© 2009 IBM Corporation

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© 2009 IBM Corporation

제품소개서

2

Scale out / distributed computing

x3550 M2

x3650 M2

x3450

x3850 M2

Clusters, HPC,Virtualization,

Web 2.0& Cloud

High density

Large symmetrical multiprocessing (SMP)

x3950 M21-4 nodes

x3200 M2x3100

Sca

le u

p /

SM

P c

om

pu

tin

g

x3755

x3655

x3455

iDataPlex

BladeCenterS, E, H, T, HT

HS22/12/21/21XMLS22/42JS12//22QS22

x3250x3350 HS22HS22

dx360 M2dx360 M2

x3400 M2/ x3500 M2

Cluster 1350

3

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4

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™

5

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6

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7

•

- - -

• • • •

• –• •

• • –•

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8

(Advantage IBM)

64 BitsData

2 BitsSpare

6 BitsECC

72 Bit DIMM

(Advantage IBM)

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9

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10

’

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11

™

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12

Xeon/Opteron4Socket

–

x3850 M2

x3950 M2(8way)

x3950 M2(16way)

x3950 M2(8way)

13

Serveraid MR10M(Option)Serveraid MR10M(Option)

–

SServeraid MR10K(Option)erveraid MR10K(Option)

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• • •

• •

•

•

• • • •

• •

• •

65nm 45nm

1.9B Transistors

TRANSISTOR DENSITY UP 100%

TRANSISTOR SWITCHING SPEED UP 20%

LOWER TRANSISTOR POWER BY 30%

LOWER GATE OXDE LEAKAGE PWR BY 10X

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기존 Tigerton CPU 대비 약 120,000 tpmC( 약 20%) 성능향상(X7350 2.93GHz 4CPU , X7460 2.66GHz 4CPU 기준 )

Intel Xeon

Tigerton CPU(7300 Series)

Intel Xeon

Dunnington CPU(7400 Series)

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Tigerton

Dunnington

Tigerton

Dunnington

Tigerton

Dunnington

Tigerton

Dunnington

0

200,000

400,000

600,000

800,000

1,000,000

1,200,000

1,400,000

–

20

0

15,000

30,000

45,000

SA

PS

x3950M2 x3950M2 Sun x4600M2 HP DL785 IBM x3850M2

HP DL580G5 Dell R900 IBM x3650M2 HP DL380G6 FSC RX300S5

As of March 17th 2009, http://www.sap.com/solutions/benchmark/sd2tier.epx?num=100 /

64-core

X7350

48-core

X7460

32-coreAMD 8384

16S 8 Sockets 4 SocketsNehalem2 Sockets

24-core X7460 8-core X5570

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► HP DL 580 대비 10% 높은 vCON score

-> 가상화 통합시 10% 이상의 성능 우월

► HP 대비 동일한 사양에서 10% 적은

전력 소모

► HP 대비 약 30% 의 Watt 당 성능치 우월

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