IAR IDE 환경에서 손쉽게 개발 할 수 있는 IoT 관련 Microchip 제품 소개 MH EUM- Senior Embedded Solutions Engineer

11 April, 2018

2

Agenda

1. Easy IAR Project creation by using Atmel START

2. Microchip Wireless Solutions for IoT

Wi-Fi®

Bluetooth

802.15.04 Zigbee

LoRa

3. Microchip Security IC for IoT Application.

ECC508 & ECC608

4. Public Cloud Examples & Apple HomeKit Support

3

EASY IAR PROJECT CREATION BY USING ATMEL START

4

Atmel START Software configuration made easy using the Web

Explore and configure software & devices Large repository of products

Supporting device drivers & software components

Select from Atmel, third party and open community software

components

Visual software and device configuration Device pin mux & system clock

Peripheral software configuration

Middleware & example software configuration

Code generation & delivery

No installation – Web-based, central

part of Atmel Open Development Platform

Software package delivery to any

Integrated Development Environment (IDE)

5

Atmel START Example project creation

http://start.atmel.com/

6

Atmel START Export the created Project for IAR

We can generated a compatible project with IAR Workbench IDE

7

Atmel START Import the created project to IAR

You can refer to the user guide from the below link http://atmel-studio-doc.s3-website-us-east-1.amazonaws.com/webhelp/GUID-4E095027-601A-4343-844F-

2034603B4C9C-en-US-1/index.html?GUID-31CAFDCB-DD38-462B-893D-B5A7DC63B24A

The Downloaded project file can be imported to IAR Wokbench IDE

8

MICROCHIP WIRELESS SOLUTIONS

9

Narrowband

2.4GHz &

Sub GHz

~2.5kb/s

Up to 2km

Ultra-NB/ DSSS

100-600bit/s

Up to ~ 40km

802.15.4

ZigBee

6LoWPAN

250kb/s

Up to 300m Wi-Fi / BT

802.11

a/b/g/n

72Mb/s

Up to 200m

Wi-Fi

802.11

a/b/g/n

72Mb/s

Up to 200m

Bluetooth

Low

Energy

1Mb/s

Up to 10m

Range

IoT: Wireless Technologies

10

MICROCHIP WIRELESS SOLUTIONS

WiFi Product

11

Wi-Fi® Portfolio

SAMW25

SAMD21 + WINC1500

256k/32k

802.11n 2.4GHz

Module

RN1723/131

802.11g

Low Power

Module

WINC15x0

802.11n

2.4GHz

IC and Module

WINC3400

802.11n

2.4GHz

BLE 4.0

IC and Module

RN1810

802.11n 2.4GHz

Module

Netw

ork

Contr

olle

r

Legacy product

Production

Sta

ndalo

ne

Lin

k

Contr

olle

r

WILC1000

802.11n 2.4GHz

IC and Module

WILC3000

802.11n 2.4GHz

BLE 4.0

IC and Module

MRF24xxx

802.11n 2.4GHz

Module

MCU with Wi-Fi

Link Control

Network Stack

Application

Network

Controller

RN or WINC

MCU

Network Stack

Application Link Control

Link

Controller

MRF or

WILC

MPU/MCU

Link Control

Application

Network Stack

12

Modules

SAMW25

15x34

SAMD21

48MHz M0+

256k/32k

+

WINC1500

WINC3400

WILC3000

15x22

802.11n

BLE 4.0

WINC1500

WILC1000

15x22

802.11n

RN1810

18x27

802.11n

RN131

802.11g

RN171

802.11g

MRF24WG

802.11g

13

WINC15x0 Wi-Fi Network Controller

Wi-Fi Network Controller:

TCP/IP & TLS1.2 stacks on-chip

OTA firmware upgradeable

4Mb (1500) / 8Mb (1510) Serial Flash

Host MCU driver < 15KB Flash

Multiple cloud partners

Fast (150ms) reconnect to access point

Both ARM and PIC32 Harmony support

WiFi Stack

TCP/IP TLS

SPI Driver

API

WINC15x0

Wi-Fi SoC 802.11 b/g/n

Device Type IC / Module

External Host MCU

Host Interface SPI

WPS,WPA/WPA2/ EAP

TCP/UDP, HTTP, HTTPS

SSL/TLS

Antenna Design PCB / uFL

Serial Flash 4Mb (1500) 8Mb (1510)

OTA Upgrade

Dimensions (mm) 5x5 IC

15x22 Module

Certification FCC, IC, ETSI

Availability (MP) Now

14

SAMW25

SAMW25

Wi-Fi SoC WINC1500B

Embedded Host MCU SAMD21

(ARM Cortex M0+)

802.11b,g,n

WPS, WPA/WPA2

TCP/UDP, DNS, HTTP/HTTPS

SSL/TLS

CryptoAuthentication (ECC508)

Antenna Design PCB/uFL

Flash 256KB Flash on MCU

OTA Upgrade

Dimensions 15 x 34 mm

Certification FCC, IC, ETSI, TELEC

Availability (MP) Now

Host Application

SPI Driver

SPI

Socket API

WiFi Stack

TCP/IP TLS

SPI Driver

API WiFi

WINC1500

MCU

SAMD21

CryptoAuth

ECC508

Standalone Edge Module MCU + Wi-Fi solution

Complete system design

15

WINC 3400 Wi-Fi + BLE network controller

Wi-Fi + BLE network controller: Single Antenna with co-existence

On-Chip Network Stack to offload MCU:

o Integrated Network IP stack to minimize

host CPU requirements

Fast boot options:

o On-Chip Boot ROM (firmware instant

boot)

o SPI flash boot (firmware patches and

state variables)

o Low-leakage on-chip memory for state

variables

o Fast AP re-association (150ms)

SPI

WINC3400

Wi-Fi SoC 802.11 b/g/n

BLE SoC BT 4.0

Host Interface SPI

WPS, WPA/WPA2, WPA2 EAP

TCP/UDP, DNS, HTTP/HTTPS

SSL/TLS

Antenna Design Chip / uFL

Flash 8Mb serial flash

OTA Upgrade

Dimensions 15x22

Certification FCC, IC, ETSI

Availability Now

16

WILC1000/WILC3000 Product

Wi-Fi Link Controller w/

or w/o BLE 4.0

Ideal add-on to

existing MCU or MPU

Linux now in RTP

WILC1000 WILC3000

Wi-Fi SoC 802.11 b/g/n 802.11 b/g/n

Bluetooth - BLE 4.0

Device Type IC / Module IC / Module

External Host MCU/MPU MCU/MPU

Host Interface SDIO or SPI SDIO or SPI

WPS,WPA/WPA2/ EAP (Host) (Host)

TCP/UDP, HTTP, HTTPS

(Host) (Host)

SSL/TLS (Host) (Host)

Antenna Design PCB / uFL PCB / uFL

Dimensions (mm) 5x5 IC

3.25x3.25 IC 15x22 Module

6x6 IC 4.2x4.2 IC

15x22 Module

Op. Voltage Range 2.5V to 4.2V 2.5V to 4.2V

Temperature -40°C to +85°C -40°C to +85°C

Certification FCC, IC, CE FCC, IC, CE

Mass Production Now Now

Host MPU/MCU

Host Application

Driver

Linux/RTOS

SPI or

SDIO

Mic

roch

ip

WIL

C1

00

0

or

300

0

WiFi Stack

SPI/SDIO Driver

API

http://www.microchip.com/ATWILC1000 http://www.microchip.com/ATWILC3000

17

Interop Test Setup at Allion WINC1500

Security

Open, WEP, WPA, WPA2,

WPA2 Hidden

- Connection

- DHCP

- Ping

- DNS

- ARP

- UDP

- SSL

Compatibility Test with

300 Access Points

18

Regulatory Certified

• Wi-Fi Modules tested against the following standards:

• US: FCC

• Europe: CE/ETSI

• Canada: Industry Canada (IC)

• Brazil: Anatel

• Compliance to the above standards, certification reports and Registrations

• Some countries require In-country RF testing

• Many countries require end product compliance or Host level registration

19

MICROCHIP WIRELESS SOLUTIONS

BLE Product

20

Provides 2-3x

battery life

compared to other

BLE solutions

available today

Rx: <4 mA @3.6V,

Tx: <3 mA @3.6V

Low Power

Package enables

up to 3x smaller

designs vs.

current solutions

Die Size: 2.15 mm

x 2.25 mm

Small Size

Certified modules

and silicon

Certified

Solutions

Easy to develop

IoT solutions with

multiple sample

examples

IoT Solutions

SAMB11 & BTLC1000 Small & low power BLE SoC

21

BLE Product Types

SAMB11 - BLE SoC • Standalone BT 4.1 MCU

• User application and BT stack run on SAMB11

• Readily available BLE SDK

SAMB11

MCU

BTLC

1000 MCU

BTLC1000 - BLE Link Controller • Companion solution for existing / new systems.

• BT 4.1 stack on BTLC1000

• User application & BT profiles run on MCU

RN MCU

“RN” Style BT Module • Companion to MCU or can run standalone

• BT 4.2 stack and scripting runs on BT IC

• User app runs on MCU (companion) or

Simple user app runs on RN (standalone)

IS187x MCU

IS1870/71 - BLE SoC • Companion to MCU or can run standalone

• BT4.2 stack runs on IS1870/71

• User app runs on BT SoC or MCU

22

BTLC1000 / SAMB11 Wireless MR Modules

SAMB11 -MR210CA

BTLC1000 -MR110CA

BLE 4.1 SoC SAMB11 BTLC1000

MCU Cortex M0 Cortex M0

Integrated Flash Memory

256KB -

Security Manager with AES128b and SHA256

Link layer

Host Layer (L2CAP, ATT, GATT, GAP)

Crypto integration (ECC508)

Antenna Design Chip

Antenna

Chip

Antenna

Dimensions 22.9 x 15.4

mm

20 x 13 mm

Pin out 39x

castellation 24x

castellation

Certification FCC, IC, CE FCC, IC, CE

Host Application

BLE API

BLE 4.1 Stack

Host MCU

Host Application

UART

BLE API

BLE 4.1 Stack

SPI/UART Driver

SAMB11

BTLC1000

23

BTLC1000 and SAMB11 ZR Modules

Fully certified modules

Small size 7.5 x 10 mm

70% smaller footprint than MR module

Integrates all BOM components

Including chip antenna except 32kHz XTAL

Based on XR SiP with castellated pins

SiP is 4.5x5.5mm ultra small LGA package

34pin + GND paddle

FCC/CE/IC certified

New SDK (v6.1) is available on ASF

ZR MR

www.microchip.com/wwwproducts/en/atbtlc1000-zr

www.microchip.com/wwwproducts/en/atsamb11-zr

24

IS1870 / 71 Series BM / RN Module

BM70/ RN4870

BM71/ RN4871

BLE 4.2 SoC IS1870 IS1871

Integrated Flash Memory

256KB 256KB

AES128b

Link layer

Host Layer ( L2CAP, ATT, GATT, GAP)

Services/Profiles

ASCII Command &

Scripting RN4870 RN4871

Antenna Design Chip Antenna Chip Antenna

Dimensions 22 x 12 mm / 15 x 12 mm

11 x 9 mm / 8 x 6 mm

Pin out 33x 17x

Certification FCC, IC, CE, MIC, SRRC, KCC, NCC

FCC, IC, CE, MIC, SRRC, KCC, NCC

Host MCU

UART

Host Application

BLE 4.2 Stack

UART Driver

Optional

Wireless BLE Module

Certified module used as a turn key Add-On module

adding BLE 4.2 Connectivity to an existing system.

BM module: Transparent mode or binary command

RN module; ASCII based embedded scripting

BLE Mesh available

25

MICROCHIP WIRELESS SOLUTIONS

802.15.04 Zigbee Product

26

SmartConnect – Enabling Embedded 15.4 Solutions

SAMR21

MCU SAMR21 Series: 802.15.4 Microcontrollers

• ARM Cortex M0+ MCU w/integrated 2.4 GHz transceiver

• High level of integration

• Standalone and host-controlled operation

• Available as modules and as SiPs

AT86RF2xx Series: 802.15.4 Transceivers

• Sub-GHz and 2.4 GHz

• Controlled fully from MCU over SPI connection

• High level of MCU flexibility

• Available as modules and as chips

Inte

gra

tio

n

AT86RF MCU

Host

MCU/MPU SAMR21

MCU

Standalone MCU operation

Network processor operation

over serial interface

External Transceiver operation

27

ATSAMR21 Device Family Cortex M0+ with 2.4Ghz 802.15.4 Transceiver

Memories

64kB/128kB/256kB/768kB Flash

8k/16k/32kB SRAM

Peripherals

4-SERCOM Interfaces

I2C, SPI, and USART

4x16 bit timers

4-Ch 12-Bit ADC

Analog Comparator

Sleep Power Consumption

<150µA/MHz active (CoreMark® )

<4µA with RTC and Full RAM retention

Key Features

HW AES

Automatic external FEM control, Antenna Diversity

Capacitive Touch HW engine (PTC)

USB FS Host & Device

Phase Measurement Unit (PMU)

Package Options

(E) 32pin 5x5mm QFN, (G) 48pin 7x7mm QFN

SAMR21

CPU Core Cortex-M0+ @ 48MHz

Max PHY rate 250kbps (IEEE 802.15.4)

Frequency 2.4GHz

Stacks Zigbee / BitCloud , MiWi

Applications Lighting, Sensor Networks,

Home Automation

Interfaces SPI, UART

RF Tx/Rx peak 14mA/12mA @ 3.0V

Tx Pout +4dBm

Rx Sensitivity -99dBm

Sleep Mode <4uA (RTC+RAM)

Package 7x7 QFN48

5x5 QFN32

Power Supply 1.8V – 3.6V

Temp Range -40 to +125˚C

Availability NOW

http://www.atmel.com/products/wireless/802154/single-chip_solutions.aspx

28

SAMR30 Single-chip MCU with Sub GHz

Transceiver

A Cortex M0+ MCU + Sub-GHz

Transceiver in a single package! ATSAML21 + AT86RF212B

256 KB flash / 32KB RAM

8KB Low Power Mode Retained

RAM

USB Host and Device

Ultra Low Power Consumption 700nA Typical with RTC

Hardware AES crypto accelerators

Peripheral Touch Controller

High performance ADC and analog

peripherals for sensor nodes

IEEE® 802.15.4-2003/2006/2011

compliant

769-935MHz band support

5x5 32QFN or 7x7mm 48QFN Pkgs

MiWi P2P and Mesh in development

Complimentary module family with

certifications in development

App Code

Protocol Stack (ex. MiWi)

48MHz CortexM0+

12b ADC (8ch)

USB

SERCOM (4)

LP SERCOM

769-935MHz BPSK / O-QPSK Transceiver

RTCC/WDT

256KB Flash

32KB RAM

8KB LP-RAM

AES Crypto

16b Timer

Analog Compare (2x)

Configurable Custom Logic (4x)

Peripheral Touch Controller

Real Time Counter

29

AT86RF215 802.15.4 Dual Band Transceiver

Sub-GHz

Radio

2.4GHz

Radio

Baseband

Core 1

MR-FSK

MR-OFDM

MR-O-QPSK /

O-QPSK

Baseband

Core 0

MR-FSK

MR-OFDM

MR-O-QPSK /

O-QPSK

SPI

Interface

1.8v

DVReg

Battery

Monitor TX/RX Switch TX/RX Switch

AVReg AVReg RNG RNG

Crystal

Oscillator

Features

• Simultaneous dual-band

operation

• SPI interface to host MCU

• True Random Number

Generator

• Single Xtal Operation

Standards Supported

• IEEE 802.15.4TM-2015

• IEEE 802.15.4gTM-2012

• ETSI TS102 887-1

Single Chip 7mm QFN48 Package

30

AT86RF215 Device Family 2.4Ghz & Sub-GHz 802.15.4 / 802.15.4g Transceiver

Fully integrated radio transceiver

Covering 389.5-510MHz / 779-1020MHz / 2400- 2483.5MHz

Including:

• European band: 863-870MHz / 870-876MHz / 915-921MHz

• Chinese band: 470-510MHz / 779-787MHz

• North American band: 902-928MHz

• Korean band: 917-923.5MHz

• Japanese band: 920-928MHz

• World-wide ISM band: 2400-2483.5MHz

• Simultaneous operation of sub-1GHz and 2.4GHz transceiver

• Programmable TX output power up to +14.5 dBm @ 900MHz

• Receiver sensitivity down to -123dBm at 6.25kb/s MR-O-QPSK

• Low power supply voltage from 1.8V to 3.6V

• Separate 2kbytes RX and TX frame buffer

Supported PHYs • MR-FSK

• MR-OFDM

• MR-O-QPSK

• O-QPSK

• Proprietary

Package Options

48pin 7x7mm QFN

AT86RF215

PHY rates 6.25kbps - 2400kbps

Frequency Simultaneous 2.4GHz /Sub-GHz

Stacks

IEEE 802.15.4 MAC

Third Party wireless stack solutions

available

Applications Smart Energy - Ranging

Interfaces SPI, I/Q

RF Tx/Rx peak 62mA/28mA TX@14dBm

Tx Pout +14.5dBm typical at 900MHz

Rx Sensitivity Down to -123dBm @ 6.25kb/s

Sleep Mode 30nA

Package 7x7mm QFN48

Power Supply 1.8V – 3.6V

Temp Range -40 to +85˚C

Availability NOW

http://www.microchip.com/design-centers/smart-energy-products/wireless-communications

Variants AT86RF215 dual band

AT86RF215M SubGhz only

AT86RF215IQ IQ radio

31

Atmel 802.15.4 Stack Support

3rd party SW vendors provide

solutions on Atmel HW

Atmel solution has ZigBee

Golden Unit status

Atmel provides reference

applications

802.15.4-2003

-2006

-2011

ZigBee IP

Smart Energy

2.0

Home

Automation

Light Link

RF Platform

Network

Platform

Input Device

Smart Energy

1.x

OEM

Manufacturer

Specific

ZigBee RF4CE ZigBee PRO

Green

Power

...

Remote

Control

On request

6LoWPAN

Atmel BitCloud SDK

OEM

Manufacturer

Specific

lwMesh

OEM

Manufacturer

Specific

OEM

Manufacturer

Specific

Applications

ZigBee 3.0

ZigBee New Standard - Unification

32

MICROCHIP WIRELESS SOLUTIONS

LoRA Product

33

LoRa Roadmap Strategy

Network Co-Processor (NCP) Modules – Certified & Available Now!

• LoRaWAN stack running on module

• Application running on external MCU

• Easiest path to integrate LoRaWAN

Open Modules or Discrete MCUs – Available Now!

• Application & LoRaWAN Library merged inside module

• Eliminates external MCU

• Delivered via MPLAB + Microchip Code Configurator (MCC)

• Also supports 1000’s of MCUs for discrete designs

ARM-based SiP – 2Q 2018

• Cortex M0+ MCU + Radio

• Atmel Studio + ASF LoRa Library

• Low power Sleep

• Smallest form-factor

• Easy to use Modules

• LoRa Alliance Certified

• Regulatory Certified

• Custom Code Development

• Reduce Cost and Size

ARM-based Module – 2Q 2018

• SiP feature set in module form-factor

• Size & cost optimized

• Enhanced crypto/authentication options SAMR--M

34

Single-chip MCU with LoRa™ Transceiver

Highly Integrated Solution

Cortex M0+ MCU & LoRa™ Radio

in a compact BGA package!

Family of cost optimized variants:

64 / 128 / 256 KB flash

USB (SAMR34) & non-USB (SAMR35)

Ultra Low Power Consumption

<< 1 uA sleep with RTC & LPRAM retention

Backup RAM retention for frame

counters

Hardware AES crypto accelerators

True Random Number Generator

High performance ADC and analog

peripherals for sensor nodes

169, 433, 780, 868 & 915MHz band

support

6 x 6 x 1.2 mm 64-ball TFBGA package

Free access to Microchip-maintained,

Alliance-certified ‘Golden’ LoRaWAN stack

Complimentary module family with

certifications

App Code

RF Stack

48MHz CortexM0+

12b ADC (8ch)

12b DAC (2ch) USB Device

SERCOM (4)

LP SERCOM

LoRa/FSK Radio

RTCC/WDT

128KB Flash (256KB Options) 16KB RAM

(32KB

Option)

4KB LP-RAM

AES Crypto

16b Timer

CCL

True RNG

Sampling: 2H 2017

MICROCHIP CONFIDENTIAL - INTERNAL USE ONLY

35

MICROCHIP SECURITY SOLUTION

ECC508 & ECC608

36

Layer 1: Physical

Layer 2: Link

Layer 3: Network

Layer 4: Transport

Layer 5: Session

Layer 6: Presentation

Layer 7: Application

802.11b/g/n

TLS/SSL

TCP/UDP

IP, ARP, DHCP

Application

HTTP, FTP, SMTP,

SNMP

Microchip Wi-Fi® Devices Security Level

CryptoAuthenticationTM

ATECC508A/608 bundled

with WINC1500 / WINC3400

Authentication used for

Anti-cloning, Ecosystem

Management, Storage of

Keys/Certificates

On-Chip (WINC1500 / 3400)

TLS 1.2 (SSL)

Ensures Data Encryption

“Coming out” of the LAN, also

Known as Internet Security

On-Chip (WINC1500 / 3400)

WEP, WPS,

WPA2 Personal

WPA2 Enterprise

Ensures Data Encryption

within the LAN to avoid

intrusion

Offering Best-in-Class Security for IoT Edge Nodes

IoT Layered Security Solutions

37

ECC508A ECC608

Key Features & Use Cases

Node / Accessory Authentication

Network Security

Node to Cloud Authentication and

On-Boarding

Key Provisioning

Node / Accessory Authentication

Network Security

Node to Cloud Authentication and

On-Boarding

Key Provisioning

Support minimum TLS1.2

cryptography

Secure Boot

LoRaTM Security

Crypto Algorithms NIST SHA256;

ECC P256

NIST SHA256;

ECC P256, AES

Non Volatile Memory 8.5 Kbits 8.5 Kbits

I/O Interface I2C, Single Wire I2C, Single Wire

Packages

UDFN8, SOIC8, SOT23-3 Package

and pin to pin compatible

UDFN8, SOIC8, SOT23-3 Package

and pin to pin compatible

Availability Production Production

ATECC508A / ATECC608A Security ICs

Addition of AES

accelerator

Allow security for small

microcontrollers

38

ATECC508A / ATECC608A Security ICs

Crypto devices

Standard

devices

Active shield over entire chip

39

Crypto Acceleration

ATECC608A versus Arm® Cortex® -M0+ MCU running

at 48 MHz

0

1000

2000

3000

4000

5000

6000

ECC256 Ken Gen ECDSA Sign ECDSA Verify ECDHE Key Agree

H/W vs S/W benchmark

ATECC508A Cortex M0+ @ 48 MHz

milliseco

nd

s

y

40

Secure Factory Provisioning

Private key generated entirely inside

the ATECC608A

Solid randomness

NEVER readable

NEVER known by anybody

Certificates generated by world-

class HSMs at Microchip

Protected in State-of-the-art

Secure Facilities

24/7 surveillance

No special equipment or procedures

required in the 3rd party

manufacturing sites

41

Security Use Cases

42

PUBLIC CLOUD EXAMPLES & APPLE HOMEKIT SUPPORT

43

Cloud service example using

Amazon Web Services

IoT OEM AWS Account

Customer Specific

Production Signers

Customer Specific

Production Signers

Root of Trust

IoT OEM OEM CA

Device #NN

Amazon DASH Button

44

Google IoT Core Use Case

ECDSA

Sign

Signature

ECDSA

ATECC608A

How the Microcontroller

communicates to the secure

element and JWT created?

CryptoAuthLib library

Signature

ECDSA

Appended to

JWT Token

32-bit Microcontroller

Signed

Send

Part of the JWT token

Token is hashed

Public

Key

Google IoT Core Device Management

Signed

45

Total System Solution Afero – Secure IOT Platform

ATSAMG55 Cortex-M4+ MCU

Executes Client and interfaces to

Communication device

ATWINC3400 Single Chip WiFi \ BLE

802.11b\g\n WiFi Network Controller

BLE4.1 Modem

ATECC508A Crypto Authentication

Key Storage

Network Authentication \ TLS Support

Afero Modulo Hardware

46

Apple HomeKit Support

HW is Based on CEC1702 (ARM Cortex M4F) + WINC1510 (Wi-Fi module)

Microchip Wi-Fi SDK is fully certified by Apple (R8 version of spec)

Development will be done on SecureIoT1702 Board + WINC1510 CLICK Board

Dramatic reduction in execution time in Homekit specific events

Power consumption on par with BLE while retaining Wi-Fi benefits

https://developer.apple.com/homekit/

WINC1500 WiFi

MFi AuthIC

WINC1510 MR210PB (Certified module)

CEC1702 ARM M4 @

48MHz

480KB SRAM

MFi AuthIC

MCU

Wi-Fi

HomeKit App

HomeKit SDK Library

Customer App

47

What Makes Our Solutions Different… and Successful

Full Documentation

IoT Security

Certified

Local Support Scalability

Software Standards and Alliances

Turn Key Solutions Robustness