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Page 1: Smart Phone in 2013

•SmartPhone Market in 2013

•Qualcomm

BlackBerry Z10

Motorola Moto X

HTC One

SAMSUNG Galaxy S4

SAMSUNG Galaxy Note 3

XiaoMi 3 WCDMA

•nVidia

XiaoMi 3 TD‐SCDMA

•SAMSUNG

SAMSUNG Galaxy S4

SAMSUNG Galaxy Note 3

•Apple

Apple iPhone 5s

Apple iPhone 5c

Page 2: Smart Phone in 2013

Source: IDC, Jan 2014

Page 3: Smart Phone in 2013

Source: IDC, Jan 2014

Page 4: Smart Phone in 2013

Source: IDC, Jan 2014

Page 5: Smart Phone in 2013

Source: IDC, Jan 2014

Page 6: Smart Phone in 2013

Source: Gartner, Feb 2014

Page 7: Smart Phone in 2013

Source: Gartner, Feb 2014

Page 8: Smart Phone in 2013

Source: Gartner, Feb 2014

Page 9: Smart Phone in 2013

Source: Gartner, Feb 2014

Page 10: Smart Phone in 2013
Page 11: Smart Phone in 2013

I2C/SPI

SLIMbus

eMMCeMMC

WiFi/BTSoC

SDIO

UART

USB

QualcommPM8921PMIC

QualcommWCD9310Audio Codec

eCompass

Accelerator

Gyroscope

I2C/SPI

I2C/SPI

QualcommWCN3660/WCN3680

Rx/Tx BB

Either One

NFCcontroller

SnapDragonSnapDragon S4 ProS4 Pro

MSM8960MSM8960

MIPI‐CSI

MIPI‐CSI

Barometer

QualcommTransceiver

I2C/SPI

I/O Hub processor

LPDDR2 Dual‐channelLPDDR2

PoP PackageLPDDR2

I/O Hub processorI2S

HDMI

MHL/SlimPortTransmitter

MHL/SlimPortDisplay

MIPI

ALS

TouchScreen

Controller

ISP

Option

SDIO

Page 12: Smart Phone in 2013
Page 13: Smart Phone in 2013

T H E N E W

B L A C K B E R R YZ 1 0Built to keep you moving

Page 14: Smart Phone in 2013

Inside BlackBerry Z10

Page 15: Smart Phone in 2013

BlackBerry Z10 US

Avago ACPM‐7051

SAMSUNG KLMAG2GE4A, 16GB eMMC

Inside Secure , SECUREAD IC5C633I4, NFC controller

Qualcomm WCD9310 audio codec

STMicroelectrics LIS3DH

Page 16: Smart Phone in 2013

BlackBerry Z10 US

Qualcomm MSM8960, PoP package;

SAMSUNG K3PE0E000A‐XGC2, 16Gb LPDDR2, PoP package

Qualcomm PM8921, PMIC for MSM8960

Qualcomm RTR8600 transceiver

Texas Instruments WL1273LTriQuint TQP6M9017

Fujitsu MBG046C

RFMD RF7252

Avago ACPM‐5017

Page 17: Smart Phone in 2013

BlackBerry Z10 US

Page 18: Smart Phone in 2013

Qualcomm MSM8960, PoP package;

SAMSUNG K3PE0E000A‐XGC2, 16Gb LPDDR2, PoP package

Qualcomm PM8921, PMIC for MSM8960

Qualcomm RTR8600 transceiver

Texas Instruments WL1273L

TriQuint TQP6M9017

Fujitsu MBG046C

Avago ACPM‐5020

Avago ACPM‐5008

BlackBerry Z10 UK

Page 19: Smart Phone in 2013

Avago ACPM‐7051

SAMSUNG KLMAG2GE4A, 16GB eMMC

Inside Secure , SECUREAD IC5C633I4, NFC controller

Qualcomm WCD9310 audio codec

STMicroelectrics LIS3DHInvensense ITG‐3050

Avago ACPM‐5007

RFMD RF7303

BlackBerry Z10 UK

Page 20: Smart Phone in 2013

BlackBerry Z10 UK

Page 21: Smart Phone in 2013

LINEAR PA MODULE. Multi‐Mode LTE/UMTS/CDMA. LTE/UMTS Bands 3, 4, 9, and 10. CDMA Band Class 15

RF7303RF Micro Devices

LTE Band 20 Power Amplifier ModuleACPM‐5020

UMTS Band 8 (880‐915MHz) Power Amplifier ModuleACPM‐5008

LTE Band 7 (2500‐2570 MHz) Power Amplifier ModuleACPM‐5007

Quad‐Band GSM / W‐CDMA Bands 1 & 5 Power Amplifier ACPM‐7051Avago

Z10 ‐ UK

SP10T Antenna SwitchCXM3582URSONY

LTE/UMTS/CDMA BAND 3 Linear Power Amplifier ModuleRF7303

CDMA/WCDMA BAND 2 Linear Power Amplifier ModuleRF7252RF Micro Devices

LTE Band 12/17 Power AmplifierACPM‐5017

Quad‐Band GSM / W‐CDMA Bands 1 & 5 Power Amplifier ACPM‐7051Avago

Z10 ‐ US

NFC controllerSECUREAD IC5C633I4Inside Secure

GSM / CDMA / W‐CDMA / LTE RxD Transceiver + GPS RTR8600Qualcomm

Wi‐Fi RF ModuleTQP6M9017TriQuint

‧802.11 a/b/g/n Wi‐Fi‧Bluetooth 4.0

WL1273LTexas Instruments

▼Radio Frequency

16GB eMMCKLMAG2GE4A

Dual‐channel/x32, 16Gb LPDDR2, LPDDR2‐1066K3PE0E000A‐XGC2SAMSUNG

▼Memory

1.5GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFx, 28nm processQualcomm Snapdragon S4, MSM8960Qualcomm

▼Processor

FunctionDeviceManufacturer

BlackBerry Z10 UK

Page 22: Smart Phone in 2013

Image processor cameraMBG046CFujitsu

▼Video

3‐axis MEMS gyroscopeITG‐3050Invensense

3‐axis MEMS accelerometerLIS3DHSTMicroelectrics

Z10 ‐ UK

3‐axis MEMS gyroscopeUnknownUnknown

3‐axis MEMS accelerometerLIS3DHSTMicroelectrics

Z10 ‐ US

▼MEMs

Touch screen controllerS3203 Synaptics

▼Touch Screen Controller

SLIMbus/I2S Audio codec; 6+ channelWCD9310Qualcomm

▼Audio

PMIC for Qualcomm MSM8960PM8921Qualcomm

▼PMIC

FunctionDeviceManufacturer

BlackBerry Z10 UK

Page 23: Smart Phone in 2013

MOTO X

Page 24: Smart Phone in 2013

MOTO X

Page 25: Smart Phone in 2013

MOTO X

X8 Mobile Computing SystemDivide and conquer with 8 coresHow can a phone that’s able to do so much, still squeeze so much life out of the battery? With a proprietary Motorola system architecture and eight processor cores that only run when there’s work to be done.

4 graphics processor cores for stunning clarity 2 application processor cores for swift action 2 low‐power cores—awaiting your next command

The Motorola X8 Mobile Computing System is comprised of a Qualcomm Snapdragon S4Pro family processor (1.7GHz Dual‐Core Krait CPU, Quad‐Core Adreno320 GPU), a natural language processor and a contextual computing processor.

Page 26: Smart Phone in 2013

MOTO X

Qualcomm MSM8960 Pro, PoPSK Hynix H9TKNNNBPDAR, 2GB LPDDR2, PoP

16/32GB eMMC,16GB: Toshiba THGBMAG7A2JBAIR

NXP 44701, NFC controller

Texas Instruments TMS320C55 DSP

Qualcomm PM8921 PMIC

Texas Instruments MSP430F5259 mixed signal processor

SKYWorks SKY77619 power amplifier

Qualcomm WTR1605L

Page 27: Smart Phone in 2013

MOTO X

Qualcomm WCN3680 WiFi/BT SoC

Qualcomm WCD9310 audio codec

NXP TFA9890 Class‐D audio amplifier

Unknown

SKYWorks SKY77737 power amplifier

EPCOS 7959 wireless LAN/BT filters

AKM AK8963

Bosch BMP180

STMicroelectronics LSM330D

Avago ACPM‐5007  power amplifier

Page 28: Smart Phone in 2013

MOTO X

QualcommPM8921

AKMAK8963

I2C

TexasInstrumentsMSP430F5259

LPDDR2

eMMC16/32GB eMMC16GB: ToshibaTHGBMAG7A2JBAIR

Rx/Tx BB QualcommWCN3680

4.7”720x1280

MIPI

ALS

SynapticsS3204B

Front facing camera

Rear facing camera,

USB

QualcommWCD9310

QualcommWTR1605L

STMLSM330D

I2C

NXP44701

I2C

BoschBMP180

I2C

SK HynixH9TKNNNBPDAR16Gb LPDDR2, PoPLPDDR2

I2C

TexasInstrumentsTMS320C55

AvagoA5507

SkyworksSKY77619

SkyworksSKY77737

SWFGMD94

Page 29: Smart Phone in 2013

MOTO X

Manufacturer Device Function

▼Processor

Qualcomm Qualcomm Snapdragon S4 Pro; MSM8960Pro

. Dual Qualcomm Krait core/1MB L2, 1.7GHz

. Qualcomm Adreno 320 GPU core

. LTE Cat3; DC‐HSPA+; 1xAdv/DO, TD‐SCDMA, GSM/GPRS/EDGE

▼Memory

SK Hynix H9TKNNNBPDAR Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066

Toshiba 16/32GB eMMC Toshiba 16/32GB eMMC16GB: Toshiba THGBMAG7A2JBAIR

▼Radio Frequency

Qualcomm WCN3680 . Dual‐band 2.4 GHz and 5 GHz wireless local area network (WLAN) compliant with the IEEE 802.11 a/b/g/n/ac specification.. Bluetooth® (BT) compliant with the Bluetooth specification version 4.0 (BR/EDR+BLE) and ANT+ Support.

Qualcomm WTR1605L . Multi‐band* plus 700/1500/2600/B41. GPS+Glonass

Skyworks SKY77619 Multiband Multimode Power Amplifier Module for Quad‐Band GSM / EDGE and Penta‐Band (Bands I, II, IV, V, VIII) WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE

SKY77737 Power Amplifier Module for LTE Bands 12/17 (698‐716 MHz)

Avago A5007 Power amplifiers for LTE Band 7

EPCOS 7959 Wireless LAN / Bluetooth Filters (IF)

▼PMIC

Qualcomm PM8921 PMIC for Qualcomm MSM8960Pro

Page 30: Smart Phone in 2013

MOTO X

Manufacturer Device Function

▼Audio

Qualcomm WCD9310 SLIMbus/I2S Audio codec; 6+ channel

Texas Instruments TMS320C55 Digital Signal Processor

NXP TFA9890 High Efficiency Class‐D Audio Amplifier

Wolfson Microelectronics WM7121 Top Port Analogue Silicon Microphone

WM7132 Bottom Port Analogue Silicon Microphone

▼Touch Screen Controller

Synaptics S3402B Touch screen controller

▼MEMs

AKM AKM8963 Electronic compass

STMicroelectronics LSM330D 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine

Bosch BMP180 Barometer

▼Others

Texas Instruments MSP430F5259 Mixed Signal Microcontroller

NXP 44701 NFC controller

unknown 0V00660 A56G 1B unknown

Page 31: Smart Phone in 2013

SnapDragonSnapDragon 600600

APQ8064APQ8064

SLIMbus

USB

QualcommPM8917PMIC

QualcommWCD9310Audio Codec

NFCcontroller

QualcommPM8018PMIC

QualcommTransceiver

QualcommMDM9x15

QualcommPM8821PMIC

MIPI‐CSI

MIPI‐CSI

I2C/SPI

eCompass

Accelerator

Gyroscope

I2C/SPI

I2C/SPI

BarometerI2C/SPI

I/O Hub processor

ISP

HDMI

MHL/SlimPortTransmitter

MHL/SlimPortDisplay

MIPI

ALS

TouchScreen

Controller

Option

Humidity/Temperature

sensor

I2C/SPI

BasebandProcessor

VoiceProcessor

Option

eMMCeMMC

WiFi/BTSoC

SDIO

UART

QualcommWCN3660/WCN3680

Rx/Tx BB

Either One

LPDDR2/3 Dual‐channelLPDDR2/3PoP Package

LPDDR2/3

SDIO

Page 32: Smart Phone in 2013
Page 33: Smart Phone in 2013
Page 34: Smart Phone in 2013

Qualcomm PM8018 PMIC

Qualcomm PM8821 PMIC

Qualcomm PM8921 PMIC

Synaptics S32028 touch screen controller

Silicon Image Sil9244 MHL transmitter

Qualcomm SnapDragon 600, PoP package

Elpida 16Gb LPDDR2, PoP package

SAMSUNG eMMC, 16/32/64GB

Qualcomm WCD9310 audio codec

AKM AK8963, compass

STMicroelectronics Package Marking: 0100 9QRV304

STMicroelectronics H3G2, Gyroscope 

Bosch BMA200, Accelerometer

Page 35: Smart Phone in 2013

TriQuint TQM7M9023

AVAGO ACPM‐5020

Qualcomm MDM9215M

Avago ACPM‐5007

AVAGO ACPM‐5508

Qualcomm WTR‐1605L

SKYWORKS SKY77764

Broadcom BCM4335 NXP PN544, NFC controller

Skyworks 85302‐11 

SKYWORKS SKY77762

Page 36: Smart Phone in 2013
Page 37: Smart Phone in 2013

2M pixel camera, front cameraOV2A9BAOmniVision

4M pixel camera, rear camera58698A

UnknownPackage Marking: 0100 9QRV304STMicroelectronics

HDMI‐to‐MHL™ TransmitterSiI9244Silicon Image

▼Video

Gyroscope for motion stabilization for Rear cameraIDG‐2021(Package markings: 1Y21 3009E1L1250)Invensense

Gyroscope H3G2STMicroelectronics

Accelerometer BMA220Bosch

Electronic compassAK8963AKM

▼MEMs

Touch screen controllerS32028Synaptics

▼Touch Screen Controller

SLIMbus/I2S Audio codec; 6+ channelWCD9310Qualcomm

▼Audio

PMIC for Qualcomm MDM9215MPM8018

PM8821PMIC for Qualcomm APQ8064

PM8921Qualcomm

▼PMIC

SAMSUNG 16/32/64GB eMMC32GB eMMC: KLMBG4GE2A 

THGBM5G6A2JBAIRSAMSUNG

Dual‐channel, x32, 16Gb LPDDR2, LPDDR2‐1066BA164B1PF‐1D‐FElpida

▼Memory

1.7GHz, Quad‐core/Krait core/1MB L2, Adreno 320 GFxQualcomm Snapdragon 600(Package Marking: APQ8064)

Qualcomm

▼Processor

FunctionDeviceManufacturer

Page 38: Smart Phone in 2013

NFC controllerPN544NXP Semiconductor

Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE – Band II (1850‐1910 MHz)

SKY77762

Power Amplifier Module for CDMA/ WCDMA/ HSDPA/ HSUPA/ HSPA+/ LTE – Bands III, IV, IX (1710 MHz–1785 MHz)

SKY77764Skyworks

Power amplifiers for LTE Band 7A5007

Power amplifiers for LTE Band 20A5020

UMTS amd GSM/EDGE Power amplifiers for UMTS Band 5 A5508Avago

Multi‐Mode, Multi‐Band Power Amplifier (MMPA) with Quad‐Band GMSK / EDGE and Dual‐Band WCDMA•Quad‐band Linear GSM / EDGE•UMTS B1 and B5/B8•Input power controlled ‐ GMSK and 8PSK•GSM LB has 3 modes ‐ HP, MP, LP•GSM HB has 2 modes ‐ HP, LP•WCDMA has 3 modes ‐ HP, MP, LP•HBT / PHEMT / CuFlip™ PA Technology

TQM7M9023TriQuint

Multi‐band* plus 700/1500/2600/B41 GPS+GlonassWTR1605L

Baseband processor‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)‧Rel 9 DCHSPA+(42/5.76Mbps)‧TD‐SCDMA(4.2/2.2Mbps)‧QICE‧Integrated Memory

MDM9215MQualcomm

2.4 GHz, 256 QAM WLAN/Bluetooth® Front‐End Module85302‐11Skyworks

‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.0‧FM Receiver

BCM4335Broadcom

▼Radio Frequency

FunctionDeviceManufacturer

Page 39: Smart Phone in 2013
Page 40: Smart Phone in 2013

Audience eS325A

SLIMBusQualcommWCD9310

BroadcomBCM20794

x32 LPDDR3

eMMC Toshiba16/32/64GB 

eMMC

SAMSUNGK3QF2F200E‐XGCE16Gb LPDDR3PoP Package

x32 LPDDR3

Rear facing camera, 13MP

USB

QualcommWTR1605L

QualcommPM8018

QualcommMDM9215M

Front facing camera, 2MP

QualcommPM8917

QualcommPM8821

FujitsuMBG965H

SKYWORKSSKY77737

SDIO

UART

Snapdragon 600

5",1920*1080AMOLED

SynapticsS5000B ALS

MAXIMMAX77803

NFC

RFMDRF7307

Silicon ImageSiI8240

HDMI

MHL

Broadcom BCM4335

SDIO

Sensirion SHTC1

I2C

I2C

I2C/SPI

I2C/SPI

ATMEL UC128L5

IR sensors

BoschBMP182

STM LSM330DLC

YamahaYAS532B

Galaxy S® 4 LTE

Page 41: Smart Phone in 2013

SLIMbus

QualcommTransceiver

QualcommWCD9320Audio Codec

HDMI

USB

QualcommPM8921PMIC

NFCcontroller

QualcommPM8821PMIC

MHL/SlimPortTransmitter

MHL/SlimPort MIPI‐CSI

MIPI‐CSI

Display

MIPI

ALS

TouchScreen

Controller

I2C/SPI

eCompass

Accelerator

Gyroscope

I2C/SPI

I2C/SPI

BarometerI2C/SPI

I/O Hub processor

Humidity/Temperature

sensor

I2C/SPI

SnapDragonSnapDragon 800800

MSM8974MSM8974

BasebandProcessor

VoiceProcessor

Option

eMMCeMMC

WiFi/BTSoC

SDIO

UART

QualcommWCN3660/WCN3680

Rx/Tx BB

Either One

LPDDR3 Dual‐channelLPDDR3

PoP PackageLPDDR3

SDIO

Page 42: Smart Phone in 2013
Page 43: Smart Phone in 2013

Model N9005Model N9005

QualcommPM8941

QualcommWCD9320

SLIMbus

LPDDR3

eMMC

QualcommPM8921

BroadcomBCM4339

SDIOUART

5.7”1920x1080

MIPI

SiliconImageSil8240B

HDMI

ALS

BroadcomBCM20794

USB

QualcommWTR1605L

SAMSUNGK3QF7F70DM‐QGCE

3GB LPDDR3PoP Package

LPDDR3

MaximMAX77804

AudienceeS325

SynapticsS5050A

WacomW9010

SAMSUNGKLMBG4GEAC‐B001

I2C

Bosche‐Compass

I2C

SensirionSHTC1

I2C

Barometer I2C

STMicro32F401B

InvenSenseMPU‐6500

MIPI‐CSI

MIPI‐CSI

RF MicroRF1119

AvagoACPM‐7600

AvagoACMD‐6207

QualcommQFE1100

Page 44: Smart Phone in 2013

Manufacture Device Function

▼Processor

Qualcomm Qualcomm Snapdragon 800, MSM8974AB . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx. Rel 10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE

▼Memory

SAMSUNG K3QF7F70DM‐QGCE Dual channel, 24Gb LPDDR3, PoP Package

KLMB4GEAC‐B0001 SAMSUNG 32GB eMMC

▼Radio Frequency

Qualcomm WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

QFE1100 LTE Envelope Tracking IC

Broadcom

BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.0‧FM Receiver

BCM20794 NFC controller

Avago ACPM‐7600 Multi‐mode/Multi‐band power amplifier

ACMD‐6207 LTE Band VII FBAR duplxer

RF Micro RF1119 Antenna control module

▼PMIC

Qualcomm PM8941 PMIC for Qualcomm MSM8974AB

PM8921 PMIC for Qualcomm MSM8974AB

▼Audio

Qualcomm WCD9320 SLIMbus/I2S Audio codec; 6+ channel

Page 45: Smart Phone in 2013

Manufacture Device Function

▼Touch Screen Controller

Synaptics S5050A Touch screen controller

WACOM W9010 Controller for SAMSUNG S Pen

▼MEMs

Invensense MPU‐6050 3‐axis MEMS gyroscope and 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine

Sensirion SHTC1 Humidity and temperature sensor

Bosch E5H eCompass

▼Video

Silicon Image Sil8240B MHL 2.0 transmitter with HDMI input

SONY IMX135 13MP, Main (rear) camera

SAMSUNG S5K6B2YX03 1.2MP Sub (front) camera

▼Others

MAXIM MAX77804 Battery charger IC

STMicroelectronics 32F401B Sensor Hub MCU

Cypress  CY8C20055  Capsense button controller chip 

Page 46: Smart Phone in 2013

QualcommPM8941

LPDDR3

eMMC ToshibaTHGBM5G7A4JBA4W

QualcommPM8921

BroadcomBCM4339

SDIOUART

5.7”1920x1080

MIPI

SiliconImageSil8240B

HDMI

ALS

BroadcomBCM20794

USB

QualcommWTR1605L

SAMSUNGKQF7F&0DM‐QGCE

3GB LPDDR3PoP Package

LPDDR3

MaximMAX77804

SynapticsS5050A

WacomW9010

SpreadtrumSC6500ES

QualcommWCD9320

SLIMbusAudienceeS325

I2C

e‐CompassI2C

SensirionSHTC1

I2C

Barometer I2C

STMicro32F401B

Accelerometer&

Gyroscope

China Mobile China Mobile N9009N9009

MIPI‐CSI

MIPI‐CSI

Page 47: Smart Phone in 2013

nexus 5

Nexus 5.Made forwhat matters.Introducing the new5” phone from Google.

Page 48: Smart Phone in 2013

nexus 5

Qualcomm SnapDragon 800, MSM8974, PoP Package

SK Hynix, H9CKNNNBPTMRLR, Dual‐channel, 16Gb LPDDR3

Qualcomm WCD9320 audio Codec 

Qualcomm QFE1100 

Avago A5805Texas Instruments BQ24192Qualcomm PM8941 PMIC

Analogix AX7808 SlimPort transmitter

Page 49: Smart Phone in 2013

nexus 5

Qualcomm PM8841 PMIC

Qualcomm WTR1605L 

Invensense MPU‐6515 AKM AK8963

Avago RF1335

Broadcom BCM4339 WiFi/BT SoC

RFMD RF1119

16GB/32GB storage

16GB: Sandisk SDIK8DE4‐16G

Page 50: Smart Phone in 2013

nexus 5

Texas Instruments BQ51013B

Broadcom 20793M NFC controller

Page 51: Smart Phone in 2013

nexus 5

SK HynixH9CKNNNBPTMRLR

16Gb LPDDR3PoP Package

QualcommPM8941

InvenSenseMPU‐6515

I2C

QualcommWCD9320

SLIMbus

LPDDR3

eMMC SandiskSDIN8DE416GB eMMC

QualcommPM8921

BroadcomBCM4339

SDIOUART

4.95”1920 x 1080

MIPI

ALS

USB

LPDDR3

TexasInstrumentsBQ24192

SynapticsS3350B

QualcommWTR1605L

AKMAK8963

I2C

BroadcomBCM20793M

AnalogixANX7808

TexasInstrumentsBQ51013B

QualcommQFE1100 AVAGO

ACPM‐7600AVAGOA5805

AVAGORFI335

RFMD6093

InvenSenseIDG

‐2020

SlimPort

Barometer I2C

Page 52: Smart Phone in 2013

nexus 5

NFC controllerBCM20793M

Manufacture Device Function

▼Processor

Qualcomm Qualcomm Snapdragon 800, MSM8974. 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx. Rel 10 LTE CA, DC‐HSPA, 1xAdv/DO,TD‐SCDMA, GSM/GPRS/EDGE

▼Memory

SK Hynix H9CKNNNBPTMRLR‐NTM Dual channel, 16Gb LPDDR3, PoP Package

Main Storage 16/32GB eMMC . 16GB/32GB eMMC. 16GB : Sandisk SDIN8DE4

▼Radio Frequency

Qualcomm WTR1605L Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

QDE1100 LTE Envelope Tracking IC

Broadcom BCM4339‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.0‧FM Receiver

Avago ACPM‐7600 Multi Mode, Multi Band RF power amplifier

RFMD RF1119 antenna control 

▼PMIC

Qualcomm PM8941 PMIC for Qualcomm MSM8974

PM8921 PMIC for Qualcomm MSM8974

Texas Instruments BQ24192 I2C controlled 4.5 A USB/adapter charger

BQ51013B WPC 1.1 Compatible Fully Integrated Wireless Power Receiver

Page 53: Smart Phone in 2013

nexus 5

Manufacture Device Function

▼Audio

Qualcomm WCD9320 SLIMbus/I2S Audio codec; 6+ channel

▼Touch Screen Controller

Synaptics S3350B Touch Screen controller

▼MEMs

Invensense MPU‐6515 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine

IDG‐2020  dual axis gyroscope for Optical Image Stabilization (OIS)

AKM AK8963 3‐axis electronic compass

▼Video

Analogix ANX7808 SlimPort transmitter

Page 54: Smart Phone in 2013
Page 55: Smart Phone in 2013

QualcommPM8941

STMicroLSM330

QualcommWCD9320

SLIMbus

LPDDR3

eMMC SanDiskSDIN8DE4‐16G16GB eMMC

I2C

QualcommPM8841

QualcommWCN3680

Rx/Tx BB

5”1920x1080, IPS

MIPI

ALS

BroadcomBCM20793M

UART

Front facing camera

Rear facing camera,

USB

QualcommWTR1625

SAMSUNGK3QF2F20DA‐QGCF16Gb LPDDR3PoP Package

LPDDR3AtmelMXT540S

QualcommQFE1101

AvagoACPM‐7600

Oberthur256111

SKYWorksSKY85702

CompassI2C

BarometerI2C

I2C

Page 56: Smart Phone in 2013

Manufacture Device Function

▼Processor

Qualcomm Qualcomm Snapdragon 800, MSM8274AB . 2.3GHz, Quad‐core/Krait core/1MB L2, Adreno 330 GFx. DC‐HSPA+, HSPA+, TDSCDMA, GSM/GPRS/EDGE

▼Memory

SAMSUNG K3QF2F20DA‐QGCF Dual‐channel LPDDR3, LPDDR3‐1866, 16Gb density, PoP Package

SanDisk i‐NAND eMMC; 16GB/32GB16GB: SDIN8DE4‐16G

▼Radio Frequency

Qualcomm WCN3680 . Dual‐band 2.4 GHz and 5 GHz wireless local area network (WLAN) compliant   with the IEEE 802.11 a/b/g/n/ac specification.. Bluetooth® (BT) compliant with the Bluetooth specification version 4.0(BR/EDR+BLE) and ANT+ Support.

SKYWorks SKY85702‐11 5 GHz WLAN Front‐End Module

Qualcomm WTR1625 Multi‐band* plus 700/1500/2600/B41 GPS+Glonass

Avago ACPM‐7600 Multimode, multiband power amplifier module 

Broadcom BCM20793M NFC controller

Oberthur 25611 Security chip for NFC

▼PMIC

Qualcomm PM8941 PMIC for Qualcomm MSM8974

PM8841 PMIC for Qualcomm MSM8974

▼Audio

Qualcomm WCD9320 SLIMbus/I2S Audio codec; 6+ channel

Page 57: Smart Phone in 2013

Manufacture Device Function

▼Touch Screen Controller

Atmel MXT540S Touch screen controller

▼MEMs

Unknown Unknown Electronic compass

Unknown Unknown Barometer

STMicroelectronics LSM330 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine

Page 58: Smart Phone in 2013
Page 59: Smart Phone in 2013

LPDDR3

eMMC eMMCMCP

WiFi/BTSoC

SDIOUART

HDMI

USB

SAMSUNGS2MPS11PMIC

NFCcontroller

MHLTransmitter

MHL

Dual‐channelLPDDR3

PoP PackageLPDDR3

MIPI‐CSI

MIPI‐CSI

Display

MIPI

ALS

TouchScreen

Controller

I2C/SPI

eCompass

Accelerator

Gyroscope

I2C/SPI

I2C/SPI

BarometerI2C/SPI

I/O Hub processor

Humidity/Temperature

sensor

I2C/SPI

SAMSUNG SAMSUNG ExynosExynos 54105410

GNSSReceiver

VoiceProcessor

AudioCodec

I2S

BasebandProcessor

Mobile DDR

OptionBasebandProcessor

SDIO

Page 60: Smart Phone in 2013
Page 61: Smart Phone in 2013

SAMSUNG Exynos 5 Octa

SAMSUNG K3QF2F200C‐XGCE

SAMSUNG KMV3W000LM

SAMSUNG S2MPS11 PMIC

Broadcom BCM4335

Wolfson WM5012E

Audience eS325B

AKM AK8963

Intel X‐Gold 636

Atmel UC128L5

Galaxy S® 4 3G

Page 62: Smart Phone in 2013

Intel SMARTi UE3 RF Transceiver

Broadcom BCM47521

Broadcom BCM20794

Silicon Image Sil8240

MAXIM MAX77803

Skyworks SKY77615

Murata SWC GKF48

Galaxy S® 4 3G

Page 63: Smart Phone in 2013

Galaxy S® 4 3G

AKMAK8963

Silicon ImageSiI8240

Rear‐facing camera:13MP

Front‐facing camera:2MP

BroadcomBCM4335

5",1920*1080AMOLED

SAMSUNGK3QF2F200C‐XGCE

8Gb LPDDR3PoP Package

SAMSUNGKMV3W000LM

eMMC+

Mobile DDR

IntelPMB5745 

SMARTi™ UE3

SAMSUNGS2MPS11

PMIC

IntelPMB9820X‐GOLD™ 636

BroadcomBCM20794

SynapticsS5000B

AudienceeS325B

Wolfson WM5102E

BroadcomBCM47521

Sensirion SHTC1

ALS

SDIO

UART

I2CSDIOUSBUART

I2SI2S

I2C

I2C

I2C/SPI

I2C/SPIHDMI

LPDDR3

LPDDR3

eMMC

MHL

Mobile DDR

ATMEL UC128L5

MAXIMMAX77803

GNSSNFC

IR sensors

BoschBMP182

GyroAccel

Page 64: Smart Phone in 2013

Galaxy S® 4 3G

Near Field Communications (NFC) Controller FamilyBCM20794

GNSS receiver, GPS, GLONASS, QZSS and SBASBCM47521

Multimode Multiband Power Amplifier Module for GSM, EGPRS, EDGE, and WCDMA modes

SKY77615Skyworks

SMARTi UE3 RF Transceiver PMB5745(Package Marking: PMB5745)

Baseband processor:‧ ARM11™ architecture‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second) 

in the downlink and category 7 (11.5 Mbit per second) in the uplink.‧ EDGE multislot class 33

XG636(Package Marking: PMB9820)Intel/Infineon

2.4 GHz QAM WLAN/BT front end module.SKY85303‐11Skyworks

‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.0‧FM Receiver

BCM4335Broadcom

▼Radio Frequency

SAMSUNG eMMC Based MCP. eMMC(16GB)+MDDR(64MB)

KMV3W000LM

‧16Gb LPDDR3‐1066‧Dual Channel/32‐bit/QDP/PoPK3QF2F200C‐XGCESAMSUNG

▼Memory

‧1.8GHz‧ARM big.LITTLE technology‧Quad core CortexTM‐A15+Quad‐core CortexTM‐A7‧Imagination PowerVR SGX544MP3‧28nm manufacturing process

Exynos 5 Octa, Exynos 5410SAMSUNG

▼Processor

FunctionPart NumberManufacturer

Page 65: Smart Phone in 2013

Galaxy S® 4 3G

Battery charger ICMAX77803MAXIM

Humidity and temperature sensorSHTC1Sensirion

▼Others

HDMI‐to‐MHL™ TransmitterSiI8240BOSilicon Image

2 MP sensor, front sensorS5K6B2YX03Samsung

13 Mp, rear‐facing image sensor.IMX135SONY

▼Video

BarometerBMP182Bosch Sensortec

Electronic compassAKM8963AKM

3D accelerometer and 3D gyroscopeLSM330STMicroelectronics

▼MEMs

Touch screen controllerS5000BSynaptics

▼Touch Screen Controller

Voice processoreS325BAudience

Audio CodecWM5012EWolfson Microelectronics

▼Audio

PMIC for SAMSUNG Exynos 5 OctaS2MPS11SAMSUNG

▼PMIC

FunctionPart NumberManufacturer

Page 66: Smart Phone in 2013

Galaxy S® 4 China Unicom

Page 67: Smart Phone in 2013

SAMSUNG SAMSUNG ExynosExynos 54205420

WiFi/BTSoC

SDIOUART

HDMI

USB

NFCcontroller

MHLTransmitter

MHL MIPI‐CSI

MIPI‐CSI

Display

MIPI

ALS

TouchScreen

Controller

I2C/SPI

eCompass

Accelerator

Gyroscope

I2C/SPI

I2C/SPI

BarometerI2C/SPI

I/O Hub processor

Humidity/Temperature

sensor

I2C/SPI

GNSSReceiver

VoiceProcessor

AudioCodec

I2S

LPDDR3

eMMC eMMCMCP

Dual‐channelLPDDR3

PoP PackageLPDDR3

BasebandProcessor

Mobile DDR

OptionBasebandProcessor

SDIO

Page 68: Smart Phone in 2013
Page 69: Smart Phone in 2013

YAMAHAY831

I2S

LPDDR3

eMMC SAMSUNGKMV2W000LM‐B506

BroadcomBCM4339

SDIOUART

5.7”1920x1080

MIPI

SiliconImageSil8240B

HDMI

ALS

BroadcomBCM20794

UART USB

IntelPMB9820X‐GOLD™ 636

SAMSUNGKQF7F&0DM‐HGCE

3GB LPDDR3PoP Package

LPDDR3

MaximMAX77804

SynapticsS5050A

WacomW9010

IntelPMB5745SMARTi™ UE3

Model N9000Model N9000

BroadcomBCM47521

UART

I2C

AKMAK9911

I2C

SensirionSHTC1

I2C

Barometer I2C

STMicro32F401B

InvenSenseMPU‐6500

MIPI‐CSI

MIPI‐CSI

Page 70: Smart Phone in 2013

Manufacture Device Function

▼Processor

SAMSUNG Exynos 5 Octa, Exynos 5420 ‧1.9GHz‧ARM big.LITTLE technologyQuad core CortexTM‐A15 + Quad‐core CortexTM‐A7

‧ARM Mali‐T628 GPU‧28nm manufacturing process

▼Memory

SAMSUNG K3QF7F70DM‐HGCE Dual channel, 24Gb LPDDR3, PoP Package(Customized PoP package for Exynos 5420, not standard package)

KMV2W000LM‐B506 SAMSUNG eMMCMCP(eMMC+LPDDR)

▼Radio Frequency

Intel X‐Gold 636(Package Marking: PMB9820) Baseband processor:‧ ARM11™ architecture‧ 3GPP Rel7 HSPA+ platform supports HSPA category 14 (21 Mbit per second) 

in the downlink and category 7 (11.5 Mbit per second) in the uplink.‧ EDGE multislot class 33

PMB5745(Package Marking: PMB5745) SMARTi UE3 RF Transceiver 

Broadcom

BCM4339 ‧802.11 ac/a/b/g/n Wi‐Fi‧Bluetooth 4.0‧FM Receiver

BCM47521 GNSS receiver

NXP BCM47521 NFC controller

RF Micro RF1119 Antenna control module

▼PMIC

Not necessary Not necessary Not necessary

▼Audio

Yamaha Y831 Audio Codec

Page 71: Smart Phone in 2013

Manufacture Device Function

▼Touch Screen Controller

Synaptics S5050A Touch screen controller

WACOM W9010 Controller for SAMSUNG S Pen

▼MEMs

Invensense MPU‐6050 3‐axis MEMS gyroscope and 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine

Sensirion SHTC1 Humidity and temperature sensor

AKM AK9911 eCompass

▼Video

Silicon Image Sil8240B MHL 2.0 transmitter with HDMI input

SONY IMX135 13MP, Main (rear) camera

SAMSUNG S5K6B2YX03 1.2MP Sub (front) camera

▼Others

MAXIM MAX77804 Battery charger IC

STMicroelectronics 32F401B Sensor Hub MCU

Cypress  CY8C20236A Capsense button controller chip 

Page 72: Smart Phone in 2013
Page 73: Smart Phone in 2013

eMMC

LPDDR3

eMMC

WiFi/BTSoC

TexasInstruments

TPS65913PMIC

I2C

GNSSReceiver

Gyro/Accel

I2C/SPI

SDIOUARTUART

AudioCodec

I2SSDIO

USB

Dual‐channelLPDDR3LPDDR3

BarometerI2C/SPI

eCompassI2C/SPI

NFCController

UART

MIPI‐CSI

MIPI‐CSI

Display

MIPI

ALS

TouchScreen

Controller

BasebandProcessor

I2S

Page 74: Smart Phone in 2013
Page 75: Smart Phone in 2013

TexasInstrumentsTPS65913PMIC

I2C

InvenSenseMPU‐6050

I2C

Cirrus LogicCS42L73

I2S

MIPI

5”1920x1080, IPS

AtmelMXT540S

Front facing camera

Rear facing camera,

LPDDR3

eMMC

SK HynixH9CCNNNBPTML16Gb LPDDR3

SanDiskSDIN8DE4‐16G16GB eMMC

LPDDR3

BroadcomBCM43341

SDIOUART

Oberthur211808

USB

SPREADTRUMSC8803G5

ALS

Micron2ZC27D9LQQ

RF MicroRF9812

SPRDSR3500

CompassI2C

BarometerI2C

Page 76: Smart Phone in 2013

Manufacture Device Function

▼Processor

nVidia NVIDIA® Tegra® 4 Quad core ARM CortexTM‐A15; nVidia 72‐cores GPU

▼Memory

SK Hynix H9CCNNNBPTML Dual‐channel LPDDR3, LPDDR3‐1866, 16Gb density

SanDisk 16/64GB eMMC eMMC 4.5; 16GB/64GB; 16GB: SanDisk SDIN8DE4‐16G

Micron MT46H32M16LFBF‐5 512Mb LPDDR, for Spreadtrum basseband processor

▼Radio Frequency

Spreadtrum SC8803G TD‐SCDMA, EDGE, GPRS and GSM operation and supports TD‐HSDPA at 2.8Mbps and TD‐HSUPA at 2.2Mbps

SR3500 FDD/TDD/LTE‐A, TD‐SCDMA, WCDMA HSPA+, GSM/EDGE (HEDGE) single‐chip radio transceivers, with support for quad‐band TD‐LTE, tri‐band FDD‐LTE, dual‐band TD‐SCDMA, penta‐band WCMDA and quad‐band GSM

Broadcom 

BCM43341 ‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Bluetooth Version 4.0‧ FM radio receiver ‧ BCM2079X NFC controller

RF Micro Devices RF9812 QUAD‐BAND GPRS/LINEAR EDGE +3.2V, TD‐SCDMA MULTI‐MODE TRANSMIT MODULE

Oberthur 211808 Security chip for NFC

Page 77: Smart Phone in 2013

Power ManagementMAX77665AMAXIM

Manufacture Device Function

▼PMIC

Texas Instruments TPS65913 PMIC for NVIDIA® Tegra® 4

▼Audio

Cirrus Logic CS42L73 Audio codec

▼Touch Screen Controller

Atmel MXT540S Touch screen controller

▼MEMs

Unknown Unknown Electronic compass

Unknown Unknown Barometer

Invensense MPU‐6050 3‐axis MEMS gyroscope, a 3‐axis MEMS accelerometer, and a Digital Motion Processor. (DMP.) hardware accelerator engine

▼Others

Page 78: Smart Phone in 2013
Page 79: Smart Phone in 2013

338S1216‐A2PMIC

338S1201Audio Codec

338S1202Class‐D Amplifier

Page 80: Smart Phone in 2013

FaceTime camera

iSight Front camera

WiFi/BTSoC

SDIOUART

Lightning

NXP1610A1

eCompass I2C/SPI

Accelerator I2C/SPI

GyroscopeI2C/SPI

NXP LPC18A1

338S1216‐A2PMIC

338S1201Audio Codec

338S1202Class‐D Amplifier

Display

MIPI

ALS

TouchScreen

Controller

BroadcomQualcomm

PMIC

QualcommTransceiver

QualcommMDM Modem

NXP6416A

LPDDR3

NAND Flash 16/32/64GB

NAND Flash

Dual‐channelLPDDR3LPDDR3

Page 81: Smart Phone in 2013
Page 82: Smart Phone in 2013

Model A1533

Model A1530

PCB Photo Source: Techinsights & iFixit

Page 83: Smart Phone in 2013

Model A1533

Model A1530

Different model (different band support) has different 

PA design.

SkyworksSKY77355

AVAGOA7900720

TriQuintTQM6M6224

SkyworksSKY77810

AVAGOA7900

PCB Photo Source: Techinsights & iFixit

Page 84: Smart Phone in 2013

SK Hynix E2NAND 3.0

WiFi module from Murata. Broadcom BCM4334 WiFi/BT SoC

Texas Instruments 37CCVHI 343S0645

Broadcom BCM5976A0KUB2G

STM 3‐axis gyroscope

Bosch Sensortech BMA220 3‐axis accelerometer

Apple 338S1216‐A2 PMIC (Dialog Semiconductor)

Apple 338S1201 audio codec (Cirrus Logic)

Apple 338S1202 Class D audio amplifier (Cirrus Logic)

Qualcomm PM8018, PMIC for MDM9615M

NXP 1610A1, unknown function

Texas Instruments 36ATLC1 65730A0P; unknown function

PA chips for Model A1533

PCB Photo Source: Techinsights, iPhone 5S Model A1533

Page 85: Smart Phone in 2013

Apple A7 application Processor, PoP package

ElpidaF8164A1PD‐GD‐F , Dual‐channel, LPDDR3‐1600, 8Gb, PoP package

Qualcomm WTR1605L transceiver

Apple M7 coprocessor, NXP LPC1800 series micro processor

AKM AK8963 compass

Qualcomm MDM9615M baseband processor

PCB Photo Source: Techinsights, iPhone 5S Model A1533

Page 86: Smart Phone in 2013

4.0”1366x640

MIPI

ALS

BroadcomBCM5976

Front facing camera

Rear facing camera,

AKMAK8963

I2C/SPI NXPLPC18A1

BoschBMP220

I2C/SPI

STMGyroscope

I2C

QualcommPM8018

QualcommWTR1605L

QualcommMDM9615M

BroadcomBCM4334

SDIOUART

LPDDR3

NAND Flash 16/32/64GB

NAND Flash

ElpidaF8164A1PD‐GD‐F8Gb LPDDR3, PoP

LPDDR3

Apple338S1216‐A2

PMICApple338S1201

Audio Codec

TexasInstruments37CCVHI343S0645

Touch Screen

Apple M7

Apple338S1202Class D AMP

Lightning

NXP1610A1

NXP6416A

PA chips

PA chips are model dependent

Page 87: Smart Phone in 2013

Multi‐band plus 700/1500/2600/B41 GPS+GlonassWTR1605L

Baseband Processor‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)‧Rel 9 DCHSPA+(42/5.76Mbps)‧TD‐SCDMA(4.2/2.2Mbps)‧QICE‧Integrated Memory

MDM9615MQualcomm

Broadcom BCM4334‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY 

layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density

parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for

supporting future specifications ‧ Bluetooth Class 1 transmitter operation

339S00205(BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC)

Murata

▼Radio Frequency

‧16GB/32GB/64GB‧Supplier: SK Hynix E2NAND 3.0

ECC free NAND FlashStorage

‧32‐bit, Dual‐channel, 8Gb LPDDR3‐1600‧PoP packageF8164A1PD‐GD‐FElpida

▼Memory

‧NXP LPC1800 series micro processor‧ARM Cortex‐M3 

NXP LPC18A1(Apple M7 Processor)

NXP

‧Dual‐core, ARMv8 architecture, 1.3GHz‧Imagination PowerVR 6 series GPU‧Manufactured by SAMSUNG 28nm HKMG process‧PoP package

Apple A7 Microprocessor(Apple APL0698)

Apple

▼Processor

FunctionDeviceManufacturer

Page 88: Smart Phone in 2013

Unknown function6416A

Unknown function1610A1NXP

Unknown function36ATLC1 65730A0PTexas Instruments

▼Others

Front Camera, 8 Mp CMOS Image SensorExmor‐RS sensorSONY

▼Camera

Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital outputAK8963AKM

Ultra small triaxial, low‐g acceleration sensor with digital interfacesBMA220Bosch Sensortech

MEMS motion sensor: three‐axis digital output gyroscopePackage markings B329STMicroelectronics

▼MEMs

Touch Screen ControllerBCM5976A0KUB2G Broadcom

Line Driver37CCVHI 343S0645Texas Instruments

▼Touch Screen Controller

Low Power Class‐D Audio AmplifiersApple 338S1202 (Cirrus Logic)

Audio CodecApple 338S1201(Cirrus Logic)Apple

▼Audio

PMIC for Qualcomm MDM9615M baseband processorPM8018Qualcomm

PMIC for Apple A7 ProcessorApple 338S1216 (Dialog D2045)Apple

▼PMIC

FunctionDeviceManufacturer

Page 89: Smart Phone in 2013

338S1164‐B2PMIC

338S1116Audio Codec

338S1202Class‐D Amplifier

Page 90: Smart Phone in 2013

FaceTime camera

iSight Front camera

WiFi/BTSoC

SDIOUART

LPDDR2

NAND Flash 16/32/64GB

NAND Flash

Dual‐channelLPDDR2

PoP PackageLPDDR2

Lightning

NXP1610A1

eCompass I2C/SPI

AcceleratorI2C/SPI

Gyroscope I2C/SPI

338S1164‐B2PMIC

QualcommPMIC

QualcommTransceiver

QualcommMDM Modem

338S1116Audio Codec

338S1202Class‐D Amplifier

Display

MIPI

ALS

TouchScreen

Controller

Page 91: Smart Phone in 2013
Page 92: Smart Phone in 2013

Model A1532

Model A1529

PCB Photo Source: Techinsights & iFixit

Page 93: Smart Phone in 2013

Model A1532

Model A1529

Different model (different band support) has different 

PA design.

PCB Photo Source: Techinsights & iFixit

SkyworksSKY77496

RF MicroRF3763

TriQuintTQF6414

SkyworksSKY77810

AVAGOA792503

SkyworksSKY77572

SkyworksSKY77355

AVAGOA7900720

TriQuintTQM6M6224

SkyworksSKY77810

AVAGOA7900

Page 94: Smart Phone in 2013

SK Hynix E2NAND 3.0

WiFi module from USI/Murata. Broadcom BCM4334 WiFi/BT SoC

Texas Instruments 37CCVHI 343S0645

Broadcom BCM5976A0KUB2G

STM 3‐axis gyroscope

Bosch Sensortech BMA220 3‐axis accelerometer

Apple 338S1164 PMIC (Dialog Semiconductor)

Apple 338S1116 audio codec (Cirrus Logic)

Apple 338S1201 Class D audio amplifier (Cirrus Logic)

Qualcomm PM8018, PMIC for MDM9615M

NXP 1610A1, unknown function

Texas Instruments 36ATLC1 65730A0P; unknown function

PA chips for Model A1532

PCB Photo Source: Techinsights, iPhone 5S Model A1532

Page 95: Smart Phone in 2013

Apple A6 application Processor, PoP package

Elpida/SK Hynix , Dual‐channel, LPDDR2‐1066, 8Gb, PoP package

Qualcomm WTR1605L transceiver

AKM AK8963 compass

Qualcomm MDM9615M baseband processor

PCB Photo Source: Techinsights, iPhone 5S Model A1532

There is no NXP LPC1800 series microprocessor

Page 96: Smart Phone in 2013

4.0”1366x640

MIPI

ALS

BroadcomBCM5976

Front facing camera

Rear facing camera,

AKMAK8963

I2C/SPI

BoschBMP220

I2C/SPI

STMGyroscope

I2C

QualcommPM8018

QualcommWTR1605L

QualcommMDM9615M

BroadcomBCM4334

SDIOUART

LPDDR2

NAND Flash

Toshiba/SK Hynix16/32GB

NAND Flash

Elpida/SK Hynix

8Gb LPDDR2, PoPLPDDR2

Apple338S1164PMIC

Apple338S1116

Audio Codec

TexasInstruments37CCVHI343S0645

Touch Screen

Apple338S1201Class D AMP

Lightning

NXP1610A1PA 

chips

PA chips are model dependent

Page 97: Smart Phone in 2013

Multi‐band plus 700/1500/2600/B41 GPS+GlonassWTR1605L

Baseband Processor‧Rel 9 LTE TDD/FDD Cat 3(100/50Mbps)‧Rel 9 DCHSPA+(42/5.76Mbps)‧TD‐SCDMA(4.2/2.2Mbps)‧QICE‧Integrated Memory

MDM9615MQualcomm

Broadcom BCM4334‧ Dual‐band 2.4 GHz and 5 GHz IEEE 802.11 a/b/g/n Wi‐Fi connectivity ‧ Single‐stream IEEE 802.11n support for 20 MHz and 40 MHz channels provides PHY 

layer rates up to 150 Mbps for typical upper‐layer throughput in excess of 90 Mbps ‧ Supports the IEEE 802.11n STBC (space‐time block coding) and LDPC (low‐density

parity check) options for improved range and power efficiency ‧ Complies with Bluetooth Core Specification Version 4.0 + HS with provisions for

supporting future specifications ‧ Bluetooth Class 1 transmitter operation

Murata: 339S0209USI: 339S0204(BRCM BCM4334 SDIO WiFi/ High Speed UART BT SoC)

Murata/USI

▼Radio Frequency

‧16GB/32GB‧Supplier: SK Hynix/Toshiba

NAND FlashStorage

‧32‐bit, Dual‐channel, 8Gb, LPDDR2‐1066‧Supplier: Elpida: B8164B3PM‐1D‐FSK Hynix: H9TKNNN8KDMRBR

8Gb LPDDR2‐1066

System Memory

▼Memory

‧1.26GHz, ARMv7, Dual‐core‧Imagination PowerVR SGX 543MP3‧SAMSUNG 32nm HKMG process

Apple A6 MicroprocessorApple

▼Processor

FunctionDeviceManufacturer

Page 98: Smart Phone in 2013

Unknown function1610A1NXP

Unknown function36ATLC1 65730A0PTexas Instruments

▼Others

Front Camera, 8 Mp CMOS Image SensorUnknownSONY

▼Camera

Electronic Compass ‐ 3‐Axis, w/ built‐in ADC & 14‐16‐bit selectable digital outputAK8963AKM

Ultra small triaxial, low‐g acceleration sensor with digital interfacesBMA220Bosch Sensortech

MEMS motion sensor: three‐axis digital output gyroscopePackage markings B329STMicroelectronics

▼MEMs

Touch Screen ControllerBCM5976A0KUB2G Broadcom

Line Driver37CCVHI 343S0645Texas Instruments

▼Touch Screen Controller

Low Power Class‐D Audio AmplifiersApple 338S1202 (Cirrus Logic)

Audio CodecApple 338S1116(Cirrus Logic CLI1588B1 42L65)

Apple

▼Audio

PMIC for Qualcomm MDM9615M baseband processorPM8018Qualcomm

PMIC for Apple A6 ProcessorApple 338S1164(Dialog Semiconductor D2013 )

Apple

▼PMIC

FunctionDeviceManufacturer