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INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT, & OEM HARDWARE SILICON-GUIDE-ALTERA MARCH 2013

INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

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Page 1: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

INTERCONNECT SOLUTIONS FOR

SILICON TEST,DEVELOPMENT,& OEM HARDWARE

SILICON-GUIDE-ALTERA

MARCh 2013

Page 2: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

SILICON-GUIDE-ALTERA

Reference Designs• Tested, reliable, standard high speed interconnects and

“drop-in-your-design” Final Inch® solutions for decreased design costs and time-to-market

• Break Out Region (BOR) PCB designs that save design, development, and validation time and resources

• Final Inch® design tools predict real-world performance expectations in real-world signal integrity applications. Visit: www.finalinch.com

Development Board Design• Samtec assistance with

development and expansion board design such as the 75Ω 3G protocol board in collaboration with Brioconcept and Gennum

• For more information on this specific application contact [email protected]

• Online and personal signal integrity support for customers using the boards and board connectors

Chip Verification• Cable and interconnect solutions

that are typically less expensive and require much less board space for a single channel

• High speed, rugged test probes, and isolated cable assemblies

• DesignVision Award winner for Bull’s Eye™ test point

ASIC Prototyping• Application specific

integrated circuit design and development boards

• For more information on this specific application contact [email protected]

ARM® Hardware Platforms

For more information visit www.samtec.com/armDevelopment boards not available through Samtec. For more on development boards visit www.arm.com

SILICON BOARD DESIGNS

Samtec Edge Rate™ HSSTP Series for ARM® High Speed Serial Trace Port Architecture www.arm.com/products/solutions/hsstp_spec.html

HIGH SPEED INTERCONNECT SOLUTIONS

ARM® Versatile Express V2F-1XV5 Logic Tile

Image courtesy of SYNPLICITY

Once high speed silicon has been integrated into a package, Samtec can assist with chip testing, verification, development board design and reference design assistance.

finalinch.com

®

Samtec SEARAY™ SEAF Series

MARCh 2013

ARM® has again chosen Samtec to supply the high performance connectors for its new prototyping platform, Versatile Express. ARM® used Samtec for its previous prototyping family, Versatile, with great success. Samtec high performance connectors used in these platforms include SEARAY™, Edge Rate™ and Q Strip®.

Versatile Express and Versatile are fully validated hardware platforms for early prototyping and development.

• Early access to the latest ARM® IP, including processors, AMBA® interfaces and PrimeCell blocks

• Fast environment for application development for a number of operating systems allows high speed software development, debugging and profiling early in the development cycle

• Risk reduction in ASIC designs by prototyping custom hardware in FPGAs and connecting it to real processors and peripherals

Versatile Express family development platform provides an ultra fast environment for prototyping the next generation of System-on-Chip designs, such as Cortex-A9 Quad Core. Through a range of plug-in daughterboards, hardware and software applications can be developed and debugged.

Versatile family development platform provides developers with prototype hardware. They are based on robust high density connectors, which allow several AMBA AHB™ or AXI™ buses to be routed between boards, also called “tiles.”

Samtec Q Strip® QSH Series connector

Images courtesy of ARM®

ARM® Versatile Express Cortex™-A9 MPCore

Samtec FFSD Series

ARM® Versatile Platform Baseboard for ARM1176JZF-S

ARM® Versatile Core Tile for the ARM11 MPCore

Samtec Q Strip® QSH Series to stack logic tiles

®

Samtec SEARAY™ SEAF Series

Page 3: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

For more information visit www.samtec.com/alteraDevelopment boards not available through Samtec. For information on development boards and mezzanine cards by Altera® visit www.altera.com

INTERCONNECT STACKING SOLUTIONS

The HSMC connectors defined by the specification are based on the 0.5mm pitch Q Strip® (QSH/QTH Series) high speed board-to-board connectors from Samtec. Many Altera development kits feature host boards with the HSMC connectors. The host board connector is Samtec part number ASP-122953-01 (a modified QSH Series). The mezzanine card connector is Samtec part number ASP-122952-01 (a modified QTH Series).

These host boards are used by FPGA designers to prototype hardware

High Speed Mezzanine Card Connectors & Altera Development Kitsdesigns. The benefit to customers is two-fold. First, a variety of mezzanine cards are being created by Altera and other hardware providers. Second, customers can create their own HSMC solutions and then interface those custom mezzanine cards to several different FPGA host boards. For a complete listing of Altera daughter cards to expand the functionality of other development platforms (including those utilizing the HSMC Specification) go to: www.altera.com/products/devkits/kit-daughter_boards.jsp

The Altera® HSMC defines the electrical and mechanical properties of a high speed mezzanine card interface. This specification standardizes the way mezzanine cards communicate and connect to host boards. By taking advantage of the high-performance I/O features in today’s FPGAs, manufacturers can build a single mezzanine card that interfaces to multiple host boards. They can also build a host board that can leverage many different, pre-built, mezzanine cards.

Altera Arria II GX FPGA Development Kit Arria® II GX delivers a complete system-level design environment that includes Samtec’s Q Strip® connectors (QSH/QTH Series).

Altera Stratix IV GX FPGA Development Kit Stratix® IV GX features a -C2 (fast) speed grade production silicon device and includes Samtec Q Strip® connectors (QSH/QTH Series).

Samtec has assisted in the development of many Semiconductor Application Designs with most major semiconductor companies. These designs are based on Samtec Q Strip® and Q Pairs® product families.

ALTERA HSMC (High Speed Mezzanine Card)

Many Altera FPGA kits and all Samtec connectors are available through Arrow®

®

Host board connector is Samtec part number ASP-122953-01. Mezzanine card connector is Samtec part number ASP-122952-01.

Host board connector is Samtec part number ASP-122953-01. Mezzanine card connector is Samtec part number ASP-122952-01.

Images courtesy of Altera®

www.arrownac.com/offers/altera-corporation/devtools

ASP-122952-01

HDR-128291-xxASP-122953-01 HDR-131992-xx-HQDPfinalinch.com

®

FPGA-BASED EVALUATION KITS & DEVELOPMENT BOARDS

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HIGH SPEED

Bull’s Eye™ High Performance Test Points• Eliminate costly high performance SMA connectors• SMA performance for 10% of the cost• Cheaper per pin• Space saving• Allows for a smaller board, fewer layers• DesignVision Award winner

High Speed Test Probes• PCI Express® RF system

(PCRF Series)• 50Ω 25 AWG, low loss

microwave coax cables or RG178 and RG316 cables

• High density pogo pin interface for high cycles (ATEP Series)

• Q Series® system (EQRF Series)

Standard 50Ω & 75Ω PCB Connectors• MHF1 and MHF3• SMA, SMB, MCX, MMCX, BNC, TNC and

N Type connectors• Quick turnaround on finished cable assemblies• RF Cable Builder, www.samtec.com/rfbuilder

SILICON TEST, DEBUG & DEVELOPMENT SOLUTIONSSamtec offers a variety of high speed test products, including an array of Bull’s Eye™ test points. These high speed solutions provide optimum test results and therefore, selling features for manufacturer review.

Page 5: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

SILICON AND REFERENCE DESIGN

High Speed Strips• Q Rate® - Slim body ground

plane sockets• Razor Beam™ - High speed

hermaphroditic socket/terminal

• Q Strip® - High speed ground plane sockets

• Edge Rate™ - Rugged high speed sockets

Right Angle & Edge Mount• Q2™ - Rugged ground plane sockets• Q Rate® - Slim body ground plane sockets• Q Strip® - High speed ground plane sockets• Edge Rate™ - Rugged high speed sockets

Rugged I/O• USB - 3.0 Super-Speed signals now available!• HDMI™ - High-Definition Multimedia Interfaces • Eye Speed® - Universal external serial cable• Mod Jacks - Single or ganged multi-port jacks

High Density Arrays• 0,80mm pitch SEARAY™ - Open pin field array• 0.050" (1,27mm) pitch SEARAY™ - Open pin field array• LP Array™ - Low profile array• DP Array® - Differential pair array

DEVELOPMENT BOARDS FOR OEM EVALUATION

®

TM

TM

Low Profile Array

®

Samtec offers co-development and co-marketing opportunities with all semiconductor companies, helping to streamline the way FPGAs and mezzanine cards communicate with the manufacturer’s host board.

Page 6: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

High Speed Connectors• Choice of 0,50mm,

0,635mm and 0,80mm pitch

• Low profile and elevated board stack heights

• Single-ended and differential pair designs

• Right angle and edge mount orientations available

Discrete Wire• Standard or high power versions• Variety of ruggedizing options• Available as components

or assemblies• Discrete Wire Solutionator®

coming soon!

Micro Backplane• Parallel, perpendicular and coplanar mating• Sockets for Micro TCA, Serial ATA and other high speed applications• Optional locking screws/holes and guide posts/holes• Standard .062" (1,60mm) and .093" (2,4mm) mating cards, or

variable card thicknesses

Production Test Assemblies• Bull’s Eye™ system

eliminates costly SMAs

• Rugged low cost test system (IRM1/ICT1 Series)

PERPENDICULAR APPLICATIONS

TOTAL INTERCONNECT SOLUTIONS

PROPRIETARy OEM HARDwARE DESIGNS

®

TM

TM

Page 7: INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT ...suddendocs.samtec.com/literature/samtec_silicon_guide-altera.pdf · INTERCONNECT SOLUTIONS FOR SILICON TEST, DEVELOPMENT,

Discrete Wire• Standard or high power versions• Variety of ruggedizing options• Available as components

or assemblies• Discrete Wire Solutionator®

coming soon!

High Speed Flex• Easy customization of cable

lengths, pin counts, connector heights, etc.

• Sudden Circuits® Solutionator® www.samtec.com/solutionator

High Speed Cables• 50Ω and 75Ω single-ended;

100Ω differential pair• Variety of pitches and cable lengths• Card edge, Edge Rate™, SEARAY™

and Q Strip® terminations• High speed cable assemblies,

Panel and I/O, application specific (ASP)• High Speed Cable Solutionator®,

www.samtec.com/HDRSolutionator

PROPRIETARy OEM HARDwARE DESIGNS

TM

TM

®

I / O S Y S T E M

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1-800-SAMTEC-9 (USA & Canada) • Tel: 812-944-6733 • Fax: 812-948-5047 • E-mail: [email protected]

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