Sh-Semi12-05E

Sh-Semi12-05E

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp

□ Quality equivalent to that of the M705 series, ensuring high quality with low silver content

□ Approx. 30% reduction in production tact time achieved by the SP series

Production efficiency is increased by shorteningthe reflow time.

M40 & M46

M40 & M46 SP series that enables maximum cost reduction

Achieves high quality with low silver contentAchieves quality characteristics equivalent to those of the M705 series by using lower amounts of precious metals, which are rising in price

Does not require profile changesRealizes packaging under the same conditions as those of the M705 series by lowering the melting point, significantly reducing production costs

Enables high-speed printingRealizes solder paste that withstands high-speed printing through the application of ourexpertise in rheology, making a large contribution to the improvement of production efficiency

Enables short time reflow solderingRealizes short reflow time through our outstanding organic synthesis technology, contributing to a significant improvement of production efficiency

Stable production yieldAchieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high production yield

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M40 & M46 SP series that enables maximum cost reductionM40 & M46 SP series that enables maximum cost reduction

Achieves high quality with low silver contentAchieves quality characteristics equivalent to those of the M705 series by using loweramounts of precious metals, which are rising in price

●

Features

□Quality equivalent to that of the M705 series, ensuring high quality with low silver content

y qy q

Stable production yieldAchieves high quality through our long-accumulated comprehensive technical capabilities, ensuring a constant high productionyield

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Specifications

External stress

External stress

Ｍ40＆Ｍ46

90

80

70

60

50

40

30

20

10

00 100 200 300 400 500 600 700 800 900

1Ag M401Ag M401Ag M40

0.3Ag M460.3Ag M460.3Ag M46

3Ag M7053Ag M7053Ag M705

0.3Ag SAC03050.3Ag SAC03050.3Ag SAC0305

Temperature cycle condition: -40 - + 85°C　Hold time: 30 minSubstrate surface treatment: Cu + OSP Mounted component: 3216 chip resistor

Temperature cycle (cyc)

Shear strength (N)

Comparison of thermal fatigue resistance of each alloy

□ Achieves high quality through solid solution strengthening

Compensation is made for strength degradation due to decreased Ag by the effect of solid solution strengthening from the addition of Bi and In.

Pure metal (Sn)Defect

Dislocation, deformation

Solid solution strengthening

Suppresses deformationby incorporating foreign atoms

Transfer condition after high speed printing (150 mm/s)

Ensure high quality,even with a short reflow time

Approx. 45% reduction

Conventional product(Print failure is observed in some dots)

SP series(No print failure is observed)

0.4 mm Pitch BGA Opening 200 um/Mask thickness 100 um

Fine powder Printing condition at 150 mm/s

0.4 mm Pitch BGA Opening 200 um/Mask thickness 100 um

High level rheology technology and fine sphericalpowder has enabled high speed printing.

□ The SP series solder paste capable of high speed printing

□ The SP series solder paste capable of short-time reflow solderingRealizes short reflow time through our outstanding

organic synthesis technology

Conventional Pb-free solderProfile for the SP series

Temperature

Time

Chip component Shield case

Ensures sufficient solderability

Ensures sufficient joint performance

Formation of an interface alloy layerProduction tact time (sec)

0 50 100 150 200 250 300 350 400 450

Currentproduct

M40-SPseries

Printing

Mount Reflow

Mount Reflow

Printing tact timeMounting tact time Reflow tact time

Approx. 30%reduction

Sh-Semi12-06E

Sh-Semi12-06E

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp

□ PoP Packaging using NSV300

NSV300

Transfer paste for 3D PoP (Package of Package)packaging M705- NSV300

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Possesses excellent transferability and significantly reduces contact non-wet failures in ball-to-ball stackingAccommodates PoP and TMV packaging and realizes excellent solderabilityRobust against warping, achieves higher performance than that of conventional products while being halogen-free

Transfer paste for 3D PoP (Package of Package)Transfer paste for 3D PoP (Package of Package)packaging M705- NSV300packaging M705 NSV300

● Possesses excellent transferability and significantly reduces

Features

● Robust against warping, achieves higher performance than that of conventional products while being halogen-free

Specifications

Solves contact non-wet failures in ball-to-ball stacking

□ NSV300 provides excellent solder transfer in specific amounts

□ Realizes 0% contact non-wet failure rate through the intervention of NSV300

Solder paste

Flux

Heating

Heating

Joint with flux intervention Contact non-wet failure rate = 2%

Joint with NSV intervention Contact non-wet failure rate = 0%

Transfer1 Transfer2 Transfer3

Transfer1 Transfer2 Transfer3 Mount JointPrint

Mount JointPrint

Insufficient solder amount

Conventionalproduct

Contact non-wetfailures are observed

NSV300Contact non-wet

failures are ignificantly reduced

NSV300intervention

Fluxintervention

Solder printing paste lacking transferability

NSV300 with excellent transferability

Sufficient solder amount

Contact non-wet pastContact non-wet pastContact non-wet past

Sh-Semi12-07E

Sh-Semi12-07E

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp

□ Automatically mounts chip solder, which melts simultaneously with solder paste

□ For reinforcement of reflow solder joints of through-hole components

□ For joint reinforcement of large components

Air enters when the suction ace is curved,weakening the suction force.

No air enters when the suctionface is flat and the suction face is strong.

Printing Joint with an insufficientamount of solder

Chip solder

"Chip solder" for lands where a lack of solder is anticipatedChip solder for lands where a lack of solder is anticipated"Chip solder" for lands where a lack of solder is anticipated

Features

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They come in tape and reel packaging which allows simultaneous automatic placement on surface mount devices.Melts in tandem with solder paste, requiring no additional solderingProvides an appropriate amount of solder to ensure high connection reliability

□ Automatically mounts chip solder, which melts simultaneously with solder paste

y py □ For joint reinforcement of large components

● Provides an appropriate amount of solder to ensure high connection reliability

Specifications

y

Solder pasteprinting

Componentmounting

Reflow Chip solder

Chip soldermounting

Solder pasteprinting

Componentmounting

Reflow

Componentmounting

Land Solder paste

Solder pasteprinting

LargeLargecomponentcomponentLarge

component

Chip solder

Solderingcomplete

Solder is supplemented with chip solder Solder is supplemented with chip solder

□ For joint reinforcement of shield cases

l

±0.05

±0.05

±0.1

±0.1

±0.1

0402

05025

0603

1005

1608

±0.05

±0.05

±0.1

±0.1

±0.1

w

±0.05

±0.05

±0.05

±0.05

±0.05

t

□ Improves mounting precision by smoothing the suction face

Chip solder

Air Air

Chip solder witha smoothsuction face

Smoothing of thesuction face

Improvement ofmounting precision

* Smooth suction face design is available in sizes smaller than the 0603-size type* Patent pending

□ Chip solder dimension tolerance(unit: mm)

Conventional methodJoint with an insufficientamount of solder

Solder

Shield case

Solderpaste

Printing + mounting Joint with a sufficientamount of solder

SolderChipsolder

Shield caseJoint with a sufficientamount of solder

Conventional method

Solder paste Inserted component

Printing ReflowPrinting Joint with an insufficient amount of solder

Joint with aninsufficient amount

of solder

Chip solder Solder paste Inserted component

Printing + mountingSolder paste

Printing + mounting Reflow Joint with a sufficientamount of solder

Joint with a sufficientamount of solder

Reflow

Reflow

Solderpaste

The 0402 size type is available for those devices where minimal solder connection is expected.

Sh-Semi12-01E

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp

Sh-Semi12-01E

M53

□ Ensures strength even on a small surface

Surface area (mm2)

□ Comparison of thermal fatigue resistance using a chip capacitorShear strength (N)

□ Comparison of cross sectional photographs

3000cyc

Chip

ChipChip

3000cyc

Chip

□ Comparison of thermal fatigue resistance using a chip resistor Using a 3216 chip resistor and a large-sized pattern Using a 3216 chip resistor and a medium-sized pattern

Using a 3216 chip resistor and small-, medium- and large-sized patterns

M53 series solder paste that is capable of being applied tosmall-sized and lightweight on-board products

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Features

Exhibits superior thermal fatigue resistance and maintains high bond strength even under severe environmentsPrevents crack propagation due to thermal fatigue and maintains electrical conductivity after long term useEnsures high quality even in products with small-sized and lightweight designs having small land areas

Shear strength (N)

□ Comparison of thermal fatigue resistance using a chip capacitor□ Comparison of thermal fatigue resistance using a chip resistorUsing a 3216 chip resistor and a large-sized pattern Using a 3216 chip resistor and a medium-sized pattern

● Ensures high quality even in products with small-sized and lightweight designs having small land areas

Specifications

Larger structurecompared to that of

SAC305

Shear strength (N)

Temperature cycle (cyc.)M53 containing Bi and In exhibits a much lower decrease in

strength compared to SAC305

90

80

70

60

50

40

30

20

10

0

M53M53M53

TCT;-40/+124℃(30min)

450040003500300025002000150010005000

SAC305SAC305SAC305

Temperature cycle (cyc.)M53 containing Bi and In maintains superior shear strength

compared to SAC305

TCT;-40/+124℃(30min)

3500300025002000150010005000

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0

M53M53M53

SAC305SAC305SAC305

1

L M S

TCT;-40/+125℃（30min)15225335

90.0

80.0

70.0

60.0

50.0

40.0

30.0

20.0

10.0

0.0

M53 InM53 InM53 In

M53 3000cyc.M53 3000cyc.M53 3000cyc.

SAC305 3000cyc.SAC305 3000cyc.

SAC305 InSAC305 InSAC305 In

SAC305 3000cyc.SAC305 3000cyc.SAC305 3000cyc.

SAC305 M53

Initial stage

Temperaturecycle

Crack has grownduring soldering

Solder alloy with greater strength and stress relaxation properties

Temperaturecycle

No cracks

Initialstage

Sh-Semi12-04E

Sh-Semi12-04E

Headquarters:Senju Hashido-cho 23, Adachi-ku, Tokyo 120-8555, Japan Phone:(81)3-3888-5151, Fax:(81)3-3870-3032 www.senju-m.co.jp

□ Cracks on flux become the cause of migration

Ion migration

Crack

Water passage in cracksor breakage

Migration

Migration

Short circuit dueto migration

Water passage is formedin cracks or breakage

Water

Voltageapplication

Dewcondensation

Flux residueTemperature

cycle

Cracks or breaking occur

Occurrence of cracksor breakage

Solder

Soldering

Features

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● No cracking of flux residue occurs even under environment with rapid temperature changes, such as in on-board equipment.Flux residue with high adhesiveness and water repellency prevents the occurrence of migration.Excellent for laser soldering, prevents flux spattering peculiar to laser soldering

MACROS

"MACROS" that prevents migration

□ Cracks on flux become the cause of migration

Water passage in cracksFl id

● Excellent for laser soldering, prevents flux spattering peculiar to laser soldering

Specifications

Flux scattering is preventedby viscosity suppression.

Ion migrationIon migrationIon migration

CrackCrackCrackFlux residueFlux residueFlux residue

When condensed water remains,ion migration easily occurs.

1.00E+04

1.00E+06

1.00E+08

1.00E+10

1.00E+12

1.00E+14

0 2 4 6 8 10

MACROS

[Test condition]

Temperature: 121°C

Humidity: 100% RH

Atmospheric pressure: 2 atm

Applied voltage: 50 V

Measuring voltage: 100 V

Measurement time: every 0.5 h

Applied voltage mode: DC

MACROS

□ Comparison of flux scatteringin laser soldering

Insu

latio

n re

sist

ance

[Ω]

Time [h]

□ Provides good break-off, ensuring good drag soldering

MACROS

Conventional product

Substrate only (Blank)

Conventional product

Conventional product

Migration does not occur becausewater does not penetrate easily.

Migration occurs in a short periodof time because water penetrates easily.

MACROS MACROS

□ SMIC has developed MACROS, which prevents the occurrence of cracks in flux residue during temperature cycle tests.

JIS Grade A product

Temperature cycle test ; -30℃/110℃　2000cyc．

No cracks

Cracks

Water drop test 5 V of voltage applied

JIS Grade A product

□ Ion migration did not occur during a water drop test with when using MACROS.

Ion migration occurs at cracks. No cracks or ion migration occur