* Standardacriche.com/_upload/Goods_Spec/SWAA0B.pdf · 2013-03-13 · 1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 2

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001

Z-Power LED X10490Z-Power LED X10490

Technical Data Sheet

Rev. 00 Rev. 00

October, 2012October, 2012

www.acrich.comwww.acrich.com

Document No. : QP-7-07-18 (Rev.00) 공통_을

SPECIFICATION[SWAA0B]

SSC CustomerDrawn by Checked by Approved by Approved by

Semi Park S.R. Ryu H.J.HONG

10/16 10/16 10/22

* Standard

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00



Document No. : QP-7-07-18 (Rev.00) 공통_을[[22 /17]/17]

Contents

1. Description -------------------- 4

2. Absolute Maximum Ratings -------------------- 5

3. Electro-Optical Characteristics -------------------- 5

4. Characteristic Diagram -------------------- 6

5. Reliability Test -------------------- 9

6. Color & Binning -------------------- 10

7. Outline Dimension -------------------- 12

8. Material List -------------------- 13

9. Packing -------------------- 14

10. Soldering -------------------- 16

11. Precaution for use -------------------- 17

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




Revision HistoryRevision History

Revision No.

Date Page Summary

00 October. 162012 The institution of New Spec

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001

Z-Power LED X10490Technical Data Sheet

Rev. 00 Rev. 00

September, 2012September, 2012



SWAA0B

1.Description

• 1-chip in one package

• SMT solderability

• Own patent reserved

• RoHS Compliant

• Low Thermal Resistance

• Pb-free Reflow Soldering application

• SWAA0B is very useful side view LED in back light unit

application • Flat Backlighting (LCD, Display)

• Mobile Phone, Camera, PDA,

Notebook

• Coupling into Light Guide Panel

• AV systems

Features

Applications

SWAA0B

• 3.7 (W) X 0.9 (D) X 0.4 (T) mm

• Side View LED of Reflector type

Photo

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




2. Absolute maximum ratings

Parameter Symbol Value Unit

Power Dissipation Pd*1 102 mW

DC Forward Current IF 30 mA

Peak Forward Current IFM *2 100 mA

Reverse Voltage VR 5 V

Operating Temperature Topr -30 ~ +85 ºC

Storage Temperature Tstg -40 ~ +100 ºC

Junction Temperature Tj max 100 ºC

*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.*2 IFM was measured at TW ≤ 0.1msec of pulse width and D ≤ 1/10 of duty ratio.

3. Electro-Optical characteristics

Parameter Symbol Condition Min Typ Max Unit

Forward Voltage

Rank Z28

VF IF =20mA

2.8 - 3.0

VRank Z30 3.0 - 3.2

Rank Z32 3.2 - 3.4

Rank z30 3.0 - 3.4

Reverse Current IR VR=5V - - 50 A

Luminous Intensity*1

Rank S15H

IV IF =20mA

1500 - 1600

mcd

Rank S16H 1600 - 1700

Rank S17H 1700 - 1800

Rank S18H 1800 - 1900

Rank S19H 1900 - 2000

Rank S20H 2000 - 2100

Rank S21H 2100 - 2200

Viewing Angle *2 2 ½ IF =20mA 120 deg.

(Ta = 25℃)

(Ta = 25℃)

* 1 Luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. * 2 1/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. * Tolerance of measurements of the Color Coordinates is ±0.007* Tolerance of measurements of the Forward Voltage is ±0.1V* The preliminary color coordinate can be changed without notice* Note : All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of Seoul Semiconductor.

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




Forward Current vs. Forward Voltage Intensity vs. Forward Current

Color Coordinate vs. Forward Current Radiation Diagram

4. Characteristic Diagram

0.275 0.280 0.285 0.290 0.295 0.300

0.268

0.272

0.276

0.280

0.284

0.288

0.292

100 mA

80 mA 30 mA

5 mA

10 mA

20 mA

Ta = 25OC

1 mA

y C

oord

.

x Coord.

-90o

-60o

-30o0o

30o

60o

90o

X-axis Y-axis

Relative illuminance (a.u.)

Rad

iati

on A

ngl

e

yx

2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6-10

0

10

20

30

40

50

60

70

80

90

100 Ta = 25OC

Forw

ard

Cur

rent

[m

A]

Forward Voltage [V]

-10 0 10 20 30 40 50 60 70 80 90 100

0

50

100

150

200

250

300

350

Ta = 25OC

Rel

ativ

e Lu

min

ous

Inte

nsi

ty[%

]

Forward Current [mA]

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




Forward Voltage vs. Ambient Temperature Relative Luminosity vs. Ambient Temperature

Color Coordinate vs. Ambient Temperature Spectrum

-45 -30 -15 0 15 30 45 60 75 90

0.96

0.98

1.00

1.02

1.04

1.06 IF = 20 mA

V F

/ V F

[

25OC

]

Ambient Temperature [oC]

0.26 0.28 0.30 0.320.25

0.26

0.27

0.28

0.29

100oC

50oC

25oC

0oC

-30oC

IF = 20 mA

y C

oord

.

x Coord.

85oC

400 500 600 700 8000.0

0.2

0.4

0.6

0.8

1.0 Ta = 25OC

Inte

nsity

[%]

Wavelength[nm]

IF = 20 mA

-45 -30 -15 0 15 30 45 60 75 900.7

0.8

0.9

1.0

1.1

1.2 IF = 20 mA

I v /

I v

[25o C

]

Ambient Temperature [oC]

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




Allowable Forward Current vs. Ambient Temperature Allowable Forward Current vs. Duty Ratio

-30 -15 0 15 30 45 60 75 900

5

10

15

20

25

30

Forw

ard

curr

ent

[mA

]

Ambient temperature [oC]1 10 100

20

40

60

80

100

120

Ta = 25OC

Allo

wab

le F

orw

ard

Cu

rren

t [

mA

]

Duty Ratio [%]

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




Item Symbol ConditionCriteria for Judgement

MIN MAX

Forward Voltage VF IF =20mA - I.V. *1 × 1.2

Reverse Current IR VR=5V - U.S.L.*2 × 2.0

Luminous Intensity IV IF =20mA I.V. × 0.7 -

Note : *1 I.V. : Initial Value *2 U.S.L. : Upper Standard Level

* Criteria for Judging the Damage

5. Reliability Test

* TEST ITEMS AND RESULTS

Item Reference Test ConditionDuration/ Cycle

Number of Damage

Life Test - Ta = 25℃, IF = 20mA 1,000 Hours 0/20

High Temperature Life Test - Ta = 85℃, IF = 5mA

1,000 Hours 0/20

Low Temperature Life Test - Ta = -30℃, IF = 20mA

1,000 Hours 0/20

High Humidity Heat Life Test

JEITA ED-4701100 102 Ta = 60℃, RH = 90%, IF = 20mA 500

Hours 0/20

High Temperature Storage

JEITA ED-4701200 201

Ta = 100℃ 1,000 Hours

0/20

Low Temperature Storage

JEITA ED-4701200 202

Ta = -40℃ 1,000 Hours

0/20

Temperature CycleJEITA ED-4701

100 105-40℃ ~ 25℃ ~ 100℃ ~ 25℃

(30min) (5min) (30min) (5min) 100 cycle 0/50

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




* CIE Chromaticity Diagram

6. Color & Binning

* Measurement Uncertainty of the Color Coordinates is ±0.007

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.80.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

460470

475480

485

490

495

500

505

510

515520525530

535540

545550

555560

565570

575580

585590

595600

610620630

830

Col

or c

oord

inat

e y

Color coordinate x

* Color Rank

A2S C2S E2S

x y x y x y

0.2640 0.2420 0.2730 0.2570 0.2820 0.2720

0.2720 0.2340 0.2800 0.2480 0.2880 0.2620

0.2800 0.2480 0.2880 0.2620 0.2960 0.2760

0.2730 0.2570 0.2820 0.2720 0.2910 0.2870

A1

K5

K4

K2

K1J4

J5

J2I5

I4I3

I2 J3

H5

H4

H3

H2G5

G2

G4F5

G3F4

F1F2

E5

E4

E3

E2

D5D4D3D2

C5C4

C2

B5B4B3

C3

K3J1

I1

H1

G1F3

B2

E1

C1

D1

B1A3

A4A5

A2

L1L2

L3L4

L5

M1M2

M3M4

M5

0.25 0.26 0.27 0.28 0.29 0.30 0.31 0.32 0.33

0.22

0.24

0.26

0.28

0.30

0.32

0.34

0.36

K2S

I2S

G2S

E2S

C2S

CIE

y

CIE x

A2S

G2S I2S K2S

x y x y x y

0.2910 0.2870 0.2990 0.3010 0.3070 0.3150

0.2960 0.2760 0.3040 0.2900 0.3120 0.3040

0.3040 0.2900 0.3120 0.3040 0.3200 0.3180

0.2990 0.3010 0.3070 0.3150 0.3150 0.3290

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




* Bin Code description

Bin Code

LuminousIntensity CIE Forward

Voltage

S18H E2S z30

▷ Part Number : SWAA0B

Color Rank @ IF = 20mA

A2S

C2S

E2S

G2S

I2S

K2S

Forward Voltage (V) @ IF = 20mA

Bin Code Min. Max.

Z28 2.8 3.0

Z30 3.0 3.2

Z32 3.2 3.4

z30 3.0 3.4

Luminous Intensity(mcd)

@ IF = 20mABin

CodeMin. Max.

S15H 1500 1600

S16H 1600 1700

S17H 1700 1800

S18H 1800 1900

S19H 1900 2000

S20H 2000 2100

S21H 2100 2200

Available ranks

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




( Tolerance: ±0.1, Unit: mm )7. Outline Dimension

<Recommended solder Pattern>

[Bottom View]

Cathode Anode

Cathode Mark

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




8. Material

①

②③④⑤

⑥

No. LIST MATERIAL

① FRAME COPPER FRAME (SILVER PLATED)

② LED CHIP GaN ON SAPPHIRE

③ WIRE GOLD WIRE

④ ENCAPSULATION SILICONE

⑤ PHOSPHOR SILICATE

⑥ PACKAGE HEAT-RESISTANT POLYMER

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




9. Packing

1) Reel & Carrier

(1) Quantity : 3500pcs/Reel(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned

off from the carrier tape at the angle of 10º to the carrier tape(4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package

( Tolerance: ±0.2, Unit: mm )

4.0±0.1

2.0±0.05

4.0±0.1

Label

180

13 ±0.3

60

22

2 ±0.2

+1

-0

15.4

13+0-3

-0+0.2

±1.0

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




2) Reel Packing Structure

Semiconductor EcoLight

245 (mm)

AcricheRoHS

TUV

220 (mm)

MADE IN KOREA

TYPE

7inch

142 (mm)

SIZE (mm)

245 220245 220

a b14280

c

Outer Box Structure

Reel

Humidity indicator

Desiccant

Aluminum Vinyl Bag

Symbol Meaning Exampleaaaaa THE DATE 09A23 (Year : 09, A : Month, 23 : day)

bbbbb SSC’s NumberEx) S0017 0001~9999 allowance

ccc-ccc Order of Taping 014-001ddddddd SSC’s Number 7300024(Automatic)

3) Lot Number

The lot number is composed of the following charactersaaaaabbbbb-ccc-ccc-ddddddd

LOT NUMBER : aaaaabbbbb-ccc-ccc-ddddddd

SSC PART NUMBER : SWAA0B

Material : Paper(SW3B(B))

QUANTITY : 3500

Reel & Bag LabelRANK :

SWAA0B

XXXXXXXXXX

Material : Paper(SW3B(B))

Box Label

LOT NUMBER : aaaaabbbbb-ddddddd

SSC PART NUMBER : SWAA0B

QUANTITY : 3500

RANK :

SWAA0B

XXXXXXXXXX

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




10. Soldering

(3) Hand Soldering conditions

Not more than 3 seconds @MAX 350C, under Soldering iron.

Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Lead Free Solder

Pre-heat 150~200℃

Pre-heat time 120 sec. Max.

Peak-Temperature 260℃ Max.

Soldering time Condition 10 sec. Max.

2.5~5 C / sec.o

oo

Pre-heating120~150 C

120sec. Max.

60sec. Max.Above 200 C

o240 C Max.10 sec. Max.

2.5~5 C / sec.

260 C Max.10 sec. Max.

o

60sec. Max.Above 220 C

120sec. Max.

Pre-heating150~200 C1~5 C / sec. o

oo

o1~5 C / sec.

(1) Lead Solder

(2) Lead-Free Solder

Lead Free Solder

Pre-heat 120~150℃

Pre-heat time 120 sec. Max.

Peak-Temperature 240℃ Max.

Soldering time Condition 10 sec. Max.

APCPCWM_4828539:WP_0000001WP_0000001A

PC

PC

WM

_482

8539

:WP

_000

0001

WP

_000

0001



Rev. 00 Rev. 00




11. Precaution for use

(1) Storage conditions

• Keep the product in a dry box or a desiccator with a desiccant in order to prevent moisture absorption.a. Keep it at a temperature in the range from 5C to 30C and at a humidity of

less than 50% RH.• The product should be kept within a year.

(2) After opening the package .

• When soldering, this could result in a decrease of the photoelectric effect or light intensity.a. Soldering should be done right after mounting the product.b. Keep the temperature in the range from 5C to 30C and the humidity at less

than 60%.• Soldering should be done within 7 days after opening the desiccant package.

If the product has been exposed for more than 7 days after opening the package or the indicating color of the desiccator changes, the product must be baked at a temperature between 65 ± 5C for less than 24 hours.

• An unused and unsealed product should be repacked in a desiccant package and kept sealed in a dry atmosphere.

• Stored at a humidity of less than 10% RH.

(3) Precautions for use

• Any external mechanical force or excessive vibration should not be applied to the product during cooling after soldering, and it is preferable to avoid rapid cooling.

• The product should not be mounted on a distorted part of PCB.• Gloves or wrist bands for ESD(Electric Static Discharge) should be wore in order to

prevent ESD and surge damage, and all devices and equipments must be grounded to the earth.

(4) Miscellaneous

• Radiation resistance is not considered.• When cleaning the product, any kind of fluid such as water, oil and organic solvent

must not be used and IPA(Isopropyl Alcohol) must be used.• When using the product, operating current should be settled in consideration of

the maximum ambient temperature.• Its appearance or specification for improvement is subject to change without

notice.

Documents

* Standardacriche.com/_upload/Goods_Spec/SWAA0B.pdf · 2013-03-13 · *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2

* Standardacriche.com/_upload/Goods_Spec/SWAA0B.pdf · 2013-03-13 · 1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. 2