View
221
Download
3
Category
Preview:
Citation preview
GSM TELEPHONE
SGH-C230
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting
Samsung Electronics Co.,Ltd. MAY. 2005Printed in Korea.
Code No.: GH68-07224A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.Any unauthorized use of Manual can be punished under applicableInternational and/or domestic law.
ⓒ
SAMSUNG Proprietary-Contents may change without notice
1. Specification
1-1
This Document can not be used without Samsung's authorization
EGSM 900Phase 2
DCS 1800Phase 1
PCS 1900Phase 1
Freq. Band[MHz]Upl ink/Downlink
880~915925~960
1710~17851805~1880
1850~19101930~1960
ARFCN range 0~124 & 975~1023 512~885 512~810
Tx/Rx spac ing 45MHz 95MHz 80MHz
Mod. Bi t rate/Bi t Per iod
270.833kbps3.692us
270.833kbps3.692us
270.833kbps3.692us
Time SlotPer iod/Frame Period
576.9us4.615ms
576.9us4.615ms
576.9us4.615ms
Modula t ion 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensi t iv i ty -102dBm -100dBm -100dBm
TDMA Mux 8 8 8
Cel l Radius 35Km 2Km 2Km
Opera t ingTempera ture
-20°C ~ +50°C
1-1. GSM General Specification
SAMSUNG Proprietary-Contents may change without notice
Specification
1-2
This Document can not be used without Samsung's authorization
SAMSUNG Proprietary-Contents may change without notice
2. Circuit Description
2-1
This Document can not be used without Samsung's authorization
2-1. SGH-C230 RF Circuit Description
2-1-1. RX PART
— ASM(F100) → Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling.
— ASM Control Logic Truth Table
VC1 VC2 VC3
EGSM TX H L L
DCS/PCS TX L H L
PCS_RX L L H
— Saw FILTER
To convert Electromagnetic Field Wave to Acoustic Wave and then pass the specific frequency band.
- GSM FILTER (F102) → For filtering the frequency band between 925 and 960 MHz.
- DCS FILTER (F102) → For filtering the frequency band between 1805 and 1880 MHz
- PCS FILTER (F101) → For filtering the frequency band between 1930 and 1990 MHz.
— Crystal (U102)
To generate the 26MHz reference clock to drive the logic and RF.
After additional process, the reference clock applies to the U801 Rx IQ demodulator and Tx IQ modulator.
The oscillator for RX IQ demodulator and Tx modulator are controlled by serial data to select channel and use fast lock
mode for GPRS high class operation.
— Si4210 (U100)
The receive section integrates four differential-input low noise amplifiers LNAs supporting the GSM850, EGSM900,
DCS1800 and PCS1900 bands. The LNA inputs are matched to the 150 ohm balanced-output SAW filters through externa
LC matching network.
A quadrature Image-reject mixer downconverts the RF signal to a 200 KHz intermediate frequency(IF). The mixer output is
amplified with an analog programmable gain amplifier(PGA) that is controlled with the AGAIN. The quadrature IF ? ?
is digitized with high resolution analog-to-digital converts (ADC).
The ADC output is downconverted to baseband with a digital quadrature LO signal. Digital decimation and FIR filters
perform digital filtering and remove ADC quantization noise, blockers and reference interferers.
After filtering, the digital output is scaled with a digital PGA, which is controlled with the DGAIN. DACs drive a
differential I and Q analog signal onto the BIP, BIN, BQP and BQN pins to interface to standard analog-input baseband
ICs.
SAMSUNG Proprietary-Contents may change without notice
Circuit Description
2-2
This Document can not be used without Samsung's authorization
2-1-2. TX PART
Baseband IQ signal fed into offset PLL, this function is included inside of U801 chip. The transmit section of U801
consist of an I/Q baseband upconverter, an offset phase-locked loop (OPLL) and two 50 ohm output buffers that can drive
an external Power Amplifier(PA). Si4210 chip generates modulator signal which power level is about 1.5dBm and fed into
Power Amplifier(U900). The PA output power and power ramping are well controlled by Auto Power Control circuit.
We use offset PLL below.
Modulation Spectrum
200kHz offset30 kHz bandwidth
GSM -35dBc
DCS -35dBc
PCS -35dBc
400kHz offset30 kHz bandwidth
GSM -66dBc
DCS -65dBc
PCS -66dBc
600kHz ~ 1.8MHz offset30 kHz bandwidth
GSM -75dBc
DCS -68dBc
PCS -75dBc
2-2. Baseband Circuit description of SGH-C230
2-2-1. CSP2200B1
— Power Management
Seven low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable LDO provides support for 1.8V, 3.0V SIMs, while a self-
resetting, electronically fused switch supplies power to external accessories. Ancillary support functions, such as two LED
drivers and two call-alert drivers, aid in reducing both board area and system complexity. A four-wire serial interface
unit(SIU) provides access to control and configuration registers. This interface gives a microprocessor full control of the
CSP2200B1 and enables system designers to maximize both standby and talk times. Error reporting is provided via an
interrupt signal and status register. Supervisory functions. including a reset generator, an input voltage monitor, and a
thermal monitor, support reliable system design. These functions work together to ensure proper system behavior during
start-up or in the event of a fault condition(low microprocessor voltage, insufficient battery energy, or excessive die
temperature).
— Battery Charge Management
A battery charge management block, incorporating an internal PMOS switch, and an 8-bit ADC, provides fast, efficient
charging of single-cell Li-Ion battery. Used in conjunction with a current-limited voltage source, this block safely
conditions near-dead cells and provides the option of having fast-charge and top-off controlled internally or by the system's
microprocessor.
SAMSUNG Proprietary-Contents may change without notice
Circuit Description
2-3
This Document can not be used without Samsung's authorization
— Backlight LED Driver
The backlight LED driver is a low-side, programmable current source designed to control the brightness of the keyboard
illumination. LED1_DRV is controlled via LED1_[0:2] and can be programmed to sink from 15mA to 60mA in 7.5mA
steps. LED2_DRV is controlled via LED2_[0:2] and can be programmed to sink from 5mA to 40mA in 5mA steps.
Both LED drivers are capable of sinking their maximum output current at a worst-case maximum output voltage of 0.6V.
For efficient use, the LEDs is connected between the battery and the LED_DRV output.
— Vibrator Motor Driver
The vibrator motor driver is a independent voltage regulator to drive a small dc motor that silently alerts the user of an
incoming call. The driver is a 3.3V constant source while sinking up to 140mA and controlled by enable signal of main
chip. For efficient use and safety, the vibrator motor should be connected between the regulator output and the ground.
2-2-2 Connector
— JTAG Connector
Trident has two JTAG ports which are for ARM core and DSP core(DSP16000). So this system has two port connector
for these ports. Pins' initials for ARM core are 'CP_' and pins' initials for DSP core are 'DSP_'.
CP_TDI and DSP_TDI signal are used for input of data. CP_TDO and DSP_TDO signals are used for the output of the
data. CP_TCK and DSP_TCK signals are used for clock because JTAG communication is a synchronous. CP_TMS and
DSP_TMS signals are test mode signals. The difference between these is the RESET_INT signal which is for ARM core
RESET.
— Keypad connector
This is consisted of key interface pins in the trident, KEY_ROW[0~4] and KEY_COL[0~4]. These signals compose the
matrix. Result of matrix informs the key status to key interface in the trident. Some pins are connected to varistor for
ESD protection. And power on/off key is seperated from the matrix.
So power on/off signal is connected with CSP2200 to enable CSP2200.
Nine key LED use the +VBATT supply voltage. These are connected to BACKLIGHT signal in the CSP2200.
This signal enables LEDs with current control.
— EMI Filtering
This system uses the EMI Filter to reduce noise from LCD part. Some control signals are connected to LCD without EMI
filtering.
SAMSUNG Proprietary-Contents may change without notice
Circuit Description
2-4
This Document can not be used without Samsung's authorization
2-2-3. IF connetor
It is 24-pin connector, and separated into two parts. One is a power supply part for main system. And the other is
designed to use SDS, DEBUG, DLC-DETECT, JIG_ON, VEXT, VTEST, VF, and GND. They connected to power supply
IC, microprocessor and signal processor IC.
2-2-4. Audio
AOUTAP, AOUTAN from CSP2200 is connected to the speaker via analog switch. AOUTBP and AOUTBN are connected
to the ear-mic speaker via ear-jack. MICIN and MICOUT are connected to the main MIC. And AUXIN and AUXOUT
are connected to the Ear-mic.
YMU762MA3 is a LSI for portable telephone that is capable of playing high quality music by utilizing FM synthesizer
and ADPCM decorder that are included in this device.
As a synthesis, YMU762MA3 is equipped 16 voices with different tones. Since the device is capable of simultaneously
generating up to synchronous with the play of the FM synthesizer, various sampled voices can be used as sound effects.
Since the play data of YMU762MA3 are interpreted at anytime through FIFO, the length of the data(playing period) is not
limited, so the device can flexibly support application such as incoming call melody music distribution service. The
hardware sequencer built in this device allows playing of the complex music without giving excessive load to the CPU of
the portable telephones. Moreover, the registers of the FM synthesizer can be operated directly for real time sound
generation, allowing, for example, utilization of various sound effects when using the game software installed in the
portable telephone.
YMU762 includes a speaker amplifier with high ripple removal rate whose maximum output is 550mW (SPVDD=3.6V).
The device is also equipped with conventional function including a vibartor and a circuit for controlling LEDs synchornous
with music.
For the headphone, it is provided with a stereophonic output terminal.
For the purpose of enabling YMU762MA3 to demonstrate its full capabilities, Yamaha purpose to use "SMAF:Synthetic
music Mobile Application Format" as a data distribution format that is compatible with multimedia.
Since the SMAF takes a structure that sets importance on the synchronization between sound and images, various contents
can be written into it including incoming call melody with words that can be used for training karaoke, and commercial
channel that combines texts, images and sounds, and others. The hardware sequencer of YMU762MA3 directly interprets
and plays blocks relevant to synthesis (playing music and reproducing ADPCM with FM synthesizer) that are included in
data distributed in SMAF.
2-2-5. Memory
This system uses SHARP's memory, LRS18B0.
It is consisted of 256M bits flash memory and 64M bits SCRAM. It has 16 bit data line, D[0~15] which is connected to
trident, LCD or CSP2200. It has 23 bit address lines, A[1~23]. They are also connected. CP_CSROMEN signal, chip
select signal in the trident, enable flash memories. They use supply voltages, VCCD and VCC_1.8A.
SAMSUNG Proprietary-Contents may change without notice
Circuit Description
2-5
This Document can not be used without Samsung's authorization
During wrting process, CP_WEN is low and it enables writing process to flash memory and SCRAM. During reading
process, CP_OEN is low and it output information which is located at the address from the trident in the flash memory or
SCRAM to data lines. Each chip select signals in the trident select flash memory or SCRAM. Reading or writing
procedure is processed after CP_WEN or CP_OEN is enabled. Memories use FLASH_RESET, which is buffered signal of
RESET from CSP2200, for ESD protection. A[0] signal enables lower byte of SCRAM and UPPER_BYTE signal enables
higher byte of SCRAM.
2-2-6. Trident
Trident is consisted of ARM core and DSP core. It has 20K*16bits RAM 144K*16bits ROM in the DSP. It has
4K*32bits ROM and 2K*32bits RAM in the ARM core. DSP is consisted of timer, one bit input/output unit(BIO), JTAG,
EMI and HDS(Hardware Development System). ARM core is consisted of EMI, PIC(Programmable Interrupt Controller),
reset/power/clock unit, DMA controller, TIC(Test Interface Controller), peripheral bridge, PPI, SSI(Synchronous Serial
Interface), ACCs(Asynchronous communications controllers), timer, ADC, RTC(Real-Time Clock) and keyboard interface.
DSP_AB[0~8], address lines of DSP core and DSP_DB[0~15], data lines of DSP core are connected to CSP2200. A[0~20],
address lines of ARM core and D[0~15], data lines of ARM core are connected to memory, LCD and YMU762.
ICP(Interprocessor Communication Port) controls the communication between ARM core and DSP core.
CSROMEN, CSRAMEN and CS1N to CS4N in the ARM core are connected to each memory. WEN and OEN control the
process of memory. External IRQ(Interrupt ReQuest) signals from each units, such as, YMU, Ear-jack, Ear-mic and
CSP1093, need the compatible process.
Some PPI pins has many special functions. CP_KB[0~9] receive the status from key FPCB and are used for the
communications using data link cable(DEBUG_DTR/RTS/TXD/RXD/CTS/DSR).
And UP_CS/SCLK/SDI, control signals for CSP2200 are outputted through PPI pins. It has signal port for
charging(CHG_DET), SIM_RESET and FLIP_SNS with which we knows open.closed status of folder. It has JTAG control
pins(TDI/TDO/TCK) for ARM core and DSP core. It recieves 13MHz clock in CKI pin from external TCXO and receives
32.768KHz clock from X1RTC. ADC(Analog to Digital Convertor) part receives the status of temperature, battery type and
battery voltage. And control signals(DSP_INT, DSP_IO and DSP_RWN) for DSP core are used. It enables main LCD with
DSP IP pins.
2-2-7. CSP2200
CSP2200 is integrated the timing and control functions for GSM 2+ mobile application with the ADC and DAC functions,
and power management block. The CSP2200 interfaces to the trident, via a 16-bit parallel interface. It serves as the
interface that connects a DSP to the RF circuitry in a GSM 2+ mobile telephone. DSP can load 148 bits of burst data
into CSP2200’s internal register, and program CSP2200’s event timing and control register with the exact time to send the
burst. When the timing portion of the event timing and control register matches the internal quarter-bit counter and internal
frame counter, the 148 bits in the internal register are GMSK modulated according to GSM 2+ standards. The resulting
phase information is translated into I and Q differential output voltages that can be connected directly to an RF modulator
at the TXOP and TXON pins. The DSP is notified when the transmission is completed. For receiving baseband data, a
DSP can program CSP2200’s event timing and control register with the exact time to start receiving I and Q samples
through TXIP and TXIN pins.
SAMSUNG Proprietary-Contents may change without notice
Circuit Description
2-6
This Document can not be used without Samsung's authorization
When that time is reached, the control portion of the event timing and control register will start the baseband receive
section converting I and Q sample pairs. The samples are stored in a double-buffered register until the register contains 32
sample pairs. CSP2200 then notifies the DSP which has sample time to read the information out before the next 32
sample pairs are stored. The voice band ADC converter issues an interrupt to the DSP whenever it finishes converting a
16-bit PCM word. The DSP then reads the new input sample and simultaneously loads the voice band output DAC
converter with a new PCM output word. The voice band output can be connected directly to a speaker via AOUTAN and
AOUTAP pins and be connected to a Ear-mic speaker via AOUTBN and AOUTBP pins.
There are 7 LDOs which are power sources of microprocessor, LCD, etc. These 7 LDOs output are programmable.
SAMSUNG Proprietary-Contents may change without notice
3. Exploded View and Parts List
3-1
This Document can not be used without Samsung's authorization
QRF03
QVO01
QKP01
QSP01
QMO01
QFR01
QLC01
QMP01
QME01
QAN01
QRE01
QCR11
QBA01
QIF01
QMI01
QRF01
3-1. Exploded View
SAMSUNG Proprietary-Contents may change without notice
Exploded view and Part List
3-2
This Document can not be used without Samsung's authorization
Location NO. Description SEC CODE Remark
QFR01 MEC-FRONT CASE GH75-06758A
QVO01 MEC-SIDE KEY GH75-04859A
QKP01 MEC-KEYPAD GH75-06834B
QSP01 SPEAKER 3001-001760
QMO01 MOTOR DC GH31-00163A
QLC01 LCD-SGHC210 MAIN GH07-00701A
QMP01 MAIN PBA GH92-02137A
QME01 UNIT-METAL DOME GH59-02124A
QMI01 MICROPHONE-ASSY GH30-00187A
QAN01 ANTENNA GH42-00551A
QRF03 PMO-EAR COVER GH72-21155A
QRE01 MEC-REAR CASE GH75-06760A
QIF01 PMO-IF COVER GH72-21397A
QCR11 SCREW-MACHINE 6001-001654
QRF01 MPR-RF SHEET GH74-14935A
QBA01 BATTERY GH43-01803A
3-2. Parts List
SAMSUNG Proprietary-Contents may change without notice
Exploded view and Part List
3-3
This Document can not be used without Samsung's authorization
Description SEC CODE
BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-00634
ADAPTOR-TAD;TAD137USE,SGH-E800,AC/DC GH44-00770A
UNIT-EARPHONE;SGH-i270,EM-SS550E-ST, GH59-01543A
LABEL(P)-WATER SOAK;SCH-X110,NORGE,1 GH68-02026A
MANUAL-USE;SGH-C230,XSP,ENGLISH,SIPL GH68-06943A
LABEL(R)-MAIN(EU);SGH-C230,EU,POLYES GH68-07006A
BOX(P)-UINIT(SEA);SGH-C230,SC300+S12 GH69-02620A
CUSHION-CASE(1-2);SGH-C230,PULP,T0.8 GH69-02914A
MPR-ESD TAPE;SGH-C200,3M 851,7X5,-,- GH74-05583A
MPR-MAIN WINDOW BOHO VI;SGH-C207,STA GH74-09827A
MPR-MAIN WINDOW BOHO;SGH-C200,S.T 55 GH74-11299A
MPR-MAIN WINDOW BOHO;SGH-C200,ST 555 GH74-11636A
MPR-LDI SPONGE;SGH-C230,PSR PORON,31 GH74-15399A
SAMSUNG Proprietary-Contents may change without notice
Exploded view and Part List
3-4
This Document can not be used without Samsung's authorization
3-3. Test Jig (GH80-00865A)
3-3-1. RF Test Cable(GH39-00283A)
3-3-2. Test Cable(GH39-00127A)
3-3-3. Serial Cable
3-3-4. Power Supply Cable 3-3-5. DATA CABLE(GH39-00143B)
3-3-6. TA(GH44-00184A)
SAMSUNG Proprietary-Contents may change without notice
4. Electrical Parts List
4-1
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODEC103 C-CER,CHIP 2203-000438C104 C-CER,CHIP 2203-000438C105 C-CER,CHIP 2203-000995C108 C-CER,CHIP 2203-002668C109 C-TA,CHIP 2404-001397C110 C-CER,CHIP 2203-006090C111 C-CER,CHIP 2203-002668C112 C-CER,CHIP 2203-005050C113 C-CER,CHIP 2203-000530C114 C-CER,CHIP 2203-001432C115 C-CER,CHIP 2203-000438C116 C-CER,CHIP 2203-000995C117 C-CER,CHIP 2203-000254C120 C-CER,CHIP 2203-005482C121 C-CER,CHIP 2203-000854C122 C-CER,CHIP 2203-000278C123 C-CER,CHIP 2203-000233C124 C-CER,CHIP 2203-002677C125 C-CER,CHIP 2203-005450C126 C-CER,CHIP 2203-002677C127 C-CER,CHIP 2203-000278C128 C-CER,CHIP 2203-005234C129 C-CER,CHIP 2203-005234C130 C-CER,CHIP 2203-001017C131 C-CER,CHIP 2203-000696C132 C-CER,CHIP 2203-000696C133 C-CER,CHIP 2203-005482C134 C-CER,CHIP 2203-000386C135 C-CER,CHIP 2203-001412C136 C-CER,CHIP 2203-005482C137 C-CER,CHIP 2203-001072C200 C-CER,CHIP 2203-000254C201 C-CER,CHIP 2203-000254C202 C-CER,CHIP 2203-000254C203 C-CER,CHIP 2203-000254C204 C-CER,CHIP 2203-005496C205 C-CER,CHIP 2203-005061C206 C-CER,CHIP 2203-000679C207 C-CER,CHIP 2203-000254C208 C-CER,CHIP 2203-001405C209 C-CER,CHIP 2203-000254C210 C-CER,CHIP 2203-000254C211 C-CER,CHIP 2203-000254C212 C-CER,CHIP 2203-000254C213 C-CER,CHIP 2203-005496C214 C-CER,CHIP 2203-000254C216 C-CER,CHIP 2203-000330C217 C-CER,CHIP 2203-000330C218 C-CER,CHIP 2203-006438C300 C-CER,CHIP 2203-000254
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-2
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODEC301 C-CER,CHIP 2203-001072C302 C-CER,CHIP 2203-005482C303 C-CER,CHIP 2203-006093C304 C-CER,CHIP 2203-000812C305 C-CER,CHIP 2203-000812C306 C-CER,CHIP 2203-000812C307 C-CER,CHIP 2203-005061C308 C-CER,CHIP 2203-001598C309 C-CER,CHIP 2203-000233C310 C-TA,CHIP 2404-001240C311 C-CER,CHIP 2203-006053C312 C-CER,CHIP 2203-006053C313 C-CER,CHIP 2203-006053C314 C-CER,CHIP 2203-006053C315 C-CER,CHIP 2203-006053C316 C-CER,CHIP 2203-001598C317 C-CER,CHIP 2203-000254C318 C-CER,CHIP 2203-005061C322 C-CER,CHIP 2203-005065C324 C-TA,CHIP 2404-001268C325 C-CER,CHIP 2203-000233C326 C-TA,CHIP 2404-001268C327 C-CER,CHIP 2203-006257C401 C-CER,CHIP 2203-000812C402 C-CER,CHIP 2203-000812C403 C-CER,CHIP 2203-005496C404 C-CER,CHIP 2203-000995C405 C-CER,CHIP 2203-000628C406 C-CER,CHIP 2203-000425C407 C-CER,CHIP 2203-005496C409 C-CER,CHIP 2203-000812C410 C-TA,CHIP 2404-001305C411 C-CER,CHIP 2203-000233C412 C-CER,CHIP 2203-005496C414 C-CER,CHIP 2203-000995C415 C-CER,CHIP 2203-000278C416 C-CER,CHIP 2203-005496C418 C-CER,CHIP 2203-000254C419 C-CER,CHIP 2203-006137C420 C-CER,CHIP 2203-005061C421 C-TA,CHIP 2404-001380C422 C-TA,CHIP 2404-001380C501 C-CER,CHIP 2203-005480C502 C-CER,CHIP 2203-000254C503 C-CER,CHIP 2203-005480C504 C-CER,CHIP 2203-000995C505 C-CER,CHIP 2203-000679C506 C-CER,CHIP 2203-005480C507 C-CER,CHIP 2203-005065C508 C-CER,CHIP 2203-005061
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-3
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODEC509 C-TA,CHIP 2404-001105C511 C-CER,CHIP 2203-006093C514 C-CER,CHIP 2203-006257C515 C-CER,CHIP 2203-005480C517 C-TA,CHIP 2404-001240C519 C-CER,CHIP 2203-005496C520 C-CER,CHIP 2203-006257C521 C-CER,CHIP 2203-006090C522 C-CER,CHIP 2203-006257C523 C-CER,CHIP 2203-005496C527 C-CER,CHIP 2203-002687C531 C-TA,CHIP 2404-001268C532 C-CER,CHIP 2203-005061C534 C-CER,CHIP 2203-005496C538 C-CER,CHIP 2203-005061C539 C-CER,CHIP 2203-000585C542 C-CER,CHIP 2203-006208C543 C-CER,CHIP 2203-006190C544 C-CER,CHIP 2203-000438C545 C-CER,CHIP 2203-005061C546 C-CER,CHIP 2203-006562C548 C-CER,CHIP 2203-006257C549 C-TA,CHIP 2404-001088C550 C-CER,CHIP 2203-006348C551 C-CER,CHIP 2203-005482C552 C-CER,CHIP 2203-000233C600 C-CER,CHIP 2203-005061C601 C-CER,CHIP 2203-005061C602 C-CER,CHIP 2203-000233C603 C-CER,CHIP 2203-000254C700 C-CER,CHIP 2203-000438C701 C-CER,CHIP 2203-000233C703 C-CER,CHIP 2203-006348C704 C-CER,CHIP 2203-006562C705 C-TA,CHIP 2404-001268C706 C-CER,CHIP 2203-000854C710 C-NETWORK 2503-001053C711 C-NETWORK 2503-001041C712 C-NETWORK 2503-001041C713 C-NETWORK 2503-001053C714 C-NETWORK 2503-001053C715 C-NETWORK 2503-001053C716 C-NETWORK 2503-001053CN100 CONNECTOR-COAXIAL 3705-001347CN300 CONNECTOR-CARD EDGE 3709-001229CN400 JACK-EAR PHONE 3722-002356CN701 CONNECTOR-INTERFACE 3710-001611CN702 CONNECTOR-HEADER 3711-005558D500 DIODE-ARRAY 0407-001002F100 DUPLEXER-ASM 2911-000002
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-4
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODEF101 FILTER-SAW 2904-001480F102 FILTER-SAW 2904-001523L101 INDUCTOR-SMD 2703-002367L102 INDUCTOR-SMD 2703-002199L103 INDUCTOR-SMD 2703-002205L105 INDUCTOR-SMD 2703-002544L106 INDUCTOR-SMD 2703-002205L107 INDUCTOR-SMD 2703-002544L108 INDUCTOR-SMD 2703-002199L109 INDUCTOR-SMD 2703-002558L110 INDUCTOR-SMD 2703-002170L112 INDUCTOR-SMD 2703-002269L401 INDUCTOR-SMD 2703-002202L402 INDUCTOR-SMD 2703-002202L403 INDUCTOR-SMD 2703-001231L501 INDUCTOR-SMD 2703-001673L503 INDUCTOR-SMD 2703-002206L701 INDUCTOR-SMD 2703-002339L702 BEAD-SMD 3301-001659
LED601 LED 0601-002020LED602 LED 0601-002020LED603 LED 0601-002020LED604 LED 0601-002020LED605 LED 0601-002020LED606 LED 0601-002020LED607 LED 0601-002020LED608 LED 0601-002020LED609 LED 0601-002020LED610 LED 0601-002020OSC200 CRYSTAL-SMD 2801-003856PCB PCB-SGHC230PCB GH41-00865AQ300 TR-DIGITAL 0504-000168R100 R-CHIP 2007-000171R101 R-CHIP 2007-001313R102 R-CHIP 2007-001298R103 R-CHIP 2007-000171R104 R-CHIP 2007-002797R105 R-CHIP 2007-000148R106 R-CHIP 2007-001308R107 R-CHIP 2007-000171R200 R-CHIP 2007-000171R201 R-CHIP 2007-000157R202 R-CHIP 2007-000172R203 R-CHIP 2007-000157R204 R-CHIP 2007-000171R205 R-CHIP 2007-000171R206 R-CHIP 2007-007480R207 R-CHIP 2007-000157R208 R-CHIP 2007-007538R209 R-CHIP 2007-000171
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-5
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODER210 R-CHIP 2007-000171R211 R-CHIP 2007-007142R212 R-CHIP 2007-000140R213 R-CHIP 2007-000171R214 R-CHIP 2007-000171R215 R-CHIP 2007-007308R216 R-CHIP 2007-000162R217 R-CHIP 2007-007308R218 R-CHIP 2007-000171R219 R-CHIP 2007-000171R220 R-CHIP 2007-000171R221 R-CHIP 2007-000171R222 R-CHIP 2007-000171R223 R-CHIP 2007-000143R224 R-CHIP 2007-000143R225 R-CHIP 2007-000157R226 R-CHIP 2007-000157R300 R-CHIP 2007-000171R301 R-CHIP 2007-001319R302 R-CHIP 2007-000172R303 R-CHIP 2007-000171R304 R-CHIP 2007-000167R310 R-CHIP 2007-007142R311 R-CHIP 2007-008263R312 R-CHIP 2007-000157R400 R-CHIP 2007-007468R401 R-CHIP 2007-007142R402 R-CHIP 2007-000148R403 R-CHIP 2007-007142R404 R-CHIP 2007-007468R405 R-CHIP 2007-001320R406 R-CHIP 2007-000142R407 R-CHIP 2007-001317R408 R-CHIP 2007-000171R409 R-CHIP 2007-000171R410 R-CHIP 2007-001320R411 R-CHIP 2007-000142R412 R-CHIP 2007-007142R413 R-CHIP 2007-007134R414 R-CHIP 2007-007134R415 R-CHIP 2007-007142R416 R-CHIP 2007-007573R417 R-CHIP 2007-007480R418 R-CHIP 2007-001339R419 R-CHIP 2007-000162R420 R-CHIP 2007-000162R421 R-CHIP 2007-000173R422 R-CHIP 2007-000173R423 R-CHIP 2007-000171R424 R-CHIP 2007-000171
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-6
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODER425 R-CHIP 2007-001317R502 R-CHIP 2007-000171R503 R-CHIP 2007-003001R505 R-CHIP 2007-000171R506 R-CHIP 2007-000162R507 R-CHIP 2007-001291R508 R-CHIP 2007-000171R509 R-CHIP 2007-000162R514 R-CHIP 2007-000171R515 R-CHIP 2007-000146R518 R-CHIP 2007-001319R519 R-CHIP 2007-001325R526 R-CHIP 2007-001291R528 R-CHIP 2007-001291R529 R-CHIP 2007-000171R530 R-CHIP 2007-000171R531 R-CHIP 2007-000171R532 R-CHIP 2007-000171R533 R-CHIP 2007-000171R534 R-CHIP 2007-000171R535 R-CHIP 2007-000171R536 R-CHIP 2007-000171R538 R-CHIP 2007-000171R539 R-CHIP 2007-000775R540 R-CHIP 2007-001325R541 R-CHIP 2007-000171R542 R-CHIP 2007-000171R600 R-CHIP 2007-000174R601 R-CHIP 2007-000174R602 R-CHIP 2007-000174R603 R-CHIP 2007-000174R604 R-CHIP 2007-000174R605 R-CHIP 2007-000174R606 R-CHIP 2007-000174R607 R-CHIP 2007-000174R608 R-CHIP 2007-000174R609 R-CHIP 2007-000174R610 R-CHIP 2007-000172R611 R-CHIP 2007-000171R700 R-CHIP 2007-000171R701 R-CHIP 2007-000171R702 R-CHIP 2007-000171R703 R-CHIP 2007-000171R704 R-CHIP 2007-000140R705 R-CHIP 2007-003001R707 R-CHIP 2007-000566R708 R-CHIP 2007-000566R709 R-CHIP 2007-000566R710 R-CHIP 2007-000566R711 R-CHIP 2007-000566
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-7
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODER712 R-CHIP 2007-000140R713 R-CHIP 2007-000140R714 R-CHIP 2007-000140R715 R-CHIP 2007-000140R716 R-CHIP 2007-000140R717 R-CHIP 2007-000140R718 R-CHIP 2007-000140R719 R-CHIP 2007-000140R720 R-CHIP 2007-000140R721 R-CHIP 2007-000140R722 R-CHIP 2007-000153R723 R-CHIP 2007-000171R724 R-CHIP 2007-000140R725 R-CHIP 2007-000162R726 R-CHIP 2007-000140R727 R-CHIP 2007-000140TH200 THERMISTOR-NTC 1404-001221U100 IC-TRANSCEIVER 1205-002683U101 IC-POWER AMP 1201-002260U102 CRYSTAL-SMD 2801-004426U200 IC MICOM-SGHX480 GH09-00036AU201 IC MICOM-SGHV100 GH09-00022AU300 IC-POWER SUPERVISOR 1203-003304U301 IC-BATTERY 1203-003109U303 BATTERY-LI(2ND) 4302-001130U401 IC-VOLTAGE COMP. 1202-001068U402 IC-ANALOG SWITCH 1001-001261U500 IC-DEMODULATOR 1204-002398U501 IC-AUDIO AMP 1201-002238U504 PHOTO-IRDA 0604-001261U505 IC-POSI.FIXED REG. 1203-002782U506 IC-MELODY 1204-002161U507 IC-ANALOG MULTIPLEX 1001-001306U601 IC-MCP 1108-000010U701 IC-CMOS LOGIC 0801-000796U719 IC-DC/DC CONVERTER 1203-003674V401 VARISTOR 1405-001082V402 VARISTOR 1405-001082V403 VARISTOR 1405-001082V404 VARISTOR 1405-001082V405 VARISTOR 1405-001082V601 VARISTOR 1405-001082V602 VARISTOR 1405-001082V603 VARISTOR 1405-001082V604 VARISTOR 1405-001082V605 VARISTOR 1405-001082V606 VARISTOR 1405-001082V607 VARISTOR 1405-001082V608 VARISTOR 1405-001082V609 VARISTOR 1405-001082
SAMSUNG Proprietary-Contents may change without notice
Electrical Parts List
4-8
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODEV610 VARISTOR 1405-001082V611 VARISTOR 1405-001082V612 VARISTOR 1405-001082V701 VARISTOR 1405-001082V702 VARISTOR 1405-001082V703 VARISTOR 1405-001082V704 VARISTOR 1405-001082V705 VARISTOR 1405-001082V706 VARISTOR 1405-001093
VOL_DN SWITCH-TACT 3404-001152VOL_UP SWITCH-TACT 3404-001152ZD501 DIODE-TVS 0406-001201ZD502 DIODE-TVS 0406-001201ZD600 DIODE-TVS 0406-001194ZD601 VARISTOR 1405-001108ZD602 VARISTOR 1405-001108ZD603 VARISTOR 1405-001108ZD701 DIODE-TVS 0406-001083ZD702 DIODE-TVS 0406-001083ZD703 DIODE-ZENER 0403-001387ZD704 DIODE-ZENER 0403-001427
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
5. Block Diagrams
5-1
5-1. RF Solution Block Diagram
SAMSUNG Proprietary-Contents may change without notice
Block Diagrams
This Document can not be used without Samsung's authorization
5-2
5-2. Base Band Solution Block Diagram
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
6. PCB Diagrams
6-1
6-1. PCB Top Diagram
SAMSUNG Proprietary-Contents may change without notice
PCB Diagrams
This Document can not be used without Samsung's authorization
6-2
6-2. PCB Bottom Diagram
SAMSUNG Proprietary-Contents may change without notice
7. Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-1
7-1. Power On
Current consumption>=100mA
The set is not ' Power On '
Voltage >= 3.3V
Download again
Charge the Battery
pin#J12 of U300 >= 2.8VCheck U300 and C314
pin#A13 of U300 = 2.8V
Check U300 and C315
Check the clock signalat pin#3 of U102Freq = 26MHz ,Vrms ≥ 300mV
Check the clock generation circuit(related to U102)
END
No
Yes
Yes
Yes
Yes
Yes
No
No
No
No
pin#G11 = 1.8VNo
Yes
Check the +VBATT Voltage
Check the pin of U300
Check the initial operation
Check the current consumption
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-2
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-3
7-2. Initial
The pin#G11 of U300 = 1.8Vand
the pin#J12 of U300 ≒ 2.825V?
Initialization Failure
Check the U300(If it has some problem, adjust it.)
END
No
Yes
Is the pin#K9 of U300"Low -> High"?
Yes
Check the U20032.768kHz wave forms at
the C216 and C217
Check the LCD Part
Yes
No
Yes
Yes
The Voltage is "High" atthe C313
Check the Audio Part
No
Check the U300(If it has some problem, adjust it.)
Check the U300
LCD display is O.K
No
No
Yes
Yes
Sound is O.K
No
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-4
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-5
7-3. SIM Part
Are there any Signals atpin#N9, #R10, #P10 of U300?
"Insert SIM" is displayed on the LCD
Check the U200
Check the SIM Card
END
No
Yes
Yes
Yes
No
Check the U300Are there any Signals at
pin#K12, #K11, #K14, #J11 ofCN100?
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-6
7-4. Charging Part
The pin#17, #18 ofCN701 is TA_VEXT ≒
5V ?
Abnormal charging operation
Replace TA or Check CN701
No
END
Yes
The pin#8 of U301 is 3.2~4.2V ?Check the U301
No
Yes
No
Solder again or change R310
Yes
The ICHRG = 1.4V(during
charging) and ≒ 180mV(full
charging) ?
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-7
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-8
VC
CA
C303
C311
R14 VREGP M13
VR
TC H
11 V
SIM
K12
G5 VSS1
K4 VSS2 VSS3 R2 VSS4 P6
VXVCM R13
XOENAQ D1
VL5S
_A D
10 C
9 V
L5S_B
VLD
O_1 G
11 V
LDO
_2 J12 A
13 V
LDO
_3 V
LDO
_4 B12
VLD
O_5 B
10
VLD
O_6 A
14 V
LDO
_7 C12
VR
EF A
10
VREGN
VDDB A6
VDDD N11
VDDV L11
VDD_IO1 N5 J4 VDD_IO2
C4 VDD_OCTL
VE
XT E
14
VIB
_DR
V F
15
VIB_RNG_EN L9
VL4S
_A A
12 V
L4S_B
B11
P10
UP
_RS
T R10
VA
CC
F14
VB
AT E
13
VDD1 J3
VD
D12 J13
VDD2 M3 VDD3 N6
VD
D34 C
11
VDD5 C10 VDD67 B13
SD
O_P
SC
N7
SE
RC
K
C2
SE
RD
A
C1
B1
SE
RLE
1 S
ER
LE2
A2
SIM
_CLK
K14
SIM
_IO J11
SIM
_RS
T K11
TXP E7
UP
_CLK
N9
UP
_IO
RESET_O K9
RIN
G_D
RV
F13
RTC
_ALM
N H
10
RTC_CLK N4
RW
N
L2
RXTXIN D6 RXTXIP D7
RXTXQN C6 RXTXQP C7
SC
LK_P
SC
L8
M7
SD
I_PS
C
A4
G6
OC
TL5 O
CTL6
B3
A3
OC
TL7
PSW1_BUF L7
PWR_KEEP M9
PWR_SW1N C15 PWR_SW2 C14
RAREF1 B6 RAREF2 B5
R3
RE
SE
TN_C
SP
N14
MICOUTN P15 MICOUTP N15
MODE N10
1 NC5 NC6 2
NC7 P5
OC
TL0 E
6 C
5 O
CTL1
OC
TL2 F5 E
5 O
CTL3
OC
TL4
GND_HCUR F11
GND_OCTL B4
GND_PSC1 B15 GND_PSC2 K15
INTRQ L10
L3 I|O
LE
D1_D
RV
G13
LE
D2_D
RV
G12
R6 MC
MICINN M14 MICINP
J10 GNDS17 K10
GNDS2 F8 GNDS3 F9 GNDS4 F10 GNDS5 G7 GNDS6 G8 GNDS7 G9
G10 GNDS8 GNDS9 H6
GNDV P13
P3
F6 GNDB
GNDD M10
GNDQ E8
F7 GNDS1
GNDS10 H7 GNDS11 H8
H9 GNDS12
J7 GNDS13 GNDS14 J8 GNDS15 J9 GNDS16
DB
14 D
3 D
B15
D2
DB
2 K
3 J5
DB
3 D
B4
J6 D
B5
H5
G3
DB
6 D
B7
G4
DB
8 F4
DB
9 F1
DINTR
K8
DAICK R4
L6 DAIDI DAIDO M6
DAIRN P4
DB
0 K
1 D
B1
K2
DB
10 F2
DB
11 F3
DB
12 E
2 D
B13
E3
AOUTBN
R12 AOUTBP
L14 AUXINN AUXINP M15
L13 AUXOUTN AUXOUTP K13
D13 AUX_ADC3
CH
_BD
RV
E11
CH
_ISE
N F
12
CH
_RE
S D
14
E9
CR
EF
CS
N_P
SC
AB
4 N
2 A
B5
M2
M1
AB
6 A
B7
K7
AB
8 K
5
AD
C_A
UX
1 E10
AD
C_A
UX
2 D15
AFC D9
AOUTAN N12 AOUTAP P11
P12
U300
AB
0 K
6 P
1 A
B1
AB
2 L5 N
1 A
B3
VR
TC
TP305
TP310
VC
C_1.8A
C316
C313
1uF C
310
10V
VC
CD
C307
R300
TP307
C317
VR
F
9 G
G
10
11 2
2 33 4
4
5 5
6 6 7 G
G
8
CN
300
R302
C308
C304
U303
NE
G
PO
S
C327
VC
CB
C305
VR
TC
VR
F
C314
Q300
1 3 2
VC
CD
C315
C312
R303 R
304
TP306
VC
CD
V
CC
A
R309
R312
R310
C324
C325
C326
C301
R311
TP308
TP301
C309
VB
AT
C300
VB
AT
R308
6 _A
CO
K 8
_CH
G 5
_EN
R301
9
GG
10 11
GG
12
GN
D
3 2 IN
4 ISE
T
VL
1
U301 B
ATT 7
C318
C306
VC
CD
C302
C322
TP309
AUXOUTP AUXINN
AUXOUTN
EA
R_A
DC
V
BA
T
AOUTBP
TA_V
EX
T
ICH
RG
C
HG
_ON
CH
G_D
ET
INTR
Q
KE
Y_C
OL(2)
KE
Y_R
OW
(0)
PW
R_K
EE
P
XO
EN
A
PC
S_R
X_E
N
FLAS
H_R
ES
ET
DS
P_IO
D
SP
_RW
N
AUXINP
AOUTAN
AOUTBN
AOUTAP
RF_E
N
MICINN
MICOUTN
RT
CA
LA
RM
RTX
_IP
RTX
_QN
R
TX_Q
P
RTX
_IN
RST
KE
Y_B
L1
SIM
RS
T S
IMD
ATA
SIM
CLK
UP
_SD
O
VR
EF
DS
P_A
B(0)
UP
_SD
I
UP
_SC
LK
MICOUTP
MICINP
UP
_CS
AFC
TX
PO
WE
R
CLK13M_MC
CLK32K
DSP_INT
PWR_ON JIG_ON
DS
P_D
B(15)
DS
P_D
B(14)
DS
P_D
B(13)
DS
P_D
B(12)
DS
P_D
B(11)
DS
P_D
B(10)
DS
P_D
B(1)
DS
P_D
B(0)
DS
P_A
B(8)
DS
P_A
B(7)
DS
P_A
B(6)
DS
P_A
B(5)
DS
P_A
B(4)
DS
P_A
B(3)
DS
P_A
B(2)
DS
P_A
B(1)
DS
P_D
B(0:15)
DS
P_A
B(0:8)
DC
S_TX
_EN
G
SM
_TX_E
N
SE
RLE
S
ER
DA
T S
ER
CLK
TX_E
N
TX_B
AN
D_S
EL
DS
P_D
B(9)
DS
P_D
B(8)
DS
P_D
B(7)
DS
P_D
B(6)
DS
P_D
B(5)
DS
P_D
B(4)
DS
P_D
B(3)
DS
P_D
B(2)
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-9
7-5. Microphone Part
Is the assembled status ofmicrophone O.K?
Microphone does not work
C410 > 2.5V
Reassemble the microphone
Solder the microphone again or
Replace around Mic Circuit
(C403, C407, R407, R410.....)
END
No
Yes
Yes
Yes
Yes
No
Is microphone ok ?
No
Check U300
Check the reference voltage on Mic path
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-10
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-11
7-6. Speaker Part
Is the terminal of SpeakerO.K.?
There is no sound from Speaker
No
Replace the Speaker
The pin#4of U402 is
Check U402
The pin#4of U402 isCheck U402
Are there anysignals
at the pin#5 and
END
Yes
YesNo
The type of soundfrom the Speaker is
Melody
YesNo No
No
Yes
YesYes
Are there anysignals
at the pin#2 and
No
Check U300
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-12
EA
RP
IEC
E
R41
0
C42
0
VC
CD
R41
4
R40
8 0
L402
R41
3
R40
7
C40
6
V40
5
R42
3
V40
4
R41
6
V40
3
R42
0
VC
CD
C40
9
R42
2
R41
1 2.
7K
C41
3
L401
C41
5
C40
0
R41
8
C41
8
R42
1
VC
CD
C40
4 C
403
R40
2
R41
9
1 V
+
R40
6
G 14
GN
D
6
4 IN
1
8 IN
2
NC
1 5
NC
2 7
2 N
O1
10 N
O2
U40
2
CO
M1
3
CO
M2
9
11
G
G 12
13
G
C41
1
2
1 3
5
4
VC
CD
U40
1
R40
5
C40
7
C42
1
R40
0
R41
5
C42
2
C41
0
C40
8
8 8 99
11
GG
12 1
3 GG
14
11 10
10
2 2 33
4 4 55
6 6 77
CN
400
C41
4
R42
5
VB
AT
R40
4
MIC
1
C40
1
V40
1
V40
2
C40
5
C41
9
R42
4
R40
3 V
CC
A R40
9
C41
2
R40
1
R41
2
C41
6
R41
7
L403
C40
2
C41
7
AO
UTB
P
RA
DIO
_SH
UTD
OW
N
SP
K_T
N
SP
K_T
P
EA
RS
PK
_R
EA
RS
PK
_L
SP
K_T
N
EA
R_S
WIT
CH
JAC
K_I
N
EA
R_A
DC
AO
UTB
N
AU
XO
UTP
AU
XIN
P
AU
XO
UTN
AU
XIN
N
R_A
NT
SP
K_T
P
MIC
OU
TN
MIC
INN
MIC
MIC
OU
TP
MIC
INP
MIC
+
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-13
7-8. EGSM Reciever
F100 CHECKpin#9 ≥ -65dBm ?
CONTINUOUS RX ONRF INPUT : 62CHAMP : -50dBm
NORMAL CONDITIONcatch the channel?
U100 CHECKpin#31 : 26MHz ?Vp-p : 860mV?
F100 CHECKpin#11 ≥ -65dBm ?
U100 CHECKpin#21,22 ≥ -65dBm ?
Check soldered status ofC108, L111, L102
CN100resolder or change
F100, C127, L108resolder or change
C131,C132,L109resolder or change
U102 CHECKclean 3V?
CHECKU300
YES
NO
NO
NO
NO
NO NO
YES
YES
YES
YES
U102 CHECK26MHz ?
Vp-p : 950mV?
U102Resolder or
Change?
YES
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-14
7-9. EGSM transmitter
CONTINUS TX ON CONDITIONTX POWER DAC:500 CODE APPLIED
CH:62RBW : 100KHzVBW : 100KHzSPAN : 10MHz
REF LEV. : 10dBmATT. : 20dB
F100 pin#7 :about 2~3
dBm?
CN100, C105check&change
F100pin#4 : 3 V?
U300check & change
C106≒ 4~5dBm?
U101check & change
C109 : 3.7 V?
NO NO
YES
YES
YES
NO
NO
BATTERY, U100check & change
BetweenR101 &
U101 : 1.2V?
YES
NO
R101check &change
R102 :≒ -5dBm ?
YES
YES
U101change
U300check &
YES
NO
U100change orresolder
NO
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-15
7-10. DCS Receiver
CONTINUOUS RX ONRF INPUT : 698CH
AMP : -50dBm
F100 CHECKpin#9 ≥ -65dBm ?
NORMAL CONDITIONcatch the channel?
U100 CHECKpin#31 : 26MHz ?Vp-p : 860mV?
F100 CHECKpin#1 ≥ -65dBm ?
U100 CHECKpin#19,20 ≥ -65dBm ?
Check soldered status ofC108, L111, L102
CN100resolder or change
F100, C130, L110resolder or change
C129, C128, L107resolder or change
U102 CHECKclean 3V?
CHECKU300
YES
NO
NO
NO
NO
NO NO
YES
YES
YES
YES
YES
U102 CHECK26MHz ?
Vp-p : 950mV?
U102Resolder or
Change?
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-16
7-11. DCS transmitter
CONTINUOUS TX ON CONDITIONCH : 698CH(DCS),660CH(PCS)
TX POWER CODE: 350 CODE APPLIED
RBW : 100KHz
VBW : 100KHz
SPAN : 10MHz
REF LEV. : 10dBm
ATT. : 20dB
U101change orresolder
F100 pin#5 :about 2~3
dBm?
CN100, C105check&change
F100pin#10 : 3 V?
U300check & change
L101:≒ 4~5dBm?
U101check & change
C109 : 3.7 V?
NO NO
YES
YES
YES
NO
NO
BATTERY, U100check & change
BetweenR101 & U101
: 1.2V?
YES
NOR101
check &change
NO
R100:≒ -5dBm ?
YES
YES
YES
U300check
NO
U100change orresolder
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-17
7-12. PCS Receiver
CONTINUOUS RX ONRF INPUT : 698CH
AMP : -50dBm
F100 CHECKpin#9 ≥ -65dBm ?
NORMAL CONDITIONcatch the channel?
U100 CHECKpin#31 : 26MHz ?Vp-p : 860mV?
F100 CHECKpin#3 ≥ -65dBm ?
U100 CHECKpin#17,18 ≥ -65dBm ?
Check soldered status ofC108, L111, L102
CN100resolder or change
F100, C125, L106resolder or change
C126, C124, L105resolder or change
U102 CHECKclean 3V?
CHECKU300
YES
NO
NO
NO
NO
NO NO
YES
YES
YES
YES
YES
U102 CHECK26MHz ?
Vp-p : 950mV?
U102Resolder or
Change?
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-18
7-13. PCS transmitter
CONTINUOUS TX ON CONDITIONCH : 698CH(DCS),660CH(PCS)
TX POWER CODE: 350 CODE APPLIED
RBW : 100KHz
VBW : 100KHz
SPAN : 10MHz
REF LEV. : 10dBm
ATT. : 20dB
U101change orresolder
F100 pin#5 :about 2~3
dBm?
CN100, C105check&change
F100pin#10 : 3 V?
U300check & change
L101:≒ 4~5dBm?
U101check & change
C109 : 3.7 V?
NO NO
YES
YES
YES
NO
NO
BATTERY, U100check & change
BetweenR101 & U101
: 1.2V?
YES
NOR101
check &change
NO
R100:≒ -5dBm ?
YES
YES
YES
U300check
NO
U100change orresolder
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-19
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-20
C106
C108
R102
C105
C137
C103
AN
T101 A
NT100
L101
R101
C117
TP103
C110
13
G
G 14
PC
S_R
X
3 10
VC
1
VC
2 4 2
VC
3
9
1 D
CS
_RX
DC
S|P
CS
TX
5
11 E
GS
M_R
X
EG
SM
_TX
7
G 86 G
12
G
F100
AN
T
L112
8 V
CC
2
VC
C2
18
VC
C_O
UT 13
VR
AM
P
6
12
11 G
G
9
G
19
G
17
7 GS
M_IN
G
SM
_OU
T 10
3 TX_E
N
VB
ATT
4 U101
2 BS
5 CE
XT
DC
S/P
CS
_IN
1 D
CS
/PC
S_O
UT
16
G 15
G 14
G
C109
C113
C111
C116
C104
C114
C107
C115
5 G
G
6
CN
100
2 A
C
3 G
1 G
4
VB
AT
R100
0
L102
L103
3.9nH
C112
EG
SM
RX
PC
S_R
X_E
N
DC
S_TX
_EN
GS
M_TX
_EN
P
CS
RX
DC
SR
X
TXP
OW
ER
GS
M_P
AM
_IN
DC
S_P
AM
_IN
TX_E
N
TX_B
AN
D_S
EL
SAMSUNG Proprietary-Contents may change without notice
Flow Chart of Troubleshooting
This Document can not be used without Samsung's authorization
7-21
(MU
RA
TA
)
(MU
RA
TA
)
GS
M
(MU
RA
TA
)
DC
S
C126
2
G
G
5
IN
1 3
OU
T
OU
T
4
R103
F101
C124
R105
C122
IN
6 O
UT
O
UT
7
OU
T
8 O
UT
9
0 R
107
F102
2
G
G 3
5
G
G 10
IN 1 4
C121
C129
VR
F
C135
U102
2
4 3
1
R106
C127
L108
L110
C128
L107
L109
C120
R104
C131
C125
C130
C133
L105
L106
VC
CD
C136
C134
VR
F
C123
9 _PDN
10
_RESET
_SE
N
2
VDD 29
11
VIO
XDIV 26 32
XEN
XMODE 25
8 X
OU
T
31
XTAL1
30
XTAL2
RF
IPP
17
16
RFOH
RFOL
15
SC
LK
1
SD
IO
3
VDD 12
VDD 13
28
VDD
35
NC
RF
IAN
24
RF
IAP
23
20 R
FID
N
RF
IDP
19
RF
IEN
22
RF
IEP
21
18 R
FIP
N
27
AFC
BIN
6 7
BIP
4 B
QN
5 B
QP
14
GND
GND 33 34
NC
U100
C132
13MH
Z_B
B
CL
K13M
_YM
U
XO
EN
A
DC
S_P
AM
_IN
GS
M_P
AM
_IN
SE
RD
AT
PC
SR
X
AF
C
RF
_EN
13MH
Z_B
B
RT
X_Q
P
RT
X_Q
N
RT
X_IP
RT
X_IN
DC
SR
X
EG
SM
RX
SE
RL
E
SE
RC
LK
CL
K13M
_TR
CL
K13M
_MC
SAMSUNG Proprietary-Contents may change without noticeThis Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
7-22
Recommended