EXTERNAL USE
I.MX 应用处理器概览
EXTERNAL USE1
i.MX overview
i.MX 2 i.MX 3 i.MX 5 i.MX 6
2008 2009 2010 2013
i.MX 8
2017 (in progress)
i.MX 2 i.MX 3 i.MX 5 i.MX 6 i.MX 8
i.MX 6
2016
i.MX 7
ARM9 ARM11Cortex
A8
Cortex
A7/A9Cortex
A7
Cortex
A72/A53/A35
EXTERNAL USE2
Over 250M i.MX SOC’s shipped to date
Over 65M vehicles enabled with i.MX since 2007
#1 in eReaders, #1 in Auto Infotainment MPU
2007 2008 2009 2010 2011 2012 2013 2014 2015
i.MX i.MX Auto
Source: IHS Technology, - Q2 2015
i.MX Driving Explosive Growth in Automotive and Smart Devices
EXTERNAL USE3
• Infotainment
• Telematics
• Instrument Clusters
• Vision/Camera Systems
• Monochrome eReader
• Color eReaders
• Medical tablets
• Industrial tablets
• Educational tablets
• IPTV / Streaming Media
• Smart Monitors
• Media / IP Phones
• Smart Home Appliances
• Printers
• Scanners
• Medical – Patient Monitoring
• Smart Energy
• Factory Automation
• HMI
• Aerospace & Defense
• Digital Signage
• Smart Metering
• Point of Sale
Automotive eReaders
Industrial and Consumer
i.MX Markets and Applications
EXTERNAL USE4
Successful examples with i.MX inside
Educational Tablet
SONY, Amazon, Kobo eReadersHigh end home
entertainmentHDD Audio
WiFi Speaker
Home Automation
& Building Control.
Transportation:1. Inflight Entertainment,
2. Austin B-Cycles,
3. John Deere Tractor,
4. Hertz NeverlostSurveillance
Camera
Industrial and
Service Robotics
Industrial HMI
and Control
Handheld devices:Handheld Scanners,
Printers, POS and
Mobile Radios.
Eyeglasses for
visually impaired
MedicalMasimo, Philips,
Withings, etc.
EXTERNAL USE5
i.MX Applications Processors Core Values
• Scalability
− CPU (single/dual/quad, asymmetric), GPU, IO
− Software: Linux, Android, QNX, Windows-embedded, RTOS
− Pin compatibility and software portability
• Trust
− Longevity: minimum of 10-15 years in all markets
− Quality, robustness, zero-defect methodology
− Security and Safety
− Qualifications: AEC-Q100, JEDEC Industrial and Consumer
• Ease of Adoption
− Industry-leading ecosystem, partnerships and support
− Design collateral, distribution, communities
− System solutions: SoC, sensors, memory, PMIC, connectivity
EXTERNAL USE6
Leadership Security – i.MX Hardware Enablement
Secure Storage
Tamper Resistance
Secure S/W Execution
Identity Management
Secure Data Communications
Secure Network Access
Policies & Certifications
In-line encryption (memory)
Manufacturing protection
Authenticated debug & field returns
Run-time integrity
Trust zone
Secure Storage
Zeroizable RAM
Root of trust
Cryptographic Acceleration
Symmetric and asymmetric accl.
Random number generator
Attack Protection
Active tamper detection (Physical)
DPA protection (side channel)
Secure S/W Execution
Resource domain control
System memory protection unit
On-the-fly decryption (code)
EXTERNAL USE7
Leadership Software – i.MX Linux Enablement
Silver Member
• Silver Member of Linux Foundation
• AGL Working Group Bronze Member
• Over the past 15 years shipping i.MX applications
processors, there have been 39,000+ Linux
downloads
• Multiple i.MX 6 series customer engagements are using
GENIVI solutions
• NXP has more compliant platforms than ANY
semiconductor vendor
• Reference: http://www.genivi.org/compliant-products
EXTERNAL USE8
i.MX Android Enablement
Commitment: 11Android OS versions released over past 8 years
Broad Acceptance: 25,000+ downloads of BSP to date
Fast Development: ~4 months from development start to production release on
multiple Android versions
Cross market robustness: Automotive, Embedded/Industrial, Consumer
Continued support: New OS releases for min. 2 years after silicon production
Leadership: i.MX – only Android system shipping in a top 5 OEM infotainment platform today
2008 2009 2010 2011 2011 2012 2012 2013 2014 2015 2016
EXTERNAL USE9
iMXCommunity.org – Connect, Collaborate, Share
Greater than 4,000 members
3500 new content added every year
Support and enablement for i.MX processors and software – share tips, ask questions, spark ideas
Federated search capability integrated with our website
Forums – Discussions – Groups – Blogs Posts – News – Multimedia Gallery – Training
Ecosystem
Partners
Channel
Partners
NXP.com
NXP
Support
DevelopersUsers
EXTERNAL USE10
i.MX 6 Series: Supreme Scalability and Flexibility Leverage One Design into Diverse Product Portfolio
Scalable series of Eleven ARM-based SoC Families
i.MX 6Solo i.MX 6Dual i.MX 6Quad
i.MX
6Solo
Family
i.MX
6Dual
Family
i.MX
6Quad
Family
i.MX 6DualLite
i.MX
6DualLite
Family
i.MX
6SoloLite
Family
i.MX 6SoloX
Pin-to-pin Compatible
Software Compatible
i.MX
6SoloX
Family
i.MX
6QuadPlus
Family
i.MX 6DualPlus
i.MX
6DualPlus
Family
i.MX
6UltraLite
Family
i.MX 6SoloLitei.MX 6UltraLite
Expanded series for performance, power efficiency and lower BOM
i.MX
6UltraLite
i.MX
6SoloLite
i.MX
6SoloX
i.MX
6Solo
i.MX
6DualLite
i.MX
6Dual
i.MX
6DualPlus
i.MX
6Quadi.MX
6QuadPlus
i.MX
6 ULL
Family
i.MX 6UltraLite
i.MX
6ULL
Pin-to-pin
Compatible
i.MX
6 SLL
Family
i.MX 6SoloLite
i.MX
6SLL
Pin-to-pin
Compatible
June
‘17
EXTERNAL USE11
i.MX 7 family
i.MX 8 family
Safety Certifiable & Efficient Performance
Flexible Efficient Connectivity
ARM® v7-A
i.MX 8M family
i.MX 8X family
Advanced Audio & Video
Advanced Graphics & Performance
i.MX 7ULP familyUltra Low Power with Graphics
ARM ® v8-A (32-bit/ 64-bit)
ARM® v7-A (32-bit)
i.MX 6QuadPlus
i.MX 6Dual
i.MX 6Solo
i.MX 6DualLite
i.MX 6SoloLite
i.MX 6SoloX
i.MX 6UltraLite
i.MX 6DualPlus
i.MX 6Quad
i.MX 6SLL
i.MX 6ULL
i.MX Processor Roadmap
June
‘17
EXTERNAL USE12
i.MX FAMILY DETAILS
EXTERNAL USE13
Advanced Heterogeneous
Architecture
− Up to Dual Cortex-A7 @ 1GHz
− Cortex-M4 @ 200MHz
▪ Offload Tasks
▪ Optimize Power
▪ Increase Security
Unmatched Power Efficiency
− 3x improvement in Power Efficiency
versus i.MX 6
− 100 uW/MHz for Cortex-A7
− 70 uW/MHz for Cortex-M4
− One third the power consumed in
the Low Power suspend mode (250uW) versus
i.MX 6
Enabling Flexible High
Speed Connectivity
− PCI-e v2.1
− Dual Gbit Ethernet with AVB
− DDR QuadSPI support
− eMMC 5.0
Complete Security Infrastructure− Secure Boot
− Crypto Hardware Acceleration
− Internal and External Tamper Detection
− Secure RAM
− DPA attack Resistance
− Secure JTAG
Bus Fabric
A7 A7 M4
i.MX 7 Series Advantages
EXTERNAL USE14
Security
Secondary CPU Platform
i.MX 7Solo Processor
Main CPU PlatformSystem Control
JTAG
PLL, OSC
Clock & Reset
Watch Dog x4
Smart DMA
Connectivity
MMC5.0 / SD3.0 x2
UART x7
I2C x4
I2S x3
USB2.0 OTG (w/ PHY)
Power Mgmt
LDO
Temp Monitor
External Memory
USB2.0 HOST (w/ HSIC)
1Gbit ENET AVB
Imaging Processing
Resizing, Blending
Inversion / Rotation
Dual-Ch Quad SPI
GPIO, Keypad
32/16bit LP-DDR2/3
DDR3/DDR3L
512KB L2-cache
ADC
2x 12-bit ADC
LCD Interface
8bit NAND(BCH62)
Internal Memory
256KB SRAM
96KB ROM
RNG
10 tamper pins
RSA 4096
Secure RTC
32KB Secure RAM
Ciphers
DPA protection
Camera Interfaces
Parallel CSI (up to 24-bit)
Core
Cortex-A7
NEON FPU
CAN x2
Cortex-M4
16KB D-cache16KB I-cache
64KB TCM
NOR FLASH/SRAM
SPI x4
FlexTimer x2
PWM x4
Smart Card I/F x2
MIPI-CSI (2-lane)
24-bit Parallel RGB
MIPI-DSI (2-lane)
Specifications:▪ Package: 19x19 BGA @ 0.75mm pitch BGA
12x12 BGA @ 0.4mm pitch BGA*
▪ Qualification
▪ Consumer (0C to +95C Tj), 5 year operation at 50% duty cycle
▪ Industrial (-20C to +105C Tj), 10 year operation at 100% duty cycle
Key Features and Advantages
▪ 800 MHz AMR Cortex-A7, 32 KB I/D, 512 KB L2 Cache
▪ 200 MHz ARM Cortex-M4, 16 KB I/D, 64 KB tightly-coupled memory
▪ Memory Support
▪ 16/32-bit LP-DDR2/3, DDR3/L @ 533 MHz
▪ Total of 256 KB on-chip SRAM
▪ 2x SDIO3.0/eMMC5.0, 8-bit NAND (BCH62)
▪ Display / Camera
▪ 24-bit Parallel LCD and MIPI-DSI (2-lane) display
▪ Parallel (up to 24-bit) and MIPI-CSI (2-lane) camera
▪ I/O
▪ 1x USB 2.0 OTG w/ PHY + 1xUSB 2.0 HOST/HSIC
▪ 1x GigE Ethernet Ports with Audio Video Bridging (AVB)
▪ Security module - enabling PCI 4.0 compliance
32KB D-cache32KB I-cache
* Feature limited (1 ADC, 4 tamper pins)
GPTx4, FlexT x 2
EXTERNAL USE15
Security
Secondary CPU Platform
Main CPU PlatformSystem Control
JTAG
PLL, OSC
Clock & Reset
Watch Dog x4
GPTx4, FlexT x 2
Smart DMA
Connectivity
MMC5.0 / SD3.0 x3
UART x7
I2C x4
I2S x3
USB2.0 OTG x2 (w/ PHY)
Power Mgmt
LDO
Temp Monitor
External Memory
USB2.0 HOST (w/ HSIC)
1Gbit ENET AVB x 2
Imaging Processing
Resizing, Blending
Inversion / Rotation
Dual-Ch Quad SPI
GPIO, Keypad
PCI-e v2.1 (1lane)
32/16bit LP-DDR2/3
DDR3/DDR3L
ADC
2x 12-bit ADC
LCD Interface
8bit NAND(BCH62)
Internal Memory
256KB SRAM
96KB ROM
RNG
10 tamper pins
RSA 4096
Secure RTC
32KB Secure RAM
Ciphers
DPA protection
Camera Interfaces
Parallel CSI (up to 24bit)
Core #0
Cortex-A7
NEON
32KB D-cache
FPU
32KB I-cache
Core #1
Cortex-A7
NEON
32KB D-cache
FPU
32KB I-cache
CAN x2
Cortex-M4
16KB D-cache16KB I-cache
64KB TCM
EPD Interface
4th-Gen EPD Controller
NOR FLASH/SRAM
SPI x4
FlexTimer x2
PWM x4
Smart Card I/F x2
MIPI-CSI (2-lane)
24-bit Parallel RGB
MIPI-DSI (2-lane)
Updated from i.MX 7Solo
512KB L2-cache
* Feature limited (1 ADC, 4 tamper pins)
Specifications:▪ Package: 19x19 BGA @ 0.75mm pitch BGA
12x12 BGA @ 0.4mm pitch BGA*
▪ Qualification
▪ Consumer (0C to +95C Tj), 5 year operation at 50% duty cycle
▪ Industrial (-20C to +105C Tj), 10 year operation at 100% duty cycle
Key Features and Advantages
▪ 1 GHz, ARM Cortex-A7, 32 KB I/D, 512 KB L2 Cache
▪ 200 MHz Cortex M4, 16 KB I/D, 64 KB tightly-coupled memory
▪ Memory Support
▪ 16/32-bit LP-DDR2/3, DDR3/L @ 533 MHz
▪ Total of 256 KB on-chip SRAM
▪ 3x SDIO3.0/eMMC5.0, 8-bit NAND (BCH62)
▪ Display / Camera
▪ 24-bit Parallel LCD and MIPI-DSI (2-lane) display
▪ Parallel (up to 24-bit) and MIPI-CSI (2-lane) camera
▪ EPDC (e-ink) display
▪ I/O
▪ 2x USB 2.0 OTG w/ PHY + 1xUSB 2.0 HOST/HSIC
▪ 2x GigE Ethernet Ports with Audio Video Bridging (AVB)
▪ PCIe 2.1
▪ Security module - enabling PCI 4.0 compliance
i.MX 7Dual Processor
EXTERNAL USE16
i.MX 6ULL Advantages
• Lowest cost and Smallest i.MX 6
Member
− ARM Cortex-A7 @ up to 900 MHz
- The 14x14 289 MAPBGA with 0.8mm pitch for
simple and low cost PCB design
- The 9x9 272 MAPBGA with 0.5mm pitch for
space constrained applications
• Connectivity optimized for Industrial
and IoT applications
− 2x high-speed USB on-the-go with PHY
− Multiple Serial Communication ports: 4x I2C,
4x SPI, 8 UART, 2 Smartcard interfaces
− 2x 12-bit ADC modules (up to 10 input
channels) with on Touch Control
− Dual speed 10/100 Mbit/s Ethernet MAC
compliant with the IEEE802.3-2002 standard
− 2x CAN ports
• Exceptional compatibility and
Scalability
− SW compatible to broad i.MX 6 series,
− SW and Pin to pin compatible with
corresponding i.MX 6UltraLite
• Most Power efficient Applications
Processor
− Integrated power management module that
reduces the complexity of external power supply
and simplifies power sequencing
− Improved power architecture reduces low power
mode power consumption by 50%.
EXTERNAL USE17
i.MX 6ULL Application Processor
• Specifications
− Core voltage: 1.1V
− Package: 289 MAPBGA, 14x14mm, 0.8mm pitch
272 MAPBGA, 9x9mm, 0.5mm pitch
− Temperature: -40C to 105C (Tj)
• Key Features and Advantages
− ARM Cortex-A7 @ up to 900 MHz, 128 KB L2 cache
− Parallel LCD Display up to WXGA (1366x768)
− 8/10/16/24-bit Parallel Camera Sensor Interface
− 16-bit LP-DDR2, DDR3/DDR3L
− 8/16-bit Parallel NOR FLASH / PSRAM
− Dual-channel Quad-SPI NOR FLASH
− 8-bit Raw NAND FLASH with 40-bit ECC
− 2x MMC 4.5/SD 3.0/SDIO Port
− 2x USB 2.0 OTG, HS/FS, Device or Host with PHY
− Audio Interfaces include ESAI, 3x I2S/SAI, S/PDIF Tx/Rx
− 2x 10/100 Ethernet with IEEE 1588
− 2x 12-bit ADC, up to 10 input channel total, with resistive touch controller
− Partial PMU Integration
• Enablement
− Linux BSP from NXP
− FreeRTOS BSP from NXP
i.MX 6ULL
CPU Platform
System Control
ARM Cortex-A7
Security
Secure JTAG
PLL, OSC
RTC & Reset
NEON
Watch Dog x3
Timer x4
PWM x8
ADC
ADC x2 (10-ch)
Smart DMA
128 KB L2-cache
32 KB D-cache
Multimedia
Connectivity
MMC 4.5 / SD 3.0 x2
UART x8
Power Mgmt
LDO
IOMUX
Temp Monitor
ETM
32 KB I-cache
NAND Ctrl (BCH40)
External Memory
Dual-Channel Quad SPI x1Internal Memory
96 KB ROM
128 KB RAM
Parallel NOR FLASH
16-bit DRAM Controller
LPDDR2/DDR3/DDR3L
24-bit Parallel LCD
16-bit Parallel CSI
I2C x4
S/PDIF Tx/Rx
I2S/SAI x3
ESAI
GPIO
10/100 ENET x2
w/ IEEE 1588
USB2 OTG w/ PHY x2
FlexCAN x2
ASRC
SPI x4
8x8 Keypad
Secure RTCCiphers & RNG HABeFuse
Pixel Processing Pipeline
CSC, Resize, Combine, Rotate
EXTERNAL USE18
i.MX 6UltraLite Advantages
• Lowest Cost and Smallest i.MX 6
Member
− ARM Cortex-A7 @ 528 and 696 MHz
- The 14x14 289 MAPBGA with 0.8mm pitch for
simple and low cost PCB design
- The 9x9 289 MAPBGA with 0.5mm pitch for
space constrained applications
• Connectivity optimized for Industrial and
IoT applications
− 2x high-speed USB on-the-go with PHY
− Multiple Serial Communication ports: 4x I2C, 4x
SPI, 8 UART, 2 Smartcard interfaces
− 2x 12-bit ADC modules (up to 10 input channels)
with on Touch Control
− Dual speed 10/100 Mbit/s Ethernet MAC compliant
with the IEEE802.3-2002 standard
− 2x CAN ports
• Advanced Security
− Hardware-enabled security features that
enable secure e-commerce, digital rights
management (DRM), information encryption,
secure boot and secure software downloads
• Most Power efficient Applications
Processor
− Integrated power management module that
reduces the complexity of external power supply
and simplifies power sequencing
“It provides up to 20% more single thread performance than
the Cortex-A5 and provides similar performance to
mainstream Cortex-A9 based smartphones in 2012 while
consuming less power.” www.arm.com/products/processors/cortex-a/cortex-a7.php
EXTERNAL USE19
i.MX 6UltraLite Processor
Specifications:
• CPU: 1x Cortex-A7 @ 528 or 696 MHz
• Package:
- 14x14 0.8mm MAPBGA
- 9x9 0.5mm MAPBGA
• Temp Range (Tj):
- Auto -40 to 125C
- Industrial -40 to 105C
- Commercial 0 to 95C
• Qual Tiers: Commercial, Automotive, Industrial
• Up to 1003 DMIPS
EXTERNAL USE20
i.MX 6SLL Application Processor
► Specifications• Process: SMIC 40LL
• Core Voltage: 1.1V
• Package: 13x13 MAPBGA, 0.5mm pitch
14x14 MAPBGA, 0.65mm pitch
• Temperature: 0C to 95C (Tj), -40C to 105C (Tj)
• Qual Tiers: Commercial, Industrial
► Key Features and Advantages▪ ARM Cortex-A9 @ 1GHz, 256 KB L2 cache
▪ 32-bit LPDDR2/LPDDR3
▪ E-INK™ Display Controller
▪ 24-bit Parallel LCD Display
▪ 8/10/16-bit Parallel Camera Sensor Interface
▪ 3x MMC 5.0/SD 3.0/SDIO Port
▪ Audio: 3x I2S/SSI, 1x S/PDIF Tx/Rx
▪ Partial PMU Integration
▪ HAB Support
► Enablement▪ Linux BSP from Freescale
▪ Android*
► Compatibility▪ Pin-to-pin compatible with i.MX6SL*
▪ SW compatible with i.MX6SL*
i.MX 6SLL
CPU Platform
System Control
ARM Cortex-A9
Secure JTAG
PLL, OSC
RTC & Reset
NEON
Watch Dog x2
Timer x3
PWM x4
Smart DMA
256 KB L2-cache
32 KB D-cache
Multimedia
Connectivity
MMC 5.0 / SD 3.0 x3
UART x5
Power Mgmt
LDO
IOMUX
Temp Monitor
ETM
32 KB I-cache
External MemoryInternal Memory
96 KB ROM
128 KB RAM
32-bit DRAM Controller
400MHz LPDDR2/LPDDR3
24-bit Parallel LCD
16-bit Parallel CSI
I2C x4
USB2 OTG w/ PHY x2
I2S/SSI x3
S/PDIF Tx/Rx
GPIO
SPI x4
8x8 Keypad
PXP
CSC/Rotation/Resize/Overlay
E-INK™ Display Controller
Security
Secure RTC
HAB
eFuse
*There may be small differences in IO and performance due to fab changes.
* here is potential minor system or SW tweaks are needed
*Separate cost/schedule/agreement on Android.
June
‘17
EXTERNAL USE21
i.MX 6SLL vs i.MX 6SLFeature i.MX 6SL* i.MX 6SLL
Core ARM Cortex-A9 ARM Cortex-A9
Speed 1GHz 1GHz
Cache32 KB-I, 32KB-D
256KB L232 KB-I, 32KB-D
256KB L2OCRAM 128 KB 128 KBDRAM 32-bit LP-DDR2, DDR3/DDR3L 32-bit LPDDR2, LPDDR3eMMC eMMC4.4 eMMC5.0
SD/eMMC Port 4 3Parallel Nor/EBI Yes None
Ethernet 10/100 MB x 1 NoneUSB with PHY OTG, HS/FS x 2 OTG, HS/FS x 2USB with HSIC 1 None
Security TRNG, Crypto Engine (AES/TDES/SHA), Secure Boot TRNG, Crypto Engine (AES/TDES/SHA), Secure BooteFuse 2K-bit 2K-bit
E-INK Display EPDC (8-bit / 16-bit) EPDC (8-bit)SiPix Display SPDC None
Image Processing PXP PXPGraphic GPU2D, OpenVG None
CSI 16-bit Parallel CSI 16-bit Parallel CSILCD 24-bit Parallel LCD 24-bit Parallel LCD
UART 5 5IIC 4 4SPI 4 4
I2S/SSI 3 3S/PDIF 1 1Timer 3 3PWM 4 4
Keyboard (8x8) Yes YesDigital LDO ARM/SOC/PU NoneAnalog LDO 1.1V/2.5V 1.1V/2.5V
Temperature 0C to 95C (Tj) 0C to 95C (Tj)
Red indicates the feature removed from i.MX6SL
Green indicates the feature added on i.MX6SLL
*Part Number: MCIMX6L8DVN10AA
June
‘17
EXTERNAL USE22
i.MX 6SLL Key Changes
6 SoloLite 6SLL
Upgrade and
Power Reduction
i.MX 6SLL
− ARM Cortex-A9 @ 800MHz/ 1GHz
− 256 KB L2 cache
− 32-bit LPDDR2/LPDDR3
− Linux
IP Changes
• Latest ARM Cortex A9 revision
• Support LPDDR3, remove DDR3
• Latest EPDC / PXP
• eMMC5.0
• Remove IPs including GPU, ENET
Power Reduction
• Remove digital LDO
• Support low power run
• Support megamix power down
(high-speed IP modules)
• 50% lower on suspend power
Design updates
• PINMUX
• Ball Map
• Memory Map
• IRQ assignment
• Less boot device
June
‘17
EXTERNAL USE23
i.MX 6SLL Feature Summary (1/2)
i.MX 6SoloLite i.MX 6ULL i.MX 6SLL i.MX 7Dual
Primary CPUCortex-A9 x1
1GHz, 2500 DMIPS
Cortex-A7 x1
900MHz, 1000 DMIPS
Cortex-A9 x1
1GHz, 2500 DMIPS
Cortex-A7 x2
1GHz, 3800 DMIPS
Cache32KB/32KB L1
256KB L2
32KB/32KB L1
128KB L2
32KB/32KB L1
256KB L2
32KB/32KB L1
512KB L2
Secondary CPU - - - Cortex-M4, 266MHz
On-Chip RAM 128KB 128KB 128KB 160KB
DRAMLPDDR2 / DDR3
400MHz, 32-bit
LPDDR2 / DDR3
400MHz, 16-bit
LPDDR2 / LPDDR3
400MHz, 32-bit
LPDDR2 / LPDDR3 /
DDR3, 533MHz, 32-bit
SD/MMCSD/eMMC x4
SD3.0, eMMC4.4
SD/eMMC x2
SD3.0, eMMC4.5
SD/eMMC x3
SD3.0, eMMC5.0
SD/eMMC x3
SD3.0, eMMC5.0
Raw NAND - 8-bit, 40-bit ECC - 8-bit, 62-bit ECC
QSPI - Dual Channel QSPI - Dual Channel QSPI
Parallel NOR 8/16-bit 8/16-bit - 8/16-bit
USB2x USB2.0 OTG w/PHY
1x HSIC2x USB2.0 OTG w/PHY 2x USB2.0 OTG w/PHY
2x USB2.0 OTG w/PHY
1x HSIC
Ethernet 1x 10/100Mbps 2x 10/100Mpbs - 2x 1Gbps
PCIe - - - PCIe 2.0, 1-lane
June
‘17
EXTERNAL USE24
i.MX 6SLL Feature Summary (2/2)
i.MX 6SoloLite i.MX 6ULL i.MX 6SLL i.MX 7Dual
EPD Display8/16-bit Panel
2332x1650@106Hz
8/16-bit Panel
2048x1536@106Hz
8/16-bit Panel
2332x1650@106Hz
8/16-bit Panel
2332x1650@106Hz
LCD Display 24-bit Parallel RGB 24-bit Parallel RGB 24-bit Parallel RGB24-bit Parallel RGB
MIPI DSI 2-lane
Image ProcessingCSC, Resize, Rotation,
Alpha-Blending
CSC, Resize, Rotation,
Alpha-Blending,
Dithering
CSC, Resize, Rotation,
Alpha-Blending,
Dithering
CSC, Resize, Rotation,
Alpha-Blending,
Dithering
EPD Waveform
ProcessingGen-I
Gen-II (REAGL/-D)
Single Engine
Gen-II (REAGL/-D)
Single Engine
Gen-II (REAGL/-D)
Dual Engine
Camera Input 16-bit Parallel 24-bit Parallel 24-bit Parallel24-bit Parallel
MIPI CSI 2-lane
AudioI2S x3
SPDIF TX/RX
I2S x3
SPDIF TX/RX
ESAI x1, ASRC
I2S x3
SPDIF TX/RXI2S x3
12-bit ADC x2 x2 x2 x2
Touch Controller - 4/5-wire resistive touch - -
UART, SPI, I2C 5, 4, 3 8, 4, 4 5, 4, 3 7, 4, 4
Package 13x13mm, 0.5mm pitch9x9mm, 0.5mm pitch
14x14mm, 0.8mm pitch
13x13mm, 0.5mm pitch
14x14mm, 0.65mm pitch
12x12mm, 0.4mm pitch
19x19mm, 0.75mm pitch
June
‘17
EXTERNAL USE25
i.MX SOFTWARE
AND SERVICES
EXTERNAL USE26
MICROCONTROLLER SOFTWARE STRATEGY
Developing Innovative Software
product & solution leveraging
Hardware IP
Accelerate our Customers' Time to Market &
Reduce their Project risks by:
Providing Knowledge and Value through
Professional Support and Services
Delivering Comprehensive Seamless
Building Components
With Ease of Use to Jump Start Projects
Embedded Processing
Solutions
EXTERNAL USE27
Software Products / TechnologyAVB, Miracast, HDCP2.x, TRLE, TEE, Home Kit,
CarPlay, Android Auto, MICROEJ, Sensor Fusion,
AUTOSAR, Connected Audio Solution, Graphic
Tools, VisionECG, GPU Driver, AGL, Genivi,
XBMC, HAB
Complimentary SupportNXP Boards
Communities
Technical Information Center
Customer Application & Technical
Support
Distributor technical support
Complimentary Software & ToolsKinetis Design Studio, Software Development Kit, Pin
Config, Power Estimator/Analyzer
THREAD, BLE, ZigBee, Bootloader, RTOS
Linux & Android BSP…
Professional SupportRisk Reduction
Fast Answers
Hot Fixes
Professional ServicesManaging Skills Gaps & Engineering Capacity
Global Staffing Capability
Vested Interest in Mutual Success
Graphic, Security, Linux/Android, Cloud.
Hardware Services1st Time Boot
Schematics & Layout Review
Software, Professional Support & Services
Embedded Processing
Solutions
EXTERNAL USE28
i.MX SOFTWARE
ROADMAP
EXTERNAL USE29
Strongest Operating Systems for i.MX Applications Processors
Supplier i.MX 6, 7 and 8 series
ARM Cortex-A technology
i.MX 6SoloX, i.MX 7 and 8 series
ARM Cortex-M technology
NXP Semiconductor Yocto Linux OS and Android OS
(Brillo OS on selected devices)
FreeRTOS
Mentor Embedded Linux OS and Nucleus RTOS Nucleus RTOS
Micrium uC/OS II and III RTOS uC/OS II and III RTOS
QNX Neutrino RTOS -
Green Hills INTEGRITY RTOS -
Embedded Access - MQX RTOS
Express Logic ThreadX RTOS (coming soon) ThreadX RTOS (coming soon)
EXTERNAL USE30
i.MX Series – Currently Shipping Devices and Platforms
• The roadmaps have become unmanageable to list every shipping device. This
chart can serve as a reference for the currently shipping devices and platforms
referred as “Shipping” on the roadmap slides.
Devices
(with 3D GPU)
Devices
(with PXP*) Dev Platforms Starting YOCTO Linux Starting Android
i.MX 6ULL EVK 4.1.15_2.0.0 Things (Brillo) AOSP
i.MX 7Dual EVK 4.1.15_1.2.0 Things (Brillo) AOSP
i.MX 6UltraLite EVK 4.1.15.1.1.0 Things (Brillo) AOSP
i.MX 6QuadPlus SABRE-SDB / AI 3.14.52_1.1.0 Android 5.1 (LP)
i.MX 6DualPlus SABRE-SDB / AI 3.14.52_1.1.0 Android 5.1 (LP)
i.MX 6SoloX SABRE-SDB/AI 3.10.53 Android 4.4 (KK)
i.MX 6Quad SABRE-SDB / AI 3.10.17 Android 4.2 (JB)
i.MX 6Dual SABRE-SDB / AI 3.10.17 Android 4.2 (JB)
i.MX 6DualLite i.MX 6DualLite SABRE-SDB / AI 3.10.17 Android 4.2 (JB)
i.MX 6Solo SABRE-SDB / AI 3.10.17 Android 4.2 (JB)
i.MX 6SoloLite EVK 3.10.17 Android 4.2 (JB)
*PXP = PiXel Processing engine for imagine resize, rotation, overlay and color space conversion.
EXTERNAL USE31
J F M A M J J A S O N D J F M A M J J A S O N D J F M
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q
2016 2017 2018
Standard Support
i.MX Linux Roadmap
Shipping (currently shipping i.MX6 and i.MX7 devices)
Execution Production
GA
Alpha
Planning Supported
Platforms
Release
Schedule
Linux
Kernel
Consolidated GA – Support for 1 year
Alpha, Beta & Single-GA – Availability until next release
3.14.x
L3.14.52_1.1.x
i.MX 6SLL
i.MX8 (x64)
“Fido”
i.MX 7ULP
4.1.x
Yocto Proj. 2.0 – “Jethro”
GA
Yocto Proj. 2.1 – “Krogoth”
GPU “p8” patch
GA for i.MX7D R1.2
L4.1.15_1.x.x
Standard Support
L4.1.x_2.x.x
GA
GA
Y.P. 2.2 – “Morty” Y.P. 2.3 – “Pyro”
L4.9.x_1.x.x
4.9.x
GA
Additional BSP releases
planned for 2H 17
for Currently Shipping
products and NPI
Standard Support
Yocto Project n+1
early releases
(see next slide)
GA Alpha
Beta release
(see next slide)
EXTERNAL USE32
i.MX Android Roadmap
J F M A M J J A S O N D J F M A M J J A S O N D J F M
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q
2016 2017 2018
Standard Support
Execution Production
GA
Alpha
Planning
Supported
Platforms
Release
Schedule
Linux
Kernel
GA – Support for 1 year
Alpha & Beta & SAGA – Availability until next release
Lollipop 5.1L5.1.1_2.x.x
3.14.x
Consolidated GA
4.1.x
Marshmallow 6.0
Standard Support
Standard Support
M6.0.x_x.0.0
GAk 4.1
GAk 3.14
GAi.MX7D R1.2
Android Nougat
Now Available!
N 7.1.0_1.0.0
Shipping (currently shipping i.MX6 and 7 devices)
Future
Arm V8 (x64)
Future
4.x.x
Additional “N” BSP
releases planned for 2H 17
for Currently Shipping
products and NPI
early release
(see next slide)
EXTERNAL USE33
J F M A M J J A S O N D J F M A M J J A S O N D J F M
1Q 2Q 3Q 4Q 1Q 2Q 3Q 4Q 1Q
2016 2017 2018
i.MX M4 RTOS Roadmap(i.MX6SoloX & i.MX7)
GA – Support for 1 year
Alpha & Beta – Availability until next release
i.MX 6Solox
i.MX 7D
Standard Support
Execution Production
GA
Alpha
Planning Supported
Platforms
Release
Schedule RTOSFree RTOS
FreeRTOS .
GA
Support plan follows
Linux BSP schedule
Future releases will
be supported in
MCUExpresso!
EXTERNAL USE34
ECOSYSTEM AND
PACKAGING
EXTERNAL USE35
i.MX Ecosystem – Many Markets, Many Choices
Concept Prototype Manufacturing
SABRE BOARDS
TIME TO
MARKET
OS Development Middleware/Apps
IDH/EBS ---------ODM
Development
HW/Modules
Training
Dev
Tools
HW
SW
EXTERNAL USE36
Small Package Options for i.MX Processors
i.MX product families
Smallest Ball Grid Array (BGA) planned
Package on Package (PoP)
Freescale Single Chip Module (SCM)
3rd-party System on Module (SOM)
i.MX 6Quadi.MX 6Dual
21x21, 0.8p, FC-PBGA 62412x12, 0.5p, FC-CSP
569
17x14, 0.65p, 1GB or 2GB LPDDR2, 16MB
SPI NOR + PMICMany
i.MX 6SoloX14x14, 0.65p17x17, 0.8p
Not planned Launching soon Several
i.MX 6UltraLite9x9, 0.5p
14x14, 0.8pPossible if good business case
TBD Several
i.MX 7Dual i.MX 7Solo
12x12, 0.4p19x19, 0.75p
Possible if good business case
TBD Several
i.MX 823x23 @ 0.65p FCBGA27x27 @ 0.75p FCBGA
Not planned TBD TBD
i.MX 8M a x a, 0.65-0.8p FCBGA 15x15, 0.4p, FCBGA TBD TBD
EXTERNAL USE37
i.MX ENABLEMENT
EXTERNAL USE38
Enablement through Reference Designs
SABRE Platform for Smart Devices SABRE for Auto Infotainment
SABRE Board for Smart Devices i.MX 6SoloLite Evaluation Kit
• Builds on SABRE Board design with additional
features including 10.1” capacitive multi-touch display,
2x MIPI camera sensors, SPI Nor Flash, GPS,
ambient light sensor and digital microphones
• Support for terrestrial and satellite radio tuners, Wi-Fi,
Bluetooth, GPS, cellular modem, iAP authentication
modules, MOST vehicle networking, cameras and displays
• Multiple connectivity options: Wi-Fi®, Bluetooth®, GPS,
Ethernet, SD, parallel/serial interfaces, SATA (i.MX 6Quad
only), and PCIe
• Enables EPD and/or LCD or HDMI display,
touch control and audio playback, and
the ability to add WLAN, a 3G modem or Bluetooth technology
• E-Ink display available separately
Supported Description
i.MX 6Quad
i.MX 6Dual (emulated)
Quad-core 1-1.2 GHz ARM Cortex-A9
Dual-core 1-1.2 GHz ARM Cortex-A9
i.MX 6DualLite
i.MX 6Solo (emulated)
Dual-core 1GHz ARM Cortex-A9
Single-core 1GHz ARM Cortex-A9
Supported Description
i.MX 6Quad
i.MX 6Dual (emulated)
Quad-core 800MHz-1GHz ARM Cortex-A9
Dual-core 800MHz-1GHz ARM Cortex-A9
i.MX 6DualLite
i.MX 6Solo (emulated)
Dual-core 800MHz ARM Cortex-A9
Single-core 800MHz ARM Cortex-A9
i.MX 6SoloX (Q3’15) 800MHz ARM Cortex-A9
200MHz ARM Cortex-M4
Supported Description
i.MX 6Quad
i.MX 6Dual (emulated)
Quad-core 1-1.2 GHz ARM Cortex-A9
Dual-core 1-1.2 GHz ARM Cortex-A9
i.MX 6SoloX 1GHz ARM Cortex-A9
200MHz ARM Cortex-M4
Supported Description
i.MX 6SoloLite Single-core 1GHz ARM Cortex-A9
EXTERNAL USE39
i.MX 7 Series: SABRE Platform Key Features
Processor
• i.MX 7Dual
- Dual Cortex™-A7 @1GHz
- 512KB L2$
• NXP PF3000 PMIC
Memory
• 1 GB DDR3
• eMMC5.0 footprint
• QuadSPI Flash
• SD/MMC socket
• NAND footprint
Display/Camera Connectors
• HDMI
• Parallel LCD
• MIPI-DSI
• Electronic Paper Display
• MIPI-CSI (camera)
Wireless
• Wifi (802.11ac) onboard
• BT4.0 / BLE onboard
Audio
• Audio HP Jack
• External speaker connection
Connectivity
• USB Host connectors
• microUSB OTG connector
• 2x ETH (1Gbit) Receptacle
• Full Mini PCIe socket
• SIM Card slot
• CAN (DB-9)
• GPIO
• MFi Module support
• MikroBus expander
Debug
• JTAG connector
• UART via USB
Sensors
• FXOS8700 three-axis digital
accelerometer/Magnetometer
• MPL3115A2R Altimeter/Pressure sensor
• FXAS21000 three-axis digital Gyroscope
Tools & OS Support
• Linux®
• Android™
• FreeRTOS
EXTERNAL USE40
SABRE Platform for Smart Devices (SDP)
Part Numbers: MCIMX6Q-SDP ($999)
MCIMX6DL-SDP ($999)
Overview
• i.MX 6Quad or 6DualLIte
• i.MX 6Dual emulation on 6Quad
• i.MX 6Solo emulation on 6DualLite
• MMPF0100 PMIC
• 1 GB DDR3 memory (non terminated)
• 3” x 7” 8-layer PCB
Display connectors
• Native 1024x768 LVDS display
(comes with kit)
• 2nd LVDS connector
• Connector for 24 bit 4.3”
800x480 WVGA with
4-wire touch screen
• HDMI connector
• MIPI DSI connector
Audio
• Wolfson Audio Codec
• Microphone and headphone jacks
• Dual 1W speakers
Additional Features
• 3-axis accelerometer
• GPS receiver
• Ambient light sensor
• eCompass
• Dual 5MP cameras
• Power supply
• Battery charger
• Battery connectors
OS Support
• Linux and Android BSPs
• Others: 3rd parties
Tools Support
• Lauterbach
• ARM (DS-5)
• Macraigor
• WiFi: (not included with kit)
• Silex WiFi module
• Murata WiFi module
Connectivity
• 2x full-size SD/MMC card slot
• 22-pin SATA connector
• 10/100/1000 Ethernet port
• 1x high-speed USB OTG port
• mPCI-e connector
Debug
• JTAG connector
• Serial to USB connector
Expansion Connector
• Enables parallel LCD or HDMI output
• Camera CSI port signals
• I2C, SSI, SPI signals
EXTERNAL USE41
SABRE Board for Smart Devices (SDB)
Website: www.nxp.com/sabresdb
Part Numbers: MCIMX6QP-SDB
MCIMX6Q-SDB
MCIMX6SX-SDB
Display (10.1”): MCIMX-LVDS1
Display (4.3”): MCIMX28LCD
Overview
•NXP i.MX 6QuadPlus, 6Quad or 6SoloX
–i.MX 6DualPlus emulation on 6QuadPlus
–i.MX 6Dual emulation on 6Quad
•NXP MMPF0100 vF9 PMIC (i.MX 6QuadPlus)
•NXP MMPF0100 PMIC (i.MX 6Quad)
•NXP MMPF0200 PMIC (i.MX 6SoloX)
•1 GB DDR3 memory (non terminated)
•3” x 7” 8-layer PCB
Display Connectors
•2x LVDS connectors (i.MX 6Quad)
•1x LVDS connector (i.MX 6SoloX)
•Connector for 24 bit 4.3” 800x480 WVGA
with 4-wire touch screen (i.MX 6Quad)
•HDMI Connector (i.MX 6Quad)
Audio
•Audio Codec
•Microphone and headphone jacks
Expansion Connector
•Enables parallel LCD or
HDMI output
•Camera CSI port signals
•I2C, SSI, SPI signals
Additional Features
•3-axis NXP accelerometer
•eCompass
•Power supply
•No battery charger
Connectivity
•2x full-size SD/MMC card slot
•22-pin SATA connector (i.MX
6Quad)
•10/100/1000 Ethernet port
•1x high-speed USB OTG port
•1x CAN port (i.MX 6SoloX)
•mPCI-e connector
Debug
•JTAG connector
•Serial to USB connector
OS Support
•Linux and Android BSPs from
NXP
•Others: 3rd parties
Tools Support
•Lauterbach
•ARM (DS-5)
•Macraigor
WiFi: (not included with kit)
•Silex WiFi module
•Murata WiFi module
EXTERNAL USE42
SABRE Platform for Auto Infotainment (AI)
Power and Memory• PF-Series PMIC
• 2 GB DDR3 memory (i.MX 6Quad/QuadPlus)
• 1GB DDR3 memory (i.MX 6Solo)
• 32GB Parallel NOR Flash
• NAND Socket
Display• LVDS connector
• compatible with MCIMX-LVDS1
• Parallel RGB display interface
• HDMI output connector
Debug• JTAG connector
• Debug UART connector
Connectivity and Expansion• SD Card Slot
• High Speed USB OTG
• Ethernet
• SATA
• MIPI CSI
• PCIe
• MLB150 INIC connector
• 281-pin MXM card edge connector for main board expansion
Connectivity and Expansion• SD card slot (WiFi module or SD)
• Bluetooth or Bluetooth+WiFi header
• AM/FM tuner header
• Sirius XM Module header (de-pop’’d)
• GPS (UART) module connector
• 2x CAN
• Dual High Speed USB Host connectors
• MLB 25/50 INIC connector
• SPI NOR flash
Display I/O• LVDS connector
• compatible with MCIMX-LVDS1
• Analog Video Input
• LVDS Input
Audio• Cirrus multichannel audio codec
• Up to 8 outputs
• Dual microphone inputs
• Stereo Line Level Input
• SPDIF receiver
OS Support• Linux, Android (internal)
• Others: future support by 3rd parties
CPU Card Details Base Board DetailsPart Numbers
Base Board: MCIMXABASEV1 ($699)
CPU Cards: MCIMX6SAICPU1 ($799)
MCIMX6QAICPU1 ($799)
MCIMX6QPAICPU3 ($799)
Display: MCIMX-LVDS1 ($499)
SABRE AI boards will only be supported at automotive customers
EXTERNAL USE43
Evaluation Kit Based on i.MX 6ULL (PN: MCIMX6ULL-EVK)
CPU Board
• i.MX 6ULL applications processor
• Discrete power management
• Memory: 4 GB DDR3L SDRAM, 400 MHz;
256 MB Quad SPI flash; MicroSD connector;
Footprint for eMMC and NAND flash
• Low cost 4-Layer PCB
Base Board
• Enables LCD display and audio playback
• Many connectivity options
• Parallel camera connector
• Sensors: eCompass, accelerometer, footprint
for gyroscope
• Low cost 4-Layer PCB
A MicroSD with pre-programmed Linux BSP is included in all i.mx 6ULL EVK
EXTERNAL USE44
i.MX 6UltraLite Development Platform Key Features
Part Numbers: MCIMX6UL-EVKB ($149)
Display (4.3”): LCD8000-43T ($100)
Processor
•i.MX 6UltraLite 528MHz ARM® Cortex™-A7 CPU
Memory
• 4Gb DDR3L DRAM memory
• 256Mb Quad SPI Flash
• Footprint for NAND
• Footprint for eMMC
• TF socket for boot
Display
• Parallel WVGA LCD add-on card via expansion
connector
• HDMI connector and Footprint for HDMI transmitter
• Camera Connector
Audio
• Audio Codec
• 4-pole Audio Headphone Jack
• External speaker connection
• Microphone
Connectivity
• USB Host connector
• Micro USB OTG connector
• Two Ethernet (10/100T) connector
• SD/SDIO Connector
• Two CAN Transceivers
• EMV Smart Card connector
Debug
• JTAG connector
• Serial to USB connector
Sensors
• Footprint for FXAS21000CQR1 Gyro
• FXLS8471Q three-axis digital accelerometer
• MAG3110 Digital eCompass
Tools & OS Support
• Linux® BSPs
Others
• CPU Module: 1.67x2.66 inch
• Base Board: 4.25x5.12 inch
• 4 layer through hole PCB
EXTERNAL USE45
Evaluation Kit Based on i.MX 6SLL (PN: MCIMX6SLL-EVK)
Processor
• i.MX 6SLL 1 GHz based on
ARM® Cortex®-A9 CORE
• NXP® PF0100 PMIC
Display board interface
• Footprint for EPD connector
• LCD daughter card
Audio
• Wolfson WM8962 audio codec
• Audio HP jack
• External speaker connection
• Microphone
Connectivity
• USB host connectors
• Micro USB OTG connector
Debug
• JTAG connector (footprint)
• One console UART
Kit Contains:
• Board: MCIMX6SLLEVK
• USB cable
• Quick Start Guide
• SD cards containing Linux OS
June
‘17
EXTERNAL USE46
i.MX 6SoloLite Development Platform Key Features
Part Numbers: MCIMX6SLEVK ($399)
IMXEBOOKDC3-E ($499)
Processor
•i.MX 6SoloLite 1 GHz ARM®
Cortex™-A9 CPU
• PF0100 PMIC
Memory
• 512 MB Double Data Rate2 Mobile (LPDDR2)
DRAM memory
• Footprint for Managed NAND (eMMC/eSD)
• SPI Flash
• Three Secure Digital (SD)/multimedia
card (MMC) sockets
Display
• HDMI Daughter Card available
• Parallel WVGA LCD add-on card via expansion
connector
• EPD add-on card via expansion connector
Audio
• Audio HP Jack
• External speaker connection
• Microphone
Connectivity
• USB Host connectors
• Micro USB OTG connector
• Ethernet (10/100T) connector
• SIM Card Socket
• Mini PCIe connector
Debug
• JTAG connector
• One console UART
Other
• MMA8450QT three-axis digital
accelerometer (SABRE)
Tools & OS Support
• VMware player to bring up image
on a Windows PC
• Linux® and Android™ BSPs