1. 2012/1/9 06:27:51 . 2012 2012/01/04

2. 2012/1/9 06:27:51 . 2012SSDMEMS Microphone (3) LTEIntel IvyNFC Bridge CPU Silicon Interposer AR Source2012/012 3. 2012/1/9 06:27:51 . Siri Siri(Android MarketVlingo)( Speaktoit) Source2012/013 4. 2012/1/9 06:27:51 . (2()APP10)10App 3D (34 (34 ) )Source2012/01 4 5. 2012/1/9 06:27:51 . Intel Ivy Bridge CPU 3D CMOS(Tri-Gate CMOS) Intel 22nm>50%37%() UltrabookSource2012/01 5 6. 2012/1/9 06:27:51 . NFCGoogle Google2011526 2NFC Google WalletGoogle Offers Android BeamAndroid 4.0 NFC Android Source2012/01 6 7. 2012/1/9 06:27:51 . SSDNAND Flash SLCMLCTLC SSD$ ECC $/GB30nm100,000100,000 ECCSLC Requirements $4 80,00020nm24 bit ECCMLC 60,000 $2 15 bit ECC TLC 40,0008 bit ECC Server$1 HDD4 bit ECC 20,000 10,0005,0003,000 1,000 NB HDD $0.2 0 SLC5xnm MLC3xnm MLC 2xnm MLC 3-bit-per-cell PC HDD $0.1SSD() 2010 2011 2012 () 1.GoogleAppleFacebook Data Center (: )SSD TIER-0 15000 2.IntelUltrabook2012 40%SSD 3.Ultrabook NB , (HDD+SSD)SSDSource2012/01 7 8. 2012/1/9 06:27:51 . MEMS Microphone MEMS (MEMS 1 3) MEMSVoice Microphone 2MEMS(Ambience Microphone) 1(Beamforming) /(MEMS 3 6) ( )20102016MEMS()Source2012/018 9. 2012/1/9 06:27:51 . LTE 9 Source2012/01 10. 2012/1/9 06:27:51 . 10 Source2012/01 11. 2012/1/9 06:27:51 . Silicon Interposer TSMC CoWoS(Chip on Wafer on Substrate) Flow DRAM DRAM Front-side Chip on WaferBonded Chip on Process &ThinningFinal LogicWaferInterposer Substrate TSV& BacksideTestBondingDicing Bonding FormationProcessSource TSMC2012/01 11 12. 2012/1/9 06:27:51 . 2011200120092012 x86 VMware200672011 3720072010600%Source2012/01 12