SMART POWER MODULES - P&S 반도체 - 페어차일드 ... · Fairchild Semiconductor – Smart Power Module SMART POWER MODULES for Low-Power Variable Speed Motor Drive Applications

Fairchild Semiconductor – Smart Power Module

SMART POWER MODULESfor Low-Power Variable Speed Motor Drive Applications

June, 2002

Application Engineering GroupFairchild Semiconductor

...

SELLING AGENCY : People & Semiconductor www.pns4u.co.kr TEL : 02) 2107-7240/7730

Fairchild Semiconductor – Smart Power ModuleJune 2002

SPIM Series

SPM Products

SPM Series

ConsumerAir-conditionerWashing MachineRefrigeratorKitchen Fan

IndustrialCommercial inverter.Fan motor controlAuto door controlAC servo , DC servoSewing machineWire bonding machine

SPM Markets


! The use of inverters in low-power motor drive, in particular,home appliances applications has been increasing due tohigh efficiency, high performance and so on.

! SPMs are becoming more and more obvious choice for

inverter makers because of their many attractive advantages:- Compact system design- Protective functions- Less parts counts- High reliability- Good noise Immunity

! Fairchild-SPMs have achieved optimum cost-performance ratios

using the following distinctive technology:- Multi-chip assembly on common lead-frame- Ceramic-based isolation packaging

Why do we need Smart Power Modules?


SPMs give the following benefits

! Reduced system design time:SPM frees customers from the job of power circuit design.

This allows them to launch new products faster.

! Reduced manufacturing time:All the necessary “Power” parts are inside the SPM. Customers need not worry about “Power”

part assemblies. Enhanced productivity in comparison to a discrete IGBT solution.

! High-yields in manufacturing:Simplified manufacturing as all the diverse components are combined in the SPM.

! Less components to order & stock:You can order and stock the SPM as just one device. Minimized inventory levels and costs.

! More compact system:The compact and thin outline of the SPM enables the design of smaller appliances.

In addition to a smaller size it also results in cost reduction.

! Reduced field failure ratio:The internal protection circuit of the SPM prevents failures in the IGBT-chips.

This is effective in minimizing the failure of the “Power” part in the field.


Integrated Function of SPM

! For inverter high-side IGBTs :Gate driving circuit

High voltage isolated high-speed level shifting

Control supply under-voltage(UV) protection

! For inverter low-side IGBTs :Gate driving circuit

Short-circuit protection with soft shut-down control

Control supply under-voltage(UV) protection

! Temperature monitoring :Over-temperature monitoring using built-in thermistor

! Fault signaling :Corresponding to a SC fault(low-side IGBTs) or a UV fault(low-side supply)

! Input interface :5V/3.3V CMOS/LSTTL compatible,Schmitt trigger input


UnitPFCor

ctifierReDiode

ModulesIGBT

UnitIsolation

CPUControlfor

SupplyPower

DrivingGatefor

SupplyPower

MultiIsolated

DriversGate

UnitIsolation

UnitgsinSen

Capacitors

LinkDC −

Variable Voltage &Variable Frequency

MotorsACSourceAC

Constant Voltage &Constant Frequency

Discrete or Conventional Module Solution

High Performanceac Drive System

100~264V

Trend of SPM Technology


Conventional IPM Solution

DrivingGatefor

SupplyPower

MultiIsolated

Controlfor

SupplyPower

Capacitors

LinkDC −

CPU


MotorsACSourceAC

Constant Voltage &Constant Frequency IGBTs

UnitIsolation

UnitgsinSen

DriversGate

UnitPFCor

ctifierReDiode

Higher Performanceand Compact Designbut Higher Cost

100~264V



SupplyPowerSingleCommon

CPUUnitgsinSen

Capacitors

LinkDC −

LVIC ControllerGate

HVIC ControllerGate

IGBTsprovedIm


MotorsACSourceAC


UnitPFCor

ctifierReDiode

Transfer-Molded Type IPM Solution (From 1999/2000)

Higher PerformanceCompact DesignLower Cost

100~264V



SPM : Smart Power ModuleSPIM : Smart Power Integrated Module

SupplyPowerCommon

CPU


MotorsAC

LVIC ControllerGate

HVIC ControllerGate

Sensing Unit

IGBTsSense −

IGBTsPerformanceHigh

SourceAC


PFC orDB Unit

ctifierReDiode

100~264V

Tip, Dip, Mini-Dip, Tiny-Dip-SPM

SPIM

Fairchild-SPM Series

TIP-SPM : Triple in- line package type of SPM.DIP-SPM : Dual in- line package type of SPM.Mini-DIP-SPM : Mini-DIP type of SPM.Tiny-DIP-SPM : Tiny-DIP type of SPM.


SPMs and SPIM Development Status and Plan

57 ×××× 55 60 ×××× 30 44 ×××× 26 34 ×××× 21

600V-50A 600V-30A 600V-10A 600V-3A

50 ×××× 75.7

- Doing Mass-Productionup to 600V-30A

- 50A rated productwill be developedat the same PKGby July of 02

- Doing Mass-Production up to 600V-20A

- The 30A-product will befinished by July of 02

- Development will be finishedby August, 02 up to 600V-30A

- Another PKG will be usedfor 600V- 50A and 1200V rated products

600V-50A / 1200V-25A

Smart Power Modules

SPMSPIM

• 3-phase IGBT Inverter• Gate driving and protection

with built-in HVIC

• 3-phase IGBT Inverter• Built-in rectifying diodes and

dynamic-braking or PFC circuit• Gate driving and protection

with built-in HVIC

TipDip Mini-Dip Tiny-Dip

- 10A ER sample : July of 02

- 3A ER sample: August of 02

41% 38% 38%


Smartsolutions

Applicablemotor ratings

( KW)

Additionalfeatures

Air-conditionerWashing machine

Air-conditionerWashing machine

Kitchen Fan motorRefrigeratorWashing Machine(BLDC)

Brushless BLDC Fan motor

Industrial - DC serve motor- Sewing machine- Elevator

- Current protection.- Sensorless available - Over temperature

monitoring.- Short circuit protection

-Compact solution.(Reduce board space)

-Sensorless available(Remove hall sensor)

- DBC substrate structure - Including bridge diode- Current sensing- Sensorless available - Over temperature

monitoring.- Short circuit protection

0.4 - 3.7

0.4 - 2.2

0.15 - 0.4

- 0.15

0.4 - 2.2

Major Application

TIP-SPM

DIP-SPM

Mini-DIP-SPM

Tiny-DIP-SPM

SPIM

Common features

- Low-loss efficient IGBTs FRDs .

- 3 Phase IGBT inverter bridgeIncluding control IC for gateDriving and protection.

- Low leakage current andHigh isolation voltagedue to ceramic-based substrate.

- Single-ground power supplyDue to built-in HVIC.

Fairchild Smart Solutions


Maj

or

Ap

pli

cati

on

Industrial

5A 10A 15A 20A 50A30A3AH M L

W/M

Mass Production

Refrigerator

A/C

Current rating

X

X

XX

XX

X

Frequency

Fan motor

In development

2A1A

SPM Line-up Status & Plan by Application


50 ×××× 75.7

- Development will be finishedby , August 02 up to 600V-30A

- Another PKG will be usedfor 600V- 50A and 1200Vrated products

600V-50A / 1200V-25A

SPIM

COM(L)

VCC

IN(UL)

IN(VL)

IN(W L)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(W L)

NU (29)

NV (28)

NW (27)

U (32)

V (31)

W (30)

P (33)

(17) VS(W )

(16) VB(W )

(19) VS(V)

(18) VB(V)

(4) CSC

(5) CFOD

(6) VFO

(7) IN(W L)

(8) IN(VL)

(9) IN(UL)

(10) COM

(11) VCC

(3) RSC

VTH (2)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

(12) IN(W H)

(13) IN(VH)

(21) VS(U)

(20) VB(U)

(14) IN(UH)

THERMISTOR

VCC

IN

OUT

COM

(22) R(23) S(24) T

B (35)

NB (26)

NR (25)

PR (25)

(15) IN (DB)

RTH (1)

Introduction to SPIM

•DBC (Direct Bonding Copper)

Substrate Structure

• Gate Driving Circuit using HVIC

for the Use of Single-power Supply

•Built-in Thermistor for internal

Temperature Detection

•Short-circuit Protection using

Low-side Sense-IGBTs

•Optional Single-phase Application

•Small Size of Packaging using

Multi-layer Technology

•Three N-terminals for Current

Control Application


W V U N

(14) (15) (16) (17)

P

(1) VCC(L)

(2) COM(L)

(3) IN(UL)

(4) IN(VL)

(5) IN(WL)

(6) VFO

(7) CFOD

(8) CSC

(12) RTH

(11) VTH

(13)

THERMISTOR

(29) VB(U)

(22) COM(H)

(27) IN(UH)

(30) VS(U)

(28) VCC(UH)

(25) VB(V)

(23) IN(VH)

(24) VCC(VH)

(26) VS(V)

(20) VB(W)

(18) IN(WH)

(19) VCC(WH)

(21) VS(W)(10) NC

(9) RSC

VCC

Wout

Uout

Vout

C(SC)

C(FOD)

V(FO)

IN(WL)

IN(VL)

IN(UL)

COM(L)

Vcc

IN

COM

VB

HO

VS

Vcc

IN

COM

VB

HO

VS

Vcc

IN

COM

VB

HO

VS

COM(L)

VCC

IN(UL)

IN(VL)

IN(W L)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(W L)

(26) NU

(27) NV

(28) NW

(29) U

(30) V

(31) W

(32) P(23) VS(W )

(22) VB(W )

(19) VS(V)

(18) VB(V)

(9) CSC

(8) C FOD

(7) VFO

(5) IN(W L)

(4) IN(VL)

(3) IN(UL)

(2) CO M(L)

(1) VCC(L)

(10) RSC

(25) RT H

(24) VT H

(6) CO M(L)

VB

VS

OUT

INCOM

VCC

VB

VS

OUT

INCOM

VCC

VBVS

OUT

IN

COMVCC

(21) VCC(W H)

(20) IN(WH)

(17) VCC(W H)

(16) COM(H)

(15) IN(WH)

(14) VS(U)

(13) VB(U)

(12) VCC(UH)

(11) IN(UH)

THERMISTO R

57 ×××× 55 60 ×××× 30

600V-50A 600V-30A

- Doing Mass-Production up to 600V-30A- The 50A rated product will be developedat the same PKG by July of 02

- Doing Mass-Production up to 600V-20A- The 30A-product will be finished by July of 02

• Ceramic-based Transfer-

Molded-Type Packaging

• Gate Driving Circuit using

HVIC for the Use of Single-

power Supply

• Optional Built-in

Thermistor

• Short-circuit Protection

using Low-side

Sense-IGBTs

• Very Low Thermal

Resistance

(TIP-SPM : <1.7 at 30A Rating)

• Three N-terminals for

Current Control Application

(DIP-SPM)

TIP-SPM DIP-SPM

Introduction to Tip-SPM & Dip-SPM


COM(L)

VCC

IN(UL)

IN(VL)

IN(W L)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(W L)

NU (21)

NV (22)

NW

(23)

U (24)

V (25)

W (26)

P (27)

(21) VS(W )

(20) VB(W )

(17) VS(V )

(16) VB(V )

(8) CSC

(7) CFOD

(6) VFO

(5) IN(W L)

(4) IN(VL)

(3) IN(UL)

(2) CO M(L)

(1) VCC(L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

(19) VCC(W H)

(18) IN(W H)

(15) VCC(W H)

(13) IN(W H)

(12) VS(U)

(11) VB(U)

(10) VCC(UH)

(9) IN(UH)

COM(L)

VCC

IN(UL)

IN(VL)

IN(W L)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(W L)

P

V

VB(W )

V

VB(V)

CSC

CFOD

VFO

IN(W L)

IN(VL)

IN(UL)

COM(L)

VCC(L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

IN(W H)

IN(W H)

U

VB(U)

IN(UH)

N

Introduction to Mini & Tiny-Dip-SPM

44 ×××× 26

600V-10A 600V-3A

- 10A ER sample : July of 02

- 3A ER sample: August of 02

• Ceramic-based Transfer-

Molded-Type Packaging

• Gate Driving Circuit using

HVIC for the Use of Single-

power Supply

• Short-circuit Protection

using Link Shunt-resistor

• Available for TPIM

(Transfer-molded-type

power integrated module)

according to User requirement

(Just Including Power Devices)

• Tiny-Dip-SPM is very suitable for

Small Fan Drive Applications

using Induction/BLDC Motors


Current Control Application

(Mini-Dip-SPM)

Mini-Dip34 ×××× 21 Tiny-Dip


Structure and Internal Block-Diagram of Tip-SPM

IGBTFRDIC IC

3.0

1.5

7.2

55mm

57mm

Vcc

IN

COM

VB

HO

VS

Vcc

Wout

Uout

Vout

COM

C(SC)

C(FOD)

V(FO)

IN(WL)

IN(VL)

IN(UL)

COM

Vcc

IN

COM

VB

HO

VS

Vcc

IN

COM

VB

HO

VS

THERMISTOR

VCC(L)

COM

IN(UL)

IN(VL)

IN(WL)

V(FO)

C(FOD)

C(SC)

COM

R(SC)

R(V+h)

VCC(V+h)

WVUNP

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

(9)

(11)

(10)

(12)

(13)(14)(15)(16)(17)

VB(U)

COM

IN(UH)

VS(U)

(29)

(28) VCC(UH)

VB(V)

IN(VH)

VCC(VH)

VS(V)

VB(W)

IN(WH)

VCC(WH)

VS(W)

(27)

(30)

(25)

(24)

(23)

(22)

(26)

(20)

(19)

(18)

(21)

Internal Block-diagram

Ceramic Base


Typical Application Circuit Example

Vcc

IN

COM

VB

HO

VS

Vcc

Wout

Uout

Vout

COM

C(SC

)

C(FOD

)

NC

V(FO)

IN(WL)

IN(VL)

IN(UL)

COM

Vcc

IN

COM

VB

HO

VS

Vcc

IN

COM

VB

HO

VS

THERMISTOR

Motor

C P U

5V Line

15V Line

5V Line

5V Line15V LineSPM1

Low-Pass Filter Part

Thermal Detecting Application

System Connection Diagram for Tip-SPM


IGBTFRD IC

3.0

1.0

7.2

60mm

31mm

Structure and Internal Block-Diagram of Dip-SPM

C O M (L )

V C C

IN (U L )

IN (V L )

IN (W L )

V F O

C (F O D )

C (S C )

O U T (U L )

O U T (V L )

O U T (W L )

NU

(2 6 )

NV

(27 )

NW

(2 8 )

U (29 )

V (30 )

W (3 1 )

P (32 )

(23 ) VS (W )

(22 ) VB (W )

(19 ) VS (V )

(18 ) VB (V )

(9 ) CS C

(8 ) CF O D

(7 ) VF O

(5 ) IN(W L )

(4 ) IN(V L )

(3 ) IN(U L )

(2 ) C O M(L )

(1 ) VC C (L )

(10 ) RS C

RT H

(2 5 )

V T H (2 4 )

(6 ) C O M(L )

V C C

V B

O U TC O M

V SIN

V B

V S

O U T

IN

C O M

V C C

V C C

V B

O U TC O M

V SIN

(21) VC C (W H )

(20 ) IN(W H )

(17 ) VC C (W H )

(15 ) IN(W H )

(16 ) C O M(H )

(14 ) VS (U )

(13 ) VB (U )

(12 ) VC C (U H )

(11 ) IN(U H )

T H E R M IS T O R

Internal Block-diagram


System Connection Diagram for Dip-SPM

COM(L)

VCC

IN(UL)

IN(VL)

IN(W L)

VFO

C(FOD)

C(SC)

OUT(UL)

OUT(VL)

OUT(W L)

NU (26)

NV (27)

N W (28)

U (29)

V (30)

W (31)

P (32)

(23) V S(W )

(22) V B(W )

(19) V S(V)

(18) V B(V)

(9) C SC

(8) CFO D

(7) V FO

(5) IN (W L)

(4) IN (VL )

(3) IN (UL )

(2) CO M (L)

(1) V CC(L)

(10) R SC

VTH (24)

RTH (25)

(6) CO M (L)

VCC

VB

OUTCOM

VSIN

VB

VS

OUT

IN

COM

VCC

VCC

VB

OUTCOM

VSIN

(21) V CC(W H)

(20) IN (W H)

(17) V CC(VH)

(15) IN (VH)

(16) CO M (H)

(14) VS(U)

(13) V B(U)

(12) VCC(UH)

(11) IN (UH)

Fault

15V line

CBS C

BSC

RBS

DBS

CBS CBSC

RBS

DBS

CBS

CBSC

RBS

DBS

CSP15CSPC15

CFOD

5V line

RP

CPL

CBPF

RP

RP

RP

CPL

CPL

5V line

CPH

RP

CPH

RP

CPH

RP

RS

RS

RS

RS

RS

RS

RS

M

VdcCDCS

5V line

RTH

CSP05

CSPC05

THER MISTOR

Temp. Monitoring

Gating UH

Gating VH

Gating W H

Gating W L

Gating VL

Gating UL

CPF

CCCCPPPPUUUU

RFU

RFV

RFW

RSU

RSV

RSW

CFUC

FVC

FW

U-Phase Current

V-Phase CurrentW-Phase Current

RF

CSC

RSC

Inverter output current sensing application


Comparisons – Dip-SPM

60××××3079××××31

up to 600V- 30A

• 27%-Smaller Size

• 20%-Lower Thermal

Resistance

• Optional built-in Thermistor


current control applications

• Short-circuit protection

using Sense-IGBTs

• Lower Thermal Resistance

• Reduced System Design Time

• Reduced Manufacturing Time

• High-yield in Manufacturing

• More Compact System

• Reduced Field Failure Ratio

• Fewer components to Order

and Stock


Comparisons – Mini-Dip-SPM

up to 600V- 10A • 25%-Smaller Size

• Much Lower Thermal

Resistance

• Available for TPIM Structure


current control applications

• Lower Thermal Resistance

• Reduced System Design Time

• Reduced Manufacturing Time

• High-yield in Manufacturing

• More Compact System

• Reduced Field Failure Ratio

• Fewer components to Order

and Stock

44××××2649××××31


0.0 0.1 0.2 0.3 0.4 0.50

5

10

15

20

25

I C [A

]

VSC

[V]

4.5㎲

Ic

Vce

Vsc

Linear Operation Region

Sensing Waveform

[0.2V/div.]

[5A/div.]

[20A/div.]

[100V/div.]

Protected Short-circuit Current

[10us/div.]

[1us/div.]

0.5V

[1V/div.]

• Low cost & small space solution• Highly precise :

≤≤≤≤ 8% of sensing resolution• Auto-reset function after

the fault-out duration time

Short-circuit Protection TechnologyUsing the Sense-IGBT


0 5 10 1540

50

60

70

80

90

100

110

120

130

Irm s [A]

Ma

x.

He

at

Sin

k T

em

p [˚

C]

Irm s & He a t S ink Te m pe ra tu re

S P M2

TO -220F

0 5 10 1530

40

50

60

70

80

90

100

110

120

130

Irm s [A]

Ma

x.

He

at

Sin

k T

em

p [˚

C]

Irm s & He a t S ink Te m pe ra ture

S P M2

TO-220F

VDC = 300[V], fsw = 15kHz, Tj = 125[ºC]) VDC = 400[V], fsw = 15kHz, Tj = 125[ºC])

Comparing to a discrete approach using TO220fullpack device,at the same Tc condition of 80 °°°°C• Can increase the motor current (power) by around 33 %

and at the same motor current (power) condition (7A of rms value)• Can get the temperature margin by around 11 °°°°C

Note: General datasheet for TO220F device is considered for the comparison.

31%

10 °°°°C

33%

11 °°°°C

Comparison of Operation power RatingDip-SPM vs. Discrete IGBT


High Frequency : H seriesHigh Frequency : H series

≤≤≤≤ 4 Khz

≥≥≥≥ 8 Khz

3,4 Khz

Washing Machine

Air-conditioner

3 – 9 Khz

Low Frequency : L seriesLow Frequency : L series

Low,Medium Frequency Low,Medium Frequency

Medium Frequency : M seriesMedium Frequency : M series

SPM Frequency


Tip-SPM Line-up

Product Motor Rating Frequency [ Khz ] Isolation Voltage applicationFPAL10SH60FPBL10SH60FPAL15SH60FPBL15SH60FPAL15SL60

FPAL15SM60

FPBL15SL60

FPBL15SM60

FPAL20SL60FPAL20SM60

FPBL20SL60

FPBL20SM60

FPAL30SL60

FPBL30SL60

W/M

Aircon

2500Vrms

0.4KW

AC100 - 264V

0.75KW

AC100 - 264V

1.5KW

AC100 - 264V

2.2KW

AC100 - 264V

≥≥≥≥ 8

≥≥≥≥ 8

≥≥≥≥ 8

≤≤≤≤ 4

3 ~ 9

3 ~ 9

3 ~ 9

≤≤≤≤ 4

≤≤≤≤ 4

3 ~ 9

≤≤≤≤ 4

≤≤≤≤ 4

≤≤≤≤ 4


Product Motor Rating Frequency [ Khz ] Isolation Voltage applicationFSAM10SH60FSBM10SH60FSAM15SH60FSBM15SH60FSAM15SL60

*FSAM15SM60

FSBM15SL60

*FSBM15SM60

FSAM20SL60*FSAM20SM60

FSBM20SL60

*FSBM20SM60

*FSAM30SL60

*FPBL30SL60

W/M

Aircon

2500Vrms

0.4KW

AC100 - 264V

0.75KW

AC100 - 264V

1.5KW

AC100 - 264V

2.2KW

AC100 - 264V

≥≥≥≥ 8

≥≥≥≥ 8

≥≥≥≥ 8

≤≤≤≤ 4

3 ~ 9

3 ~ 9

3 ~ 9

≤≤≤≤ 4

≤≤≤≤ 4

3 ~ 9

≤≤≤≤ 4

≤≤≤≤ 4

≤≤≤≤ 4

Dip-SPM Line-up

* Under development


Motor Rating F a i r c h i l d M i t s u b i s h i S a n y o T o s h i b a application

0.4 KW

0.75 KW

1.5 KW

2.2 KW

FPAL10SH60 PM10CSJ060PS21353-GPS21553-GPM10CSJ060PS21353-GPS21553-GPS21254-EPS21454-EPS21254-EPS21454-EPM15CTMPS21244-EPS21444-EPM15CTMPS21244-EPS21444-EPM20CTMPS21245-EPS21445-EPM20CTMPS21245-EPS21445-EPM30CTJ060PS21246-EPM30CTJ060PS21246-E

FPBL10SH60

FPAL15SH60

FPBL15SH60


FPBL15SL60FPBL15SM60


FPBL20SL60FPBL20SM60

FPAL30SL60

FPBL30SL60

STK621-220STK621-051

STK621-320

STK621-320

STK621-400STK621-401

STK621-601 MIG30J501L

W/M

Aircon

Cross Reference


F P A L 15 S H 60VOLTAGE RATING ( ×××× 10)

H: HIGH SWITCHING FREQUENCYM: MEDIUM SWITCHING FREQUENCYL: LOW SWITCHING FREQUENCY

S: SINGLE-POWER SUPPLYM: MULTI-POWER SUPPLYP: POWER DEVICES ONLY

CURRENT RATING

L: TIP TYPE OF SPMM : DIP TYPE OF SPMS : MINI DIP TYPE OF SPM U: TINY DIP TYPE OF SPMC: SPIM FOR ONE-PHASE INPUTD: SPIM FOR THREE-PHASE INPUT

A: BUILT-IN THERMISTORB: NO-THERMISTOR

P: COMMON N-TERMINALS: DIVIDED N-TERMINALS ( Sensorless )

FAIRCHILD SEMICONDUCTOR

Ordering Information


Contact Points

조동휘조동휘조동휘조동휘(Group leader)[email protected] : 1833

이명호이명호이명호이명호(Manager)[email protected] : 1738

BJT/HV DIODE

양일수양일수양일수양일수(A. Manager)[email protected] : 1717Low to medium voltage BJTMosfet for Ballast

이정헌이정헌이정헌이정헌(A. Manager)[email protected] : 1738Horizontal deflection TRHV Diode(1.5/1.7kV)

임병철임병철임병철임병철(A.Manager)[email protected] : 1836

MOSFET

양성모양성모양성모양성모(A. Manager)[email protected] : 1836MOSFET/SUPER junction

조강희조강희조강희조강희(A. Manager)[email protected] : 1382Mosfet for PDP

김영주김영주김영주김영주(Manager)[email protected] : 1835

IGBT/SPM/TRIAC

김차광김차광김차광김차광(A. Manager)[email protected] : 1879SPM / SPIM

이용택이용택이용택이용택(A. Manager)[email protected] : 1835Discrete IGBT, TRIAC

오금심오금심오금심오금심(A. Manager)[email protected] : 1833Low voltage MOSFET

엄기주엄기주엄기주엄기주(A. Manager)[email protected] : 1879IGBT Module for Motor drive

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Documents

SMART POWER MODULES - P&S 반도체 - 페어차일드 ... · Fairchild Semiconductor – Smart Power Module SMART POWER MODULES for Low-Power Variable Speed Motor Drive Applications