LG 32LH20 Servicemanual

LCD TVSERVICE MANUAL

CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

CHASSIS : LP91A

MODEL : 32LH20R 32LH20R-LA/TA

North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com

Internal Use Only

LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

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CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ..................................................................................3

SPECIFICATION ........................................................................................6

ADJUSTMENT INSTRUCTION .................................................................9

TROUBLE SHOOTING ............................................................................14

BLOCK DIAGRAM...................................................................................17

EXPLODED VIEW .................................................................................. 18

SVC. SHEET ...............................................................................................


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SAFETY PRECAUTIONS

Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1M and 5.2M. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.

Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

Leakage Current Hot Check circuit

1.5 Kohm/10W

To Instrument'sexposed METALLIC PARTS

Good Earth Groundsuch as WATER PIPE,CONDUIT etc.

AC Volt-meter

When 25A is impressed between Earth and 2nd Groundfor 1 second, Resistance must be less than 0.1*Base on Adjustment standard

IMPORTANT SAFETY NOTICE

0.15uF


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CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

source before;a. Removing or reinstalling any component, circuit board

module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.

2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of itsassemblies.

4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.

7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.

8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the

unit under test.2. After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).

7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.

8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within therange or 500F to 600F.

2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.

(500F to 600F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500F to 600F)b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the

component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

SERVICING PRECAUTIONS


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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

Removal1. Desolder and straighten each IC lead in one operation by gently

prying up on the lead with the soldering iron tip as the soldermelts.

2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.

Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

solder it.3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as

possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as

possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

board.3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of

the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.2. Securely crimp the leads of replacement component around

notch at stake top.3. Solder the connections.

CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).

1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.


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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement.

4. Electrical specification4.1. General Specification

1. Application rangeThis spec sheet is applied to LCD TV used LP91A chassis.

2. SpecificationEach part is tested as below without special appointment.

1) Temperature : 255C (779F), CST : 405C2) Relative Humidity : 6510%3) Power Voltage : Standard input voltage(100~240V@50/60Hz)

* Standard Voltage of each products is marked by models.4) Specification and performance of each parts are followed

each drawing and specif ication by part number inaccordance with BOM.

5) The receiver must be operated for about 5 minutes prior tothe adjustment.

3. Test method1) Performance: LGE TV test method followed 2) Demanded other specification

- Safety: CE, IEC specification- EMC : CE, IEC

No Item Specification Measurement Remark1 Screen Size 32 wide Color Display Module Resolution : 1366*7682 Aspect Ratio 16:93 LCD Module 32 TFT WXGA LCD4 Operating Environment Temp.: 0 ~ 40 deg

Humidity : 0 ~ 85 %5 Storage Environment Temp.: -20 ~ 60 deg

Humidity : 0~ 85 %6 Input Voltage AC100-240V~, 50/60Hz

150 W 32 HD7 LDC Module HD 760 x 450 x 48 Unit : mm

(Maker : LGD) 0.17025 x 0.5107512 EEFL

Coating 3H

- 7 - LGE Internal Use OnlyCopyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

No. Item Min. Typ. Max. Unit Maker Remark1. Luminance 400 500 cd/m2

(W/O PC mode)2. VIew angle (R/L, U/D) 178 / 178 degree LGD3. Color Coordinates White Wx Typ 0.279 Typ LGD 32(HD)

Wy -0.03 0.292 +0.03RED Xr 0.636

Yr 0.335Green Xg 0.291

Yg 0.613Blue Xb 0.146

Yb 0.0614. Contrast ratio 700:1 1000:15. Luminance Variation 1.3

5. Chroma& Brightness (Optical)5.1. LCD Module

the Color Coordinates check condition - 50cm from the surface, Full White Pattern- Picture mode Vivid

6. Component Video Input (Y, PB, PR)No Specification Remark

Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz4 720* 480 31.47 59.94 27.000 SDTV 480P5 720* 480 31.50 60.00 27.027 SDTV 480P6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz7 1280* 720 44.96 59.94 74.176 HDTV 720P8 1280* 720 45.00 60.00 74.250 HDTV 720P9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,11 1920* 1080 33.72 59.94 74.176 HDTV 1080I12 1920* 1080 33.75 60.00 74.25 HDTV 1080I13 1920* 1080 56.25 50 148.5 HDTV 1080P14 1920* 1080 67.432 59.94 148.350 HDTV 1080P15 1920* 1080 67.5 60.00 148.5 HDTV 1080P


No Specification Proposed RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 640* 350 31.468 70.09 25.17 EGA2 720* 400 31.469 70.09 28.32 DOS3 640* 480 31.469 59.94 25.17 VESA( VGA)4 800* 600 37.879 60.317 40 VESA( SVGA)5 1024* 768 48.363 60.004 65 VESA( XGA)6 1280* 768 47.776 59.87 79.5 VESA( WXGA)7 1360* 768 47.72 59.799 84.75 VESA( WXGA)8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model

7. RGB7.1. Analog PC, RGB- DTV NOT SUPPORT

8. HDMI Input8.1. PC Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark1 640 x 480 31.469 59.94 25.17 VESA( VGA)2 800 x 600 37.879 60.317 40.00 VESA( SVGA)3 1024 x 768 48.363 60.004 65.00 VESA( XGA)4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)5 1360 x 768 47.72 59.799 84.62 VESA( WXGA) 6 1366 x 768 47.7 60.00 84.62 WXGA7 1280 x 1024 63.595 60.00 108.875 SXGA8 1920 x 1080 66.647 59.988 138.625 WUXGA

8.2. DTV Mode

No Specification RemarkResolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)

1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) Spec. out2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) but display.3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz 4 720 x 480 31.47 59.94 27 SDTV 480P5 720 x 480 31.5 60.00 27.027 SDTV 480P6 720 x 576 31.25 50.00 27 SDTV 576P7 1280 x 720 44.96 59.94 74.176 HDTV 720P8 1280 x 720 45 60.00 74.25 HDTV 720P9 1280 x 720 37.5 50.00 74.25 HDTV 720P

10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P16 1920 x 1080 27 24.00 74.25 HDTV 1080P17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P


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ADJUSTMENT INSTRUCTION1. Application Range

This specification sheet is applied to all of the LCD TV,LP91A/B/C/D chassis.

2. Specification1) Because this is not a hot chassis, it is not necessary to use

an isolation transformer. However, the use of isolationtransformer will help protect test instrument.

2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of

25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation.

4) The input voltage of the receiver must keep 100~220V,50/60Hz.

5) Before adjustment, execute Heat-Run for 5 minutes at RFno signal.

3. Adjustment items3.1. PCB assembly adjustment items

(1) Download the MSTAR main software(IC800, Mstar ISP Utility)1) Using D/L Jig2) Using USB Memory Stick.

(2) Input Tool-Option/Area option.(3) Download the EDID

- EDID datas are automatically download when adjustingthe Tool Option2

(4) ADC Calibration RGB / Component(4) Check SW Version.

3.2. SET assembly adjustment items(1) Input Area option(2) Adjustment of White Balance : Auto & Manual(3) Input Tool-Option/Area option(4) Intelligent Sensor Inspection Guide(5) Preset CH information(6) Factoring Option Data input

4. PCB assembly adjustment method4.1. Mstar Main S/W program download4.1.1. Using D/L Jig

(1) Preliminary steps1) Connect the download jig to D-sub(RGB) jack

(2) Download steps1) Execute ISP Tool program, the main window(Mstar ISP

utility Vx.x.x) will be opened2) Click the Connect button and confirm Dialog Box

3) Click the Config. button and Change speed I2C Speedsetting : 350Khz~400Khz

4) Read and write bin file.Click (1)Read tab, and then load downloadfile(XXXX.bin) by clicking Read.

- LH20/ LH30

1

Filexxx.bin

1

Filexxx.binFilexxx.bin

5) Click (2)Auto tab and set as below6) Click (3)Run.7) After downloading, you can see the (4)Pass message.

4.1.2. Using the Memory Stick* USB download : Service Mode1) Insert the USB memory stick to the ISB port.2) Automatically detect the SW Version.

-> S/W download process is executed automatically.3) Show the message Copy the file from the Memory

4) After Finished the Download, Automatically DC Off -> On

5) Check The update SW Version.

4.2. Input tool option.Adjust tool option refer to the BOM.- Tool Option Input : PCBA Check Process- Area Option Input : Set Assembly Process

After Input Tool Option and AC offBefore PCBA check, you have to change the Tool option andhave to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)

(1) Profile : Must be changed the option value because beingdifferent with some setting value depend onmodule maker, inch and market

(2) Equipment : adjustment remote control.

(3). Adjustment method- The input methods are same as other chassis.(Use IN-

START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)

Refer to Job Expression of each main chassis assy(EBTxxxxxxxx) for Option value Caution : Dont Press IN-STOP key after completing thefunction inspection.

4.3. EDID D/L methodRecommend that dont connect HDMI and RGB(D-SUB) cablewhen downloading the EDID.If not possible, recommend that connect the MSPG equipment.There are two methods of downloading the edid data

4.3.1. 1st MethodEDID datas are automatically downloaded when adjusting theTool Option2.Automatically downloaded when pushing the enter key afteradjusting the tool option2.It takes about 2seconds.

4.3.2. 2nd Method* Caution :

Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not bedownloaded well.

1) Press the ADJ key2) Move to the EDID D/L and Press the right direction key(G)3) Press the right direction key(G) at Start.4) After about a few seconds, appear OK, then compele.

4.3.3. RS-232C command Method(1) Command : AE 00 10

* Caution Dont connect HDMI and RGB(D-SUB) cable whendownloading the EDID.If the cables are connected, Downloading of edid could befailed.


1

Filexxx.bin

4.3.4. EDID data(1) Analog(RGB): 128bytes>

(2) HDMI 1 : 256Bytes

(3) HDMI 2 : 256Bytes

4.4. ADC Calibration4.4.1. ADC Calibration - Component (Using External pattern)

(1) Required Equipments- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process1) Change the Input to Component1 or 2 mode.2) Input the Component 480i@60Hz 100% Color Bar

YPbPr signal into Component1 or 2.(MSPG-925F Model: 209 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : Component by using D/E

(CH +/-) and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear

4.4.2. ADC Calibration - RGB (Using External pattern)(1) Required Equipments

- Remote controller for adjustment- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator

(2) Process1) Change the Input to RGB mode..2) Input the PC 1024x768@60Hz Horizontal Color Bar

signal into RGB.(MSPG-925F Model: 60 / Pattern: 65 )

3) Press ADJ key on R/C for adjustment.4) Enter Password number. Password is 0 0 0 0.5) Select 0. ADC calibration : RGB by using D/E(CH +/-)

and press ENTER(A).6) ADC adjustment is executed automatically .7) When ADC adjustment is finished, this OSD appear


OK

OK

4.5. Check SW Version(1) Method

1) Push In-star key on Adjust remote-controller.2) SW Version check

Check SW VER : V3.xx LH70

5. PCB assembly adjustment method5.1. Input Area-Option

(1) Profile : Must be changed the Area option value becausebeing different of each Countrys Language andsignal Condition.

(2) Equipment : adjustment remote control.(3) Adjustment method

- The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)

Refer to Job Expression of each main chassis assy(EBTxxxxxxxx) for Option value.

* White Balance Adjustment- Purpose : Adjust the color temperature to reduce the

deviation of the module color temperature.- Principle : To adjust the white balance without the saturation,

Fix the one of R/G/B gain to 192 (default data)and decrease the others.

- Adjustment mode : Three modes Cool / Medium / Warm- Required Equipment

1) Remote controller for adjustment 2) Color Analyzer : CA100+ or CA-210 or same product -

LCD TV( ch : 9 ),(should be used in the calibrated ch by CS-1000)

3) Auto W/B adjustment instrument(only for Auto adjustment)

5.2. Adjustment of White Balance: (For automatic adjustment)

* LP91A~D Support RS-232C & I2C DDC Communication-White Balance Mode.

(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-

run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition

of Heat-run => Maintain after AC off/on in status of Heat-run pattern display)

(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on

in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off

command(F3 00 00) from adjustment equipment.- Need to transmit the aging off command to TV set after

finishing the adjustment.- Check DDC adjust mode release by exit key and release

DDC adjust mode)

(3) Enter the adjust mode of white balance)- Enter the white balance adjustment mode with aging

command (F3, 00, FF)* Luminance min value is 150cd in the Cool/Medium/Warm

mode(For LCD)

5.3. Adjustment of White Balance(for Manual adjustment)(1) Color analyzer(CA100+, CA210) should be used in the

calibrated ch by CS-1000(2) Operate the zero-calibration of the CA100+ or CA-210,

then stick sensor to the module when adjusting.(3) For manual adjustment, it is also possible by the following

sequence.1) Select white pattern of heat-run by pressing POWER

ON key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)

2) Push Exit key.3) Change to the AV mode by remote control.4) Input external pattern (85% white pattern)5) Push the ADJ key -> Enter 0000 (Password)6) Select 3. W/B ADJUST7) Enter the W/B ADJUST Mode8) Stick the sensor to the center of the screen and select

each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C..

9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.10) Adjust three modes all (Cool / Medium / Warm) : Fix

the one of R/G/B gain and change the others11) When adjustment is completed, Enter COPY ALL.12) Exit adjustment mode using EXIT key on R/C.


* CASEFirst adjust the coordinate far away from the target value(x, y).1. x, y > target

i) Decrease the R, G. 2. x, y < target

i) First decrease the B gain, ii) Decrease the one of the others.

3. x > target, y < targeti) First decrease B, so make y a little more than the target.ii) Adjust x value by decreasing the R

4. x < target, y > targeti) First decrease B, so make x a little more than the target.ii) Adjust x value by decreasing the G

(4) Standard color coordinate and temperature when using theCA100+ or CA210 equipment

To check the Coordinates of White Balance, you have tomeasure at the below conditions.Picture Mode : User 1Dynamic Contrast : OffDynamic Colour : Off(If you miss the upper condition, the coordinates of W/Bcan be lower than the spec.)


Coordinate Mode

x y Temp uv

Cool 0.2760.002 0.2830.002 11,000K 0.000Medium 0.2850.002 0.2930.002 9,300K 0.000Warm 0.3130.002 0.3290.002 6,500K 0.003


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TROUBLESHOOTING

No power(LED indicator off)

Check 24V, 12V, 5,2V of Power B/D

Check short of Main B/D or Change Power B/D

Pass

Check Output of IC1001, IC1003, IC1007

Check P307 Connector

Change LED Assy

: [A] PROCESS

Fail

Fail

Pass

Pass

Check LED Assy

Change IC1002,, Q1003

Pass

Check short of IC1001,IC1003, IC1007

Fail

Re-soldering or Change defectpart of IC1001, IC1003, IC1007

Fail

No Raster [B]: Process

Check LED statusOn Display Unit Repeat A PROCESS

Pass

Fail

Check Output of IC802 Change IC802Fail

Change Inverter ConnectorOr InverterFail

Pass

Fail

Pass

Change ModuleFail

Check LVDS Cable

Pass

Check Panel Link Cable Or Module

Change Panel Link CableOr Module

Check Inverter ConnectorOr Inverter

Pass


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No Raster on PC Signal

Check Input source Cableand Jack

Pass

Re-soldering or Change the defect part

Pass

Check the Input/OutputOf IC100 Fail

Re-soldering or Change the defect part,Check RGB EDID Data

Repeat [A], & [B] Process

Pass

Check the Input/OutputOf J104 Fail

Pass



Pass

No Raster on COMMPONENT Signal

Check Input source Cable And Jack

Pass


Pass




Check The Input/OutputOf JK101 Fail

Pass

No Raster on HDMI Signal


Pass

Check the Input/OutputOf JK301, JK302, JK303 Fail


Pass

Pass

Check the Input/OutputOf IC300, IC301, JK302 Fail

Re-soldering or Change the defect partCheck HDMI EDID Data

Re-download HDCP

Pass

Pass





- 16 -

No Sound

Check The Input Sourse.

Check The Input/OutputOf IC600.

Re-soldering or Change the defect part.Fail

Pass

Pass

Check The Speaker. Change Speaker.Fail

Check The Speaker Wire.

Pass

Change The Source Input.Fail

No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal


Pass


Pass

Check The Input/OutputOf JK101, JK201

Pass


Pass

Fail

Pass




Pass

Check The Input/OutputOf TU500

Pass


Pass

Fail





- 17 -

BLOCK DIAGRAM

RG

B_

PC

PC_

Audi

o

TV (RF)

CO

MP1

HD

MI1

HD

MI2

RS2

32

TX

232C

D

rive

rST

3232

CTx

/Rx

:

15Vp

p

PC_

R/G

/B/H

S/VS

PC_

Au

dio

_L/

R :7

00m

Vrm

s

MN

T_O

UT:

1Vp

p

SID

E_V

:1Vp

p

SID

E_L/

SID

E_R

:500m

Vrm

s

DD

R2(

512M

B)

L_SP

K_O

UT

R_

SPK_

OU

T

EEPR

OM

24C

02

Com

p1_

L/R

:500m

Vrm

s

TUN

ER

AV1

_VI

N:

1Vpp

AV1

1_LI

N/R

IN :5

00m

Vrm

s

PWM

NTP

3100

L

MN

T_O

UT

MN

T_LO

UT/

RO

UT:

500m

Vrm

s

AV2

(Sid

e A

V)

MAI

N SC

ALER

TXD

/R

XD : 5

V D

igita

l

CO

MP1

_Y/

Pb/P

r: 1/

0.7V

ppC

OM

P2_

Y/Pb

/Pr: 1/

0.7V

pp

IR HD

MI_

DAT

A_1

HD

MI_

DAT

A_2

HD

MI1

_SC

L/SD

A

OU

T_E_

TX_

CLK

OU

T_E_

TX_

EO

UT_

E_TX

_D

OU

T_E_

TX_

CO

UT_

E_TX

_B

OU

T_E_

TX_

ATU

_M

AIN

S I F

CO

MP1

_Y/

Pb/P

r 1/

0.7V

pp

AV1

_VI

N

PC_

Au

dio

_L/

R

CO

MP1

_LI

N/R

IN

L_C

HR

_CH

LVDSconnector

TU_

MA

INSU

B_

SCL

SDA

EEPR

OM

24C

02

EEPR

OM

24C

02

SIF

AV1

_LI

N/R

IN

MN

T_L/

R O

UT

AV1

MN

T_O

UT

Com

p2_

L/R

:500m

Vrm

s

CO

MP2

_Y/

Pb/

:1/

0.7V

pp

CO

MP2

_LI

N/R

IN

CO

MP2

OU

T_O

_TX

_C

LK

OU

T_O

_TX

_E

OU

T_O

_TX

_D

OU

T_O

_TX

_C

OU

T_O

_TX

_B

OU

T_O

_TX

_A

PC_

R/G

/B/H

S/VS

HD

M2_

SCL/

SDA

PC_

SCL/

SDA

MN

T_VO

UT

AV2

_VI

NA

V2_

LIN

/RIN

IIS_

OU

T

USB

USB

_D

N/P

N

AUD

IOAM

P

HD

MI3

_SC

L/SD

AEE

PRO

M24

C02

HD

MI_

DAT

A_3

TMD

STM

DS

TMD

SH

DM

I3

USB

For

D/L

EEPR

OM

(256

K)

Seria

l Fla

sh

(8M

Byt

e)

RG

B_

PC

PC_

Audi

o

TV (RF)

CO

MP1

HD

MI1

HD

MI2

RS2

32

TX

232C

D

rive

rST

3232

C

PC_

R/G

/B/H

S/VS

PC_

Au

dio

_L/

R :7

00m

Vrm

s

MN

T_O

UT:

1Vp

p

SID

E_V

:1Vp

p

SID

E_L/

SID

E_R

:500m

Vrm

s

DD

R2(

512M

B)

EEPR

OM

24C

02

Com

p1_

L/R

:500m

Vrm

s

TUN

ER

AV1

_VI

N:

1Vpp

AV1

1_LI

N/R

IN :5

00m

Vrm

s

PWM

NTP

3100

L

MN

T_O

UT

MN

T_LO

UT/

RO

UT:

500m

Vrm

s

AV2

(Sid

e A

V)

MAI

N SC

ALER

TXD

/R

XD : 5

V D

igita

l

CO

MP1

_Y/

Pb/P

r: 1/

0.7V

ppC

OM

P2_

Y/Pb

/Pr: 1/

0.7V

pp

HD

MI_

DAT

A_1

HD

MI_

DAT

A_2

_

OU

T_E_

TX_

CLK

OU

T_E_

TX_

O

UT_

E_TX

_

OU

T_E_

TX_

C

OU

T_E_

TX_

B

OU

T_E_

TX_

A

TU_

MA

IN

S I F

CO

MP1

_Y/

Pb/P

:1/

0.7V

pp

AV1

_VI

N

PC_

Au

dio

_L/

R

CO

MP1

_LI

N/R

IN

L_C

HR

_CH

LVDSconnector

TU_

MA

IN/

EEPR

OM

24C

02

EEPR

OM

24C

02

SIF

AV1

_LI

N/R

IN

MN

T_L/

R O

UT

AV1

MN

T_O

UT

Com

p2_

L/R

:500m

Vrm

s

CO

MP2

_Y/

Pb/P

r1/

0.7V

pp

CO

MP2

_LI

N/R

IN

CO

MP2

OU

T_O

_TX

_C

OU

T_O

_TX

_E

OU

T_O

_TX

_D

OU

T_O

_TX

_C

OU

T_O

_TX

_B

OU

T_O

_TX

_A

PC_

R/G

/B/H

S/VS

PC_

SCL/

SDA

PC_

SCL/

SDA

MN

T_VO

UT

AV2

_VI

NA

V2_

LIN

/RIN

IIS_

OU

T

USB

USB

_D

N/P

N

AUD

IOAM

P

HD

MI3

_SC

L/SD

AH

DM

I3_

SCL/

SDA

EEPR

OM

24C

02H

DM

I_D

ATA_

3

TMD

STM

DS

TMD

SH

DM

I3

USB

For

D/L

EEPR

OM

(256

K)

Seria

l Fla

sh

(8M

Byt

e)

- 18 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes

300

200

801

802

803

804

805

806

520

530

540

550

400

900

120

510

500

320

200T

200N

310

LV1

A2A1

0

EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

THE

SY

MBO

L M

ARK

OF

THIS

SCH

EMET

IC D

IAG

RAM

INCO

RPO

RATE

SSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PRO

TECT

ION

FRO

M X

-RAD

IATI

ON.

FILR

E AN

D E

LECT

RICA

L SH

OCK

HAZ

ARDS

, WHE

N SE

RVIC

ING

IF IS

ES

SENT

IAL

THAT

ONL

Y M

ANUF

ATUR

ES S

PECF

IED

PART

S BE

USE

D FO

RTH

E CR

ITIC

AL C

OM

PONE

NTS

IN T

HE

SYM

BOL

MAR

K O

F TH

E SC

HEM

ETIC

.

CVBS

_LIN

MUTE

_LIN

EAU

DIO_

R

SD05

ZD10

0

100u

F16

VC1

02

SD05

ZD10

3

SD05

ZD10

5

MNT_

ROUT

CVBS

_VIN

SPK_

R+_H

OTEL

RT1C

3904

-T11

2Q1

00E

BC

SPK_

R-_H

OTEL

CVBS

_RIN

SD05

ZD10

4

10uF

16V

C101

MUTE

_LIN

E

SD05

ZD10

1

SD05

ZD10

2

MNT_

LOUT

RT1C

3904

-T11

2Q1

01E

BC

MNT_

VOUT

10uF

16V

C100

30V

NON_

HOTE

L_OP

TD1

02

30V

NON_

HOTE

L_OP

TD1

03

30V

D101

30V

ADUC

30S0

3010

L_AM

ODIO

DE

D100

30V

D104

30V

D105

COMP

2_Y

COMP

2_PB

COMP

2_PR

COMP

2_L

COMP

2_R

S_VI

DEO_

DET

SIDE

_Y

SIDE

_C

+3.3V

_MUL

TI_M

ST

OPT

REA

DY

C10

4

30V

D10630V

D107

SD05

ZD10

6

SD05

ZD10

7

PS

J01

4-0

1JK

101

S-V

IDE

O

GN

D6

1

C-L

UG

1

2C

-LU

G2

30-

SP

RIN

G

4C

-LU

G3

5C

-LU

G4

SHIE

LD

7

75R1

02

0HO

TEL_

OPT

R103

0HO

TEL_

OPT

R105

0NO

N_HO

TEL_

OPT

R106

0HO

TEL_

OPT

R101

75R109

75R108

75R107

220K

R104

12K

R118

12K

R117

12K

R119

12K

R120

10K

R113

10K

R115

10K

R116

220K

R100

220K

R111

220K

R112

75R110

75R122

S-V

IDE

O

75R121

S-V

IDE

O

10K

R12

3

100p

FRE

ADY

C103

10K

R114

PPJ2

26-0

1JK

100

9A[GN

]1P_C

AN4A

[GN]O-

SPRIN

G_A

3A[GN

]CONT

ACT_A

9B[BL

]1P_C

AN8B

[BL]C-

LUG_

A9C

[RD]1P

_CAN

_18C

[RD]C-

LUG_

A9D

[WH]1

P_CAN

8D[W

H]C-LU

G_A_

19E

[RD]1P

_CAN

_24E

[RD]O

-SPRIN

G_A_

13E

[RD]CO

NTAC

T_A_1

9F[YL

]2P_C

AN4F

[YL]O-

SPRIN

G_A

3F[YL

]CONT

ACT_A

9G[W

H]2P_C

AN8G

[WH]C

-LUG_

A_2

9H[RD

]2P_C

AN4H

[RD]O

-SPRIN

G_A_

23H

[RD]CO

NTAC

T_A_2

5J

[YL]

O-S

PRIN

G_B

6J

[YL]

CON

TACT

_B

7K[W

H]C

-LU

G_B

5L[R

D]O

-SPR

ING

_B

6L[R

D]C

ON

TACT

_B

1 9

20

08

/12

/16

INP

UT

1

MS

TA

R N

-EU

EAX

5685

6904

H6

LCD

MER

CURY

PO

P N

OIS

E

MNT_OUT

COMPONENT1

PO

P N

OIS

E

AV1

COM

PON

ENT1

, AV

1, M

NT_

OU

T[JA

CK PA

CK T

YPE

D] : J

K100

S-V

IDE

O(C

hin

a M

od

el)

INP

UT

1 : C

OM

PO

NE

NT

1, S

-VID

EO

Copyright 2009 LG Electronics. Inc. All right reserved. Only for training and service purposes

LGE Internal Use Only

USB_

DN

USB_

DP

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

SIDE

_LIN

SIDE_

RIN

5.6

BZ

D20

3

SIDE_

V

PP

J21

8-0

1JK

201

5C[RD

]CONT

ACT

2C[RD

]U_CA

N

4C[RD

]O_S

PRIN

G2B

[WH]U

_CAN

3B[W

H]C_LU

G2A

[YL]U_

CAN

5A[YL

]CONT

ACT

4A[Y

L]O_S

PRIN

G5

.6B

ZD

202

USB DOWN STREAM

KJA-UB-4-0004

SID

E_U

SB

JK20

4

1 2 3 4

5

IR_O

UT

+3.3V

_MST

TXD

4.7K

R204

ST32

32CD

RIC

200

3C1

-

2V+

4C2

+

1C1

+

6V-

5C2

-

7T2

OUT

8R2

IN9

R2OU

T

10T2

IN

11T1

IN

12R1

OUT

13R1

IN

14T1

OUT

15GN

D

16VC

C

4.7K

R205

RXD

KCN-

DS-1

-008

8JK

200

1 2 3 4 5

6 7 8 9 10

+3.3V

_MST

+5VS

T_MS

T

6630

TGA0

04K

KCN-

DS-1-

0089

JK20

2

1RE

D

2GR

EEN

3BL

UE

4GN

D_1

5DD

C_GN

D

6RE

D_GN

D

7GR

EEN_

GND

8BL

UE_G

ND

9NC

10SY

NC_G

ND

11GN

D_2

12DD

C_DA

TA

13H_

SYNC

14V_

SYNC

15DD

C_CL

OCK

16SH

ILED

SD05

ZD20

0

DSUB

_SDA P

C_VS

SD05

ZD20

1

ENKMC2837-T112

D211

A

AC

C

PC_B

ENKMC2837-T112

D210

A

AC

C

PEJ0

24-0

1JK

203

6BT_

TERM

INAL

2

8SH

IELD_

PLAT

E

7BB_

TERM

INAL

2

5T_

SPRI

NG

4R_

SPRI

NG

7AB_

TERM

INAL

1

6AT_

TERM

INAL

1

3E_

SPRI

NG

DSUB

_SDAPC_A

UD_R

PC_G

DSUB

_SCL

CA

T24

C02

WI-

GT

3IC

20

1

3A

2

2A

1

4V

SS

1A

0

5SD

A

6SC

L

7W

P

8V

CC

ENKMC2837-T112

D212

A

AC

C

DDC_

WP

PC_H

S

PC_A

UD_L

+5V_

MULT

I

DSUB

_SCL

PC_R

CDS3

C30G

TH30

VD2

02 CDS3

C30G

TH30

VD2

03

ADUC

30S0

3010

L_AM

ODIO

DE

30V

D200

ADUC

30S0

3010

L_AM

ODIO

DE

30V

D201

30V

D206

30V

D205

ADUC

30S0

3010

L_AM

ODIO

DE

30V

D204

ADUC

30S0

3010

L_AM

ODIO

DE 30

VD2

09

30V

D20

8

REA

DY

30V

D20

7

REA

DY

USB_

DL_N

USB_

DL_P

0

REA

R_U

SBR

229

0

REA

R_U

SB

R23

0

USB DOWN STREAM

UB01123-4HHS-4F

JK20

5R

EAR

_USB

1 2 3 4

5

0.1u

FC2

03

0.1u

FC2

00

0.1u

FC2

01 0.1u

FC2

02

0.0

1u

FC

205

0.1

uF

C20

40

.1u

FC

206

0.1

uF

C20

7

100

R202

100

R203

75R227

220K

R223

REA

DY

220K

R222

REA

DY

12KR2

26

12K

R228

75R211

75R212

75R213

4.7KR214

4.7K

R215

220K

R231 220K

R232

10K

R233

10K

R234

12K

R235

12K

R236

4.7K

R220

4.7KR2

21

100

R216

100

R217

100

R218

0.1u

FOC

P_RE

ADY

C208

MIC

2009

YM6-T

R OC

P_RE

ADY

IC20

2

3EN

ABLE

2GN

D

4FA

ULT/

1VI

N6

VOUT

5IL

IMIT

10uF

OCP_

READ

YC2

09

120O

HMOC

P_RE

ADY

L200

+5V_

USB

1K OCP_

READ

Y

R209

4.7K

OCP_

READ

YR2

10

0No

n_OC

PR2

37

10uF

6.3V

C210

USB_

DL_N

USB_

DL_P

68R20

7

68R20

8

68pF

C21

3

68pF

C21

1

4.7K

R219

REA

DY

0R20

0

0R20

1

500

L201

22

0uF

16V

C21

2

100

uF16

VC

214

KD

S226

D21

3

OC

P_R

EAD

Y

AA

CC

510

OCP_

READ

YR2

38

160

OCP_

READ

YR2

06

10K

R224

10K

R225IR_O

UT

2 9

INP

UT

2

MS

TA

R N

-EU

20

08

/12

/16

INP

UT

2 :

PC

,RS

-23

2C

,SID

E A

V,U

SB

US

B

EAX

5685

6904

H6

LCD

MER

CURY

Its

pos

sibe

l to

27~4

7ohm

**

1

A D

esi

gn

SID

E A

V

RS-2

32C

(CI IT

EM)

PC ED

ID

PC PC SO

UND

Pin

to

Pin

wit

hE

AN

4343

9401

Clo

se t

o S

IDE

_U

SB



TMDS

3_RX

2-

+5V_

HDMI

_2

TMDS

3_RX

C-

HPD_

MST

_2

TMDS

3_RX

0+

TMDS

2_RX

2-

CEC

TMDS

2_RX

C-TM

DS2_

RXC+

TMDS

1_RX

C-

TMDS

2_RX

0+TM

DS3_

RX0-

TMDS

3_RX

1+

TMDS

3_RX

C+

+5V_

HDMI

_2

HPD_

MST

_1

CEC

TMDS

1_RX

2+

TMDS

2_RX

1+

+5V_

MULT

I

+5V_

HDMI

_1

TMDS

3_RX

2+

TMDS

2_RX

0-

TMDS

1_RX

1-

TMDS

2_RX

1-

TMDS

1_RX

2-

+5V_

HDMI

_3

TMDS

3_RX

1-

+5V_

MULT

I+5

V_HD

MI_3

+5V_

MULT

I+5

V_HD

MI_1

TMDS

1_RX

0-

TMDS

1_RX

1+

CEC

TMDS

1_RX

0+

TMDS

2_RX

2+

TMDS

1_RX

C+

HPD_

MST

_3

DDC_

SDA2

DDC_

SCL2

DDC_

SDA1

DDC_

SCL1

DDC_

SDA3

DDC_

SCL3

JP3

04

JP3

05

JP3

01

JP3

00

JP3

02

JP3

03

2SC3

875S

RT

1C39

04-T

112

Q301

E

B

C

2SC3

875S

RT

1C39

04-T

112

Q300 E

B

C

2SC3

875S R

T1C

3904

-T11

2

Q302 E

B

C

KJA-

ET-0

-003

2 JK

30314

NC

13

CEC

5D

AT

A1_

SHIE

LD

20

JAC

K_G

ND

12

CL

K-

11

CL

K_S

HIE

LD

2D

AT

A2_

SHIE

LD

19

HPD

18

+5V

_PO

WER

10

CLK

+

4D

ATA

1+

1D

ATA

2+

17 D

DC

/CEC

_GN

D

9D

AT

A0-

8D

AT

A0_

SHIE

LD

3D

AT

A2-

16

SDA

7D

ATA

0+

6D

AT

A1-

15

SCL

KDS1

84S

D300

A1

C

A2

KDS1

84S

D301

A1

C

A2

KDS1

84S

D302

A1

C

A2

CA

T24

C02

WI-

GT

3IC

30

1

3A

2

2A

1

4V

SS

1A

0

5SD

A

6SC

L

7W

P

8V

CC

CA

T24

C02

WI-

GT

3IC

30

2

3A

2

2A

1

4V

SS

1A

0

5SD

A

6SC

L

7W

P

8V

CC

CA

T24

C02

WI-

GT

3IC

30

0

3A

2

2A

1

4V

SS

1A

0

5SD

A

6SC

L

7W

P

8V

CC

DDC_

WP

DDC_

WP

DDC_

WP

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

BSS8

3CE

C_RE

ADY

Q303

SBDG

CEC

+3.3V

_MST

CEC_

C

CDS3

C30G

TH30

VCE

C_RE

ADY

D304

MMBD

301LT

1G30

VCE

C_RE

ADY

D303

10K

R301

1KR303

0.0

1u

FC

300

10K

R300

1KR302

100

R329

1KR314

10K

R312

68K

CEC_

READ

YR3

15

0R313

100

R317

100

R318

100

R305

100

R304

0.0

1u

FC

301

100

R331

100

R306

100

R307

0.0

1u

FC

302

100

R327

10K

R308

10K

R310

10K

R309

10K

R311

10K

R319

10K

R320

QJ41

193-C

FEE1

-7FJK

301

1D

ATA

2+

2D

AT

A2_

SHIE

LD

3D

AT

A2-

4D

ATA

1+

5D

AT

A1_

SHIE

LD

6D

AT

A1-

7D

ATA

0+

8D

AT

A0_

SHIE

LD

9D

AT

A0-

10

CLK

+1

1

12

13

14

15

16

17

18

19 20

JAC

K_G

ND

21

.

22

QJ41

193-C

FEE1

-7FJK

302

1D

ATA

2+

2D

AT

A2_

SHIE

LD

3D

AT

A2-

4D

ATA

1+

5D

AT

A1_

SHIE

LD

6D

AT

A1-

7D

ATA

0+

8D

AT

A0_

SHIE

LD

9D

AT

A0-

10

CLK

+1

1

12

13

14

15

16

17

18

19 20

JAC

K_G

ND

21

.

22

56K

CEC_

READ

YR3

16

HD

MI

3 9

MS

TA

R N

-EU

20

08

/12

/16

OP

TIO

N

SW

_H

PD

: U

SE

SW

HP

D (

Def

ault

)M

ST

_H

PD

: U

SE

MS

T H

PD

H6

LCD

MER

CURY

EAX5

6856

904



TXCE

0+,T

XCE0

-,TXC

E1+,T

XCE1

-,TXC

E2+,T

XCE2

-,TXC

E3+,T

XCE3

-,TXC

E4+,T

XCE4

-,TXC

LKE+

,TXC

LKE-

,TXC

LKO+

,TXC

LKO-

,TXC

O0+,T

XCO0

-,TXC

O1+,T

XCO1

-,TXC

O2+,T

XCO2

-,TXC

O3+,T

XCO3

-,TXC

O4+,T

XCO4

-

47pF

C403

22IR

-OUT

R430

470p

FC4

04N

ON

_19_

22_2

6"

KEY1

ZD40

1

120o

hmL4

06N

ON

_19_

22_2

6"

ZD40

2

+5VS

T_MS

T

ZD40

0

500-

ohm

L410

NON_

19_2

2_26

"

IR_O

UT

+3.3V

_MUL

TI_M

ST

10K

IR-O

UTR4

29

2SC3

052

Q405

IR-O

UTE

BC

500-

ohm

L411

NON_

19_2

2_26

"SU

B_SC

L

120o

hmL4

02

KEY2

2SC3

052

Q404

IR-O

UTE

BC

+5VS

T_MS

T

IR

SUB_

SDA

0.1u

FC4

08N

ON

_19_

22_2

6"

+3.3V

_MST

+5VS

T_MS

T

0.1u

FC4

11N

ON

_19_

22_2

6"

470p

FC4

12N

ON

_19_

22_2

6"

120o

hmL4

03N

ON

_19_

22_2

6"

+3.3V

_MUL

TI_M

ST

+3.3V

_MUL

TI_M

ST

+5V_

+12V

_LCD

0.1u

FC4

07RE

ADY

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

47uF 16V

C406

0.1u

F16

VC4

14NO

N_19

_22_

26"

+3.3V

_MST

KEY

2

100

pF50

V

C40

11

9_

22

_2

6"

KEY

1

100

pF50

V

C40

01

9_

22

_2

6"

+5V_

+12V

_LCD

TXCE

0+,T

XCE0

-,TXC

E1+,T

XCE1

-,TXC

E2+,T

XCE2

-,TXC

E3+,T

XCE3

-,TXC

E4+,T

XCE4

-,TXC

LKE+

,TXC

LKE-

,TXC

LKO+

,TXC

LKO-

,TXC

O0+,T

XCO0

-,TXC

O1+,T

XCO1

-,TXC

O2+,T

XCO2

-,TXC

O3+,T

XCO3

-,TXC

O4+,T

XCO4

-

+5V_

+12V

_LCD

+3.3V

_MUL

TI_MS

T

OPC_

EN

E-DI

M

OPC_

OUT

100

pF50

V

C40

5

19

_2

2_

26

"

SUB

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L

100

pF50

V

C40

2

19

_2

2_

26

"

1250

7WS

-12L

P40

0

NO

N_1

9_22

_26"

1SC

L

2SD

A

3G

ND

4K

EY1

5K

EY2

65V

_ST

7G

ND

8W

AR

M_S

T(L

ED_R

_BIG

)

9IR

10

GN

D

11

ST

_3.3

V(L

ED_B

)

12

POW

ER_O

N(L

ED_R

_SM

ALL)

13

.

P40

51

9_

22

_2

6" 1

KEY

1

2K

EY2

3G

ND

45V

_ST

5G

ND

6IR

7L

ED

_B

8L

ED

_R

9

.

BG

1608

B12

1FL

400

19

_2

2_

26

"

BG

1608

B12

1FL

401

19

_2

2_

26

"

BG

1608

B12

1FL

408

19

_2

2_

26

"

BG

1608

B12

1FL

405

19

_2

2_

26

"

4.7K

R420

4.7K

R421

10K

IR-O

UTR4

27

10K

IR-O

UTR4

28

47K

IR-O

UTR4

26

0R

417

NO

N_1

9_22

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0R

400 RE

AD

Y

0

R40

3

NO

N_1

9_22

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0R

413

REA

DY

0R402

8BIT

or 5

2 sh

arp

4.7K

10BI

TR4

01

4.7K

JEID

AR4

07

0R424

VESA

100

R409 RE

AD

Y

0READ

YR4

05

0

OPC

_EN

AB

LER

412

470

R435

OPC_

ENAB

LE

SMA

W20

0-03

P40

41

9_

22

_2

6"

1K

EY1

2K

EY2

3G

ND

120-

ohm

L404

120-

ohm

L407NO

N_19

_22_

26"

TF

05-5

1SP

401

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51

52

FF

10

00

1-3

0P

402

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

31

SMW

200-

28C

P4

03

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28

LE

D_R

+3.3V

_MST

RT1C

3904

-T11

2Q4

00O

PC_E

NA

BLE

EB

C1K

R411

OPC

_EN

AB

LE

10K

R404

19_2

2_26

"

2SC3

052

Q401

19_2

2_26

"E

BC+3

.3V_M

ULTI

_MST 10

KR4

1019

_22_

26"

10K

R414

19_2

2_26

"

2SC3

052

Q402

19_2

2_26

"EB

C+3.3V

_MST

10K

R415

19_2

2_26

"

4.7K

R406

19_2

2_26

"

0RE

ADY

R416

0RE

ADY

R418

0NO

N 22

/27" F

HDR4

190

NON

22/27

" FHD

R422

0NO

N 22

/27" F

HDR4

23

0NO

N 22

/27" F

HDR4

310

NON

22/27

" FHD

R425

TXCO

3+

TXCE

1+

TXCO

1+

TXCE

1-

TXCL

KO+

TXCO

2-TX

CO2+

TXCO

1-

TX

CE

2+

TX

CE

2-

TXC

LKE+

TX

CL

KE

-

TX

CE

3+

TX

CE

3-

TX

CE

4+

TX

CE

4-

TX

CO

3-

TX

CO

4+

TX

CO

4-

TX

CLK

O-

TX

CE

2-

TX

CE

2+

TX

CE

1-

TX

CE

1+

TX

CE

0-

TX

CE

0+

TXC

LKE+

TX

CL

KE

-

TX

CE

3+

TX

CE

3-

TX

CE

3-

TX

CE

3+

TX

CL

KE

-

TXC

LKE+

TX

CE

2-

TX

CE

2+

TX

CE

1-

TX

CE

1+

TX

CE

0-

TX

CE

0+

TXCE

0-TX

CE0+

TXCO

0+TX

CO0-

EAX

5685

6904

H6

LCD

MER

CURY

LV

DS

,CT

R K

EY

4 9

MS

TA

R2

00

8/1

2/1

6

FH

D

X

R402

4.7K

10BI

T(FHD

)X

8BIT

(HD)

X X0

X

32 s

harp

R401

00 X52

sha

rp8B

IT(FH

D)

CO

NT

RO

L K

EY

OPC

_EA

BLE

OPC

_OU

TPU

T

Ex

tern

al V

BR

PA

NE

L W

AF

ER

IR

(19

/22

/26

")

(19

/22

/26

")

HD

(19

/22

")

IR

(No

n 1

9/2

2/2

6)

CO

NT

RO

L K

EY

(Non 1

9/2

2/2

6)

*8B

IT(F

HD):2

2/27"

HD

(26

/32

/37

/42

/47

")



MAI

N_SIF

0.01

uFC5

01

M_SD

A

27pF

C500

+5V_

TUNE

R

TV_M

AIN

M_SC

L

+5V_

TUNE

R

C50

4R

EAD

Y

27pF

C502

10uH

L50

2

REA

DY

82pF

C50

7

REA

DY

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

10uF

16V

C50

8

120-

ohm

L500

REA

DY

ISA1

530A

C1Q5

02E

BC

TA

FT

-H20

3FT

U50

0-*1

NT

SC_T

UN

ER

14

NC

_51

3V

-OU

T

5R

F_A

GC

12

NC

_41

1M

OPL

L_A

S

2G

ND

_1

19

NC

_81

8N

C_7

10

SCL

4N

C_2

1N

C_1

17

NC

_6

9SD

A8

GN

D_2

3+

B[5

V]

16

SIF

-OU

T

7N

C_3

6T

P[3

.3V

_OPT

]

15

A-O

UT

21

SHIE

LD

20

NC

_9

TAFT

-Z20

3DTU

500

PA

L_T

UN

ER 1

4NC_

513

V-OU

T

5RF

_AGC

12NC

_411

MOP

LL_A

S

2GN

D_1

19NC

_818

NC_7

10SC

L

4NC

_2

1NC

_1

17NC

_6

9SD

A8

GND_

2

3+B

[5V]

16SI

F-OU

T

7NC

_3

6TP

[3.3V

_OPT

]

15A-

OUT

21 SHI

ELD20

NC_9

4.7K

R502

220

R506

220

R507

100u

F16

VC5

0510

0uF

16V

C509

100u

F16

VC5

06

120-

ohm

L501

47R5

04

47R5

05

0.1

uF

50V

C50

30L

501-

*1

0 O

hm

TU

NE

R5

9

MS

TA

R2

00

8/1

2/1

6

H6

LCD

MER

CURY

EAX5

6856

904

Ne

ar t

he

pin



0.1u

FC6

44

0.1u

FC6

37

M_SDA

1000

pFC6

06

2200

0pF

C616

2200

0pF

C623

+1.8V

_DVD

D

1000

pF50

VC6

51

0.47

uFC6

32

MULT

I_PW

_SW

0.1u

FC6

05

+1.8V

_DVD

D

0.1u

FC6

15

0.1u

FC6

29AMP_MUTE_HOTEL

+3.3V

_MUL

TI_M

ST

0.1u

FC6

43

DA-8

580

EAP3

8319

001

L607

2S 1S1F2F

0.1u

FC6

17

0.1u

FC6

020.

01uF

C647

SPK_

R+

M_SCL

0.1u

FC6

10

DA-8

580

EAP3

8319

001

L603

2S 1S1F2F

2200

0pF

C611

SPK_

L+

+1.8V

_AVD

D

SPK_

L-0.

1uF

C669

+16V

_NTP

+16V

_NTP

SPK_

R-

100p

FC6

01

2200

0pF

C625

+1.8V

_AVD

D

0.01

uFC6

72

0.01

uFC6

48

1000

pFC6

03

SW_R

ESET

0.47

uFC6

73

0.01

uFC6

71

0.1u

FC6

26

0.01

uFC6

13

330u

F35

VC6

12

THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

SPK_

L-SP

K_R+

+1.8V

_DVD

D

SPK_

R-

SMA

W25

0-04

P60

0

1 2 3 4SP

K_L+

+1.8V

_AVD

D

+1

.8V

I2S_M

CLK

I2S_SDO

I2S_WS

I2S_SCK

390p

FC6

19

390p

FC6

21

390p

FC6

30

390p

FC6

34

1uF

C608

1uF

C618

1uF

C624

1uF

C614

0.1u

F50

VC6

07

10uF

35V

C64

2R

EAD

Y

+12

V_A

UD

IO

MNT

_R_A

MP

+12

V_A

UD

IO

RT

1C39

04-T

112

Q60

0

E

B

C

RT

1C39

04-T

112

Q60

1

E

B

C

MNT

_L_A

MP

0.01

uFC6

35

MNT

_ROU

T

+12

V_A

UD

IO

LM32

4D

IC60

1

3IN

PUT1

+

2IN

PUT1

-

4VC

C

1OU

T1

6IN

PUT2

-

5IN

PUT2

+

7OU

T28

OUT3

9IN

PUT3

-10

INPU

T3+

11GN

D

12IN

PUT4

+

13IN

PUT4

-14

OUT4

6800

pFC

628

6800

pFC

627

MNT

_LOU

T

AUDI

O_R

SPK_

R-_H

OTEL

SPK_

R+_H

OTEL

1250

5WR-

09A0

0HO

TEL_

OPT

P601

1 2 3 4 5 6 7 8 9

10

0.1u

FHO

TEL_

OPT

C636

+16V

_NTP

RT1C

3904

-T11

2HO

TEL_

OPT

Q602

E

BC

AMP_

MUTE

_HOT

EL

+3.3V

_MUL

TI_MS

T SW_R

ESET

10uF

16V

C600

10uF

16V

C604

10uF

16V

C609

3.3

R604

12R608

12R611

12R610

12R638

4.7K

R663

4.7K

R623

3.3

R626

3.3

R625

100

R601

3.3K

R600

100 R676

100

R677

100 R678

100

R602

100

R603

0

R656

HOTEL_OPT

0R6

73

12R658

12R653

12R621

12R654

4.7K

R628

4.7K

R667

3.3

R671

3.3

R635

1KR60

7

10K

NO

N_H

OTE

L_O

PT

R613

12K

HO

TEL_

OPT

R613

-* 5.6K

R614

5.6K

R615

10K

NO

N_H

OTE

L_O

PT

R616

12K

HO

TEL_

OPT

R616

-*

1KR

609

4.7

KR

606

200

HOTE

L_OP

TR6

12

10K

HOTE

L_OP

TR6

17

0HO

TEL_

OPT

R620 0

HO

TEL_

OPT

R619

4.7

KR

605

33pF

C631

33pF

C633

0.1u

FC6

20 0.1u

FC6

22

6.8K

R618

6.8K

R622

NTP-

3100

LIC

600

1BS

T1A

2VD

R1A

3RE

SET

4AD

5DV

SS_1

6VS

S_IO

7CL

K_I

8VD

D_IO

9DG

ND_P

LL

10AG

ND_P

LL

11LF

M

12AV

DD_P

LL

13DV

DD_P

LL

14TE

ST0

15

DVSS_2

16

DVDD

17

SDATA

18

WCK

19

BCK

20

SDA

21

SCL

22

MONITOR_0

23

MONITOR_1

24

MONITOR_2

25

FAULT

26

VDR2B

27

BST2B

28

PGND2B_1

29PG

ND2B

_2

30OU

T2B_

1

31OU

T2B_

2

32PV

DD2B

_1

33PV

DD2B

_2

34PV

DD2A

_1

35PV

DD2A

_2

36OU

T2A_

1

37OU

T2A_

2

38PG

ND2A

_1

39PG

ND2A

_2

40BS

T2A

41VD

R2A

42NC

43

VDR1B

44

BST1B

45

PGND1B_1

46

PGND1B_2

47

OUT1B_1

48

OUT1B_2

49

PVDD1B_1

50

PVDD1B_2

51

PVDD1A_1

52

PVDD1A_2

53

OUT1A_1

54

OUT1A_2

55

PGND1A_1

56

PGND1A_2

MLB

-201

209-

0120

P-N2

0LCM

L000

03B

120-

ohm

L605

MLB

-201

209-

0120

P-N2

0LCM

L000

03B

120-

ohm

L606

33pF

50V

C63

8

REA

DY

33pF

50V

C63

9

REA

DY

+3.3V

_MST

10K

R630 RT

1C39

04-T

112

Q603

E

BC

10K

R629

MULT

I_PW

_SW

0R6

27R

EAD

Y0R6

24R

EAD

Y

22K

R631

REA

DY

SP

K_L

-

H6

LCD

MER

CURY

EAX

5685

6904

AU

DIO

MS

TA

R N

-EU

20

08

/12

/16

6

9

Main

AM

P

AMP :

GAIN

X 4

Chin

ese

Hote

l Opt

ion



THE

SYM

BOL

MAR

K OF

THI

S SCH

EMET

IC D

IAGR

AM IN

CORP

ORAT

ESSP

ECIA

L FE

ATUR

ES IM

PORT

ANT

FOR

PROT

ECTI

ON FR

OM X

-RAD

IATI

ON.

FILR

E AN

D EL

ECTR

ICAL

SHOC

K HA

ZARD

S, W

HEN

SERV

ICIN

G IF

IS

ESSE

NTIA

L THA

T ONL

Y M

ANUF

ATUR

ES SP

ECFI

ED PA

RTS B

E USE

D FO

RTH

E CR

ITIC

AL C

OMPO

NENT

S IN

THE

SYM

BOL

MAR

K OF

THE

SCHE

MET

IC.

MULT

I_PW

_SW

10R8

59

56

AR812

SUB_

SDA

HPD_MST_3

+1.8V

_DDR

COMP

2_PB

RT1C

3904

-T11

2Q8

02E

BC

DDR2

_DQM

0

100 R825

0.04

7uF

C828

KEY1

RL_ON

MX2

5L64

05DM

I-12G

IC80

2

3NC

_1

2VC

C

4NC

_2

1HO

LD

6NC

_4

5NC

_3

7CS

8SO

/SIO

19

WP/A

CC

10GN

D

11NC

_5

12NC

_6

13NC

_7

14NC

_8

15SI

.SIO

016

SCLK

0.01

uFC8

64

0.1uF C882

I2S_SCK

TMDS

2_RX

2-0.

1uF

C833

I2S_MCLK

USB_DN

100

R882

MAI

N_SIFPC_G

100 R8024

33R8

44

10 R801

HDMI3_SIDE

0.04

7uF

C830

PANEL_STATUS

TMDS

2_RX0

+

MNT_

VOUT

_T

TMDS3_RX0+

0.1u

FC8

42

SW_R

ESET

RXD

0.01

uFC8

58

TMDS

2_RX2

+

+3.3V

_MUL

TI_M

ST

0.1uF C813

12MHz

X801

10R8

74

1M

R839

4.7u

FC8

12

RL_O

N

M_SDA

DDC_SDA3

+3.3V

_MUL

TI_M

ST

+3.3V

_MST

MUTE

_LIN

E

EEP_

SCL

E-DIM

SIDE_

RIN

10R8

62

56AR80

5 DDR2

_DQM

1

10 R848

HDMI3_SIDE

EEP_SCL

CEC_C

10uF

C86

6

0.01

uFC8

60

47R8

34

56

AR813

TMDS3_RX1+

SYS_RESET

SPI_CZ

I2S_SDO

0.1u

FC8

15

22K

R842T

MDS2_

RXC+

DDC_SCL1

0.04

7uF

C837

POWER_SW

47R8

32

TMDS

2_RXC

-

+5VS

T_MS

T

0.1u

FC8

48

56AR81

0

10 R841

HDMI3_SIDE

0.1u

FC8

38

+1.2V

_VDD

C_MS

T

+3.3V

_MUL

TI_M

STJT

P-11

27W

EMSW

800

1

2 4

3

MNT_

L_AM

P

0.1

uF

C81

1

MNT_

VOUT

DDR2_CASZ

PANE

L_ON

1000

pFC8

35

0.1u

FC8

49

PC_B

TMDS3_RX2+

+3.3V

_MUL

TI_M

ST

0.04

7uF

C829

DDC_SCL3

DDR2_BA1

DISP

_EN/

VAVS

_ON

DDR2_RASZ

DDR2

_D[0-

15]

TMDS3_RX0-

10R8

54

COMP

2_Y

33

AR818

0.04

7uF

C832

PC_AUD_L

PC_VS

CVBS_LIN

SPI_

DI

402

R807 R

EADY

0.1uF C883

DDR2_BA0

EEP_

SCL

10 R820

HDMI3_SIDE

0.01

uFC8

59

+3.3V

_MUL

TI_M

ST

DDR2

_DQS0

M

SIDE

_LIN

SIDE_

V0.

047u

FC8

31

0.01

uFC8

03

TMDS

2_RX1

+

+1.8V

_DDR

DDC_SDA1

SUB_

SCL

DSUB_SDA

10R8

90

100

R881

CAT2

4WC0

8W-T

IC80

3

3A

2

2A

1

4V

SS

1A

0

5SD

A

6SC

L

7W

P

8V

CC

DDR2_CKE

+12V

_AUD

IO

SPI_CLK

+3.3V

_MUL

TI_M

ST

DDR2

_DQS1

M

0.01

uFC8

07

KDS1

81D8

03

USB_DP

+3.3V

_MST

100 R8025

+3.3V

_MUL

TI_M

ST

56AR80

9

I-DIM

SPI_C

Z

0.1uF C808

0.1u

FC8

04

56 R852

IR

0.01

uFC8

41

EEP_SDA

DDR2

_A[0-

12]

+3.3V

_MUL

TI_M

ST 10 R822HDMI3_SIDE

CVBS

_VIN

10R8

51

DDR2

_DQS

1P

10 R823

HDMI3_SIDE

TMDS3_RXC-

MNT_

VOUT

_T

TMDS

2_RX

0-

+3.3V

_MUL

TI_M

ST

DDR2

_DQS

0P

10 R821

HDMI3_SIDE

10R8

69

47R8

37

DDR2

_MCL

KZ

DDR2_WEZ

TXD

56AR80

6

0.04

7uF

C834

EEP_

SDA

TMDS

1_RXC

+

24LC

256-

I/SM

IC80

1

3A

2

2A

1

4V

SS

1A

0

5SD

A

6SC

L

7W

P

8V

CC

COMP2_R

M_SCL

+3.3V

_MUL

TI_M

ST

PC_HS

TMDS

1_RX

2-

0.01

uFC8

50

+3.3V

_MUL

TI_M

ST

TMDS3_RXC+

47uF

25V

C870

+3.3V

_MUL

TI_M

ST

470

R835

10R8

91

KDS1

81D8

02

TV_M

AIN

1000pF C818

COMP

2_PR

RT1C

3904

-T11

2Q8

04N

ON

19_

22"

EB

C

0.1

uF

C86

7

22K

R845

100 R8026

TMDS3_RX1-

P_24

V_SM

ALL_

15V

0.01uF C840

2.2u

FC8

61

HPD_

MST_

1

10R8

73

10R8

80

SPI_D

O

PC_AUD_R

0.01

uFC8

10

56

AR814

+1.2V

_VDD

C_MS

T

100 R8023

TMDS

2_RX

1-

DDC_SCL2

10R8

58

10R8

92

TMDS

1_RX1

+

10R8

71

TMDS

1_RX2

+

EEP_

SDA

56

AR800

10 R805

HDMI3_SIDE

KDS1

81D8

01

DDR2_ODT

TMDS

1_RXC

-

SPI_DI

I2S_WS

DDR2

_MCL

K

0.04

7uF

C826

TMDS

1_RX

0-

10R8

72

MNT_

R_AM

P

10R8

79

HPD_

MST_

2

0.1u

FC8

53

0.01

uFC8

39

DSUB_SCL

0.01

uFC8

65

COMP2_L

10uF16V C809

+1.8V

_DDR

0.01

uFC8

62

+1.2V

_VDD

C_MS

T

TMDS

1_RX

1-

4.7uF C820

100 R824

100 R829

KEY2

56

AR815

TMDS

1_RX0

+

0.01

uFC8

57

CVBS_RIN

2.2u

FC8

56

0.1u

FC8

69

+5VS

T_MS

T

0.1u

FC8

14

PC_R

SPI_C

LK

33R8

43

0.1uF C844

10R8

56

TMDS3_RX2-

0.01uF C876

DDC_SDA2

SPI_DO

P_12

V_SM

ALL_

15V

+5VS

T_MS

TPO

WER

_DET

POWER_DET

RT

1C39

04-T

112

Q80

3

E

B

C

+5VS

T_MS

T

SYS_

RESE

T

100 R8012

0.01

uFC8

770.

01uF

C878

0.01

uFC8

79

TXD

RXD

0.1uF C863

ISA1

530A

C1Q8

00E

BC

ISA1

530A

C1Q8

01E

BC

2.2

uF

16V

C80

00R

EAD

Y

+3.3V

_MUL

TI_M

ST

0

R806

0 R870

S_VI

DEO_

DET

SIDE_

YSID

E_C

DDC_

WP

Documents

LG 32LH20 Servicemanual