IT General Technology Series-Server.pdf

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IT General Technology——Server

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HUAWEI TECHNOLOGIES CO., LTD. Huawei Confidential Page 2

Chapter 1 Server Overview

Chapter 2 Components and Key Technologies

General Knowledge About Servers

Chapter 3 Component Configuration

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What’s Server?

Server

The server is a high-performance computer, as the network nodes, storing and

operating 80% information of network, therefore, it’s called the soul of the network

There is a vivid metaphor: the server is like the post office switches, but the computer,

laptop, PDA, mobile phone and other fixed or mobile terminals like telephones

scattered in the family, offices, public places.

Request

客户机

Server

Database

Server and

PC difference？

File

Data Query

Respond

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Basic Concept

A Server is a high-performance computer and serves as a network node and hub. It stores and processes 80% of data and

information on the network. It also provides information services for multiple network clients at the same time. For this

reason, the server is also called the soul of the network.

RASUM Feature

Reliability

• Reliability is a feature used to ensure data reliability and consistency. By using this feature, a server can ensure

data integrity and generate warnings for hardware errors. The feature involves hardware redundancy, warnings,

and redundant array of independent disks (RAID) technologies.

Availability

• Availability is a feature indicating that a server is available at any time and can be used immediately.

• This feature allows a server to quickly recover from system errors, and supports hot swap for key components

and replacement of faulty components.

Scalability

• Scalability is a feature indicating that a server can be expanded.

• This feature increases the memory, CPU, and disk capacities, and supports multiple mainstream operating

systems (OSs).

Usability

• Usability is a feature indicating whether a system is easy to operate. For example, whether the user navigation

system is complete, whether the chassis is designed for better user experience, whether key recovery functions

are allowed, whether OS backup is supported, and whether sufficient training and support are provided for users.

Manageability

• Manageability is a feature providing the following two functions: supports efficient management to reduce

manpower and material resources and provides simple infrastructure to streamline management.

Basic Server Concept and RASUM Feature

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Server Category-1

By instruction set used by CPUs

• Complex Instruction Set Computer (CISC)

1. Intel x86 series CPUs and compatible CPUs

2. AMD full series CPUs and Intel series CPUs excluding the Itanium series

• Reduced Instruction Set Computing (RISC)

1. Minicomputer (from IBM, HP, and SUN); (2) Dedicated platform and system; (3)Application-intensive processing

system

The mid- and high-range servers generally use the RISC-based CPUs, especially all high-range servers use RISC-based

CPU.

• Explicitly Parallel Instruction Computing (EPIC)

EPIC permits microprocessors to execute software instructions in parallel. It is used by the Intel Itanium and Itanium 2

series CPU.

By appearance • Tower server: A tower server is a common server built in an upright and horizontal chassis. The tower server can be

used in common office environments. It adopts a large chassis to offer large expansion space for internal hard disks,

redundant power supply units (PSUs), and redundant fan modules, and provides excellent heat dissipation.

• Rack Server: A rack server is a server mounted on a rack. The rack server uses the standardized rack dimensions for

traditional telecom equipment rooms. The standardized width is 19 inches, and the height is calculated by the unit of U.

1U is 1.75 inches (44.45 cm = 1.75 x 2.45 cm).

• Blade server: A blade server contains multiple server blades that are inserted in a chassis. Generally, a chassis can

house 10 to 20 server blades. Each server blade works as a system board.

By number of CPUs • Servers can be categorized into three types: single-socket servers, dual-socket servers, and multiple-socket servers. The

number of sockets indicates the number of CPUs supported by a server. The number of cores indicates the number of

chips that are packaged into a CPU.

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Server Category-2 By application level

• Entry-level server: is the most basic low-end server. The entry-level server uses one dual-core CPU and supports redundancy for some

hardware devices. The server is set at a market price as a high-end PC. It can be connected to about 20 terminals. It applies to scenarios

where file printing and simple database servers are required by users in small-size networks.

• Workgroup server: is a low-end server. The workgroup server uses two dual-core CPUs and allows redundancy for more hardware

devices. It provides comprehensive functions and features excellent manageability and easy maintenance. The server can be connected to

about 50 terminals and is set at a market price as two or three PCs. It applies to scenarios where multiple service applications in small- and

medium-size networks and local application demands in large-size networks are required.

• Department-level server: is a medium-range server. The department-level server uses two dual-core CPUs, allows redundancy for more

hardware devices, and provides better configuration. The server can be connected to 100 terminals and is set at a market price as five PCs.

It serves as an enterprise IT infrastructure and applies to scenarios where rapid service expansion and timely online upgrades are required

for small- and medium-size enterprise networks.

• Enterprise-level server: is a high-end server. The enterprise-level server uses four or more than four dual-core CPUs, provides

independent dual-PCI channels, memory expansion board design, and high memory bandwidth. It supports hot swappable large-capacity

hard disks and high-power PSUs. It also offers comprehensive functions for monitoring and managing circuits and excellent fault-tolerant

capability and scalability. The server can be connected to hundreds of terminals. It applies to scenarios where mass of data, rapid processing

speed and high reliability are required for finance, securities, transportation, communication, and large-scale enterprises.

By application scenario: file server, Enterprise Resource Planning (ERP) server, web server, File Transfer

protocol (FTP) server, database server, mail server, video server, media server, and game server.

Internet File/Print server

Office computer

Internal Web system

Mail system

Database system

……

Communication server

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Server Category-3

Tower Server (Huawei has no such product)

Tower servers have vertical and horizontal structure type and can be placed in a regular

office environment(like traditional PC).

The tower server density is a low and single-processor system(a small part of a dual-

processor system). System power supply and fan are generally monogamous, non-

redundant and low reliability

Rack Server

The rack uses standard structure of the telecommunication room, width is19 inches,

height measured unit Unit, "U" is 1.75 inches, that is 4.445cm

Generally, there are 1U, 2U, 4U and 8U types, 2U and 1U support the most shipments,

4U and 8U are No.2 shipment.

Blade Server

Blade Server has higher density than rack server. It includes blade servers, blade chassis

(including backplane) and a rear card. Different vendors have different height chassis. Various

vendors chassis are 19 inches wide and can be installed in a standard 42U cabinet.

A single chassis can be inserted varying amounts (8 to 20) "blade“, Every piece of "blade" is

actually a server motherboard.

In the current market, blade servers mainly include HP BL460c Gen8, IBM HS23, Dell M820,

Huawei BH622 V2.

http://configure.us.dell.com/dellstore/config.aspx?oc=bect32&model_id=poweredge-t320&c=us&l=en&s=bsd&cs=04&

http://appserver.lenovo.com.cn/product_detail.aspx?gdsId=A0500017181

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Server Benchmark Test System Two bench test organizations: Transaction Processing Performance Council (TPC) and Standard Performance

Evaluation Corporation (SPEC)

Benchmark tests for four major applications:

(1) High-performance computing (HPC): Linpack… (2)Online transaction processing (OLTP): TPC-C…

(3) Web service: SPEC Web2005, TPC-W (4)Java application server: SPECjbb2005

Dedicated benchmark tests——Oracle benchmark test and SAP benchmark test

Key server benchmark test specification: TPC-C

• Founded in the 1990s, the TPC is a worldwide organization that establishes benchmarks for the industry. With these benchmarks, enterprises

start to consider rational factors except for subjective factors when purchasing servers.

• TPC-C is an online transaction processing benchmark. TPC-C performance is measured in new-order transaction per minute. The primary

metrics are the transaction rate (tpmC).

• TPC-C simulates an enterprise management information system (MIS) and ERP system environment where the online transaction processing

capability of a server is tested.

Key server benchmark test specification: SPEC

• The SPEC is a worldwide authorized organization that provides third-party application performance tests. It is founded to

establish, maintain and endorse a series of evaluation standards for server application performance. Currently, the SPEC

provides the following benchmark tests:

• CPU performance: SEPC CPU2000 and SPEC CPU2006

• Web server: SEPC Web2005

• HPC: SPEC HPC2002 and SPEC MPI2006

• Java application: SPEC jAppServer2004, SEPC JBB2005, and test indicators for graphics, networks, and mail servers

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The server hardware includes CPUs, DIMMs, chipsets, I/O devices (such as RAID cards, NIC cards, and HBA

cards), hard disks, and a chassis (including PSUs and fan modules).

Server Hardware

Front view Rear view

1. PSUs (1+1 redundancy) 2. PCIe slot

3. Onboard NIC card 4. HDD/SSD

5. Rear USB port 6. Rear DB15 VGA port

7. BMC management network port 8. RJ45 RS232 port

1. DVD-ROM drive 2. DB15 VGA port

3. LED panel 4. Front USB port

5. Counter-rotating fan modules 6. HDD/SSD

2 PSUs

8 PCIe slots

4 CPUsBuilt-in RAID card

slot (PCIe x8)+BBU

6 fans

8 memory acceleration

cards, supporting up to

8 x 8 DIMMs

Top view

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Intel Mainboard

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CPU Overview Definition: A central processing unit (CPU) is the most important part of a computer. It consists of an

arithmetic logic unit (ALU), controller, and register.

Multi-core CPU: A multi-core CPU contains multiple cores in a package. For example, a dual-core CPU

contains two cores, and a quad-core CPU contains four cores. Using multi-core servers can improve

computing efficiency and prolong the investment lifecycle for servers.

Key indicators: frequency, cache, front side bus, and power consumption

1. Frequency: The dominant frequency also refers to the clock frequency, which is measured in MHz or GHz that

indicating the frequency at which a CPU computes and processes data. The CPU dominant frequency is calculated

by the following equation: CPU dominant frequency = External frequency x Clock multiplier factor. The external

frequency indicates the CPU reference frequency and is measured in MHz. It determines the operating speed of the

entire mainboard. The value of the clock multiplier factor ranges from 1.5 to the infinitely large value, with a difference

of 0.5 between two consecutive values. A multiplier allows the system bus to work at a quite low frequency, which

improves the CPU speed.

2. Cache: The structure and size of a cache have great impact on the CPU speed. Because a CPU needs to read the

same data block repeatedly, an increase in the size of a cache can greatly increase a CPU's reading data hit rate.

Therefore, the CPU does not need to access data in the memory or hard disks, which improves system performance.

3. Front side bus (FSB): The FSB frequency refers to the bus frequency, which affects the speed of direct data

exchange between the CPU and the memory. The data bandwidth is calculated by the following equation: Data

bandwidth= (Bus frequency x Data bit width)/8. For example, for the Intel Xeon Nocona 64-bit CPU, the FSB frequency

is 800 MHz, and the data bit width is 64. Based on the equation, its maximum data transmission bandwidth is 6.4 GB/s.

CPU data sources: CPU Cache Memory Hard disk; CPU accesses the cache

first, then memory, and finally hard disk for data.

CPU naming (take the Intel CPU as an example)

For example, the XH310 V2 uses the E3-1230 CPU.

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Strict data requirement Intel® Xeon ® E7-8800/4800/2800 series processor

Intel® Xeon ® 7500 series processor

Maximizes performance, reliability, and scalability.

Intel ® dual-core Itanium ® processor 9000

Mainframe server, providing top-level flexibility and reliability

RISC and mainframes

Basic computing

Intel® Xeon® E3-1200 series processor Cost-effective and reliable single-socket server

High density infrastructure

Intel® Xeon® E5-2600/2400series processor

Offers high energy efficiency and excellent performance

per watt

Intel® Xeon® E5-4600series processor

Uses 8-core processor to maximize high performance density.

Key Component CPU—Intel® Server Family

The development plan for server hardware must follow the Intel's Tick-Tock model,

that is, follow the architecture and microarchitecture progress

Tick indicates the year for architecture change and Tock indicates the year for

microarchitecture change. Tick: 2011 and 2013; Tock: 2012 and 2014

Tick: Upgrade the architecture, and develop the next generation technology of the

mainstream servers; Tock: Optimize features, upgrade the CPU, optimized server

features, prepare patches, and provide product versions of temporary market

requirements.

Server

Level

CPU Series Number of

Server

Sockets

CPU Series

1-socket

server

E3-1200 series

E5-1400 series

1-socket

server

E3-1200 series

E5-1400 series

Entry-level

2-socket

server

E5-2400 series 2-socket

server

E5-2400 series

E6-2600 series

E7-2800 series

high-

performanc

e 2-socket

or 4-socket

server

E5-2600 series

E5-4600 series

4-socket

server

E5-4600 series

E7-4800 series

high-end

server

E7-2800 series

E7-4800 series

E7-8800 series

8-socket

server

E7-8800 series

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HUAWEI TECHNOLOGIES CO., LTD. Huawei Confidential

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E5-4600: Romley EP -4S

E5-2600: Romley EP

E5-2400: Romley EN

Intel E5 CPU Introduction

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CPU—EN&EP platforms

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Table 1 Romley-EN & EP Comparison (2-socket servers)

Feature Remarks

Socket type

QPI portEP platform provides the bandwidth

two times that of the EN platform

Memory channel EP platform provides the memory bandwidth 33% larger than that of

the EN platform--higher

Number of DIMMs supported--supported

Maximum memory capacity (GB)

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CPU

Model

Number of

Cores/Threads

Cach

Capacit

y(MB)

QPI

Rate

(GT/s)

CPU Dominant

Frequency

(GHz)

Memory

Speed

(MHz)

Turbo Feature (The maximum

frequency is determined by active

cores. The number of active cores

is in descending order from left to

right.)

Hyper

Threading(HT)

Feature

Power

Consumption

(W)

E5-2690 8/16 20 8 2.9 1600 3.30/3.30/3.30/3.40/3.40/3.60/3.60/3.80 ■ 135

E5-2680 8/16 20 8 2.7 1600 3.10/3.10/3.20/3.20/3.20/3.40/3.50/ 3.50 ■ 130

E5-2650L 8/16 20 8 1.8 1600 2.00/2.00/2.10/2.10/2.20/2.20/2.30/2.30 ■ 70

E5-2670 8/16 20 8 2.6 1600 3.00/3.00/3.10/3.10/3.20/3.20/3.30/3.30 ■ 115

E5-2690 8/16 20 8 2.9 1600 3.30/3.30/3.30/3.40/3.40/3.60/3.60/3.80 ■ 135

E5-2665 8/16 20 8 2.4 1600 2.80/2.80/2.90/2.90/3.00/3.00/3.10/3.10 ■ 115

E5-2667 6/12 15 8 2.9 1600 3.20/3.20/3.20/3.30/3.40/3.50 ■ 130

E5-2640 6/12 15 7.2 2.5 1333 2.80/2.80/2.90/2.90/3.00/3.00 ■ 95

E5-2620 6/12 15 7.2 2.0 1333 2.30/2.30/2.40/2.40/2.50/2.50 ■ 95

E5-2660 8/16 20 8 2.2 1600 2.70/2.70/2.80/2.80/2.90/2.90/3.00/3.00 ■ 95

E5-2650 8/16 20 8 2.0 1600 2.40/2.40/2.50/2.50/2.50/2.70/2.80/2.80 ■ 95

E5-2630L 6/12 15 7.2 2.0 1333 2.30/2.30/2.40/2.40/2.50/2.50 ■ 60

E5-2630 6/12 15 7.2 2.3 1333 2.60/2.60/2.70/2.70/2.80/2.80 ■ 95

E5-2609 4/4 10 6.4 2.4 1067 N/A NO 80

E5-2603 4/4 10 6.4 1.8 1067 N/A NO 80

EN series

E5-2470 8/16 20 8 2.3 1600 2.80/2.80/2.90/2.90/3.00/3.00/3.10/3.10 ■ 95

E5-2450L 8/16 20 8 1.8 1600 2.00/2.00/2.10/2.10/2.20/2.20/2.30/2.30 ■ 70

E5-2450 8/16 20 8 2.1 1600 2.60/2.60/2.70/2.70/2.80/2.80/2.90/2.90 ■ 95

E5-2440 6/12 15 7.2 2.4 1333 2.70/2.70/2.80/2.80/2.90/2.90 ■ 95

E5-2430L 6/12 15 7.2 2.0 1333 2.30/2.30/2.40/2.40/2.50/2.50 ■ 60

E5-2430 6/12 15 7.2 2.2 1333 2.50/2.50/2.60/2.60/2.70/2.70 ■ 95

E5-2420 6/12 15 7.2 1.9 1333 2.20/2.20/2.30/2.30/2.40/2.40 ■ 95

E5-2407 4/4 10 6.4 2.2 1067 N/A NO 80

E5-2403 4/4 10 6.4 1.8 1067 N/A NO 80

CPU—Specification List

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Memory-1

Definition: Memory is used to store the current running (or executing) data and processes. All running programs need

to be executed by memory. If multiple programs have to be executed or the size of programs is too large, memory

capacity will be consumed.

DDR3 DIMM

Double Data Rate 3 (DDR3) is the third generation of the DDR SDRAM technology, which provides higher bandwidth

and lower power consumption compared with DDR2. Compared with DDR2 memory, DDR3 memory can increase the

bandwidth by up to 66% and uses 40% less power at the same rate. Both DDR3 and DDR2 DIMMs have 240 pins, but

they have different notch position. DDR3 is incompatible with DDR2.

Typical technology——ECC: Traditional servers adopt only the error checking and correcting (ECC) technology for

memory. ECC can correct 1-bit and 2-bit memory errors. The following advanced memory fault-tolerant technologies are

used to provide high reliability:

1. (1)Memory sparing: Hot-backup DIMM is not used in the normal conditions. When the number of errors generated

by working memory exceeds the predefined ECC limit, the system automatically transfers data from the faulty

DIMMs to the hot-backup DIMMs, and the faulty DIMMs are not used any more.

2. (2)Memory mirroring: Two copies of the same data are created on the memory, which prevents data loss caused

by faulty DIMMs. In addition, the working memory and mirroring memory are not in the same channel, which also

prevents data loss caused by memory channel errors.

JEDEC Name Common Name Transmission Speed Maximum Throughput

PC3-12800 DDR3-1600 1600 MT/s 12.8 GB/s

PC3-10600 DDR3-1333 1333 MT/s 10.6 GB/s

PC3-8500 DDR3-1066 1066 MT/s 8.5 GB/s

PC3-6400 DDR3-800 800 MT/s 6.4 GB/s

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Memory-2 DIMM type: UDIMM, RDIMM, LRDIMM

• UDIMM: UDIMM is an abbreviation for unbuffered DIMM. On the UDIMM, the addresses and control signals output by

controllers are directly transmitted to DRAM chips. A UDIMM has a small capacity and low frequency. Compared with

DIMMs of other types, because UDIMM has no cache, it has a lower latency at the same frequency. A single UDIMM

provides the memory capacity of 2 GB or 4 GB and dominant frequency of up to 1.33 GHz.

• RDIMM: RDIMM is an abbreviation for registered DIMM. On the RDIMM, the IP addresses and control signals output

by controllers are transmitted to registers and then to DRAM chips. The RDIMM is the mainstream DIMM. A single

RDIMM provides the memory capacity of 2 to 32 GB and the dominant frequency of up to 1.6 GHz. RDIMM offers

better performance and scalability and is cost-effective.

• LRDIMM: LRDIMM is an abbreviation for load reduced DIMM. LRDIMM uses new technologies and lower working

voltage. In this way, the server memory bus load and power consumption are reduced, and the server memory bus

can work at a higher working frequency to greatly increase available memory capacity. Compared with a common

RDIMM, a dual-rank LRDIMM consumes 50% less power.

DIMM indicators:

• Capacity: 4/8/16/32 GB

• Frequency: 800/1066/1333/1600 MHz

• Latency: indicates the time waiting for memory responses before the system is ready to perform data access

operation. The value is in the format of four digits separated by endashs (-) to indicate CL-TRP-TRCD-TRAS, for

example, 3-4-4-8. Generally, the smaller digits indicate better memory performance. However, the memory

performance depends on the combination of these four digits.

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Chipset Definition: A chipset is a set or multiple sets of chips used to manage data communication between the processor,

memory and I/O level. The chipset is the core of motherboard circuit. if CPU is compared to human brain, the chipset

is the heart. The chipset determines the motherboard. The chipset is an umbrella term for southbridge and

northbridge. As technology develops, the southbridge and northbridge are integrated on a chipset.

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Currently, form factors of server hard disks are 2.5 inches and 3.5 inches. The server hard disks are categorized

into the following three types:

SATA hard disk: Mainstream Serial Advanced Technology Attachment (SATA) hard disks are 3.5 inches, which are

hot-swappable and are not hot-swappable. The SATA hard disks that do not support hot swap have no hard disk tray.

The SATA hard disks are used for low- and mid-range servers, mass storage, and nearline storage.

SAS hard disk: Serial Attached SCSI (SAS) hard disks have the following two types: 3 Gb/s SAS hard disk and 6

Gb/s SAS hard disk. The SAS hard disks are used for mid- and high- range servers.

SSD: SSD is an abbreviation for solid-state disk. The SSD is a high-performance disk that is made by using solid-state

electrical storage chip arrays. The SSD consists of a control unit and a storage unit (DRAM or flash chip). The storage

unit is used to store data, and the control unit is used to read and write data.

NandFlash is the key component of the SSD, which consists of an SLC* (single-layer unit) and an MLC* (multi-layer unit).

Advantages: rapid speed, high performance, excellent endurance and shockproof performance, small power consumption,

no noise, and light weight

Disadvantages: small capacity and high price

Hard Disk

No moving mechanical components, providing

high performance and smaller power consumption

Multi-channel concurrence, allowing time-division

multiplexing for flash granules in a channel

TCQ/NCQ, responding to multiple I/O requests in

one response

Typical response time of less than 0.1 ms DDR DIMM

Backup PSUs

SAS port

FLASH

6 Gb/s Multi-channel

concurrence

SSD controller

SSD framework SSD Hardware Structure Principle

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PCIe

Definition: Peripheral Component Interconnect (IPCI) is a bus standard designed to support the connection between the computer motherboard and high-

speed peripheral devices, such as graphic cards, audio cards, Network cards, and disk controllers. In applications that require high data transfer rate, PCI

can break the low data transfer rate bottleneck of the older bus standards. PCI has evolved from Peripheral Component Interconnect eXtended (PCI-X) to

Peripheral Component Interconnect Express (PCIe). Currently, PCIe is the latest generation of the PCI technology.

PCIe: The PCIe is the latest I/O bus technology. PCIe is used for the point-to-point communication between high-speed serial interfaces by using dual

channels for high bandwidth transmission. PCIe allocates exclusive channel bandwidth for its connected devices. Therefore, resources are not shared,

which break the system I/O bandwidth bottleneck. The PCIe technology provides functions, such as automatic power supply management, error reporting,

reliable end-to-end transmission, hot swap, and Quality of Service (QoS).

PCIe 2.0: The current 16-lane PCIe 2.0 connector (x16) can support throughput up to 16 GB/s aggregate.

PCIe 3.0: The PCIe 3.0 standard provides 8 GHz/s data transfer rate. It is backward compatible with PCIE 2.x/1.x and supports 2.5 GHz and 5 GHz clock

rate for signals. PCIe 3.0 x1 provides single-direction bandwidth of about 1 GB/s per lane, and PCIe 3.0 x16 provides bidirectional bandwidth of up to 32

GB/s.

PCIe Network adapter: PCIe network adapters are used to support for the connection between servers and network devices

such as switches. The common PCIe network adapters are as follows:

x1 x16 x4

x8

PCIe HBA: The Host bus adapter (HBA) is an adapter used to provide I/O processing and physically connected circuit boards

and/or integrated circuits (ICs) for the connection between servers and storage devices. Because HBA reduces the load of data

storage and retrieval for the host processor, it can improver server performance. An HBA and its connected disk subsystem are

called a disk channel.

RJ45 Ethernet

network adapter FC Ethernet

network adapter

Multi-port Ethernet

network adapter

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RAID card: A RAID card used to implement the RAID function consists of an I/O processor, hard disk controller, hard disk connector,

and cache. RAID cards are categorized into the following levels: RAID 0, RAID 1, RAID 3, RAID 4, RAID 5, and RAID 10. The RAID

card allows multiple disk drives to transmit data at the same time, reaching a data transfer rate several folds or even hundred folds

that of a single disk drive. In addition, RAID card provides the fault-tolerant function.

Cache

ibutton supports RAID battery protection. Cache is used for exchanging data between a RAID card and external bus. A

large-capacity cache can greatly increase data hit rate to improve RAID card

performance.

Item Lsi2308 Lsi2208

Supported

RAID levels

RAID 0, 1, 1E, 10 RAID 0, 1, 5, 6, 10, 50, 60

Read and

write cache

None 512 MB or 1 GB

Hard disk

type

SAS/SATA HDDs or SSDs SAS/SATA HDDs or SSDs

Port Supports PCIe ports;

Provides eight 6 Gbit/s

SAS or SATA ports.

Supports PCIe ports;

Provides 6 Gbit/s SAS or

SATA ports.

RAID Card

Name of RAID Cards Supported

Type of Chips

Supported

Number of Hard Disks Supported

Supported RAID Level

E6000 server blade

X6000 server node

Pass through card

Pass through card

Rack server

Server

RAID 0/1/5/6/10/50/60Enable the CacheCade

function

RAID 0/1/5/6/10/50/60Enable the CacheCade

function

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RAID Concept——Definition

RAID is an abbreviation for Redundant Array of Independent Disks. RAID is a storage technology that combines

multiple independent physical hard disks in various ways into a logical hard disk, which improves hard disk

read/write performance and ensures data security.

RAID cards are categorized into the following levels depending on their combination schemes:

RAID 0 Block-level stripping without parity

RAID 1 Mirroring without parity

RAID 3 Byte-level stripping with parity stored on a dedicated hard disk

RAID 5 Block-level stripping with distributed parity

RAID 6 Block-level stripping with distributed parity and double redundancy

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RAID 01 RAID 0 is made first and then RAID 1 is made, which provides block-level stripping and mirroring at the

same time.

RAID 10 RAID 10 is similar to RAID 01. The key difference is that RAID 1 is made first and then RAID 0 is made.

RAID 50 RAID 5 is made first and then RAID 0 is made, which efficiently improves RAID 5 performance.

Different RAID levels can be nested to form a new RAID level:

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RAID Concept——Data Organization and

Access Mode

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Data Organization Modes

D7

D4

D1

Drive 2

D6

D3

D0

Drive 1

D8

D5

D2

Drive 3

Strip 2

Strip 1

Strip 0

Data blocks

on disks

Data blocks

on disks

Data blocks

on disks

Block: A partition is divided into

multiple pieces with equal size and

adjacent address. These pieces are

called blocks. Blocks are elements of

a strip.

Strip: A strip is formed by blocks with

the same "position" (or the same

numbering) in multiple disk drives of

the same disk array.

Parallel access mode: In this mode, the spindle motor of all disk drives are accurately controlled. All disk positions are

synchronized. A short I/O data transfer is performed to distribute each I/O request sent by the host to each disk drive,

which maximizes performance of each disk drive in the array.

This mode is used for the applications that feature sequential access to continuous large-size data for a long time.

Independent access mode: Data on each disk drive is accessed independently and randomly without the restriction of

time interval. Each disk drive can receive multiple I/O requests, and the size of each data volume to be transmitted is

small. This mode is used for the applications that require frequent data access and small size of access data.

Data Access Modes

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RAID Concept——Hot spare and Rebuilt

Definition:

In a redundant RAID group, when a hard disk is faulty, another normal hard disk for hot spare

automatically replaces the faulty one without affecting the normal use of the RAID, which ensures RAID

redundancy.

Type:

Global hot spare: A hot spare hard disk is shared by all redundant RAID groups.

Dedicated hot spare: A hot spare hard disk is dedicated to a redundant RAID group.

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Hot spare

Rebuild

Data disk

A1 A0 P

A0

A1 P

XOR

Failed

Data disk Parity disk

A2 A2

XOR

Data disk

Replaced

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RAID Concept——Logical Volume

One or more logical volumes are created for a RAID based on the specified capacity. The

logical volumes are identified by logic unit number (LUN).

Page 27

Physical disks

RAID

Logical volumes

RAID

LUN1 LUN2 LUN3

Division

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RAID Levels—RAID 0 and RAID 1

A RAID 0 is a strip set that provides no

fault tolerance. In RAID 0, data is evenly

distributed in strips across each hard

disk.

RAID 2 is also called a mirror of a set

of data on two disks. In RAID 2, data is

written consistently to the primary disk

and mirroring disk at the same time.

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Data Data

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RAID Level——RAID 3 and RAID 5

A RAID 3 is a parallel data transmission

array with a dedicated parity. In RAID 3,

data is distributed in strips in data disks,

and parity data is stored on a dedicated

parity disk.

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A RAID 5 is similar to a RAID 3. However, In

RAID 5, parity data is evenly distributed on

each data disk, data and parity information

are stored on RAID member disks at the

same time, and data blocks and

corresponding parity information are stored

on different disks. RAID 5 is one of the

commonly used RAID levels.

XOR

Data disk Parity disk

XOR

Data

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RAID Level —— Using RAID 6 As an Example

for Illustration

A1 A3 A2 A4

A7

A10

A8 A5

A9

A13

A6

A15

A11 A12

A16

XOR

A1 A2 A3 A4 A5 A6 A7 A9 ……

Horizontal parity disks P1 to P4 store horizontal parity data in each data disk.

For example, P1 = A1 XOR A2 XOR A3 XOR A4

Diagonal parity disks DP1 to DP4 store diagonal parity data in each data disk and horizontal parity disks.

For example, DP1 = A1 XOR A6 XOR A11 XOR A16

P1

P2

P3

P4

Horizontal

parity disk Diagonal

parity disk

Data disk

A8

DP1

DP2

DP3

DP4 A14

DP5

Page 30

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Nested RAID Levels——RAID 10 and RAID 50

RAID 10 is a nested RAID level that combines

mirroring and stripping. For a RAID 10, drives

are first combined into multiple level 1 RAIDs,

which are treated as a single drive to be

combined into a single RAID 0. RAID 10 is

also one of the widely used RAID levels.

Page 31

RAID 50 is a combination of RAID 5 and

RAID 0. The first level is RAID5 and the

second level is RAID 0.

XOR XOR

Hard disk 0

Hard disk 1

Hard disk 2

Hard disk 3

Hard disk 4

Hard disk 5

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S&K

RAID Level Comparison

RAID level RAID 1 RAID 3 RAID 5 RAID 10 RAID 0

Fault tolerance Yes Yes Yes Yes No

Redundancy

type

Mirroring

redundancy

Parity

redundancy Parity

redundancy

Mirroring

redundancy No

Read

performance Low High High Medium High

Random write

performance Low Low Medium High

Continuous write

performance Low Low Low Medium High

Minimum

number of disks 2 3 3 4 2

Available space 50% (N-1)/N (N-1)/N 50% 100%

Application

Scenario High

transmission

bandwidth

High security Large file and

continuous data

High read/write

rate

High security

Low

Page 32

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32pt

) :18pt


Management Technology

IPMI: The Intelligent Platform Management Interface (IPMI) is a standard interface specification used for server

management system design. Intel, Hewlett-Packard, Dell, and NEC Corporation announced IPMI in 1998. Users can

use the IPMI to monitor the health status of a physical server, such as temperature, voltage, and status of fan

modules and PSUs. System management can be implemented for different types of server system hardware by

using IPMI, which makes central management of different platforms possible.

Work rule:

The core component of an IPMI system is a dedicated chip or controller called the Baseboard management

controller (BMC). The IPMI system operates independently of the server processor, basic input/output system

(BIOS), and OS. The IPMI system can start to work with the BMC and IPMI firmware. The BMC is a microcontroller

embedded independently on the motherboard of a server. Now, some server motherboards support the integration of

the IPMI system. The IPMI system uses low-level hardware instead of an OS for intelligent management, which has

the following advantages: This configuration allows out-of-band management. Transmission system status data is not

required for the OS.

IPMI

KVM over IP

KVM over IP: KVM over IP indicates that the keyboard, video, and mouse of a remote server is virtualized to a local

control terminal over networks. In this way, the server can be remotely operated by the local control terminal.

Advantages: (1) Low costs for implementation and upgrade, and seamless upgrade; (2) Flexible centralized

management; (3) Global control and simple operations; (4) Rich management control functions provided by IP

technologies

Virtual Media

Virtual media: The virtual media technology maps any media on a local terminal to USB devices of a controlled

server. By using this technology, IT administrators can fully control a server in the absence of the server to perform

field operations for data, such as troubleshooting faults, transferring files, and patching applications and OSs.

Page 33

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32pt

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) :18pt


Configuration Overview

Clustered NAS

engines

Components for Configuration Quotation

Server model and

PSUs CPU Hard

disks

RAID cards, network

cards, and HBA cards Services Commerce

Configuration Example Based on Server Model

Customers can choose computing servers or storage servers based on your service requirements:

• Computing server: Computing servers have higher requirements for CPUs and generally requires external storage devices.

For virtualization, you are advised to choose computing servers (such as blade servers, high-density servers, and 4-socket

rack servers)

• Storage server: Storage severs have low requirements for CPUs and generally requires no external storage devices. (A 2-

socket rack server is often used as a storage server, which can be configured with multiple hard disks.)

For optimized configuration, you can consider the CPU performance, power consumption, and price when selecting

CPU models. If the memory capacity and bandwidth are important for you, you are advised to choose the EP series

CPUs. You can choose the EN series CPUs for common enterprise-level applications.

For optimized CPU and memory configuration, pay attention to the following considerations: Maximum memory

frequency supported by the CPU and memory that works at the maximum frequency

For example, if two E5-2620 CPUs are used, the optimized performance can be achieved when the memory capacity

is set to 64 GB.

Analysis: The memory working frequency supported by an E5-2620 is 1333 MHz. Two E5-2620 CPUs provide eight memory

channels, balanced configuration can be achieved by selecting eight 8 GB DIMMs. Therefore, you can select the following:

DIMMs Chassis Switch

modules

Required by blade servers

Thank You.

Documents

IT General Technology Series-Server.pdf