Embed Size (px)
DESCRIPTION
SV and CP Pkg CTE. TQFP_EP (SV). Mold Compound. Silicon. Leadframe. LFCSP, QFN (CP). Mold Compound. Silicon. Leadframe. Mold Compound Sumitomo G700 CTE: α 1 ≤ 8, α 2 ≤ 38 ppm/C Tg = 130 ⁰ C. Die: Silicon CTE: 3 ppm/C Thickness: 10 mils. Leadframe: Copper CTE : 17 ppm/C - PowerPoint PPT Presentation
Citation preview
SV and CP Pkg CTE
Mold CompoundSumitomo G700
CTE: α1 ≤ 8, α2 ≤ 38 ppm/CTg = 130 ⁰C
Leadframe: CopperCTE: 17 ppm/C
Thickness: 8 mils
Die: SiliconCTE: 3 ppm/C
Thickness: 10 mils
TQFP_EP (SV)
LFCSP, QFN (CP)
Silicon
Silicon
Mold Compound
Mold Compound
Leadframe
Leadframe
