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A study on power quality improvement
of semiconductor process during
instantaneous voltage drop
IT
A study on power quality improvement
of semiconductor process during
instantaneous voltage drop
.
2015 2
IT
i
.
.
.
,
. Wafer
Size Chip Size
, FAB
. RF Gen
.
.
.
,
.
. ! ,
, ,
.
ii
.
2014 12 20
iii
, PLC, AC/DC
Drive
.
, ,
.
,
.
,
,
. , , ,
EMI ,
.
. Wafer
Impact
Main Receipt
Wafer .
iv
Power Vaccine
, RF Generator
(Voltage Drop Protector)
.
Keywords : SAG, VDP, RF Generator, Power Vaccine, SEMI F47
v
1 ............................................................................................. 1
1 ..................................................................................... 1
2 ..................................................................................... 2
3 ..................................................................................... 3
2 ................................................... 4
1 .................................................................. 4
2 .......................................... 11
3 .......................................................... 15
3 ................................... 17
1 RF Generator ............................... 17
2 RF Generator ...................... 18
3 (Voltage Drop Protector) ............ 21
4 ........................................................................................... 26
.................................................................................................... 27
vi
1. ................................................................................. 7
2. ........................................... 8
3. .................................................. 10
4. ..................................................................................... 15
5. Voltage Sag ............................ 17
6. RF Generator .......................... 17
7. ......................................... 19
8. RF Generator .................. 20
9. RF Generator .............................. 21
10. RF Generator ........................................ 23
11. RF Generator ..................... 25
vii
1. IEEE Std. 1159 1250 .............. 4
2. ............................................................ 6
3. RF Generator ............................... 21
4. .................................. 22
5. Matrix ........................................................ 24
- 1 -
1
1
.
.
[1]. , ,
,
[1].
[2]-[5].
.
.
.
(Distributed Generation)
[1],[6].
.
,
, ,
100~200ms .
- 2 -
Dip sag Down Wafer
Reject/Rework . Main
Control (uninterruptible
power supply)
.
Semi F47 Common
specification . ,
Down .
Back up Loss
.
2
Main
Control
Power Vaccine .
Wafer Size
.
,
Battery
.
Power Vaccine
.
- 3 -
(Voltage Drop Protector)
.
.
. .
.
Power Vaccine
.
3
2 .
. 3
Power Vaccine
. 4 3
.
.
- 4 -
2
1
IEEE Std. 1159 IEEE Std. 1250
[p.u]
Instantaneous Sag
Instantaneous Swell
Momentary Interruption
Momentary Sag
Momentary Swell
Temporary Interruption
Temporary Sag
Temporary Swell
0.1 ~ 0.9
1.1 ~ 1.8
< 0.1
0.1 ~ 0.9
1.1 ~ 1.4
< 0.1
0.1 < 0.9
1.1 ~ 1.4
0.5~30[cycles]
0.5~30[cycles]
0.5[cycle]~3[sec]
30[cycle]~3[sec]
30[cycle]~3[sec]
3[sec]~1[min]
3[sec]~1[min]
3[sec]~1[min]
0.5~30[cycles]
0.5[cycle]~3[sec]
30[cycle]~2[sec]
3[sec]~1[min]
3[sec]~1[min]
2.
Sustained Interruption
Undervoltage
Overvoltage
Voltage Imbalance
0.0
0.8 ~ 0.9
1.1 ~ 1.2
0.5 ~ 2.0
> 1[min]
> 1[min]
> 1[min]
Steady state
> 2[min]
1. IEEE Std. 1159 1250
Table 1. Definition of the quality of the voltage magnitude of
IEEE Std. 1159 and 1250
- 5 -
0.5cycle 1 0.1pu
0.9pu IEC Dip
IEEE Sag .
(Momentary Interruption),
(Sustained Interruption), (Voltage Sag) .
IEEE Std. 1159 IEEE Std. 1250
1995 ,
[7],[8]. ,
.
2
1990 .
- 6 -
ANSI/IEEE Std.446 (
) 1987
ANSI Std.C84.1
CBEMA(Computer Business Equipment
Manufacturer Association)
1989
IEEE Std.493
1990
IEEE Std.1159
Instantaneous momentary, temporary,
sustained
1995
IEEE Std.1250
Instantaneous momentary, temporary,
sustained
1995
IEEE Std.P1366 1996
2.
Table 2. Representative of the voltage quality standard
- 7 -
.
.
.
1.
Fig. 1 Transmission and distribution system diagram
1 ,
. 0.07 ~ 0.2
.
- 8 -
. 1
150 msec( 9 ) 2
[9],[10].
3~6
.
2.
Fig. 2 Voltage drop across the width according to the distance from
the accident spot
- 9 -
20%
60% 10% .
5~6 60% , 0.2 80% .
3
[9],[10].
.
0.1 .
.
- 10 -
3.
Fig. 3 Conditions of Voltage sag and coverage
11
2
, ,
,
, , .
. ,
, ,
.
.
,
.
, ,
, .
,
.
.
12
.
.
, , ,
.
.
(1.1) .
(1.1)
.
(1.2)
: ( =, =)
I : ()
R :
X : .
13
(1.3) .
(1.3)
% (1.4) .
(1.4)
(1.5)
14
T
T = 3 [VA] T KVA KV
. (1.6)
R X %R %X
(1.7)
(1.8)
. (1.9)
, P = Tcos, Q = Tsin, TB =[KVA]
4 .
15
4.
Fig. 4 Voltage drop
,
.
1 .
.
3
.
Custom Power -
16
. - .
.
-
.
,
, , ,
.
,
. , 100 kVA
, .
80% ,
.
.
.
.
, 1~10 .
, 5% 35% .
, 60Hz (8 msec) .
, .
, [11].
17
3
1 RF Generator
5. Voltage Sag (1999~2013)
Fig. 5 Per year of the semiconductor factory Voltage sag (1999~2013)
6. RF Generator
Fig. 6 Status of the damage caused by the RF Generator of
equipment damage
18
15 (1999 ~2013 )
324 27,911
Wafer 56,528 , Power Vaccine
2007 5.6% 9.4% ,
RF Generator 22.7% 81.8% .
RF Generator
RF Generator
.
2 RF Generator
Pump Chiller
Heater
. RF Generator
, Interlock Issue
.
,
.
..
19
7.
Fig. 7 Emergency power supply status of the semiconductor
production equipment
CVD, METAL, ETCH RF
Generator 17,333, 103,875kVA .
RF Generator
. RF Generator
.
20
8. RF Generator
Fig. 8 Voltage sag damage variation analysis status of RF Generator
8 SEMI F47
.
RF Generator Issue 20%
1sec , 70%
500msec , 100%
200msec
.
21
80%
RF Generator
.
3 (Voltage Drop Protector)
9. RF Generator
Fig. 9 RF Generator voltage sag compensation Measures
3. RF Generator
Table 3. RF Generator voltage sag compensation Measures
22
RF Generator
. 1
. ,
RF Generator
. . 2
RF Generator OFF .
1
Logic
. 3 RF Generator
Issue
1 .
4.
Table 4. Measures voltage sag compensation effectiveness analysis
23
1 9 .
2 OFF
. 3 CPU
Dip Sag .
RF Generator 1
4 .
1
Power Vaccine
RF Generator
. , RF
Generator
.
10 RF Generator
RF Generator RF
Generator
.
10. RF Generator
Fig. 10 Separate power supply scheme of RF Generator
24
RF Generator ,
LSI
. Wafer Loss
Loss , LSI
, 8 CVD ETCH
.
Maker
W/F Loss Back-Up
Down
Step Reprocess
Wet
Clean
3 4 10 4 10 4
CVD_HDP Novellus 1 3 , , 3
CVD_HDP AMT 2 3 , , 3
Metal_M1,M2 AMT 3 4 2
Metal_M1,M2 Ulvac 4 4 1
Etch_Metal AMT 5 4 2
Etch_Metal LAM 6 4 2
CVD_PETEOS AMT 7 6 , 3
CVD_PETEOS Novellus 8 8 , 2
Etch_Oxide LAM 9 3 , 2
Etch_Poly AMT 10 3 , , 1
CVD_PE SiN Novellus 11 8 2
CVD_SiON AMT 12 6 , 3
Etch_Oxide AMT 13 3 , 1
5. Matrix
Table 5. Each process priority evaluation
25
Wafer loss
Back up 5
Matrix
.
, Wafer
Wafer loss Process , Process ,
Back up , Back up Wet cleaning ,
Down .
1999 15
Drop RF Generator
Specification ,
SAG 100% RF Generator
11 .
11. RF Generator
Fig. 11 Voltage sag protection scope of RF Generator
26
4
.
,
.
RF Generator
.
.
.
.
27
1. M. H. J. Bollen, Understanding Power Quality Problems: Voltage
Sags and Interruptions, Piscataway, NJ, 2000, IEEE Power
Engineering Series.
2. Jovica V. Milanovic, C. P. Gupta., "Probabilistic Assessment of
Financial Losses due to Interruptions and Voltage Sags-Part I: The
Methodology," IEEE Trans. Power Delivery, vol. 21, no. 2, pp.918-
924, Apr. 2006.
3. Jovica V. Milanovic, C. P. Gupta., "Probabilistic Assessment of
Financial Losses due to Interruptions and Voltage Sags-Part II :
Practical Implementation," IEEE Trans. Power Delivery, vol. 21, no.
2, pp.925-932, Apr. 2006.
4. Zhang, L., Bollen, Math H. J., "Characteristic of Voltage Dips(Sags)
in Power Systems," IEEE Trans. Power Delivery,vol.15, pp.827-832,
Apr. 2000
5. Arrillaga, J., Watson, N. R., Chen, S. "Power System Quality
Assessment", New York: John Wiley & Sons, pp. 1-32. 2000.
6. R. C. Dugan, M. F. McGranaghan, S. Santoso, and H. W. Beaty,
Electrical Power Systems Quality. New York : McGraw-Hill, 2002
28
7. IEEE std 1159, "IEEE `Recommended Practice for Monitering
Electric Power Quility ", 1995
8. IEEE std 1250, "IEEE Guide for Service to Equipment Sensitive to
Momentary Voltage Disturbance", 1995
9. J. Lamoree, D. Muller, Paul Vinett, W. Jones, M/ Samotyj, Voltage
Sag Analysis Case Studies, IEEE Trans. On Industrial Applications,
Vol. 30, No. 4, pp. 1083-1088, 1994
10. G. Yalcinkayam H.J, etc. Characterization of Voltage Sags in
Industrial Distribution Systems, IEEE Trans. on Industrial
Applications, Vol. 34, No. 4, pp. 682-688, 1998
11. , , p14~18, 2000
12. , , ,
, 43 p27~42, 2000
13. , , , ,
43 p43~58, 2000
14. , , , ,
, p760~763, 2004
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