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    No-nonsense tools for the busy EE

    SEPTEMBER 2013

    electronicproducts.com A Hearst Business Publication

    IN THIS ISSUE:ndustry Exclusive: FIRST member creates low-cost prosthetic leg Working with Microsofts Windows

    Embedded Compact RTOS Precision-circuit semiconductors drive gains in energy harvesting

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    Hearst Business Media

    P.O.Box 3012

    Northbrook, IL 60065-3012

    In what format would you like to continue to receiveyour FREE Electronic Products Subscription?

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    AFFIX1st CLASSPOSTAGE

    Elect ronicPRODUCTS

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    Please print clearly.

    (01) Computers, Servers, Peripherals

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    (15) ICs and Semiconductors

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    ICs & SEMICONDUCTORS

    (01) Microprocessors, Microcontrollers,Digital Signal Processors

    (02) SoCs, ASICs, Programmable Logic (incl. FPGAs)

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    COMPONENTS

    (10) Resistors, Capacitors andPotentiometers

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    (13) Sensors & Transducers

    (14) Display Devices & Indicators

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  • 8/12/2019 Sel Prod

    3/70electronicproducts.comA Hearst Business Publication

    SEPTEMBER 2013

    Also In This ISSUE:

    Industry Exclusive: FIRST membercreates low-cost prosthetic leg

    Working with Microsofts WindowsEmbedded Compact RTOS

    Precision-circuit semiconductorsdrive gains in energy harvesting

    p.34

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    Electronic Products Magazine (USPS 539490) (ISSN 0013-4953)Published monthly by Hearst Business Communications Inc./UTP Division, 50 Charles Lindbergh Blvd., Suite 100,Uniondale, NY 11553. Periodicals postage paid Garden City, NY and additional mailing of fices. Electronic Produc ts is distributed at no charge to qualif ied persons actively engaged inthe authorization, recommendation or specification of electronic components, instruments, materials, systems and subsystems. The publisher reserves the right to reject any sub-scription on the basis of information submitted in order to comply with audit regulations. Paid subscriptions available: U.S. subscriber rate $65 per year, 2 years $110. Single issue,$6.00. Information contained herein is subject to change without notice. No responsibility is assumed by the publisher for its accuracy or completeness.

    Postmaster: Send address changes to Electronic Products, PO Box 3012, Northbrook, Il 60065-3012. Phone 847-559-73172013 by Hearst Business Communications Inc./UTP Division. ALL RIGHTS RESERVEDPublications Mail Agreement Number 40012807. Return Undeliverable Canadian Addresses to: Station A PO Box 12, Windsor, ON N9A 6J5

    4 Contents

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    Features

    20Wire & Cable:40 Gbits/s over twisted-pair copper cable is on the way

    24Real-Time Software Design:Working with Windows Embedded Compact RTOS

    28Portable Test Support:Working on remote RF remotely

    30Energy-Saving Initiative:Precision-circuit semiconductors drive gains in energy harvesting

    Vol. 56, No.4 September 2013

    Cover Story34 Getting started with ARM embedded MCU design

    Analog & Digital ICs

    38 Myths about endpoint security for embedded devices42 Tripling the power of PoE

    Touch Points

    6Viewpoint:Its a brave new world for next-generationprocessors

    8The Story Behind the Story: NIs PXIe-5644R RF vectorsignal transceiver

    11 Outlook (Technology News):Device can detect disease in just one drop of bloodAutotestcon looks to innovate in tight budgets

    14Industry Exclusive: FIRST member creates low-costprosthetic leg

    48Product Trends:Medical electronicsSensor fusion andpotential healthcare benefits

    50Product Roundup:LEDs: Technology gains, pricereductions

    52Industry Innovators:Bruno Maisonnier, founder and CEOof Aldebaran Robotics

    New Products55 Power Sources 62 Test & Measurement

    58 Components & Subassemblies 63 Optoelectronics

    59 Packaging & Interconnections

    38

    11

    50

    Only OnlineElectronicproducts.com

    Education Center:

    Boost and monitor brain fitness or controlthings wirelessly with your mind

    Water-based gels used to create bend-

    able, soft robots

    The pros and cons of retrofit LED bulbs

    Handheld point-and-shoot 3D scanner

    creates a model out of anything

    Cove

    rImagescourtesyofARM(

    www.arm.com)andTexasInstruments(www.t

    i.com).DigitalimagerybyDonWilber.

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  • 8/12/2019 Sel Prod

    10/70SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    6Viewpoint

    Its a brave new world fornext-generation processors

    I'm going to make a wild prediction. Soon, Intel will bring

    out a new processor that is NO 50% faster and 50% lower

    power than the last one. Yes, it's true. Unbelievable as it

    may seem, that's my prediction. I predict that the next Core

    processor will ONLY be 25% faster and 25% lower power. his

    will, of course, set off near panic in what's left the PC process-

    ing world. he end is near for Mr. Moore's law.

    I'm so used to Intel upping the stakes with every new Core

    CPU release. I just expect it. So, of course I wasshocked. Intel's recently announced Has-

    well Core processor, which is

    at 22 nm and uses ri-gate 3-D

    transistors, actually didn't really

    provide much of a performance

    boost at all. Just somewhere

    around 10% at most. It had to

    happen someday.

    Te way Intel put this was in-

    teresting. "Te 4th generation Intel

    Core vPro processors are up to 2x

    faster for business productivity ap-

    plications over 4-year-old systems."

    Tat's one way to look at it I guess.

    Te really interesting thing is that nobody cares. You see, PCs

    have gotten fast enough. Everyone is totally happy with their

    machines (except the gamers, of course). We don't need any

    more speed. Lower power, yes, always, but not higher speed.

    It's a brave new world.

    Intel has addressed a lot of other stuff with this 4th-gen-

    eration Core family, including graphics performance (yes,

    another big step up for integrated graphics) and security.

    And, the lower power chips means ultrabook laptops can befanless by running at a scenario design point (SDP) of 4.5 W.

    Te new 1.4-GHz Core i5-4200Y version has a max thermal

    design power (DP) of 11.5 W and SDP of 6 W with 4.5-W

    versions coming soon. Other versions of Haswell go as high as

    84-W DP.

    SDP is said to be an operational profile representative of

    a tablet computer. MacBook Air laptops with Haswell are

    expected in September with the slim 13-in. display model

    boasting of an incredible 12-hour battery life.

    Meanwhile, the semiconductor in-dustry overall is going along nicely.

    International Data Corp. raised its

    worldwide semiconductor revenue

    forecast for the year and projected

    further growth for 2014, as demand

    for smartphones and tablets remain

    strong. IDC expects worldwide

    semiconductor revenue to improve

    6.9% to $320 billion this year. Te

    company raised that from a pre-

    diction of 3.5% in May. Te market

    researcher also forecast semiconduc-

    tor revenues to be up another 2.9% in 2014.

    Intel chips are in a lot of embedded apps, of

    course. But, over in the other corner, it seems as though

    ARM CPU cores are taking over embedded processing.

    Every MCU maker has 'em. Oh no! I was just imagining

    that ARM had placed a disable command in every processor

    it's ever produced (let's start a rumor). And, they have a

    switch in Cambridge that they can throw any time they like

    and shut 'em all down. he European Union better not try

    pushing ARM around like they do Google and Microsoft.

    No sir. Do it and they'll throwthe switch

    .Jim Harrison

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    Advanced semiconductorsolutions to fuel your creativity.Come to Mouser first for whats next from these industry leaders.

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    Mouser and Mouser Electronics are registered trademar ks of Mouser Electronics, Inc. Other products, logos, and company names mentioned herein, may be trademarks of their respective owners.

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    8 Story Behind the Story

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    A look at the making of POY award winnersElectronicPRODUCTS

    EDITORIAL STAFF

    516-227-1300 FAX: 516-227-1901

    Content Operations Director Bryan DeLuca

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    Managing Editor John Fil ippelli

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    Senior Editor Paul OShea

    941-359-8684 [email protected]

    Technical Editor Jim Harrison

    415-456-1404 [email protected]

    Editor Richard Comerford

    516-227-1433 rcomerford@hear st.com

    Editor Lauren Leetun

    516-455-8602 [email protected]

    Contributing Editors Michael Kawa

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    Chief Copy Editor Leonard Schiefer

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    Group Publisher Steve CholasElectronics Group

    Director of Online Sales Robert McIntoshand Operations

    Published by

    Hearst Business Communications, Inc.UTP Division

    A Unit of The Hearst Corporation

    50 Charles Lindbergh Blvd.,

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    TEL: (516) 227-1300 FAX: (516) 227-1901

    Robert D. WilbanksTreasurer

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    THE HEARST CORPORATION

    Steven R. SwartzPresident & Chief Executive Officer

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    HEARST BUSINESS MEDIARichard P. Malloch

    President & Group Head

    Robert D. WilbanksGroup Controller

    For years, RF instruments have used FPGAs to

    implement the instruments capabilities and con-

    trols their so-called firmware personalities but the development of these personalities had been

    done by specialized HDL engineers and presented to the

    user in locked-up form. On the other hand, National In-

    struments was providing programmable FPGAs in data

    acquisition and control products such as the R Series and CompactRIO. Using LabVIEW

    to program the FPGAs, users could define an instruments functionality, making the devel-

    opment of these complex applications accessible to the novice. With the PXIe-5644R RF

    vector signal transceiver (VST), NI decided to take the next step in instrument evolution.

    e core development of the VST was a joint effort between R&D, manufacturing,

    product marketing, and sales. Together, the departments jointly defined and evolved the

    product from concept to release. Each of these groups needed to be involved in the concept

    and development to ensure that the product was comprehensive in its ability to meet theneeds of a broad range of applications in the RF industry.

    Ten years ago, on the RF instrumentation front, NI brought high-performance vector

    signal analysis to PXI, thereby enabling a fast, modular approach to RF test applications. As

    the test challenges evolved at an increasing pace, NI saw an opportunity to integrate these

    separately successful technologies to produce a fast, flexible, extensible instrument that

    boasts performance among the best in the industry. e design cycle for the VST was con-

    sistent with NIs historical trend of 1 to 3 years. Very early in the development of the VST,

    NI felt it had an excellent product coming together, and work done with lead users indicat-

    ed that it would be successful. For example, Qualcomm Atheros improved its WLAN test

    speed 200x, which gave Qualcomm better insight into its device under test using the VST.

    e VST is designed around a high-performance FPGA that defines the core function-

    ality of the instrument, and evolution of FPGA technology has provided increasing power.

    Not only did NI take advantage of the latest FPGA technologies, but the company also

    had to design a uniquely architected programming API, the Instrument Design Libraries,

    to expose the VSTs soware-designed functionality to the user. (For whitepapers on the

    hardware and soware architectures, visit ni.com/vst.) Another key to opening the instru-

    ments power to customers in an easy-to-use way was heavy reliance on LabVIEW FPGA.

    Without it, it would be almost impossible for customers to modify the VSTs firmware

    the main thing NI expected users to dowithout extensive help from NI.

    For the VST, the manufacturing team developed unique manufacturing processes to

    handle the complex manufacturing and testing requirements demanded by the VST. For

    example, the manufacturing team created a new production cell that uses NI instrumen-

    tation almost exclusively, reducing capital costs and manufacturing overhead. is addedenormous value to the production process and removed the need for costly traditional box

    instruments.

    So far, the VST has won seven global industry awards and has been extremely success-

    ful in applications from production test to research. Customers are also using the VST for

    applications NI had never dreamt of and, in terms of revenue, aer the first nine months

    it is the most successful new hardware product in NIs history. NI says that, when you set

    about to something as bold as giving customers the ability to rewrite the firmware of an RF

    instrument, you have to have a little doubt that its possible and effi cient. VST taught the

    company that it was not only possible but, when done correctly, extremely empowering for

    users. And instead of increasing NIs support burden for simple firmware modifications,

    the VST actually reduced it; customers can now do the modifications themselves (success-

    fully) without asking NI, freeing the company to deliver new innovations. .Richard Comerford

    NIs PXIe-5644R RF vectorsignal transceiver

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    Well-connected.

    Newark element14 makes it easy to find all your electronics products and solutions fast. newark.com

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    Outlook 11Innovations impacting product, technology and applications

    ELECTRONIC PRODUCTS electronicproducts.com SEPTEMBER 2013

    Device can detectdisease in just one

    drop of bloodCarbon nanotube creates prototype lab-on-a-chip

    for physicians

    A New Jersey Institute o echnology proessor known or his cutting-edge work

    with carbon nanotubes is overseeing the making o a prototype lab-on-a-chip that

    may someday enable a physician to detect disease or virus rom just one drop o

    liquid, including blood. Proessors Reginald Farrow and Alokik Kanwal, his ormer

    postdoctoral ellow, have created a carbon nanotube-based device to noninvasively

    and quickly detect mobile single cells with the potential to maintain a high degree o

    spatial resolution.NJI researchers

    evaluated three different

    types o cells using three

    different electrical probes.

    "It was an exploratory

    study and we don't want

    to say that we have a

    signature," Farrow said.

    "What we do say here

    is that these cells differ

    based on electrical prop-

    erties. Establishing a sig-

    nature, however, will take

    time. We do know that

    the distribution o elec-

    trical charges in a healthy

    cell changes markedly

    when it becomes sick."

    Te device uses

    standard CMOS technologies or abrication, allowing it to be easily scalable down to

    a ew nanometers. Nanotubes are deposited using electrophoresis afer abrication in

    order to maintain CMOS compatibility. Te devices are spaced by 6 m, which is the

    same size or smaller than a single cell. o demonstrate its capability to detect cells, theresearchers perormed impedance spectroscopy on mobile human embryonic kidney

    (HEK) cells, neurons rom mice, and yeast cells. Measurements were perormed with

    and without cells and with and without nanotubes. Nanotubes were ound to be cru-

    cial to successully detecting the presence o cells.

    Te carbon nanotubes are very strong, electrically conductive structures a single

    nanometer in diameter, or approximately the size o 10 hydrogen atoms in a row.

    Farrow's breakthrough is a controlled method or firmly bonding one o these submi-

    croscopic crystalline electrical wires to a specific location on a substrate. His method

    also introduces the option o simultaneously bonding an array o millions o nanotubes

    and efficiently manuacturing many devices at the same time. For more inormation, go

    to www.njit.edu/news/2013/2013-218.php.

    Jim Harrison

    NJIT researchers have created this prototype lab-on-a-chipthat may someday enable a physician to detect disease or

    virus from just one drop of liquid. (Photo: NJIT.)

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    Outlook 12

    Innovations impacting product, technology and applications

    ELECTRONIC PRODUCTS electronicproducts.com SEPTEMBER 2013

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    Autotestcon looks to innovate in tight budgetsTe largest U.S. conerence ocused on automatic test equip-

    ment or U.S. military systems, IEEE Autotestcon will be held in

    Schaumburg, IL, rom September 16 to 19. Te theme or this, the

    48th annual conerence, is "AS Innovation

    in the Era o Challenging Budgets." GeneralConerence Chair M. Kay Burch o Northrop

    Grumman notes that the theme "is especially

    relevant in today's changing environment. As

    affordability is a key actor in this changing

    economy, technical sessions including stan-

    dardization, lie-cycle cost reduction, reusable

    sofware, interoperability, and multinational support will appeal

    to a wide audience. When beginning to identiy affordability,

    it is important that we challenge ourselves to find new ways to

    lower operating, development, and implementation costs. We are

    being offered an unprecedented opportunity to participate in this

    transormation. . ." She also notes that "virtually every significantcompany in the industry" will be represented, with approximately

    170 exhibit booths and over 80 papers being presented.

    Te technical program kicks off on Monday with a ull day o

    seminars that offer insights into a wide range o topics, including

    built-in test, integrated diagnostics, AE technology and manage-

    ment, and instrumentation and sofware standards.

    uesday begins with a keynote session eaturing Jeffrey Q.

    Palombo, the Sector Vice President and General Manager o

    Northrop Grumman's Land and Sel Protection Systems (L&SPS)

    Division. Te L&SPS is a diverse organization specializing in land

    orces, rotary wing survivability systems, inter-

    national and U.S. military ground-based tacticalradars, communications systems, inrared counter-

    measure systems, automatic test equipment and

    simulation, and the Laser Systems business unit ca-

    pabilities. Te division is based at multiple locations

    around the United States and the United Kingdom,

    with headquarters in Rolling Meadows, IL.

    uesday through Tursday have an array o papers and panel

    sessions: arranged into three tracks that explore topics in:

    echnologies, trends, and applications in instrumentation

    Automatic test systems, test programs, testability, and management

    Diagnostics, prognostics, and health management.

    Some papers will be theoretical, most will be practical, "and allwill be inormative. Tese presentations will capture and hold your

    interest," notes the echnical Chair, eresa Lopes o eradyne, Inc.

    In addition, there will be our panel sessions hosted by techni-

    cal leaders in their field, exploring the ollowing topics: testability,

    synthetic instruments, modular instruments, and IVI & LXI.

    For more inormation about attending, visitwww.autotestcon.com.

    Richard Comerford

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    VIN12V

    VOUT0.8V @ 2.5A

    PVIN

    INTVCC

    TTHERMAL LIMIT

    TMONITOR IMONITOR

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    20V, 2.5ASWITCHER+

    Info & Free Samples

    The LTC3626 SWITCHER+is the first member of a new switcher family featuring programmable input and output

    current limits, as well as on-chip die temperature monitoring with programmable thermal shutdown. These featuresprovide enhanced system level protection, control and real time status readings. Plus, its unique controlled on-timearchitecture is ideal for high step-down ratios where high switching frequencies and fast transient response are essential.The LTC3626 combines up to 3MHz switching with a small, compact solution footprint.

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    ,LT, LTC, LTM, Linear Technology and the Linear logo areregistered trademarks and Switcher+is a trademark of LinearTechnology Corporation. All other trademarks are the propertyof their respective owners.

    cds.linear.com/docs/Design%20Note/dn511.pdf

    Output Current (A)

    1

    MeasuredOutputCurrentError(%)

    1.25 1.5 1.75 2 2.25

    5

    4

    3

    2

    1

    0

    1

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    4

    52.5

    TA= 85CTA= 25CTA= 40C

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    14 Industry Exclusive

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    FIRST member creates low-costprosthetic legBY JIM HARRISON

    Last fall, Parker Owen was a senior at the Alabama

    School of Math and Science in Mobile, AL, and a

    member of FIRST Robotics Competition (FRC) Team

    3469 and FIRST Tech Challenge (FTC) Team 4260. Parker

    invented a low-cost prosthetic leg that he sees being able to

    help perhaps thousands of people who can't afford the profes-

    sional device.

    Parker Owen won this year's Future Innovator Award.

    Tis award recognizes creativity in effectively solving a

    real-world complex problem through the invention o a unique

    solution beyond the requirements o the FIRS competition

    season. Tis award directly links to the FIRS mission to inspireyoung people to be science and technology leaders and to the

    FIRS vision to transorm the culture by creating a world where

    science and technology are celebrated. Te award is sponsored by

    the Abbott Fund. See more about FIRS at www.usfirst.org and

    www.electronicproducts.com/News/You_need_to_know_about_

    FIRS.aspx?terms=%22You%20need%20to%20know%22).

    Last all, Parker was talking with a riend who had tak-

    en mission trips to Honduras. Te riend told Parker about

    the need in Honduras or prosthetic legs, which cost around

    $10,000 each. Parker went to his FIRS robotics team, and the

    team started looking at available prosthetics on their computers

    all o which were very expensive.

    Parker was thinking about this and then watched a ew

    videos o "third-world countries" on his computer. He noticed

    there were bicycles everywhere.

    "Afer staring at a bicycle diagram

    or a ew hours, I had an idea in my

    head about how the parts might fit

    together," he told me. Te ollowing Sat-

    urday afernoon he went to a thrif store

    and bought a $20 bike. He took it home

    to his dad's shop and tore it apart. He then

    put various parts together in the orm o

    a prosthetic leg and it came together very

    well. He decided to use the bike's inner tube

    as a pneumatic actuator to adjust the fit or

    different size people and to allow the wearer

    to adjust it as his/her body and strength maychange. It seemed to work.

    His riend Greg knew o a prosthetic expert

    in the next town. Tis expert had been part o the

    Honduras trips, and Parker called him and

    then took his new device over to show him.

    Very impressed, the expert agreed to advise

    Parker on getting some o the details in place.

    Parker went to Honduras with a prototype, but stiff legal and

    safety regulations precluded getting the leg in use there. He is now

    working on getting the documentation and testing done. Patents

    are in place or in process. He credits FIRST with giving him the

    perspective and enthusiasm needed for ideas such as this.

    Parker Owen earned the Future Innovator Award sponsored by the

    Abbott Fund for his invention, the Cycle-Leg. Pictured here (from L to R)

    are Parkers dad, Scott; Dean Kamen, founder of FIRST; Parker Owen;

    and Dr. Woodie Flowers, chairman of the FIRST Advisory Board.

    Parker Owens

    invention, theCycle-Leg.

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    16 Engineering Distribution

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    IN PARTNERSHIP WITH

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    RFID and NFC PunctuateOur Daily Lives

    he use o RFID and NFC technology to access and share

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    transmitting the data via a smartphone.

    While both RFID and NFC technologies have existed

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    BY CAROLYN MATHAS

    Fig. 2: Block diagram of the Texas Instruments TRF7970A 13.56-

    MHz RFID and NFC transceiver IC. (Source: Datasheet.)

    Fig. 1: RFID development kits from DLP Designs.

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    Engineering Distribution 17

    ELECTRONIC PRODUCTS electronicproducts.com SEPTEMBER 2013

    IN PARTNERSHIP WITH

    As RFID Gains Traction,Design Opportunities Proliferate

    By the time you arrived in the office this morning, you

    may have used radio frequency identification (RFID)

    four times without being aware of it: when you inserted

    the key in your car, disabling the immobilizer circuit; when you

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    your fee; when you used your cell phone to pay for your morning

    cappuccino; and when your ID badge registered your entry into

    the office. RFID may not be everywhere, but it is getting there.

    Te market for RFID tags is growing rapidly and is expected

    to accelerate. IDechEx forecasts that the number of passiveRFID tags will rise from fewer than three billion units in 2011 to

    approximately 250 billion units in 2021.

    For businesses, RFID offers an unprecedented opportunity for

    increasing productivity and improving customer experience by

    providing data at a very granular level and by automating ser-

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    perspective, RFID is not a single technology, and the technology

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    and reading range of the three major RFID bands.

    Table 1: RFID bands and applications.Although a subset of RFID technology, near-field communi-

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    NFC also requires minimal user intervention to create links and

    supports communication with passive RFID devices such as

    smart cards.

    As a result, NFC applications will grow rapidly with mobile

    phones as the main driver. According to IMS Research, NFC-en-

    abled mobile phones will reach up to 1.2 billion units by 2017

    as manufacturers adopt wireless communications and payment

    technology as a de facto standard.

    Most RFID system design activity is focused on reader sys-

    tems and specific reader characteristics are driven largely by the

    application and the charac-

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    Semiconductor

    manufacturers are now

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    RFID readers such as ams

    AS3993 UHF reader chip

    offer high performance and

    low power. In NFC system

    design, the controller chip plays a central role.

    Among other typical tasks, it has to monitor

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    Once system architecture is carefully thought

    out, however, there are numerous design tools and developmentkits to provide a clear path to a successful project.

    Learn more about RFID and NFC technology as well as the

    latest products at www.mouser.com/applications/rfid-nfc/.

    By Jack Shandle for Mouser Electronics, www.mouser.com

    Fig. 1: RFID tag showing the chip

    with coiled antenna.

    Learn more at mouser.com/applications/rfid-nfc/

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    QWHAT IS SPECIAL ABOUTUFS FLASH MEMORY

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    solutions, which process

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    20Wire & Cable

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    40 Gbits/s over twisted-paircopper cable is on the wayCategory 8 cable and 40GBASE-T standards are in process

    BY FRANK STRAKAProduct Development ManagerPanduit, www.panduit.com

    Recently the IEEE P802.3bq ask

    Force was formed to create a

    standard for 40-gigabit Ether-

    net over copper twisted-pair cabling

    (40GBASE-). his is the next gen-

    eration following 10-gigabit Ether-

    net over copper twisted-pair cabling

    (10GBASE-). he BASE- families

    of standards are regarded as one of themost successful and deployed Ether-

    net standards in the world today. hey

    feature cost advantages and ease of de-

    ployment with auto-negotiation and the

    ubiquitous RJ45 connector for seamless

    backward compatibility. he IEEE is

    the main standards body for BASE-,

    focusing on both the equipment and

    cabling. In support of the development

    of 40GBASE-, the cabling standards

    bodies (IA and ISO/IEC) have also

    been working hard on creating Category

    8 cabling and connector specifications.

    Tere is a distinct trade-off between

    the cabling specifications and the equip-

    ment specifications. Cables that are

    easier to design and manufacture tend

    to have worse performance, requiring

    more advanced equipment, while more

    advanced and harder to manufacture ca-

    bles will likely have better performance,

    requiring less advanced equipment. Te

    goal of the standards body is to cometogether and try to find the optimum

    trade-offs between these elements tooptimize the time to market and power

    consumption for the user and maintain

    a broad market potential.

    Collaboration required40GBASE- is a great example where

    both the equipment vendors and

    cabling vendors are working together

    to try and find the optimum scenario.

    Cabling vendors, such as Panduit, want

    to ensure that our customers continue

    to enjoy the advantages of BASE- stan-

    dards. We need to ensure that the cable

    specification has sufficient reach and

    usability so it can be used in as many

    scenarios as possible.

    While there are no official standardsyet developed, it is clear that 40GBASE-

    will require the most advanced twist-ed-pair cabling technology yet. It will

    require a bandwidth of between 1,500

    to 2,000 MHz. As a point of reference,

    10GBASE- only requires Category 6A/

    Class EA components with a bandwidth

    of 500 MHz. Even the European ISO/

    IEC standards for Category 7A/Class FA

    only have a bandwidth of 1,000 MHz.

    Te difference in magnitudes can be seen

    in Fig. 1.

    Another change with 40GBASE-

    over traditional BASE- standardsis that the channel length had to be

    reduced from 100 m to 30 m in order

    to reduce power consumption and

    equipment complexity. (Channel is

    the term for the combination of cables

    and connectors.) All prior Categories

    and BASE- Ethernet standards allowed

    for lengths of up to 100 m. In order toproperly service as broad a market as

    Fig. 2: Maximum lengths compared.

    Fig. 1: Existing cabling standards versus40GBASE-T (Category 8).

  • 8/12/2019 Sel Prod

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    WE BUILD SUPERIOR QUALITY INTO

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    22Wire & Cable

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    possible, companies worked

    to ensure the maximum

    channel length was at least

    30 m designed to support

    both end of row and top of

    rack topologies and provide

    data center customers with

    maximum flexibility. Whilethis length can change since

    there is no standard published,

    at this point 30 m is assumed

    to be the likely maximum cable

    length (see Fig. 2).

    Available next yearWhat this highlights is that

    there are no existing cabling

    standards that are close

    to meeting the needs for

    40GBASE-. Cabling compa-nies have been working hard

    to develop new Category 8

    cables and connectors. Tere

    has been much progress from

    a multitude of cabling vendors

    like Panduit showing connec-

    tors and cabling with 2,000 MHz bandwidths (see Fig. 3).

    It is expected that products will be available in late 2014

    to early 2015 when the standards become more developed. At

    this point the standards are in a state of constant flux so it is

    still too early to supply products.

    able 1 highlights the different categories of cables and the

    applications they are designed to support, as well as the up-

    grade path through the different data rates. 1000BASE- will

    run on Category 6, 10GBASE- will run on Category 6A, and

    40GBASE- will run on the yet to be fully defined Category

    8. Tere are no specific Ethernet applications for Category 7

    or Category 7A. Since 40GBASE- standards are in state of

    flux and no existing standards come close to meeting these

    requirements, it is recommended that today if someone is

    looking to install 10GBASE- that they use Category 6A

    cabling and connectors.

    40GBASE- is becoming an excellent example of differ-ent industries collaborating together in order to provide our

    customers with the optimum products with the fastest time to

    market. Cabling companies like Panduit are working hard and

    doing our part to design next-generation cabling and connec-

    tors so that 40GBASE- becomes another successful member

    of the BASE- Ethernet family.

    Currently, the state of the art for twisted-pair copper

    cabling is running 10GBASE- over Category 6A cabling. Te

    Panduit MariX Category 6A solution, including the PUP6A-

    04BU-UG cable with CJ6X88G-style jacks, is an example of

    an available Cat 6A system good for lengths up to 100 m with

    a bandwidth of 500 MHz.

    Table 1: Category cable standards overview with supported data rates and upgrade path

    Fig. 3: Category 8 prototype test results.

    MEGA Electronics Inc.

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    24 Real-Time Software Design

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    Working with WindowsEmbedded Compact RTOSThis small-footprint operating system can be customized to meet the

    targeted requirements of a specialized device on multiple chipset options

    BY JUSTINE COATESTechnical EvangelistMicrosoft, www.microsoft.com

    Windows Embedded Com-

    pact 2013 dierentiates

    itsel rom other operat-

    ing systems by providing a real-time,

    small-ootprint operating system that

    can be customized to meet the targeted

    requirements o a specialized device onmultiple chipset options, including both

    x86 and ARM. With an emphasis on

    "non-PC" solutions, Windows Embed-

    ded Compact is not trying to create

    multi-purpose desktop, but instead

    ocuses on devices such as industrial

    controllers, medical imaging units,

    printers, digital signs, and retail scan-

    ners, to name a ew.

    Te specific characteristics o a

    device, like a small touchscreen or no

    screen at all (headless), plus its sin-

    gle-purpose unctionality, make it a

    "specialized device." As you can imagine,

    there are thousands o possibilities and

    you probably interact with these special-

    ized devices every day without realizing

    it. When you want to design a device to

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    ded Compact is a great place to start.

    Minimally, as a 32-bit operating

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    cessors, allowing developers to control

    which processor does the work or let the

    operating system balance the workload

    across multiple cores.

    OS advantagesEmbedded device manuacturers can and

    do take advantage o the logical separa-

    tion o operating system design and the

    hardware. Developers in charge o the

    sofware eatures o their design can start

    their operating system and application

    prototyping on a Virtual PC-based plat-

    orm while hardware-level board-sup-

    port package (BSP) development is done

    in tandem (see Fig. 1). Te modular

    design o the OS is uniquely geared so

    that designers can select only the compo-

    nents needed or their targeted scenario

    and it easily allows or the integration o

    third-party or custom eatures as well.

    Windows Embedded Compact gives all

    o the benefits o a Win32 API, coupled

    with the reedom to make the OS have

    only the eatures that are absolutely

    required.

    Windows Embedded Compactdevelopment is done using tools hosted

    in Visual Studio. Tis allows embedded

    developers to use the latest in Microsof

    developer tools when creating their

    platorm.

    Te Windows Embedded Com-

    pact OS design tool, Platorm Builder,

    provides access to a catalog o eatures

    and the ability select only those sofware

    components that are absolutely neces-

    sary or the targeted solution. Applica-

    tion Builder (ormerly Visual Studio or

    Devices) allows application developers

    to create rich, targeted device applica-

    tions without requiring the ull platorm

    development toolset. Not only is Win-

    32 available in Windows Embedded

    Compact, but AL, MFC, DirectDraw,

    OpenGL, and XAML are also available

    i the designer includes the required

    components.

    A "compact" version o the .NE

    Framework is selectable in the Windows

    Embedded Compact catalog to support

    Visual Basic and C# development or

    devices. Te Microsof .NE Compact

    Framework enables the device to host

    managed applications and use web ser-

    vices. It includes an optimized common

    language runtime (CLR) and a subset

    o the .NE Framework class librarythat supports eatures such as Windows

    Communication Foundation (WCF)

    and Windows Forms. It also contains

    classes that are designed exclusively or

    the .NE Compact Framework.

    When and why would I useWindows Embedded Compact?Embedded operating systems, unlike

    their desktop counterparts, usually

    bundle the operating system and the re-

    quired application together into a single

    Fig. 1: Developers in charge o the sofware eatures o their design can start their operatingsystem and application prototyping on a Virtual PC-based platorm while hardware-level

    board-support package development is done in tandem.

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    WELL CUSTOM DESIGN THE INTERCONNECTYOU NEED ASSUMING, OF COURSE,ITS NOT ALREADY IN STOCK.

    Prototyping and concurrent engineering are part of Mill-Max support.

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    engineers. We look for ways to enhance functionality, simplify manufacturing,

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    a specialty and were happy to do it even on short-run projects.

    See the whole Mill-Max story at www.mill-max.com/videos.Mill-Max manufactures a wide variety of both

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    2013 MILL-MAX MFG. CORP. 190 PINE HOLLOW ROAD OYSTER BAY, NY 11771 PHONE: (516) 922-6000 Maximum Support.

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    26 Real-Time Software Design

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    executable image or purpose-driven

    devices. Using less space and only in-

    cluding required sofware allows Win-

    dows Embedded Compact to run on

    small-ootprint devices needing flexible

    hardware and hard, real-time support.

    In short, you would use Windows

    Embedded Compact to create lowercost, purpose-driven devices where you

    need the reliability o a trusted Micro-

    sof platorm with support or up to 15

    years.

    A ully eatured image or Win-

    dows Embedded Compact is about 45

    Mbytes, but the size will vary based on

    what you include. It is recommended

    that a designer download the Compact

    2013 kit (it is ree at www.Windowsem-

    bedded.com/Compact) and try it out

    using the Virtual PC.

    Microsof recently posted a blog that

    discusses real-time in some detail and

    has links to the real-time studies done

    on Compact 7 (http://blogs.msdn.com/b/

    windows-embedded/archive/2013/07/17/

    the-hard-and-sof-acts-behind-real-

    time.aspx).

    Te blog, in general, has a number ointeresting postings at http://blogs.msdn.

    com/b/windows-embedded.

    Windows Embedded Compact offers

    encryption and networking security op-

    tions, and Windows CE supports creat-

    ing a trusted app execution environment

    using certs etc. See http://msdn.microsof.

    com/en-us/library/ee498894.aspx.

    Downloads o all Windows Em-

    bedded offerings are available at www.

    microsof.com/windowsembedded/en-us/

    downloads.aspx.

    When you want

    to design a device

    to serve a specific

    purpose and build it to

    meet a cost objective,

    Windows Embedded

    Compact is a greatplace to start.

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    28 Portable Test Support

    SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    Working on remoteRF remotelyRecently, a number of companies have introduced

    ways to ease the burden on field personnel byletting them control RF instruments from afar

    BY RICHARD COMERFORD

    With widespread deployment o

    RF systems such as celluar and

    radar equipment in some o the

    most remote locals on earth, ield engineers

    and technicians oten need to be able to

    perorm sophisticated RF measurements in

    places and under conditions that can best

    be described by the expression, "I wouldn'tsend a dog out on a night like this." Yet

    these systems are so critical to business

    and everyday lie that not maintaining

    them is not an option.

    Recently, a number o instrumenta-

    tion companies have introduced ways to

    ease the burden on field personnel by

    allowing them to control RF equip-

    ment remotely, say rom within the com-

    ort o a truck cab, while the instrumenta-

    tion is doing its job in precarious locations

    and/or exposed to the elements.

    For example, with Option 030, the

    FieldFox handheld analyzers rom Agilent

    echnologies (www.agilent.com) can now

    be remotely controlled via an iOS device

    such as an iPad or iPhone, which enables

    viewing and control o the instrument

    via the Remote Viewer iOS app. With a

    wireless LAN or cellular broadband data

    connection and an iOS device, the analyz-

    ers can now be placed in areas where users

    do not wish to stay long due to extremelyharsh or unsae conditions. Additionally,

    i one technician or engineer has trouble

    making a measurement or determining

    the source o a problem, another can step

    in to remotely troubleshoot and solve the

    problem. Once users launch the Remote

    Viewer, they can also access technical

    literature such as user guides, application

    notes, and datasheets, as well as demo

    videos. Tis lets users quickly find the data

    they need to resolve network issues as they

    arise in the field.

    Also new to the instrument are a

    spectrum analysis time-gating option (Op-

    tion 238) and support or Agilent's USB

    peak-power sensors (Option 302). Te

    spectrum analysis time-gating unction is

    specifically geared toward engineers testing

    the pulse characteristics o their radar

    systems. Unlike

    competing solu-

    tions, the instrument's time-gating unc-

    tion allows users to view both requency

    and time domain at the same time, and it

    can measure very narrow pulses (less than

    1us wide) with sweep time as small as 8 us.

    Enhanced trigger unctions (burst trigger

    and pre-trigger, or example) urther ease

    the signal-measurement challenge.

    Peak power measurements are needed

    to test pulsed transmissions. Te pow-

    er meter option supports Agilent USB

    peak-power sensors so engineers can

    measure peak and average power to 18 or

    40 GHz with the same accuracy as with

    traditional peak-power meters. By extend-ing requency measurements to 40 GHz,

    the power meter option suits engineers

    maintaining and troubleshooting radar

    communications equipment and networks.

    Anritsu (www.anristsu.com) too has

    introduced remote capability, in the

    orm o its Wireless Remote ools or

    its touchscreen PIM Master, Site Mas-

    ter, Spectrum Master, and VNA Master

    handheld instruments. With the sofware

    installed, field technicians and engineers

    can remotely view screens and control the

    FieldFox handheld analyzers cannow be operated remotley using

    iPads or iPhones.

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    Portable Test Support 29

    ELECTRONIC PRODUCTS electronicproducts.com SEPTEMBER 2013

    industry-leading field instruments using

    a Windows-based tablet, laptop, or PC to

    simpliy deployment and maintenance o

    2G/3G/4G wireless networks.

    Available or ree download rom the

    Anritsu ool box web page, Wireless

    Remote ools makes conducting field

    measurements, such as sweeps, spectrum

    analysis, PIM, and S-parameters, easier

    and more efficient. For example, operatorscan now remain on the ground and use a

    Site Master cable-and-antenna analyzer to

    conduct sweeps on jumpers at the top o

    the tower. Remote spectrum monitoring

    can also be done more effectively, espe-

    cially i the intererence is caused by an

    intermittent signal. Users can now monitor

    and control a Spectrum Master handheld

    spectrum analyzer at a remote location,

    such as a desk, using the sofware.

    Wireless Remote ools initially sup-

    ports the Site Master S331E/S332E and

    S361E/S362E; VNA Master MS2024B/

    MS2025B and MS2034B/MS2035B hand-

    held vector network analyzers; Spectrum

    Master MS2712E/MS2713E and MS2720;

    and PIM Master MW82119A Passive

    Intermodulation analyzer. Te handheld

    instruments can be connected remotely

    via a Wi-Fi link using a pocket Wi-Fi

    router or local remote control or rom the

    Ethernet port on the analyzer through the

    Internet.Te Model RR 2727 alon RF/IF sig-

    nal recording and playback system rom

    Pentek (www.pentek.com) is a rugged

    portable recorder suitable or military and

    aerospace applications. Te system ea-

    tures recording and playback o IF signals

    up to 700 MHz with signal bandwidths to

    200 MHz, and it can be configured with

    500-MHz 12-bit A/Ds or 400-MHz 14-bit

    A/Ds and an 800-MHz 16-bit D/A. Avail-

    able I/O includes audio and VGA video,

    RS-232/422/485 serial, multiple USB 2.0

    and 3.0, eSAA, and dual Giga-

    bit Ethernet connections.

    Te instrument's System-

    Flow sofware allows turnkey

    operation through a graphical

    user interace, while System-

    Flows API provides or remote

    system control and integrationo the recording sofware into

    custom applications. Te sofware also

    includes a virtual oscilloscope and spec-

    trum analyzer to monitor signals beore,

    during, and afer data collection. Record-

    ed files are stored in native Windows

    NFS ormat, so they can be used without

    post-recording file conversion. At the

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  • 8/12/2019 Sel Prod

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    an electronic products special series

    30 Energy-Saving Initiative

    Precision-circuit semiconductorsdrive gains in energy harvestingThe precision semiconductor technology delivers markedly improvedsystem sensitivity, reliability, stability, and functionality

    BY ROBERT CHAO, Founder and CEO,

    Advanced Linear Devices

    www.aldinc.com

    Advancements in the fields of en-

    ergy harvesting, sensor networks,

    building automation, and security

    systems are making tremendous strides due

    to recent innovations in precision circuit

    semiconductors. While developersseek integration for all four system

    categories, the precision semicon-

    ductor technology delivers mark-

    edly improved system sensitivity,

    reliability, stability, and functionality.

    Growth and interest in these systems

    has evolved to the point where the

    IEEE is developing protocols for a

    more integrated approach to sensor

    networks and building automation

    so that end solutions are more cost

    effective and energy efficient.

    Industry standards for such

    systems are called for in a document

    entitled Building lighting automa-

    tion through the integration of DALI

    with wireless sensor networks. Te

    consumer electronics-focusedrans-

    actions journal published the paper

    on the integration of Digital Address-

    able Lighting Interface (DALI) devic-

    es in wireless sensor networks and explores

    possible improvements for the technology.Since different manufacturers usually

    deal with one aspect of building automa-

    tion for example, heating ventilation and

    air conditioning, lighting control, differ-

    ent kinds of alarms, etc. final building

    automation system has different subsys-

    tems that are finally taken to an integrated

    building management system.

    An economical fully centralized system

    Our main purpose is to provide the end

    consumer with an economical fully cen-

    tralized system in which home appliances

    are managed by an IEEE 802.15.4-based

    wireless sensor network.

    Te case of building automation is

    ideal for demonstrating how advances in

    semiconductor technology enable break-

    through capabilities for these systems.

    Operators of large facilities such as office

    buildings and municipal complexes have

    made great strides in cutting cost and

    improving energy efficiency by usingbuilding automation and security in con-

    junction with energy-harvesting systems

    and wireless sensor networks.

    Large office complexes use sensor net-

    works to interface with building controls

    to turn on power, heating, and ventilation

    to individual offices and cubicles only

    when people are present. However, there

    is much room for improvement in such

    systems as anyone who has had their

    office lights shut off in the middle of the

    working day might attest. By improving

    Fig. 1: Current-source circuit diagram constructed with

    precision semiconductor devices

    the circuits of these systems, its possible

    to improve accuracy of the controls that

    activate building automations systems

    so that they more accurately respond to

    real-life situations for which they were

    intended.

    In practical applications, the technol-

    ogy hasnt always worked as designed.

    Systems set up to detect the presence

    of motion and temperature changesare limited in their capabilities and

    this has undesired results. Tats why

    lights turn off even when workers are

    present. Te systems have limitations

    in accuracy, reliability, and sensitivity

    range. Te goal of many in sensor

    network and building automation

    development is to improve the tech-

    nology so that it truly matches the

    real-life situations for which they were

    designed.

    Circuit design progress

    One of the most important areas

    where designers are making prog-

    ress is in the basic building blocks of

    circuit design. With better circuits

    that afford greater operating dynam-

    ics, building automation and security

    systems are finely attuned to real-life

    usage models. For example, greater

    sensitivity and reliability can prevent cost-

    ly false alarms in building security.Energy harvesting and ultra-low

    power are also important features that

    enable greater reliability and cost-effective

    wireless installation. In building a system,

    designers desire extremely low power

    circuits, so that as much energy as pos-

    sible can be harvested, stored, and used

    for some other purpose. If the electronics

    consume a prohibitive amount of power,

    it is difficult to build high-efficiency

    systems.

    It is important that these circuits con-

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    36/70SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    an electronic products special series

    32 Energy-Saving Initiative

    sume as little energy as possible so that

    the current and voltage that is harnessed

    from an ambient source can be maxi-

    mized to drive the electronic systems that

    they were intended to supply. Greater

    power ranges provide building automa-

    tion system developers and end-userswith greater flexibility and reliability to

    deploy improved solutions.

    oday, energy harvesting is a growing

    field because it helps building operators

    with the ability to install automation

    controls with wireless networks. Tis

    helps eliminate cost and complexity

    for operators who want to improve the

    efficiency and reduce the operating cost

    of their facilities.

    Te research firm IDechEx expects

    the total market of energy-harvestingdevices to rise to more than $5 billion

    in 2022. In a report, the firm stated,

    Te technology has reached a tipping

    point, because the necessary lower power

    electronics and more efficient energy

    gathering and storage are now sufficient-

    ly affordable, reliable, and longer-lived

    for a huge number of applications to be

    practicable.

    An example of this type of advance-

    ment is the ALD210800 MOSFE array,

    with a gate threshold voltage is exactly

    0.00-V 0.001 (10 mV). Tis newcategory of device enables breakthrough

    analog circuit design parameters, such as:

    100-mV minimum operating voltage

    1-nA minimum operating current

    1-nW minimum operating power

    Te ALD210800 is a basic building

    block in circuits to enable greater sensor

    sensitivity. Each MOSFE is enabled

    by fully independent input and output,

    source, and drain. Compared to previous

    generations, it increases current output by

    greater than an order of magnitude. It alsoreduces circuit size by 50%, which in turn

    helps decrease board real estate and cost.

    Te MOSFE array is designed to tap

    a number of energy-harvesting sources

    that have less than a 1-V supply voltage.

    Te array also helps improve energy

    efficiency and extend battery life. Designed

    with precise specifications, this new catego-

    ry of device gives developers a new frontier

    of operating voltages, power consumption,

    and increased precision. In the analog

    world, precision is always welcome.

    N-channel current source

    Figure 1 depicts a circuit design for a

    very basic current source. Actual useful

    current and voltage ranges also depend

    on the device being used. Te ALD

    210800 offers the highest-precision

    performance with the lowest current and

    voltage requirements. You can build this

    current source with any of the devices

    that are listed above or that are current-

    ly on the market. Te difference is the

    actual specifications that can be achieved.Tis marks a new frontier for basic MOS-

    FE circuits.

    With innovative materials like the

    new generation of ultra-precise semi-

    conductors, developers of energy-har-

    vesting systems and sensor arrays will be

    able to make improvements in building

    automation security, wireless networks,

    and building automation. Sensors will

    be given greater dynamic range to detect

    motion and heat. Tis will spur greater

    sensitivity to detect when people are

    present and when they are not, and

    afford operators finer granularity in

    controlling their facilities.

    Te new category of precision circuit

    semiconductors will enable the circuits

    supporting these systems to be more sta-

    ble more reliable and more dependable.

    It also allows energy harvesting systems

    to make greater use of the ambient ener-

    gy and store power when it is not needed

    so that systems are ready to be deployedwhen they are called into action.

    About the author

    Robert L. Chao, CEO of Advanced Lin-

    ear Devices in Sunnyvale, CA, founded

    ALD in 1985 and has been a leading

    authority in the analog semiconductor

    industry for over 30 years. A founder of

    Supertex, Mr. Chao was instrumental

    in inventing the analog circuitry that

    enabled the home smoke detector.

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    38/70SEPTEMBER 2013 electronicproducts.com ELECTRONIC PRODUCTS

    34 Cover Story

    Choosing the right processor is a

    critical decision as it deines a

    products capabilities. When a

    processor is correctly sized, it supports

    the ull suite o a products unctions and

    leaves headroom or growth. Overspeci-

    ying the processor will drive system cost

    up unnecessarily. An incorrectly chosenprocessor may run out o perormance

    during the design cycle, leading to key

    eatures being eliminated or downsized.

    In a worst-case scenario, an improperly

    sized device in the ield may not have the

    capacity or a critical update.

    Sofware is also a very important con-

    sideration and ofen represents a majority

    o the development investment, both in

    terms o cost and time, so the optimal

    processor or an application also must

    have the right development resources sup-

    porting it. Finally, an application-specific

    perspective is required to determine how

    the needs o particular markets also affect

    processor and sofware requirements.

    Making sense of the ARM coresARM offers several licensable cores to meet

    a wide range o application requirements.

    Microcontroller manuacturers obtain an

    ARM core architectural license to modiy

    the core and design a complete proces-sor or SoC around the ARM core. Tis

    includes integrating peripherals and mem-

    ory, as well as adding application-specific

    eatures that can enhance perormance

    and power efficiency. While many vendors

    design their own processor offering an

    ARM core, the resulting processors are not

    equal. ARM Cortex processors are used

    most requently or embedded processing

    designs that need to eature low-power.

    Tese Cortex processors also provide a

    large amount o compatibility and scalabili-

    Getting started with ARMembedded MCU designChoosing the right ARM Cortex-based processor

    BY SANGMIN CHONCentral Marketing DirectorTexas Instruments, www.ti.com

    ty among each other.

    Selecting the right ARM-Cortex proces-

    sor or your application involves more than

    just estimating perormance requirements.

    Te first step in selecting the right ARM

    core or an application is to understand the

    three primary ARM-Cortex core amilies

    and the basic differences between them.

    Here is a description o each o the

    ARM cores in a nutshell:

    ARM Cortex-A:Application processors

    based on the Cortex-A series core offerlow power, along with exceptional 32-bit

    perormance. Tis architecture supports

    multicore configurations, as well as option-

    al advanced floating-point capabilities. Te

    Cortex-A offers up to 13-stage technology

    with 1.5 to 2.5 DMIPS/MHz per core with

    advanced branch prediction. Its Neon

    integer and floating-point SIMD engine

    enable advanced media perormance or

    applications. Te series is tuned or memo-

    ry streaming with one- to two-cycle cache

    access, pipelined loads and stores, and

    coupled (or integrated) level-2 caches.

    With their high perormance and

    advanced memory, Cortex-Abased MCUsare well suited or any product that needs

    to incorporate and run an advanced oper-

    ating system, such as Windows, Linux, or

    Android. In addition, Cortex-A processors

    provide additional benefits through a ew

    available technology extensions