Snapdragon platforms overview feat. MSM7x30 chipset

Maxim Birger

October 2010

Agenda

2

Terminology

Snapdragon family roadmap

MSM7230 chipset features and structure

MSM7230 Modem + PoP Memory

QTR8200 Transceiver

PM8058 PMIC

WCN1312 WLAN module

Design with MSM platform

Summary

Terminology

3

SnapdragonTM

Scorpion

Adreno™

- Family of mobile processors by Qualcomm

- Snapdragon Application processor core

- Designed by Qualcomm

- Licensed ARM core architecture

- Utilize ARMv7 instruction set

- 2D/3D Qualcomm’s Graphics technology

Snapdragon family roadmap

4

Snapdragon OS

5

1st Generation

6

Model Max CLK Frequency

Process Availability (ES)

Market

QSD8x50 1GHz 65nm Q4 2008 Nexus One HTC Desire HTC HD2 LG… Dell… Toshiba… Others

X=2 – GSM/GPRS/EDGE; UMTS/HSPA X=6 – GSM/GPRS/EDGE; UMTS/HSPA; CDMA2000 1xEV-DO Adreno 200 GPU

2nd Generation

7

Model Max CLK Frequency

Process Availability (ES)

Market

MSM7x30 800MHz 45nm Q4 2009

HTC Desire

MSM8255 1GHz 45nm Q4 2009 HTC Desire HD

X=2 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+ X=6 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+; CDMA2000 1xEV-DO Adreno 205 GPU

3rd Generation

8

Model Max CLK

Frequency

Process Availability (ES)

Market

MSM8x60 Dual 1.2GHz

45nm Q2 2010

MSM8x70 Dual 1.5GHz

28nm Q2 2011

QSD8672* Dual 1.5GHz

45nm Q4 2010

X=2 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+ X=6 – GSM/GPRS/EDGE; UMTS/HSPA/HSPA+; CDMA2000 1xEV-DO Adreno 220 GPU * Smartbooks/tablets oriented

MSM Roadmap

9

Chipset configurations

10

MODEM MSM7230 MSM8255 MSM8260 MSM8270 QSD8672

PMIC PM8058 PM8058 PM8058 + PM8901

PM8921

PM8058 + PM8901

RF QTR8200/ QTR8600/ QTR8601/ QTR8615/ QTR9215

QTR8200/ QTR8600/ QTR8601/ QTR8615/ QTR9215

QTR8615/ QTR9215

RTR8600/ RTR8600L

QTR8615

WLAN WCN1312/ WCN1314

WCN1312/ WCN1314

WCN1314

WCN3660

WCN1314

Other WCD9310

Package 904 NSP PoP, 14x14mm

904 NSP PoP, 14x14mm

976 NSP, 14x14mm

904 NSP PoP, 14x14mm

1249 NSP, 15x15mm

QTR8200 – GSM/UMTS operating bands; QTR8600 – GSM/UMTS/CDMA2000 operating bands; QTR8615 – Rx Diversity; QTR9215 – No Rx Diversity;

Market Milestones

11

Model Release OS Chipset Max CLK Flash RAM Screen Battery

HTC diamond

May 2008 WM6.1 MSM7201A 528MHz 256MB 192MB 2.8’’ 640x480

900mAH

Samsung Omnia

July 2008 WM6.1 Marvell PXA312

624MHz 256MB 128MB 3.2’’ 400x240

1440mAH

HTC Diamond2

Apr 2009 WM6.1 MSM7200A 528MHz 512MB 288MB 3.2’’ 800x480

1100mAH

iPhone 3GS

June 2009 Apple OS Samsung ARM Cortex A8

600MHz 16GB 256MB 3.5’’ 480x320

1220mAH

HTC HD2 Nov 2009 WM6.5 QSD8250 1GHz 512MB 448MB 4.3’’ 800x480

1230mAH

Nexus One Jan 2010 Android QSD8250 1GHz 512MB 512MB 3.7’’ 800x480

1400mAH

HTC Desire Apr 2010 Android QSD8250 1GHz 512MB 576MB 3.7’’ 800x480

1400mAH

iPhone 4 June 2010 Apple OS Samsung ARM Cortex A8

1GHz 16/32GB 512MB 3.5’’ 960x640

1420mAH

Samsung Galaxy

June 2010 Android Samsung ARM Cortex A8

1GHz 2GB 512MB 4’’ 800x480

1500mAH

HTC Desire HD

Oct 2010 Android MSM8255 1GHz 1.5GB 768MB 4.3’’ 800x480

1230mAH

HTC HD7 Oct 2010 WP7 QSD8250 1GHz 512MB 576MB 4.3’’ 800x480

1230mAH

Modu T Nov 2010 Brew QSC6270 230MHz 256MB 128MB 2.2’’ 320x240

500mAH

MSM7230 chipset

12

MSM7230 chipset

13

MSM7x30 chipset key features – Air Interface

14

Cellular radio technologies and standards

TDMA – GSM/GPRS/EDGE

WCDMA – UMTS/HSPA/HSPA+

CDMA/TDMA – CDMA2000 1x + 1xEV-DO releases (MSM7630)

WLAN 802.11 b/g/n

GNSS radio (Global Navigation Satellites Systems)

GPSCDMA_1575MHz (USA) and GLONASSFDMA/CDMA_1598-1610MHz (Russia)

Assisted and standalone mode supported

Bluetooth – compliant with BT 3.0, 2.1+EDR and earlier

FM radio Receiver and Transmitter

FM

MSM7230 chipset key features – Multimedia

15

Multimedia support

HXGA 1024×480 display via RGB interface

FWVGA 860×480 display via MDDI SerDes link

WQVGA 400×240 display via slow EBI2 interface

Analog S-Video output for driving PAL/NTSC TV standards

HDMI 720p (1280×720) video output (requires external HDMI bridge)

Wide variety of Audio and Video codecs

Up to 12MP camera (2-lane CSI SerDes link or parallel CAMIF)

Video Applications – Camcorder, Video player and Video telephony

Digital and Analog Audio ports

MSM7230 chipset key features – Multimedia

16

MSM7230 chipset key features – Connectivity

17

182x General Purpose I/O

3x I2C

4x SPI

2x High Speed UART

4x SDIO

1x HS USB with integrated PHY

1x UICC USB (Mega SIM)

4x Stereo I2S digital audio (including M-I2S: 4 DATA, common CLK/WS)

1x PCM digital audio

User Programmable Logic support 16-bit truth table (via PM8058)

MSM7230 chipset key features – Power & UI

18

Power features

Battery charger

Vibration motor driver

Backlight and Flash drivers

User Interface

Up to 8x8 keypad matrix scanner

5 function joystick

4-wire/5-wire resistive touch panel controller

Light pulse generator – flash/torch/UP modes for fun lights

MSM7230 Mobile Station Modem – Architecture

19

Baseband processing features

ARM1136JS™ embedded microprocessor modem (Up to 400MHz)

Scorpion™ application processor (Up to 800 MHz)

Modem DSP , Application DSP, Air Interface DSPs

Memory controllers

Single/Dual channel DDR1/2 SDRAM via EBI0/1 interfaces (192/333MHz)

8/16-bit NAND flash via 16-bit multiplexed EBI2 (runs at 80MHz)

High performance AHB/AXI on-chip interconnects

Adreno™ graphics GPU, video enc./dec. and A/V codecs

GPIOs and Peripherals

MSM7230 Mobile Station Modem – Architecture

20

PoP Mobile Memory

21

PoP Mobile Memory

22

MSM7x30-0 = MSM + Dual Ch. DDR2 MSM7x30-1 = MSM+DDR1+FLASH

14x14 package 904 NSP Bottom + 240 CSP Top = 1144 total pins

Dual channel DDR2 in PoP with external Flash Single channel DDR1 with Flash in PoP

Best in class multimedia+modem concurrencies Best in class PCB area – modem+AP+memory sys

Default configuration – 256MB LPDDR2 (2x128MB) Default configuration – 256MB LPDDR1 with 512MB NAND Flash

Only external Flash supported PoP flash can be supplemented by external flash

PoP Mobile Memory

23

PoP DRAM/Flash device support

1Gb (128MB) /2Gb (256MB) x32 LPDDR1 SDRAM

2Gb (256MB) /4Gb (512MB) /8 Gb (1GB) x32 LPDDR2 SDRAM per channel

2Gb (256MB) /4Gb (512MB) /8 Gb (1GB) x16 discrete flash

Prototyped by Qualcomm (Samsung)

MSM device Configuration Rank Memory specification

MSM7x30-0 Dual-channel LPDDR2

Single

1Gb (32M×32) LPDDR2 SDRAM + 1Gb (32M×32) LPDDR2 SDRAM

MSM7x30-1 Single-channel LPDDR1 + NAND flash

Single 2Gb (64M×32) LPDDR1 SDRAM + 4Gb (256M×16, NAND flash)

PoP Mobile Memory

24

Memory Channel/Rank possible configurations

PoP Mobile Memory

25

Non-reference memory parts availability (for May 2010)

PM8058 Power Management IC

26

Input power management

VBAT and VDD voltage/current regulation and protection

Charger block

Output power management

5x SMPS, 26x LDOs with different ratings, 1x Negative charge pump

House keeping functions

System Clocks + RTC

Analog multiplexing and scaling + ADC circuits

UI

LPG, Vibrator driver, Joystick + Keypad support, UPL, MIC bias

LEDs, Backlight and Flash current drivers

QTR8200 Transceiver IC

27

Multiband UMTS + quad band GSM operation

GSM/UMTS transmitters and receivers

UMTS bands: LB- 700/800/850/900MHz; HB- 1500/1700/1900/AWS/2100MHz

GSM bands: LB- GSM850/900; HB- DCS1800/PCS1900

GNSS receivers (GPS + GLONASS)

Bluetooth radio

Analog RF transceiver, Digital baseband modem, ARM7 core + memory

FM radio

Analog RF transmitter and receiver, Intel 8051 core + program/data memories

Analog audio input/output channels

Resistive touch panel controller

WCN1312 WLAN module

28

WLAN 802.11 b/g/n

WLAN RF transceiver

Digital baseband modem

Operates on PHY/MAC data packets

ARM9 core + memories

Used for control path processing, power save operations and housekeeping

Clock circuits and SDIO-to-host interface

WLAN/BT coexistence control

Internal power management

Design with MSM platform

29

Design, Manufacturing & Test Complexity

30

BGAs and other heavy parts must be located on one side due to

SMT process constraints

MSM + QTR + PM + WCN + NAND flash + (modu ASIC) + SIM & SD sockets

Complex PCB stack-up and routing

High-Density-Interconnect internal layer routing

Stacked/Staggered micro-vias

Via-In-Pad for most BGA pins

NSMD Land Patterns for best solder joints

PoP memory SMT process and verification

Difficult design validation

Lack of probe accessibility

0.4mm

0.4mm

0.4mm

0.5mm min

Power Consumption – FFA7x30 platform

31

Modem operation (all values in mA)

Non-modem operation (all values in mA)

Measured values from Sep. 2010 and subject to changes

Consumption is highly dependent on OS version and SW optimization

In parentheses () targeted values, after SW optimization, to Sep. 2010

Mode WCDMA CDMA TDMA

Sleep 1.19 1.18 1.19

Talk (2G @ 0dBm; 3G @ 5dBm)

145 (125)

131 (121)

104 (66)

Standby 2.4 (1.7)

2.1 (1.5)

3.3 (1.9)

GPS VGA HD MP3 2D 3D

62 (8.2)

78 (71)

124 (106)

43 (20)

87 (67)

148 (125)

PCB Area Estimation (with WLAN and HDMI)

32

PCB Area Estimation – modu T FF

33

Device D1 [mm]

D2 [mm]

S [mm2]

MSM7230-0 14 14 196

QTR8200 12.6 6.2 78.12

PM8058 7 7 49

WCN1312 7 7 49

NAND flash 195

MOSAIC 7 7 49

Total (major components) 616.12

Without consideration in: Orientation of components RFI/EMI shield areas occupancy Fine pitch BGA Fan-out

Summary

34

Summary

35

MSM7x30 is a powerful platform today!

In a year from now? Two years?

ModuT or small FF can be met under some conditions

Current 500mAH battery may be not enough

LCD size and Battery will determine the physical dimensions

MSM7x30-0 is more adequate choice than MSM7x30-1 when

performance come to mind

MSM8x60 and MSM8x70 platforms will operate high-end mobiles

and QSD8672 tablets, released during 2011-2012

Thank you