010.
IPO initiated with A-stock in March 2003.
The foundation-laying ceremony of Chengdu SilanSemiconductor Manufacturing Ltd. was held at Chenddu Aba Industrial Park in Nov. 2010.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
StructureSilan Microelectronics Co.,Ltd
Power Management
& Driver
Digital Audio/Video
Video Surveillance
MCU
Mixed Signal and R.F.
Discrete Devices
ASIC Tech.
Digital Audio/Video
Product
Image Processing
MCU R&D
Mixed Signal Tech.
SOC Embedded
Software
Back-end Design Tech.
Processor Tech.
Test Verification Tech.
Shenzhen Sale (I)
Shenzhen Sale (II)
Shenzhen Sale (III)
Shenzhen Sale (IV)
Shenzhen Sale (V)
Hangzhou Sale (I)
Device Dept.
Wafer Test Dept.
Final Test Dept.
Test Technology
Development Dept.
Quality Management
Product Line R&D Dept. Sale Dept.Test factory in
Binjiang
Management Dept.
R&D Management
Main subsidiariesSilan-IC
Silan Azure
Production Management
Sale Management
Sale Overseas
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Wafer fab
Wafer manufacturing base in Xiasha includes Silan-IC wafer fabs and Silan Azure LED
manufacturing fab
Silan-IC cover area: 125,400 M2 for three wafer
fabs
Silan Azure cover
area: 50000 M2
Running Building Under Planning
2
3 4
5
No. 10 Road
No. 1
9 R
oad
FAB 3
Building
110 KVSubstation
6
Under Planning
FAB 1
RunningFAB 2
Running
21
号
路
LED chip FABRunning
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Silan-ic (wafer fab)
• Located in Hangzhou Xiasha Economic and
Technology Development Area;
• Founded in Jan. 2001, and the first wafer fab line
(Fab 1) began to be built in May;
• Fab 2 began to run in Oct. 2005;
• Total investment has reached over RMB800 million
at the end of 2009.
• 1# clean-room: 3600 M2;
• Process: 1.5-3.0µm bipolar and bipolar based
discrete device process;
• Production capacity: 85000 pcs per month (will
expand to 110k pcs).
• 2# clean-room: 7000 M2;
• Process: 0.6-0.8µm BiCMOS/ BCD/ VDMOS, etc;
• Production capacity: 35000 pcs per month(will
expand to 90k pcs).
• 3# clean-room: Began to be built in Oct. 2010,
10000 M2 in plan for 8-inch wafer fab.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
• Silan chengdu manufacturing factory is located in Chengdu-Aba Industrial, where is about a 50-minute drive away
from Chengdu Shuangliu Airport;
• Cover a total area of 310,770 M2, with the first phase of about 73,000 M2 started building in Nov. 2010;
• It will run in fourth quarter of 2011 and plan for the following businesses:
(1)ICs and power devices manufacturing (2)High-brightness LED chips manufacturing
(3)Power module packaging (4)LED product and component packaging
First phase construction of Chengdu Silan Semiconductor Manufacturing Ltd.
Slian Chengdu manufacturing factory
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Silan Azure (LED chip)
With 800KK/Month production capacity
12 MOCVDs are provided
Green LED Chip Blue LED Chip Red LED Chip
• Special located in the design and manufacturing of GaN high-
brightness R/G/B LED chips;
• Total investment has reached RMB 700 million;
• High-quality LED ICs are well received by our customers and widely
used in large LED screen;
• Continuously explore the LED illumination applications.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
• Multi-color is engaged in full color R/G/B LED chips packaging. The products have
been used in large display screen at Tiananmen Square and already accepted by
high-end customers at home and abroad;
• Each package capacity for lamp and SMD is 30KK/month;
• Features:
(1) No attenuation: 30mA, 25 ℃, 1000 hours aging, attenuation<5%;
(2) Good light-type: smooth light-type, RGB light relative to light distribution is
controlled within 10%;
(3) High reliability: failure rate less than 0.003 percent ;
(4) Brightness Uniformity: 1 : 1.1 classified;
(5) Color consistency: classified every 3nm wavelength.
Multi-color (LED packaging)
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
R&D center
Back-end Design Tech.
Technology Departments Management Structure Product Lines
R&D management Dept.
Image Processing
Mixed Signal Tech.
Digital Audio/Video Product
MCU R&D
ASIC Tech.
Test Verification Tech.
SOC Embedded software
Processor Tech.
Video Surveillance
Mixed Signal & R.F.
Consumer ICs
MCU
Discrete Devices
Digital Audio/Video
Power Management & Driver
• The R&D Center employs talented professionals and has formed a group with more than
250 design engineers, 100 of which hold a Master’s or Doctor’s degree.
• Silan is constructing a R&D platform for both technology and product, during which we
will take advantage of our technical priority and improve management.
Based on the Integrated Products Development (IPD) system, Silan
R&D Center uses an effective matrix organization to separately
develop various aspects of IC technology. We emphasize the
accumulation of core technology, and re-usable IP core.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Core technology
• Based on continuous technology accumulation, Silan is able to design complex SOC (system on
chip) ICs and has the ability to offer total system solutions (including system solution, software
and IC) to our customers.
Core technology
R.F/Analog Tech.
Audio/Video Tech.
MCU/DSP Product
Platform
BiCMOS/BCD Process Platform
Discrete Device
Power Management
Platform
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Research on High Voltage Special Process
• Because the high voltage process and product platform development is a very
complex activity involving a wide range of technical inputs, Silan insists on the R&D
in the following aspects:
Device structure research,Model parameter design environmentbuilding
Process platform constructing
Application system research
Quality evaluation system
Circuit design validation
Package tech. research
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Road map of wafer fab process
2µm 600V high voltage IC process(for high voltage driver)
2007 2008 2009 2010 2011
HV BCD
LV BCD
BiCMOS
Bipolar
SBD
FRD
IGBT
HV MOSFETS-Rin
TMstructure
F-CellTM
structure
First generation super-junction MOSFET of Silan
600V planar PT-IGBT
1200V grooved-gate NPT IGBT
200V-600V planar FRD
800V-1200V planar structure FRD
40V-200V common SBD
1.5µm high voltage bipolar process
600V planar SBD
Super-junction SBD
Trench SBD with large current
0.8µm complementary bipolar process
0.8µm 9V BiCMOS process0.8µm high frequency BiCMOS process
0.8µm 25V BiCMOS process0.6µm BiCMOS process
0.8µm complementary 25V BCD process
0.8µm 50V BCD process 0.8µm 100V BCD process
0.8µm 75V BCD process 0.6µm BCD process
1µm 600V high voltage IC process2µm 1200V high voltage IC process
1µm 600V high voltage BCD process Built-in
600V high power lateral super junction MOS
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Product line
Power Management & Driver
Strategy
Based on advanced BCD/high-voltage IC process of Silan,
develop green power products with high efficiency and low
standby power dissipation, LED illumination driver, DC
variable-frequency motor driver with Silan’s advanced
power and motor driver structure.
Category
• AC-DC converter
• DC-DC converter
• LED driver
• DC brushless motor driver
• Digital audio power amplifier
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Product line
Mixed Signal and R.F.
Strategy
Develop high integration and high cost-performance toy
remote control IC with R.F., MCU and power driver
functions.
Based on high-frequency BiCMOS process of Silan-IC,
develop high-frequency tuner IC used in set-top box and
digital TV.
Category• High integration toy remote control IC
• Remote control codec IC
• Video processing IC
• High-frequency tuner IC
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Product line
Digital Audio/Video
StrategyDevelop SOC products based on disc servo/digital audio
/video decode technology; and expend its business in
segment market with the high cost-performance
application solutions .
Category• CD servo IC and system solution
• MP3/WMA digital audio decoder and system solution
• CHD-15 red light high-definition digital media player
and system solution
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
MCU
Strategy Based on 4-bit/8-bit MCU, develop MCU products for
household appliances control.
Category• Audio system control IC
• Household appliance control IC
• Programmable remote control IC
Product line
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Product line
Video Surveillance
StrategyDevelop high integration multi-channel H.264 video
encoder with high cost-performance and provide digital
video surveillance solutions for customers.
Category • Multi-channel video Encoder
• Single-channel video SOC
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Product line
Discrete Device
StrategyBased on the advanced process of Silan fab line and
powerful production capacity, develop various
semiconductor discrete devices and provide best service
for our customers.
Category
• High Voltage MOSFET
• Schottky Diode
• Current Regulative Diode
• Fast Recovery Diode
• TVS&ESD Protection Diode
• Switching Diode
• Zener Diode
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Market Ratio Product Ratio
LDO:42%
AC-DC:27%
DC-DC:15%
Others:16%
Product Ratio Of
Power Management & Driver
Million U.S. $Calculated at current exchange rates
Revenue
20
40
60
80
100
120
140
160
180
200
220
240
260
1998 1999 2000 2001 2002 2003 2004 2005 2006 2007 2008
7761
2011
Anticipation280
2009
141
2010
110
127134
224
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Main customers
Power
Management ICs
CD Servo &
Digital
Audio/Video ICs
Car Products
Consumer ICs
Discrete Devices
Discrete
Devices(Die)
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Subcontractors
Assembly Factory Wafer Foundry
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Quality control
Continuous quality improvement for the high quality standard in the whole world.
Careful and precise product failure analysis flow.
Mature product function parameters and quality control system for product preparation before it is put into use.
Consider the customer’s strict requirements for the quality as the chance and challenge of improving Silan’s quality control.
Has been authorized ISO9001 quality certification//ISO14001 environmental management system and SONY GP certification.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Support
Customer
Customer support
/sale/product application
engineer
Q R A
Sale manager
Product managerSale engineer
Design engineer
Product engineerSilan foundry Supplier
Finish in 5
workdaysImmediate
Response
Actual average 4.13 days in 2010!
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Audits of Customers and Partners
Customer Approval
Received Date Authorizer Certification No. or Code
ECO partner 2007-07-01 Samsung D6C3 SLHK Limited
/ 2010-06-03 LG Innotek /
/ 2010-06-28 Osram ZSIN
/ 2010-08-05 EXAR /
/ 2010-08-18 FSP /
/ 2010-08-20 Panasonic /
/ 2010-09-14 SEMCO /
/ 2010-09-15 Hisense /
/ 2010-09-20 DVE /
SONY GP 2010-10-05 Sony SOEM12104
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
QRA quality certificate
SILAN certified by CQMfor ISO9001:2008
SILAN certified by CQM for ISO14001:2004
SILAN certified by SONY GP
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Failure analysis
Acquisition of
failure information
Failure analysis report
• Hand test
• Auto test
• X-ray
• Ultrasonic inspection
• Die surfacedefect inspection
• Bonding defect inspection
• Microscope • Scanning Electron
microscope
• Liquid analysis
• Photonic analysis
• Dry etching
• Wet etching
• Manual probe test
• Aggregation particle
number analysis
Appearance
InspectionOpen/short
UI-JT test
Electrical
Characteristics Test
Non-destructive
Package Inspection
Decap
Internal
Inspection Failure Position Delayer Failure Analysis
Failure Mechanism
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Test
For the important quality control during IC design and
manufacture, Silan has the considerable ability in wafer and
IC final testing. At present, more than ten thousand wafers
and tens of millions of ICs can be tested per month.
The well controlled test system guarantees the product
quality and meets the requirements of the increasing
production capacity.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Test equipment design
Automatic test handlers of different types are
manufactured for final testing ICs with different
packages of DIP, SIP, SOP, TO-92, TO-220,
and QFP, etc.
The technology of all above test equipments
has reached the domestic leading level, and
we have used more than 200 sets in
production line.
Besides IC design, Silan also
has the ability to self-design
the test equipments. Now, the
second generation of discrete
device test system, analog IC
test system and the third
generation of digital IC test
system are in mass production.
In addition, the new generation
mixed signal test system M800
with high performance has
been successfully designed
and put into use.
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
Offer attractive, value-added products and services
Create wealth through hard work, and contribute to
benefit the community
Provide individual development and
prosperous career opportunities
Maximize return on investment and
ensure a bright long term future
为客户
For Staff For Shareholder
For Customer
For Society
© 2011 Hangzhou Silan Microelectronics CO.,LTD. All rights reserved.
http://www.silan.com.cn