Plasma Display Panel

1. Plasma Display Panel Process 1. Glass , Panel Ne + Xe + . 2. . 3. Plasma (R,G,B) / . Barrier Rib(Front Glass Substrate)Sustain ElectrodeDielectric LayerProtection Layer(MgO)Dielectric Layer Bus ElectrodeUnder LayerPhosphor(R,G,B)Address Electrode(Back Glass Substrate) AC PDP Glass Plasma , Condenser Glass Address , Coating Align Gas Panel Module , , . PlasmaUVPhosphor(R,G,B)Barrier RibVisible LightAddress ElectrodeBack Glass SubstrateSustain ElectrodeDielectric LayerProtection Layer(MgO)Dielectric LayerVisible Light Bus ElectrodeUnder LayerFront Glass Substrate Front Glass 90 1/22

1. Plasma Display Panel ProcessPDP Assy PANELMODULEDriver CircuitMemorySignal Control CircuitGlass2/22

1. Plasma Display Panel ProcessPDP photolithography Plasma .PR/ / BUS ElectrodeFront GlassSustain Electrode Condenser Coating.Dielectric LayerSeal Frit Glass .DispensingSeal 2 MgO . MgO ProtectionLayer(MgO) Address .// // Dielectric LayerBack GlassAddress ElectrodeUnder Layer Cross talk 100 Sandblast . / Film / SandblastBarrier Rib R,G,B Strip . R/ G/B/Phosphor(R,G,B) Glass Align. AlignClampingFront GlassBack GlassSealing/GAS Panel , 500Torr . GAS Front GlassBack Glass /AgingMgO .TESTSET Module Panel . SolderingInterconnection3/22

1-1. AC PDP 4/22FireCoat MgO Depo.DFR Lami.CoatCleaningFireFirePR CoatingDryDryExposeStrip Glass () SealDispense ExposeDevelopEtch/StripDryDevelopSandblast Data CoatExposeDevelopFire RibGlassDryRepairP.FireSputteringCoatDry ()Cleaning GlassGlassDry(R)ExposeDevelopExposeCoat(G)Dry(G)DevelopCoat(R)Coat(B)ExposeDevelopFireDry(B)FireFireDryCoatingCoatDryDryCoatExposeDevelopRepairP.Fire

1-2. AC PDP SealingAging/Gas //GasAGING/ P.CheckPad Cut,5/22

1-3. AC PDP Module ModuleDryCASEModuleModule AgingFPCDry PCBIC 6/22

2-1. Process (Front Plate)(Back Plate)1. (Sustain): AC PDP Cell , . BUS . ,. ITO(Indium Tin Oxide) - Sputter( ) - Ion Plating. - . SnO2(:NESA) - (CVD) (Sustain) ITO(Indium Tin Oxide) - Photoetching - Liftoff SnO2(NESA) - Liftoff - Photoetching2. BUS: BUS .AC PDP BUS , Data Writing Data() . Uniformity Matching Cr/Cu/Cr,Cr/Al/Cr - Sputter Paste(Ag) - , Coating Paste(Ag) - Pattern BUS Cr/Cu/Cr,Cr/Al/Cr - Photoetching - Liftoff Paste. - Photo. Paste. - Direct Pattern.1. Address(Data ) : Data writing. - BUS . 7/22

Acid EtchingPhotoresist Roll GlassPR(Photoresist)Backup RollCoating RollDuct RollPRUV(365nm).Photomask1. PR Coating2. 3. 4. SnO2 ( )5. Photoresist PR(Photoresist)PR(Photoresist)1. ITO (Sputter)Roll GlassBackup RollCoating RollDuct Roll2. PR CoatingITO(000~0000)Glass3. PRUV(365nm).PhotomaskPR(Photoresist)ITO 4. PR(Photoresist)5. Etch/StripITO 2-1. Process8/22

BUS (UV)PASTE EtchingPost Baking/Pre Baking PR Strip, Coating SqueezerPasteScreen MaskAgUV(365nm).Photomask 2-1. Process9/22GlassCr/Cu/CrPR Coating

Barrier Rib Screen Printing Sandblasting Method Squeezing MethodPhotolithograpy Method Direct EtchingGlass Paste Screen Printing Repetition (10 ~ 15 times)Glass Paste Dry Film Resist Laminating Exposure/DevelopResist Sandblasting Thick Layer Resist Exposure/Develop Squeezing Glass Paste into grooves StripPhotosensitive Glass Paste Exposure Develop Glass PastePhotoresistCoating &Exposure Develop/Etch Photoresist2-2. Barrier Rib ProcessStrip10/22Glass Red, Green, Blue Strip

FlowProcess , , ,, Condenser ScreenDry FilmGlass Paste(*,)Glass GreenSheet(,)* : Matching : ,2-3. Process27 Binder Burn-Out (, ) Process FlowLaminatorGlass11/22

Dry Film D/F Laminating Printing (23)Process Cost Cost Laminator D/F Laminating1: ITO 2: RollGlass 2-3. Process12/22Dry Film

Paste Screen Mask Glass Screen MaskPaste ,Address,White Back,Rib, Rib, , B/M PDP PDP . 1. 2. MechanismS/QPasteS/Q(Squeezer) Paste .Screen Mask SUS SUS Paste . , Paste, Screen Mask 3 .Screen Mask Screen ( Mechanism )Screen Mesh Paste ( Mechanism )S/Q Screen Paste . ( Leveling/ Mechanism ) LevelingPaste Rolling Mechanism 2-3. Process13/22

Process ,, PastePatternR,G,BAg Paste* R,G,B Paste-Dry FilmR,G,BGreen Sheet VUV Patterning ( / ) Leveling Binder Burn-Out Process FlowPhosphorGlassElectrode R, G , B3 Sqeeze RubberPattern Screen MaskBarrier Rib2-4. Process Flow14/22

(Life time) . . () EB, Sputter, Ion plating,

Power (, ), , Aging , (Seal) Pumping , Aging Aging (,,,) outgassing Crack Ion () 2-5. Process( Sputter) 2 Sealing / No. Panel 12345 Panel , 2 .15/22

2-6. Seal// ProcessProcess Flow Flow Process / Glass Plasma Gas Seal, / . Seal Heater, Pump Gas . MgO SealTip-off AlignAgingGasSeal///Seal 16/22

2-6. Seal// ProcessProcess . Seal Frit Ring . => 000~000 Process / Align Key Clipping Align Seal// . Gas Frit Ring .ClippingProcess / Glass Align Key . / Glass Align Key . Align . Clip . Clip => 0.0 ~ 0.0 Kgf/cm2 /, / Align . Align => X 000, Y 000 & Gas Glass Frit Ring . / Clip( ) Frit Ring Seal17/22

2-6. Seal// ProcessProcess Panel Gas . Tip-off Panel Panel Aging . Sustain Pulse Cell Gas . * => , , , Process Process / Gas Panel . * => ~ 10-7 Torr Panel Gas . Gas Panel . * => Gas (He, Ne, Xe.), Panel Gas . Aging Panel . * / => , , (Open, Short, Cell Defect) / / Gas Torch Aging Aging Tester 18/22

Gas Panel PDP ProcessACF 2-7. Process Module FPC ModulePanelFPC000,00Kgf/ panel 000,00Kgf/ FPC ACF Head Head FPC *)ACF*) FPC Panel

Module 19/22*) ACF : Anisotropic Conducting Film FPC : Flexible Print Circuit

PCBFPCPanelACF : Anisotropic Conductive Film( Film) Au Coating Ni Ball Film. 150C FPC Glass . Panel . Aging Panel .2-7. Process Module FPC : Flexible Printed Circuit Polymide Pattern Film . Panel .20/22

3. PDP Process Tool Paste Photo-Etching ResistPhoto-MaskTargetDC Sputter Resist (roll, coater, laminator,)Etching Resist Paste Photolithography PastePhoto Mask Paste MgO Source 21/22

Process Tool Paste Additive (Photo-)Dry . FilmPastePhoto MaskDry . Film laminator Paste Dry Film Paste Photolithography PastePhoto MaskPasteSand Blaster PasteDry . FilmPhoto Mask Paste laminatorSand Blaster MachineDry Film 3. PDP 22/22