Quality Reliability Technology - qrtkr.com · Engine control system Transmission Fuel injection Fuel pump ... EV 1 NG parts 0 JESD22 ... SCR 3 DP 10 3 Note B

Quality Reliability Technology

QRT

www.qrtkr.com 3

VISION

QRT

QRT()()SKHynix

QRT()

QRT()QRT() QRT()

Operating Life & Environmental Reliability Test

Physical & Mechanical Test

Electrical Stress Test

Failure Analysis

FIB(Focused Ion Beam)Solution

Material Analysis

Training & Consulting

/

/

/ ESD EMI EOS

- /

FIB

/

&

(HTOL)(THB)(T/C)/(HTSL/LTSL)/

EMC

CEO Message Business Part

QRT()

Quality Reliability Technology www.qrtkr.com4 5

FIB

&

X(X-Ray)

(SAT/SAM)

(Curve Tracing)

Decapsulation(Decap)

Chip Delayering

Cross Section

Crack

PCB

-

-

-

-

-

TEM

//

(SEM)

(EDS)

EMMl(PHEMOS/THEMOS)

Dye & Pry

(Optical Scope)

(FE-SEM)(Dual FIB)(TEM)(EDS)

(EELS)

(AFM)(TOF-SIMS)

(AES)X(XPS)X(XRD)

(GC)(GC-MS)

(FT-IR) /(UV/VIS)

(ICP-OES)(ICP-MS)

X(XRF) (IC)

Metal Cut/Deposition

Insulation Cut/Deposition

(Training)

(Consulting)

(Factory Audit)

Remarks

Service Items JEDEC/MIL/AEC/ES(QR)

/

(ELFR)

/(HTOL/LTOL)

/ (HTGB/HTRB)

(Flash)

(VIB)

(CERT)

(HALT)

(MS)

/(Drop)

- IEC, ISO

- JEDEC, AEC, MIL-STD

- ES, GMOEM

()

()

- IEC, ISO


- ES, GMOEM

UTM///

- Die, Wire Bonding

- PKG Body, Lead, Solder Ball

- PCB, Module

- IEC, ISO


- ES, GMOEM

(Solder Joint)

- IPC, JEDEC

(MSL)

(Preconditioning)

/(HTSL/LTSL)

/(THB/THS)

(TC)

(PTC)

(Liquid TS)

(HAST/uHAST)

(PCT)

///

(Board Level Drop/Bending/TC/VIS)

/(Shear/Tensile)

/(Torque/Twist/Bending)

/(SD/RSH)

/

/

Remarks

ESD/EOS/IC-EMI

ESD(HBM/MM/CDM)

(Latch-up)

ESD(Gun-ESD)

(EOS)

(IC-EMI)


AEC Standards & OEM Specification

AEC-Q100Integrated Circuits

AEC-Q101Discrete Semiconductors

AEC-Q200Passive Components

JEDEC, AEC-Q100,101,200, OEM in-house spec.

AEC-Q101Discrete Semiconductors

AEC-Q200Passive Components

AEC-Q100Integrated Circuits

Component LevelQualification

Automotive LevelMechanical Durability

Sub. System LevelQualification

Driver informationDashboard displayCar navigation

ChassisPower steeringBrakingVDM

Body electricalsIBCMCAN gatewayLight controls

SecurityImmobilizerCar alarm

PowertrainEngine control systemTransmissionFuel injectionFuel pump

SafetyAirbagsSeat occupation detectionPedestrian protectionNight visionTire air pressure detection

Ultracapacitors

Hydtogen tanks

Electric motor

Power Control Unit

Fuel cell system box

Fuel cell stack

Powertrain radiator

Fuel cell systemradiator

Automotive Electronics Quali cation

OEM Components Qualification SpecificationES95400 / ES95910 / ES90000 Series and etc


AEC-Q100 (IC) , 4

. , Target

.

AEC-Q101 FET, Diode, IGBT, Transistor

(Discrete Components) .

.

AEC Q100 AEC Q101

Qualification Test Definitions for Discrete Semiconductors

Qualification Test Flow for Integrated Circuits

-40 to +125 discrete semiconductors except for LEDs

-40 to +85 all LEDs

Grade 0 -40 to +150

Grade 1 -40 to +125

Grade 2 -40 to +105

Grade 3 -40 to +85

Stress Abrv Datatype NoteSample

Sizeper lot

# oflots

Accepton #

failed

Reference(currentrevision)

1

Pre- and Post-Stress Electrical

Test

TEST 1 NGparts tested per therequirements of the

appropriate part0

User

suppliersstandard

Test is performed as specifi ed in the applicable stress reference at room temperature.

2 Pre- PC 1 GS parts before Test # 7,8, 9, & 10.

0 JESD22A-113

Performed on surface mount parts (SMDs) prior to Test #

Any replacement of parts must be reported.

3 External Visual EV 1 NG parts 0JESD22B-101 marking and workmanship.

4 Parametric PV 1 N 25 3Note A 0Individual AEC over the part temperature range to insure

5High

TemperatureReverse Bias

HTRB 1 CDGKUVPX 773

Note B 0MIL-STD-750-1

M1038 Method A

1000 hours at the maximum DC Reverse Voltage rated

The ambient temperature TA is to be adjusted

HTRB as a minimum. (See note X HTRB.)To be implemented on, or before, April 1, 2014.

27 Dielectric Integrity DI 3 DM 5 1 0AEC-Q101-004

Pre- & Post-process change comparison to evaluate process change robustness.All parts must exceed gate breakdown voltage minimum (Power MOS & IGBT only).

28

Short CircuitReliability

Characteriza- SCR 3 DP 103

Note B 0 AEC-Q101-006 For smart power parts only.

29 Lead Free LF 3 - - - AEC-Q005For all related solderability, solder heat resistance and whisker requirements.To be implemented on, or before, April 1, 2014.

Transistor

LED


Grade Level Ambient Operating Temp. Range Minimum Temp. Range

QUALIFICATION TEST DEFINITIONS

Discrete Semiconductor Type

AEC-Q100(IC)4

AEC-Q101FET, Diode, IGBT, Transistor(Discrete Components)

FAB


AEC .

. () AEC

, Full Coverage Qualification Service .

() , AEC-Q Standard

, , .

, Lab, .

AEC Qualification Test , 1:1

One Stop Service .

0 -50 to +150 Flat chip ceramic Resistors, X8R ceramic capacitors

1 -40 to +125Capacitor Networks, Resistors, Inductors, Transformers, Thermistors, Resonators, Crystals and Varistors, all other ceramic and tantalum capacitors

2 -40 to +105

3 -40 to +85Film capacitors, Ferrites, R/R-C Networks and Trimmer capacitors

Stress NO. Note Sample Size Per LotNumberof lots

Accept onNumber

failedPre-and Post-StressElectrical Test 1 G 0

High TemperatureExposure 3 DG

77Note B 1 0

Temperature Cycling 4 DG 77Note B 1 0

Analysis 5 DG77

Note B 1 0

Shear Strength 31 DG 30 1 0

Short Circuit FaultCurrent Durability 32 DG 30 1 0

Fault Current Durability 33 DG 30 1 0

End-of-Life Mode 34 DG 30 1 0

Jump Start Endurance 35 DG 30 1 0

Load Dump Endurance 36 DG 30 1 0

Inductor

Resistor

Capacitor

() AEC Standard Full Coverage ServiceAEC-Q200 Capacitor, Inductor, Resistor . , Flammability, Lead

Integrity .

Qualification Test Definitions for Passive Components

AEC Q200


Grade Temp. Range Passive Component Type

QUALIFICATION SAMPLE SIZE REQUIREMENTS

AEC-Q200Capacitor. Inductor. ResistorFlammability, Lead Integrity

AECQRTAECFull Coverage Qualification Service

QRTAEC-Q Standard Lab1:1 One Stop ServiceAEC Qualification Test

QRTAEC Standard Full Coverage Service


Semiconductor & Electronic Component

Smart Appliance

Smartphone

Internet of Things (IOT)

Smart Medical System

Wearable Device

Aerospace/Defense

ICT

ISO26262OEM

ES(Sequencial Test)36524Functional Test

ES90000-01 Inspection of Solder Joint

ES90000-04 Reliability Tests for Pb-free Soldering

ES90000-02 Delamination Inspection for Mounted Part

ES90000-03 Reliability Test for bare PCB

ES90000-05 Highly Accelerated Life Test

ES95400-10 Environmental Tests for Electronic EquipmentES95910-93 Environmental Tests for Air Bag System

/

ES


One-Stop

Failure Analysis Service

(Material Analysis)

LED Quantum Well Stucture_TEM Nano Cellulose_FE-SEM Bump Grain Orientation_Dual FIB

Micro Structure Analysis

Organic Analysis

FE-SEM Analysis Dual FIB Analysis TEM Analysis EDS Analysis EELS Analysis

GC Analysis GC-MS Analysis FT-IR Analysis UV/VIS Analysis

AFM Analysis TOF-SIMS Analysis AES Analysis XPS Analysis XRD Analysis

ICP-OES Analysis ICP-MS Analysis XRF Analysis IC Analysis

Surface Analysis

Inorganic Analysis

SMT / PCB Analysis

PCB

Material Analysis

FIB Circuit Edit

Electronic Components / Parts Analysis

Reverse Engineering

Solderability Test

FAILURE ANALYSISSERVICE


/ Training(on-site)()

S

/

(6 sigma/TPM/SPC etc.)

(ISO 9000/9001, KOLAS, ISO 26262 etc.)

/ /

(etc.)

()

12()

- (ww.smtech.go.kr)

- www.smtech.go.kr

- (12)

: +82-31-8094-8253 [email protected]

: +82-31-8094-8251 [email protected]

/ Consulting

/ Factory Audit

Training and Consulting National Support Project

(7)

70% (7,000)

30%()

100%

(7)

60%(7,000)

40%()

100%

(on-site)

Money

Time

Quality

www.smtech.go.kr()

(16)

(http://sminfo.smba.go.kr/)

()

* NET()NEP()

*

()

National Support ProjectNational Support ProjectNational Support ProjectNational Support Project

1,000 600(60%/) + 400(40%/)


(AEC/JEDEC/OEM Specification)

Service Procedure / Accreditation Location & Contact Point

QRT20042009KOLASQRT

QRT

60~70%(www.smtech.ga.kr)

QRTIPC(Institute for Printed Circuits : )IPC-A-610 (Acceptability of Electronics

Assemblies)IPC-A-600 (Acceptability of Printed Boards)Certified IP: Specialist(IPC)ICT

Global Network

Jeong, Hanchul +82-31-8094-8212 [email protected]

Lee, Jinsu +82-31-8094-8214 [email protected]

Kang, Jeonghoon +82-31-8094-8213 [email protected]

Lee, Hyunbae +82-31-8094-8256 [email protected]

/ Mechanical Jung, Sukhwan +82-31-8094-8228 [email protected]

/ Kim, Namho +82-31-8094-8221 [email protected]

(Open Lab) Kim, Hyunsoo +82-31-546-7546 [email protected]

FIB ( Open Lab) Kim, Chulsoo +82-31-546-7544 [email protected]

(Open Lab)

ESD/EOS/EMI(Open Lab) Kim, Dongseong +82-31-546-7549 [email protected]

To cover the whole spectrum of the electronics industry from IC to end Products.

KOREA

CHINA-WUXI

JAPAN-TOKYO

USA-SAN JOSE

()

Sales Net-work

(PO)

Board3~4

Board

Board

Board/

Package

Board

Datasheet / Pin

HTOLLTOL THB ESD

Test VectorOperation TimingOperating Voltage

Bias Con gurationBiasing Voltage

Zapping VoltageZapping ModeZapping Pin/Group

HTOL:

T H B :

E S D :

Pin count / Dimension

QRT()

QRT()

031.8094.8211

A Global Leading-edge Company

for Reliability Engineering and Failure Analysis

Documents

Quality Reliability Technology - qrtkr.com · Engine control system Transmission Fuel injection Fuel pump ... EV 1 NG parts 0 JESD22 ... SCR 3 DP 10 3 Note B