1Publication date: July 2009 SME00002CEC
DATA SHEET
Part No.
Package Code No.
MN39901PLWQFN044-C-1212A
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MN39901PL
2SME00002CEC
ContentsOverview ……………………………………………………….…………………………………………………… 3
Features ……………………………………………………….……………………………………………………. 3
Applications …………………………………………………………………………………………………………. 3
Package …………………………………………………………………………………………………………….. 3
Application Circuit Example ………………………………………………………………………………………. 4
Pin Assignments ……………………………………………….…………………………………………………... 5
Pin Descriptions …………………………………………………………………………………………………… 6
Device Parameter ………………………………………………………………………………………………….. 7
Imaging Characteristics …………………………………………………………………………………………… 7
Absolute Maximum Ratings / Operating Voltage Conditions ……………………………................................ 8
Power Supply Currents …………………………………………………………………………………………… 9
Temperature Ratings ………………………………………………………………………………………………. 9
Spectral Characteristics …………………………………………………………………………………………… 9
Technical Data …………………………………………………………………………………………………….. 10
1/3.6 Inch 750H Timing …………………………………………………………………………………………. 10
1/3.6 Inch 750H Timing (Close-up A) …………………………………………………………………………... 13
1/3.6 Inch 750H Timing (Close-up B) …………………………………………………………………………… 14
Package Dimensions ……………………………………………………………………………………………… 15
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MN39901PL
3SME00002CEC
MN39901PLMOS Image Sensor
OverviewThe MN39901PL (ν Maicovicon®) is a 4.9 mm (Type 1/3.6) 37 k-pixel MOS image sensor that is most suitable for security
cameras and IP cameras. Excellent color reproducibility has been realized by applying the RGB Bayer pattern primary color on-chip filter.
Furthermore, the MN39901PL allows high sensitive and low noise shooting with a pixel dimension of 5.6 μm.And well, this device has a total of 410 800pixels (790 horizontally × 520 vertically) and provides clear and stable images.
FeaturesType-1/3.6 inch panorama VGA 0.37 mega pixel MOS image sensorEffective pixels: 738(H) × 480(V)Unit pixel size: 5.6 μm × 5.6 μm
ApplicationsIP camera (Network camera)Monitoring camera
PackageSmall type LCC 44Pin
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MN39901PL
4SME00002CEC
Application Circuit Example
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MN39901PL
5SME00002CEC
Pin Assignments
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MN39901PL
6SME00002CEC
Pin Descriptions
Digital groundInputDGND15
HSR (horizontal shift resister) clock pulse 2InputH214
HSR (horizontal shift resister) clock pulse 1InputH113
Noise cancellation clamp pulseInputNCCL12
Noise cancellation sample hold pulseInputNCSH11
HSR (horizontal shift resister) start pulseInputHST10
Horizontal signal line reset pulseInputSIGRS9
——N.C.8
Horizontal common signal line clamp voltageInputCLDCNC7
——N.C.6
——N.C.5
——N.C.4
Analog power supplyInputAVDD3
Analog signal outputOutputAMPOUT2
Analog groundInputAGND1
VSR (vertical shift resister) clock pulse 2InputV234
VSR (vertical shift resister) clock pulse 1InputV133
Pixel read-out pulseInputTRANS32
Pixel reset pulseInputRSCELL31
Multiplexer driving pulseInputVDRRS30
Multiplexer down pulseInputMXTR29
Digital groundInputDGND28
——N.C.27
Electronic shutter VSR (vertical shift resister) clock pulse 2 InputEV226
Electronic shutter VSR (vertical shift resister) clock pulse 1InputEV125
Digital power supplyInputDVDD24
——N.C.23
——N.C.22
——N.C.21
——N.C.20
——N.C.19
——N.C.18
Black crushed suppress circuit bias voltageInputBWJDG117
Digital power supplyInputDVDD16
DescriptionI/OPin namePin No.
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MN39901PL
7SME00002CEC
Pin Descriptions (continued)
——N.C.44
Analog groundInputAGND43
Digital groundInputDGND42
Pixel SF current supply pulseInputLOADCELL41
Power supply (VSR)InputDVDD40
Pixel power supply pulseInputVDDCELL39
Electronic shutter pixel reset pulseInputERSCELL38
Electronic shutter pixel readout pulseInputETRANS37
Electronic shutter VSR (vertical shift resister) start pulseInputSHT36
VSR (vertical shift resister) start pulseInputVST35
DescriptionI/OPin namePin No.
Device Parameter
μm24.133(H) × 2.688(V)Valid imaging area size
μm25.6(H) × 5.6(V)Pixel size
pixels738(H) × 480(V) = 354 240Valid pixels
pixels750(H) × 500(V) = 375 000Effective pixels(including transient ones)
pixels790(H) × 520(V) = 410 800Number of pixels
UnitValueParameter
Imaging Characteristics
275.0
758.0
Min
Standard illuminance
Saturation illuminance
Condition
300.0
900.0
Typ
mV—Sensitivity (G)
mV—Saturation output
UnitMaxParameter
<Definition of the “standard imaging condition">PKG conditionStandard exposure means the state using halogen bulb (color temperature 3200K), inserting an IR cut filter (CM500S, t = 2.5 mm) in the optical path, and having the sensor surface illuminated at 8.792 lx (Lens iris; F8). This is the definition of the standard imaging condition in this document. The standard exposure is defined as the sensor surface illuminance at this time.
Test conditions1. During measurement, apply the typical operating voltages for both the bias voltage conditions and clock voltage conditions as the sensor drive
conditions.2. Unless otherwise specified, the specifications show characteristics for an integration time of 1/30 seconds. (SIGRS clock: 18 MHz)
Unless otherwise specified, the test temperature is 60 °C.
Test Procedures1. Saturation Output
In the standard imaging condition, illuminance the sensor at 32 times the standard exposure and measure the sensor output signal voltage. The saturation output is determined from the formula below.
Saturation output (mV) = (average output in the test area) – (average output in the OB area)2. Sensitivity
In the standard imaging condition, measure the sensor output signal output voltage. The sensitivity is determined from the formula below.
Sensitivity (mV) = (average output for each color in the measurement area) – (average output in the OB area)
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MN39901PL
8SME00002CEC
Absolute Maximum Ratings / Operating Voltage Conditions
V0.20– 0.2—– 0.3LV5.25.04.85.3—H
ETRANS
V0.20– 0.2—– 0.3LV5.25.04.87—H
MXTR
V5.25.04.85.3—HEV1, EV2
V0.20– 0.2—– 0.3L
V2.22.01.8—– 0.3LV5.25.04.87—H
VDDCELL
V0.20– 0.2—– 0.3LV5.25.04.85.3—H
V1, V2
V0.20– 0.2—– 0.3LV5.25.04.87—H
VDRRS
V0.20– 0.2—– 0.3LV5.25.04.87—H
LOADCELL
V0.20– 0.2—– 0.3LV5.25.04.87—H
NCCL
V0.20– 0.2—– 0.3LV5.25.04.87—H
NCSH
V00– 0.2—– 0.3LV5.25.04.85.3—H
TRANS
V0.20– 0.2—– 0.3LV5.25.04.85.3—H
RSCELL
V0.20– 0.2—– 0.3LV5.25.04.85.3—H
H1, H2
V0.20– 0.2—– 0.3LV5.25.04.85.3—H
HST
V0.20– 0.2—– 0.3LV5.25.04.85.3—H
VST, SHT
V0.20– 0.2—– 0.3LV5.25.04.87—H
SIGRS
Operating voltage conditions
MaxTypMinMaxMin
– 0.3—
—GND
– 0.3– 0.3
Absolute maximum ratings
—5.3
—
4.07.0
– 0.24.8
—2.94.8
05.0
2.50
3.05.0
0.25.2
—3.15.2 VVDD(DVDD, AVDD)
VHERSCELL
*1VBWJDG1VDGND, AGND
NoteUnitPin name
VL
VCLDCNC
<VDDCELL>
H
LGND
<Pulse other than VDCEL>H
L(GND)
Note) *1: Fixed to 0 V externally when the suppression circuit for high luminance black spot is off.
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MN39901PL
9SME00002CEC
Power Supply Currents
Note) Temperature ratings are defined on package back side.
MaxTypMin
—
—
2
15
4
30 mAAVDD Current
NotesUnitParameter
mADVDD Current
MaxTypMin
–10
–30
–20
25
25
25
60
85
75 °COperating Temperature
°CPerformance Guarantee Temperature
NotesUnitParameter
°CStorage temperature
Temperature Ratings
Spectral Characteristics
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MN39901PL
10SME00002CEC
Technical Data1/3.6 Inch 750H Timing
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MN39901PL
11SME00002CEC
Technical Data (continued)1/3.6 Inch 750H Timing (continued)
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MN39901PL
12SME00002CEC
Technical Data (continued)1/3.6 Inch 750H Timing (continued)
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MN39901PL
13SME00002CEC
Technical Data (continued)1/3.6 Inch 750H Timing (Close-up A)
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MN39901PL
14SME00002CEC
Technical Data (continued)1/3.6 Inch 750H Timing (Close-up B)
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MN39901PL
15SME00002CEC
Package Dimensions (Unit: mm)WQFN044-C-1212A
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Request for your special attention and precautions in using the technical information andsemiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications:� Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-ucts may directly jeopardize life or harm the human body.� Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
20080805
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