Thermal Project

Recruiter : 張元鼎

Thermal Project Outline

OSE

Flash memory card

Transient thermal analysis

Compact model validation

The LGA in board level thermal analysis

ASE

DDR2/DDR3 memory module

Thermally enhance of substrate

TSV thermal analysis

Thermal solutions for POP

A Thermal Study of Impingement Flow & Liquid Cooling During Function Testing

Liquid Cooling Survey

Thermal Analysis of Chipset & Processor of NB System

Thermal Modeling by Direct ECAD Import

Thermal analysis of W/B Heating Plate for Punch QFN

Flash Memory Card

Thermal analysis of memory card

Contribution: Step out thermal analysis to real applications

Transient Thermal Analysis

Temperature distributions various with time

Contribution: To build up capability for thermal simulation in transient analysis

Ceramic PKG

Metal PKG

Time : 0.120 sec

Compact Thermal Model Validation

Compact model capabilities for board/system level thermal analysis

Contribution: The establishment of compact models as the dominant method of

quantifying the thermal performance of electronic components

Board

Insulation on all 4 sides

Top node

Junction node

0

5

10

15

20

25

30

0 1 2Air Speed (m/s)

Θja

(℃

/W)

Detailed

2-ResistorTop Inner Top Outer

Junction

Bottom Inner Bottom Outer

Leads

Thermal

Resistors

The LGA in Board Level Thermal Analysis

Thermal solutions for board level in cellphone

Contribution: Provide thermal solutions for customer in board level

DDR2/DDR3 Memory Module

The different types of packages were considered in DIMMs

Contribution: Critical project for ASE

67.65

66.92

65.19

65.70

66.46

5.45

5.33

5.25

5.12

5.04

64

64

65

65

66

66

67

67

68

68

wBGA WLCSP Copper Frame FCCSP FCCSP (solder type) Fan Out WLCSP

Max

imu

m j

un

ctio

n t

emp

erat

ure

(oC

)

4.80

4.90

5.00

5.10

5.20

5.30

5.40

5.50

Th

erm

al r

esis

tan

ce o

f m

od

ule

(oC

/W)

0.44

-5.18 -5.14

-6

-5

-4

-3

-2

-1

0

1

BurnIn Test FLOTHERM MemTestT

her

mal

Im

pro

vem

ent

(%)

Thermally Enhance of Substrate

Special thermal design in substrate

Contribution: Co-work with material site and developed thermal solutions for

substrate

6.62 6.75 6.84

18.39 18.51 18.58

0

2

4

6

8

10

12

14

16

18

20

25 36 49

BVH Count

Delt

a T

j Decre

asi

ng

(%

)21.38

21.40

21.43

21.37

21.38

21.39

21.40

21.41

21.42

21.43

21.44

16 21 26 31 36 41 46 51 56

BVH Count

Th

erm

al R

esis

tan

ce_T

het

a JA

(oC

/W)

TSV Thermal Analysis

Key technologies for 3D IC stacking and thermal effects

Contribution: Liquid circulation cooling and provided analytical solution

Thermal Solutions for PoP

Directly impinge liquid cooling

Contribution: Active thermal solution were applied in applications

A Thermal Study of Impingement Flow &

Liquid Cooling During Functional Testing

Thermal strategy for function testing

Contribution: Provide the design guideline for chuck and socket

0.00

0.02

0.04

0.06

0.08

0.10

0.12

Water Potassium Formate/Water Methanol/Water (FC-77)

Coolant Type

Theta

-jw

(oC

/W)

Liquid Cooling Survey

Thermal solutions for high power density & hot spots

Contribution: Model construction and validation of liquid cooling module

0

50

100

150

200

250

300

350

0.05 0.1 0.2 0.3 0.4 0.5 0.6

Flowrate (L/s)

Pre

ssu

re d

rop

(p

si)

Thermal Analysis of Chipset & Processor of NB

System

System level simulation of the NB system

Contribution: Find the root cause for chipset damage

Provide the thermal solutions for cell phone and mini-PC

Thermal Solutions for Fanless Products

Chip

Solution-1: With gap filler only

Solution-2: Gap filler + heat spreader

G.F

H.S

10

12

14

16

18

20

22

24

Prototype Solution-1 Solution-2

Theta

_JA (

oC/W

)

4%

27%

Thermal Solutions for Fanless Products

Technical innovations in thermal modeling

Auto-calculating the substrate inner copper coverage and vias

The “TRUE” heat transfer phenomena

Thermal Modeling by Direct ECAD Import

FLOTHERMIcePak

ECAD/EDA ECAD/EDA

Thermal solution for reducing temperature difference of the heating plate

Thermal Analysis of W/B Heating Plate For

Punch QFN

Embedd

ed

heater

Heating plate

(Carbon Steel)

Base

(Aluminu

m)

Fixed support

(Ceramic)

W/B machine pedestal

(Copper)

233oC~236oC

T~3oC

T~1.5oC

Before

After

Thermal Solutions for High Power LED

Using the HP and VC solutions in the LED thermal module/system

LED module and system