Features Application

• Chip Material : AlGaAs

• Chip Dimension : 1000um * 1000um

• Number of Chips : 3pcs

• Peak Wavelength : 850nm typ.

• Lead Frame Die : Silver Plated on Copper

• Package Resin : PA9T

• Lens : Silicone Resin

• Infrared Illumination for Cameras

• Machine Vision System

Data Sheet

SMBB850DS-3100S-I

anode

5AnodeMark

1

land pattern for solder

a1

5

c1

6

3.62

cathode

4.2

4.6

3.62

heatsink

5.2

5.2

6

heat

sin

kc1

a1

850nm High Power TOP LED

(Unit : mm)

Outline and Internal Circuit

PRELIMINARY

Data Sheet SMBB850DS-3100S-I

USHIO EPITEX INC.

www.epitex.com

Absolute Maximum Ratings (Tc=25°C)

‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us.

‡Soldering condition : Soldering condition must be completed with 5 seconds at 250°C.

Optical and Electrical Characteristics (Tc=25°C)

Parameter Symbol Min Typ Max Unit Test Condition

Forward Voltage

VF 9.6 (12.6)

V

IF=1A

VFP 12 IFP=3A

Total Radiated Power PO

4000

mW

IF=1A

10000 IFP=3A

Peak Wavelength λp 840 865 nm IF=1A

Half Width ∆λ 33 nm IF=1A

Rise Time tr 30 ns IF=1A

Fall Time tf 30 ns IF=1A

‡Radiated Power is measured by S3584-08.

‡Radiant Intensity is measured by CIE127-2007 Condition B.

Item Symbol Ratings Unit

Power Dissipation PD 13 W

Forward Current IF 1000 mA

Pulse Forward Current IFP (5000) mA

Reverse Voltage VR 15 V

Thermal Resistance Rthja 5 K/W

Junction Temperature Tj 130 °C

Operating Temperature Topr -40 ~ +100 °C

Storage Temperature Tstg -40 ~ +100 °C

Soldering Temperature TSOL 250 °C

Data Sheet SMBB850DS-3100S-I

USHIO EPITEX INC.

www.epitex.com

102

2

3

4

5

6

7

89

103

2

3

4

5

6

7

89

104

Forw

ard

Curr

ent Ifp [m

A]

100

101

102

103

104

105

106

Duration tw [µµµµs]

10kH

z

1kH

z

100H

z

10H

z

Forward Current - Pulse Duration

0.0001

0.001

0.01

0.1

1

10

Rela

tive R

adia

nt In

tensity (A

.U.)

1 10 100 1000

Forward Current (mA)

(ta=25°C, tw=10µµµµs, Duty=1%)

1000mA Standard

Relative Radiant Intensity - Forward Current

100

101

102

103

104

Forw

ard

Curr

ent (m

A)

1514131211109876

Forward Voltage (V)

(ta=25°C, tw=10µµµµs, Duty=1%)

Forward Curent - Forward Voltage

1200

1100

1000

900

800

700

600

500

400

300

200

100

0

Allow

able

Forw

ard

Curr

ent(m

A)

100806040200

Ambient Temperature (°C)

Allowable Forward Current -Ambient Temperature

Rthja=5K/W

Typical Characteristic Curves

Data Sheet SMBB850DS-3100S-I

USHIO EPITEX INC.

www.epitex.com

900

890

880

870

860

850

840

830

820

810

800

Peak W

avele

ngth

(nm

)

100806040200

Ambient Temperature (°C)

Peak Wavelength -Ambient Temperature

If=1000mA

0.1

2

3

4

5

6

7

89

1

2

3

4

5

6

7

89

10

Rela

tive R

adia

nt In

tensity (A

.U.)

100806040200

Ambient Temperature (°C)

If=1000mA

Relative Radiant Intensity -Ambient Temperature

10.6

10.4

10.2

10.0

9.8

9.6

9.4

9.2

9.0

8.8

8.6

Forw

ard

Voltage (V

)

100806040200

Ambient Temperatture (°C)

If=1000mA

Forward Voltage -Ambient Temperture

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

Rela

tive R

adia

nt In

tensity (A

.U.)

950900850800750

Wavelength (nm)

(ta=25°C)

Relative Spectral Emission

Data Sheet SMBB850DS-3100S-I

USHIO EPITEX INC.

www.epitex.com

Wrapping

Moisture barrier bag aluminum laminated film with a desiccant to keep out the moisture absorption

during the transportation and storage.

SMD LED storage and handling precautions

Storage Conditions before Opening a Moisture-Barrier Aluminum Bag

� Before opening a moisture-barrier aluminum bag, please store it at <30ºC, <60%RH.

� Please note that the maximum shelf life is 12 months under these conditions.

Storage Conditions after Opening a Moisture-Barrier Aluminum Bag

� After opening a moisture-barrier aluminum bag, store the aluminum bag and silica gel in a

desiccator.

� After opening the bag, please solder the LEDs within 72 hours in a room with 5 - 30ºC, <50%RH.

� Please put any unused, remaining LEDs and silica gel back in the same aluminum bag and then

vacuum-seal the bag.

� It is recommended to keep the re-sealed bag in a desiccator at <30%RH.

� The 72-hour- long floor life does not include the time while LEDs are stored in the

moisture-barrier aluminum bag. However, we strongly recommend to solder the LEDs as soon as

possible after opening the aluminum bag

Notes about Re-sealing a Moisture-Barrier Aluminum Bag

� When vacuum-sealing an opened aluminum bag, if you find the moisture-indicator of the silica

gel has changed to pink from blue (indicating a relative humidity of 30 % or more), please do not

use the unused LEDs, the aluminum bag, or the silica gel.

Notes about Opening a Re-sealed Moisture-Barrier Aluminum Bag

� When opening a vacuumed and re-sealed aluminum bag in order to use the remaining LEDs

stored in the bag, if you find that the moisture-indicator of the silica has changed to pink, please

do not use the LEDs.

Data Sheet SMBB850DS-3100S-I

USHIO EPITEX INC.

www.epitex.com

Disclaimer

Product specifications and data shown in this product catalog are subject to change without notice for the

purposes of improving product performance, reliability, design, or otherwise.

Product data and parameters in this catalog are typical values based on reasonably up-to-date measurements.

Product data and parameters may vary by user application and over time.

Products shown in this catalog are intended to be used for general electronic equipment. Products are not

guaranteed for applications where product malfunction or failure may cause personal injury or death, including

but not limited to life-supporting / saving devices, medical devices, safety devices, airplanes, aerospace

equipment, automobiles, traffic control systems, and nuclear reactor control systems.

2016.05

*Effective June 2015, Epitex Inc. is now Ushio Epitex Inc.