深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW SMT in Wertheim
Headquarter, Technology Center, Plant I and Plant IV Plant II and Plant III
• Founded in 1987 by Hans-Günter Ulzhöfer
• “Made in Germany” 6000 m² (64600 ft²)
• 160 employees
• Experts for thermal processes
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW SMT Organisation
Registered SMT Sales + Service offices: i
• Wertheim, Germany
• Richmond, Virginia, USA
• Singapore
• Suzhou China
Representatives located in
• Africa (Egypt, Marocco, South Africa,…)
• Asia (China, India, Philippines,…)
• Europe (Belgium, Italy, Spain,…)
• North America (Canada, USA)
• South America (Brazil, Mexico,…)
Service availability 24/7
• With our local representative and
• With SMT offices
• Spare and Ware parts also included
深祥發展有限公司
SPARKLE TW Products
• Lowest energy and
media consumption
• Precise nitrogen control
• Low maintenance
• 1 to x-lane
• Heavy-duty transport
• Customized solutions
• High throughput
• Small footprint
• No maintenance
• High throughput
• Small footprint
• Lean systems
• Voids reduced up to
99%
• One sealing surface
• Customized and
solutionoriented
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Customers worldwide
Industries served:
• Automotive
• Telecommunication
• Aerospace
• Medicine
• Defence
… and many more
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Mechanical Vacuum Engineering
• Vacuum module between peak- and cooling zone
• Stainless steel vacuum chamber is externally heated
• Inline system
• Nitrogen capable
• Vacuum and non-vacuum process
• All process parameters are adjustable
• High installed base
Motion picture
pre-heating peak vacuum module cooling
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Principle vacuum reflow process
• Process steps:
- heating melting
- vacuum void reduction
- cooling solidification
• Only one process step more compared to conventional reflow process
• Voids cause thermal resistance :
critical in terms of heat flow
lifetime reduction
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Temperature profile
• Exemplary temperature profile of
bare die on DBC
• Vacuum process is part of time above
liquidus (TAL)
• Constant product temperature due to
thermal balance between product
and chamber
Temperature profile taken out of white paper: Vacuum reflow: A simple approach for void reduction by means of an inline reflow system, Christian Ulzhöfer, 2012.
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Vacuum Profile
• All vacuum parameter are adjustable
• Pressure range: 2 - 500 mbar
• Evacuating time: 5 - … s
• Holding time: 0 - … s
• Ventilation time: 5 - … s
• Total vacuum cycle: 33 - … s
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW SMT Vacuum oven cycle time
Transport speed
0.8m/min(13.3mm/s) 1.0m/min(16.7mm/s) 1.2m/min(20mm/s)
LP-length 200mm 400mm 200mm 400mm 200mm 400mm
Transfor into
vacuum chamber 15+2 30+2 12+2 24+2 10+2 20+2
close the chamber 2.5s 2.5s 2.5s 2.5s 2.5s 2.5s
Vacuum 5mbar
5s 5s 5s 5s 5s 5s
hold time
0 0 0 0 0 0
ventilation
5s 5s 5s 5s 5s 5s
open the chamber
2.5s 2.5s 2.5s 2.5s 2.5 2.5
Transfor out of
vacuum chamber
15s 30s 12s 24s 10s 20s
total cycle time
47s 77s 41s 65s 37s 57s
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Vacuum results: bare die on DCB
• Vacuum reflow is designed for:
- PCB
- DBC
- Lead frame
- anything!
• Power electronics:
- voiding < 5%
• Automotive:
- voiding < 10%
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Total voiding, bare die on DBC
• 1.000 analyzed solder joints
• 7 bare dies on 1 DBC
• Voiding requirement: < 5%
• Conventional reflow 99% waste
• Vacuum reflow 0% waste
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Largest void, bare die on DBC
• Single void requirement 1%
• Conventional reflow:
- solitary lare single voids
- single voids with more than „1%“
• Vacuum reflow:
- reduction of single void area
- hotspots are eliminated
- high quality gain
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Influencing factors on void reduction
Vacuum pressure
Temperature profile
Nitrogen
Void reduction
Cause
Effect
wettability
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Effect of nitrogen (on MOS-FET)
• X-ray pictures
• Nitrogen marginal
improvement
• Our experience:
If solder paste wetting is not
improved by nitrogen, aire or
nitrogen atmosphere can be applied
for vacuum process to eliminate
voids.
• Nitrogen in vacuum process used to
avoid oxidated (bonding) surfaces.
• Nitrogen in high power electronics
improves quality of following process
steps, e.g. wahing, bonding.
Air process + vacuum
Nitrogen process + vacuum
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Effect of pressure
• Investigation: bare die on DCB
• Each value is calculated by means of 44
analyzed solder joints
• Vacuum pressure has low impact on void
reduction quality
• Pressures <50 mbar good result
1
0.5
0
1.5
2
2.5
3
0 50 100 150 200 250 300
Vacuum pressure p [mbar]
To
tal
vo
id a
ve
rag
e,
sta
nd
ard
de
v. [
%]
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Effect of bad temperature profile
• Temperature profile is too short
Wettability is poor underneath IGBT
• Voiding ist poorly reduced despite
vacuum!
• X-ray inspection of components:
Voiding > 5%
• Improved temperature profile, same
vacuum parameters:
Voiding < 1%
0
50
100
150
200
250
00:00 05:01 01:00 02:01 03:01 04:01
Process time [min:sec]
Pro
duct te
mpe
ratu
re [°C
]
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Detailed vacuum reflow process
• Void extraction is done by:
1. Void inflating,
2. Void gets in touch with solder joint surface,
3. Void is extracted by means of surface tension,
• Critical process step:
- Displaced liquid solder must reflow above surface.
• Good wettability surfaces are fully wetted with solder
• Bad wettability surfaces are partly wetted with solder
remaining voids
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Conclusion
• SMT vacuum reflow is mighty technology for:
- nitrogen, air, vacuum and non-vacuum processes
- solder joint quality improvement
• Great advantage compare to other vacuum soldering technologies:
- homogeneous heat transer
- simple profiling
- fully inline capable
- suitable for any reflow product (DCB, PCB, lead frame, … any!)
• Combination of profiling, solder paste wettability and vacuum must be considered.
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Fourth part:
5,556
5,554
5,552
5,550
5,548
5,546
5,562
5,560
5,558
5,566
5,564
No Vacuum: Vacuum:
vacuum 0s 30s
Vacuum:
60s
Process variation
Av
era
ge
we
igh
t [g
]
0.004g
0.002g
0.004g
0.004g
Lead free vacuum reflow processes: Effect on mass and capacity of electrolyte capacitors
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Goal of investigations
• Does the reflow process effect the
capacity or the weight of electrolyte
capacitors?
• Does the electrolytes solution boil?
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Capacitor specifications
Data sheet:
• Copied specification of Nippon Chemi-Con
• Voltage Vdc = 35 V
• Capacity F = 470µF
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Investigation
Activities:
• Arranging 4 groups
each with 25 capacitors
• Measuring weight and capacity of each
capacitor
• Applying 4 different reflow profiles:
1 profile for each group
• Measuring weight and capacity of each
capacitor
• Comparing the results before and after
thermal treament
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW SMT vacuum reflow system
• Reflow set up (top and bottom):
Zone 1: 150°C
Zone 2: 160°C
Zone 3: 170°C
Zone 4: 190°C
Zone 5: 235°C
Zone 6: 275°C
Zone 7: 260°C Zone 8: 260°C (vacuum chamber)
Zone 9: 80°C
Zone 10: 40°C
Zone 11: 40°C
• Conveyor speed: 0.8 m/min
• Fan frequency : 50 Hz
Heating zone
Vacuum chamber
Cooling zone
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Temperature, vacuum profiles
• Process variations:
1. No vacuum
stopping 6 s + 8 s = 14 s in
vacuum chamber
2. Vacuum:
6 s evacuating, 0 s holding,
8 s soaking
3. Vacuum:
6 s evacuating, 30 s holding,
8 s soaking
4. Vacuum:
6 s evacuating, 60 s holding,
8 s soaking
• Remark:
Vacuum holding times are typically
shorter than 10 s.
Te
mp
era
ture
[°C
]
300
without
vacuum 0s 30s 60s
250
200
150
100
50
0
Time [min:s]
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW
Average weights before and after thermal treatment
• Measurement error:
m ≈ +/- 0.001 g
• Absolute loss of weight after thermal
treatment: 0.002 g < m < 0.004 g
• Relative loss of weight after thermal
treatment: 0.03 % < m/m < 0.08 %
• Loss of weight is always smaller 0.004 g,
independent from reflow or vacuum
process.
• Conclusion:
- Vacuum and non-vacuum treatments
slightly reduce the weight of capacitors
- No negative effect of vacuum.
5,556
5,554
5,552
5,550
5,548
5,546
5,562
5,560
5,558
5,566
5,564
No Vacuum: Vacuum:
vacuum 0s 30s
Vacuum:
60s
Process variation
Av
era
ge
we
igh
t [g
]
0.004g
0.002g
0.004g
0.004g
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW
• Measurement error:
C ≈ 1 F
• Absolute capacity loss of after thermal
treatment: - 1.24 F < F < 0.016 F
• Relative Capacity after thermal
treatment: 0.25% < F/F < 0.03%
• Maximum capacity loss is 1.24 F for
non-relevant vacuum process with
60 s holding time.
• Conclusion:
- No significant impact on capacity. 495,000
495,500
496,000
496,500
497,000
497,500
498,000
No
vacuum
Vacuum:
0s
Vacuum:
30s
Vacuum:
60s
Process variation
Av
era
ge
ca
pa
cit
y [µ
F] 0.5µF
0.4µF
0.16µF
1,24µF
Average capacities before and after thermal treatment
深祥發展有限公司
SPARKLE TW
深祥發展有限公司
SPARKLE TW Conclusion
• All thermal treatments (vacuum and conventional processes) slightly reduce the
weights of the capacitors.
• However, theses losses are very small: <0.1% relative loss.
• The same conclusion holds for the capacities:
- Capacity losses are very small: <0.25%
- Capacity losses appear for conventional and vacuum reflow processes
深祥發展有限公司
SPARKLE TW
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Contact
深祥發展有限公司
S PA R K L E T W
Taiwan:alan 0908-236000
China :lester 186-7556-3745