Wintech-Nano Corp Broch－new version

COMPANY PROFILE

WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.您的成功就是胜科的成功。

WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis. WinTech Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-SIMS, D-SIMS, XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production customers.

胜科纳米是世界顶尖的独立第三方实验室，其材料分析和失效分析实验室配备了全套的高端分析仪器，并搭建起了

开放式的专业分析平台，拥有世界一流的实验室设备，如：高分辨透射电镜（HR-TEM）,双束聚焦离子束（Dual Beam

FIB），场发射扫描电镜（FE-SEM），飞行时间二次离子质谱仪（TOF-SIMS），动态二次离子质谱仪（D-SIMS），X射

线光电子能谱仪（XPS/ESCA）等。胜科纳米拥有众多的专家级分析人员，均拥有十多年海外从业经历。他们非常熟悉

相关工艺流程，且具有超强的设计、试验及分析能力。我们提供7天24小时不间断的一站式服务，随时为贵公司项目及

产品的研发、生产、客服提供最专业最快捷的分析服务。

“Our mission is to be the preferred analytical solution provider for R&D and manufacturing company through our stringent quality control and excellent customer service.”

“我们的服务宗旨是通过对服务质量的严格把关和提供卓越

的客户服务，成为研发及制造业的首选分析服务商。”Li XiaominManaging Director

COMPANY PROFILE

WITH WINTECH, YOUR SUCCESS IS OUR SUCCESS.

“Our mission is to be the preferred analytical

solution provider for R&D and manufacturing company through our stringent quality control and excellent customer service.” “

” Involvement

3D X-‐Ray

EMMI

OBIRCH Project

TEM

SEM

ESD Thermal

FIB

Auger

SIMS

XPS

WinTech Nano is a leading 24 hour running service laboratory providing one-stop analytical services. Our professional services cover Structure Analysis, Material Characterization and Electrical Failure Analysis. WinTech Nano has world-class analytical instruments including: 3D X-Ray, OBIRCH, EMMI, FIB, TEM, TOF-SIMS, D-SIMS, XPS, etc. Our fast and reliable analysis result gives the best support to R&D and production customers.

HR- TEM ,Dual Beam FI B FE- SEM TOF- SI MSD- SI MS X XPS/ ESCA

7 24

Quality Assured

TOP15 SME 2011

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SINGAPORE:�WinTech Nano-Technology Services Pte. Ltd. The Alpha, 10 Science Park Road, Science Park II�Tel: +65-67777354�

SUZHOU (CHINA):��

99 NW-09-507�+86-512-62800006

COMPANY PROFILE

MODULE TEAM 分析能力

Structure Analysis 结构分析

SEM, FIB, TEM, Ion Milling, EBSD…Material Analysis材料分析

TOF-SIMS, D-SIMS, XPS, Auger, AFM, FTIR, CT…Electrical Testing电性分析

OBIRCH, EMMI, CAFM, AFP, Thermal, TDR, ESD..

PROJECT TEAM项目团队能力

Project team provides customized mid-term and long-term technology assessment. Members over 10 years expertise in advanced analytical lab. Our international expert advisory board provides technical support.

项目团队通过目标管理，结合行业专家，长期提供

系统集成化的专业技术分析服务。

TURNAROUND TIME交货时间

WinTech is your 24-hour service lab. Our standard turnaround time is 3 days (including weekends and holidays). For urgent requests, the delivery time is 24 hours.

实验室7天24小时运作，服务交付时间为3天（含

周末及节假日），加急服务交付时间为24小时。

INFORMATION SECURITY 保密信息

WinTech provides 3 level of information security to ensure the highest standard for our customer.

- NDA coverage for legal perspective- Physical sample storage and information firewall- VPN secured line login for data transmission

实验室提供最高3层保密层级：保密协议，物理信息隔离，VPN专用数据网。

Our Network 我们的网络

Website: www.wintech-nano.comEmail: [email protected]

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PRODUCT ANALYSIS

SYSTEM/PACKAGE LEVEL ANALYSIS

WinTech Nano provide full range of package related analysis.For Product Engineering: 2.5D/3D, BGA, QFN, Flip Chip, SOP, CSP, WLP, SOC, SiP, PCB, Lead Frame, Wire, EMC, Chemical

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PRODUCT ANALYSIS

系统及封装分析

For Process Engineering: TSV, Sawing, DA, WB, Bumping, Plating, Molding, SMT Testing, Failure Analysis, Reliability

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!   Non Destructive X-Ray CT scan !   Package metal fuse or bridging !   Wire Bond failure !   Solder bump void/crack !   PCB via open/short !   Surface contamination !   Metal surface oxidation !   Trace element analysis !   Thermal heat distribution !   Package reflow warpage

!   CMOS defect in metal trace, via !   ESD and EOS damage isolation !   Junction damage, !   gate oxide breakdown !   Memory single bit failure !   Implantation/Diffusion defect !   Substrate dislocation !   LED and Solar damage !   Soft defect identification !   EBAC/EBIC analysis !   nA leakage localization

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PRODUCT ANALYSIS

IC DIE LEVEL ANALYSIS

Our wafer fabrication knowledge extending into latest technology node.For Product Engineering: SOI, Bulk Si, CPU, Memory, Analog, Digital, RF, MEMS, Si Interposer

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PRODUCT ANALYSIS

芯片分析

For Process Engineering: Epitaxial, Litho, Implant, Diffusion, CVD PVD, ALD, EtchCMP, CleanTech, Plating, TSV, Wafer Bonding, Metrology

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!   Non Destructive X-Ray CT scan !   Package metal fuse or bridging !   Wire Bond failure !   Solder bump void/crack !   PCB via open/short !   Surface contamination !   Metal surface oxidation !   Trace element analysis !   Thermal heat distribution !   Package reflow warpage

!   CMOS defect in metal trace, via !   ESD and EOS damage isolation !   Junction damage, !   gate oxide breakdown !   Memory single bit failure !   Implantation/Diffusion defect !   Substrate dislocation !   LED and Solar damage !   Soft defect identification !   EBAC/EBIC analysis !   nA leakage localization

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PRODUCT ANALYSIS

III-V and II-VI 光电元器件

WinTech is serving world top 5 LED and RF manufacturer.For Product Engineering: LED in GaN, GaAs, GaP, InP, Sapphire, HEMT, VCSEL, DFB, PIN, Optoelectronics, Fiber Optics, For Process Engineering: MOCVD, MBE, Litho, Etch, Saw, DA, WB, Bump, Bond, Mold, Plating

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200

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1000

μmNa+M

C: 102; TC

: 2.577e+006

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C: 44; TC

: 2.950e+005

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PRODUCT ANALYSIS

DISPLAY PANEL 触摸显示屏

Display panel is the key industry in future product.For Product Engineering: LCD, OLED, Array, Cell, Module, In-Cell, On-Cell, OGS, Metal Mesh, Glass, ACF, COG, Flex, OCA, PET For Process Engineering: CVD/PVD, Litho, Implant, Sputter, Etch, Grind, Bond, a-Si, IGZO, LTPS

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CUSTOMIZED ANALYSIS

Leader in Lab Services 世界一流实验室

Our leading analytical services are serving not only electronic and semiconductor but also chemical, consumer, biotech, aerospace industries and many other research organizations.

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Finger Print (TOF-SIMS)

World Leading Analysis

Surface Element Quantification

Top Surface & Interface Material Structure

3D Imaging X-ray /

Element / Organic

Nano Beam Electron

Diffraction (NBED)

2.5D/3D IC Electrical & Physical FA

Nano Particle (TEM)

Human Hair (SEM) WinTech Logo (FIB) a-Si Pyramid (TEM)

AR Coating (TEM, SIMS) Nano Pattern (FIB)

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Analytical Techniques Spot Size Vs Signal Depth

CAPABILITIES

One Stop Solution Lab 一站式分析服务

Today, a cutting-edge integrated circuit (IC) easily consists of over 100 million transistors with a critical dimension below 14 nanometers. In order to analyze the interior of buried structure of the micro/nano-scale region, group of advance technique are irreplaceable solution for root cause analysis and customer satisfaction.

NDT: 3D X-Ray, CSAM, Thermal, TDR

Electrical Analysis

Fault Isolation: EMMI, OBIRCH, EBAC

Circuit Edit & Probing

Fault Localization: CAFM, Nano-probing, AFP

Structure Analysis

RIE, Stain

SEM, EBSD

Ion Milling

Reliability Test: ESD, HTSL, PCT, HAST, TC

Consultation Service

Hardness, Shadow Moire, Solderability

Material Characterization

Top surface: TOF-SIMS, XPS, Auger, TXRF

Thin film: D-SIMS, EDX, FTIR, Ellipsometry, XRF, XRD

Chemical: ICP-MS, IC, GC-MS, LC-MS

Thermal: TGA, DSC, DMA, TMA

Wafer Storage Life Qualification

Bond Pad Qualification

DB-FIB, HR-TEM

Counterfeit Verification

Construction Analysis

Modelling, Simulation

Dual Beam FIB

XPS

TEM D-SIMS OBIRCH

胜科纳米（苏州）有限公司Suzhou (China)电话：+86-512-62800006 传真：+86-512-62800007

地址：苏州工业园区金鸡湖大道99号苏州纳米城NW-09-507邮编：215123

网站: www.wintech-nano.com电邮: [email protected]

Copyright ©2014 WinTech Nano-Technology Services Pte. Ltd.

WinTech Nano-Technology Services Pte. Ltd.10 Science Park Road

#03-26, The AlphaSingapore Science Park II

Singapore 117684tel: +65 67777354 fax: +65 67772462

Website: www.wintech-nano.com Email: [email protected]

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Wintech-Nano Corp Broch－new version