Seismic Design of High-Tech Industrial Structures with ... · Shell Structure Process Support Interior Structure Double Fab. 9-3 ... Desired Performance for Seismic Design of Fabs

9-1

Taiwan-Japan Workshop on Seismic Disaster Simulation and Loss Estimation

Nov. 24~25, 2003Taipei, Taiwan

Seismic Design of High-Tech Industrial Structures with

Vibration-Sensitive Equipment

黃震興

國立台灣科技大學營建系

國家地震工程研究中心

Seismicity

M=7.3

M=6.3

M=7.1

M=6.1

331

921

9-2



Seismic Resistance of Existing Microelectronics Industrial Facilities

CleanroomSub FAB

Secondary Substation

Pile foundation as needed

Shell Structure

Process Support Interior Structure

Double Fab

9-3



Multiple Fab (TFT LCD)

Seismic Resistance of Existing Microelectronics Industrial Facilities

B. Non-structures

Vibration Sensitive Facilities: Photolithography and metrology such as steppers, scanners, SEMs, TEMs, AFMs, FIBs and other inspection tools.

Vibration Non-sensitive Facilities: piping, supporting systems, gas & chemicals, etc.

Seismic Qualification: Unknown or not availableEquipment may be structurally safe during a major quake, but they may not necessarily be functional after the quake.

`

9-4



3-C2-C1-CNP-CLife Safety

3-B2-B1-BImmediateOccupancy

NP-BImmediate Occupancy

N-R2-A1-AOperational

NP-AOperational

SP-3Life

Safety

SP-2Damage Control

SP-1ImmediateOccupancy

Structural PerformanceLevel

NonstructuralPerformance Level

Performance Level (ATC40)

Vision 2000 defines “microchip facilities” as “Hazardous facilities”.

The performance should correspondingly be : Fully operational for an occasional earthquake, operational after a rare earthquake.

However, the design approach for the fabs at the silicon valley has assumed the fabs as “basic facilities”.The structures are to remain fully operational after frequent quakes, operational after occasional quakes and life-safe after a rare quake

Silicon Valley

9-5



Desired Performance for Seismic Design of Fabs

The shell structure and clean room should be safe for occupancy immediately following the earthquake

The clean room tools, control system and robotics must remain operational and within calibration following the quake

The emergency power generator must survive the quake and come on immediately

The exhaust and make-up air system must remain operational through the system shut-down period.

Hazardous material containment must remain fully intact

Seismic Hazard Mitigation

Seismic isolation for entire building

Seismic isolation for essential flooring system

Seismic isolation of individual semiconductor tools andother critical equipment

Seismic protection of entire building with structural dampers

9-6



Pacific Bell North Area Operations Center (California, U.S.A.)

9-7



ROHM濱松公司半導體廠 (Japan)

104 LRB (seismic isolation bearings)PGA: 0.5g~0.6gMaximum structural response: 0.25g

増幅機構付き強化減衰装置（PSA-P）Power up shock absorber Pantograph

B半導体工場樓版微振動制御

静岡県

97年

B社

A半導体工場樓版微振動制御

静岡県

97年

A社

9-8



PSA-P之裝設効果

【PSA-P使用情況與效果】利用PSA-P來制御既存半導体工場的樓版微震動的場合、1/3 octave band測定結果、周波數帶在 0.5∼100Hz的全域約折減5∼10dB。

Seismic Retrofit of Fab Using Base Isolation

Conexant (Rockwell) SemiconductorAt Newport Beach of Southern California

Stepper Room

Testing LabPhotomask

9-9



Viscous Damper

Diagonal Brace with Dampers

15 20 25 30 35Time (sec)

-1.0

-0.5

0.0

0.5

1.0

Gro

und

Acc

eler

atio

n ( g

)

15 20 25 30 35-1.0

-0.5

0.0

0.5

1.0

Roo

f A

bsol

ute

Acc

eler

atio

n ( g

)

Moment Resistant Frame

Diagonal Brace

Chi-Chi Earthquake 300%TCU017

Max.= 0.99g ─ M.F.Max.= 0.53g ─ D.B.

PGA = 0.40g

9-10



1 10 1000

5

10

15

1 10 1000

5

10

15

RM

S Ve

loci

ty (

Mic

ro M

eter

/ se

c)

1 10 100

One-Third Octave Band Center Frenquency (Hz)0

5

10

15

Roof

3rd Floor

2nd Floor

X - directionM.F.

D.B.

1 10 1000

10

20

30

1 10 1000

10

20

30

RM

S Ve

loci

ty (

Mic

ro M

eter

/ se

c)

1 10 100


10

20

30

3rd Floor

2nd Floor

1st Floor

Y- directionM.F.

D.B.

9-11



1 10 1000

10

20

30

1 10 1000

10

20

30

RM

S Ve

loci

ty (

Mic

ro M

eter

/ se

c)

1 10 100


10

20

30

3rd Floor

2nd Floor

1st Floor

Z- directionM.F.

D.B.

HDRB

Damper

HDRB ＋ DAMPER

9-12



0 5 10 15 20 25 30-0.90-0.60-0.300.000.300.600.90

Acc

eler

atio

n (g

)

0 5 10 15 20 25 30 Time History (sec)

-0.90-0.60-0.300.000.300.600.90

0 5 10 15 20 25 30-0.90-0.60-0.300.000.300.600.90

Roof of Base-Isolated (HDRB)

Roof of Fixed-Base

GroundTCU048 180%

Max.=0.270g

Max.=0.824g

Max.=0.193g

0 5 10 15 20 25-1.00-0.75-0.50-0.250.000.250.500.751.00

Acc

eler

atio

n (g

)

0 5 10 15 20 25 Time History (sec)

-1.00-0.75-0.50-0.250.000.250.500.751.00

0 5 10 15 20 25-1.00-0.75-0.50-0.250.000.250.500.751.00

Roof of Base-Isolated (HDRB)

Roof of Fixed-Base

GroundKOBE 30%

Max.=0.230g

Max.=0.908g

Max.=0.156g

0 20 40 60 800

3

6

9

12

15

18

0 20 40 60 800

3

6

9

12

15

18

RM

S Ve

loci

ty (M

icro

met

ers/

sec)

0 20 40 60 80One-Third Octave Band Center Frequency (Hz)0

3

6

9

12

15

18

Base

2nd Floor

3rd Floor

Base- Isolated vs Fixed-Base X-direction

Fixed-Base

Base-Isolated (HDRB)

Base-Isolated (HDRB+VD)

0 20 40 60 800

3

6

9

12

0 20 40 60 800

3

6

9

12

RM

S Ve

loci

ty (M

icro

met

ers/

sec)

0 20 40 60 80One-Third Octave Band Center Frequency (Hz)0

3

6

9

12

Base

2nd Floor

3rd Floor

Base- Isolated vs Fixed-Base Y-direction

Fixed-Base

Base-Isolated (HDRB)

Base-Isolated (HDRB+VD)

Documents

Seismic Design of High-Tech Industrial Structures with ... · Shell Structure Process Support Interior Structure Double Fab. 9-3 ... Desired Performance for Seismic Design of Fabs