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I+D en el CNM/IMB para futuros aceleradores. Update from Santiago meeting, October 2008. Manuel Lozano. IFCA. CNM Clean Room expansion. From 1000 to 1500 m2 Still waiting for some equipments relevant for advanced packaging Wafer grinder CMP - PowerPoint PPT Presentation
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Haga clic para modificar el estilo de texto del patrónI+D en el CNM/IMB parafuturos aceleradores
Manuel Lozano
Update from Santiago meeting, October 2008
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
CNM Clean Room expansion From 1000 to 1500 m2 Still waiting for some equipments relevant for
advanced packaging Wafer grinder CMP Wafer alignment and bonding system (3D packaging)
Clean room operational, but not 100%
IFCA
Not ready
yet
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
New equipment: Plastic Laser-sintering system EOS FORMIGA P 100 (Germany) Very fast prototyping From CAD to piece in a couple of
hours Effective building volume:
20 cm x 25 cm x 33 cm Resolution ~0.1 mm 20 mm height/hr
Very interesting to test new ideas either at reduced scale or actual size or to make functional pieces
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
New equipment: Plastic Laser-sintering system
Very complex pieces Only limitation, no closed
cavities Different materials
available
Examples: Springs Nut and bolts Hinges Micropipes
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
IR transparent detectors
In collaboration with IFCA Mask finalized
12 different detectors Common parameters: active area= 1.2x1.5 cm2 circular window in the back
metal (r=0.5 cm) 256 readout strips with 1.5 cm
length 9 guard rings and scribe line
with n-well 6 detectors have been
completed with floating intermediate strips in order to improve spatial resolution using the capacitive charge division principle.
IFCA
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
IR transparent detectors
Processing run started
IFCA
no5um17.5um12
no5um12.5um11
no3um15um10
no5um15um9
no10um15um8
no15um15um7
15um17.5um6
15um12.5um5
13um15um4
15um15um3
110um15um2
115um15um1
Intermediate stripsMetal widthp+ strip width
no5um17.5um12
no5um12.5um11
no3um15um10
no5um15um9
no10um15um8
no15um15um7
15um17.5um6
15um12.5um5
13um15um4
15um15um3
110um15um2
115um15um1
Intermediate stripsMetal widthp+ strip width
Si
n+
p+ p+p+p+ p+
15 μm strip width 5 μm metal width Intermediate strip
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
IR transparent detectors
Will be tested at IFCA using ALIBAVA System with laser
IFCA
I0 70% I0 49% I0 34% I0
IR Laserpseudo track
IR light is partially absorbed by silicon detectors Ф≈1mm open in the Al allows beam-through
Si
n+
p+p+
p+p+
Si
n+
p+p+
p+p+
Si
n+
p+p+
p+p+
Si
n+
p+p+
p+p+
Si
n+
p+p+
p+p+
Si
n+
p+p+
p+p+
Partially funded by Spanish Acces to Large Facilities: GICSERV
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Medipix2
Diodes 2Dspreading
Test structures
Atlas pixel
3d pads
strips
Long strip
10x10 matrixMOS
Test for SEM
3x3 matrix
Pilatus
3D detector technology
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
3D detector technology
Success with Medipix type pixel sensors
Now we are designing of a new mask set for ATLAS pixel sensors
Work done in the framework of RD50 collaboration.
Possibility of developing a prototype of B-layer for ATLAS upgrade with 3D pixels
0.5 m2, 2500 chips, 250 wafers CNM will try to get the contract
Partially funded by Spanish Acces to Large Facilities: GICSERV
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
ALIBAVA: A readout system for microstrip silicon sensors
System finished 20 units already distributed
New fabrication batch will start soon Upgrade for test beam telescope Upgrade for ethernet connectivity
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Bump Bonding In collaboration with IFAE Bump bonding already working
Medipix and ATLAS pixels successfully bonded
Now working to increase yield and qualify the technology
SET/Süss FC150 machine 1 micron placing accuracy In-situ reflow
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Trenched detectors
Work started in collaboration with IFAE (Cristobal Padilla)
Trenches used to reduce the dead area at the edge of the sensor (also named edgeless, slim-edge, ...)
First application for ATLAS pixels Can be extended to strips
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
•High resistivity polysilicon used to fill the trenches to assure mechanical strength•Thermal oxide inside trenches to assure insulation.
p+
p
10um30 um150um
Al
Side cut (D
RIE or D
iamond saw
)
polySiO2
n+p+
n+ n+
50 um 6um 80um
p-stopPixels
p+
Si3N4
guard
p+
UBM
300um
Δ 30um
Trenched detectors Initial configuration
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Simulation The trench isolates the
depletion area from the damaged cut.
The equipotential lines accumulates at the implant decreasing the breakdown voltage.
However, it is still possible to over deplete the detector.
Accumulation of equipotential lines
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Trench + diamond saw cut
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Trench filled with polysilicon
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
ATLAS upgrade readout electronics
TECHNOLOGIES FEATURESKEY PARAMETERS
fT (GHz)
β (target)
VCE0
(V)
SGB25VD Low cost 50 190 4.5
SG25H1 MAIN TECHNOLOGY 190 200 1.9
SG25H3 Alternative 120 150 2.3
3 transistor types from SGB25VDtechnology (30, 50, 80 GHz)
Minimum transistor in tech. SG25H1 (0.17 μm2)
2 different transistors from tech. SG25H3 (0.17μm2 & 0.35μm2)
Study of 3 tecnologies 0.25 μm SiGe BiCMOS from IHP (Germany)
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
GICSERV
Easy access through the Spanish “Access to Large Facilities” Program: ICTS GICSERV
Last call January 2009 70 applications, 50 accesses
7 projects approved (1 rejected) in detector technology for HEP
3D medipix-type detectors. Diamond (UK) Stripixels. Laaperanta and BNL (Finland and USA) Thin pixel detectors. Univ. Santiago Thin strip detectors. IFCA Atlas pixels with slim edge. IFAE Increased efficiency detectors. Univ. Liverpool (UK) Bump bonding for DEPFETS. MPI Halbleiterlabor (Germany)
5 projects in 2008, and 3 in 2007
ILC Meeting. Barcelona, May 2008
I+D en el CNM/IMB para futuros aceleradoresManuel Lozano
Conlusions
Transparent detectors processing. Bump bonding working Started activity in pixel and strip slim-edge
detectors ALIBAVA system finished and distributed Activity in ATLAS upgrade evaluating BiCMOS
technologies
GICSERV working satisfactory