52
日日日日日日日日日日日日日日日日日日 日日日日日日日日 日日日日日日日日日日 日日日 Nov. 23, 2006

日月光半導體 e 化 之 進程與問題之分享

  • Upload
    zahi

  • View
    274

  • Download
    1

Embed Size (px)

DESCRIPTION

日月光半導體 e 化 之 進程與問題之分享. 日月光高雄廠資訊中心 盛敏成 Nov. 23, 2006. Agenda. ASE Group Our business models Our IT strategy A follower, a partner and a leader 由服務中學習 , 由學習中改善服務 ASEKH IT system evolution Case study 晶采計劃 Smart customer SAP II project Experience sharing Conclusion. ASE MISSION. - PowerPoint PPT Presentation

Citation preview

Page 1: 日月光半導體 e 化 之 進程與問題之分享

日月光半導體日月光半導體ee化化之之

進程與問題之分享進程與問題之分享

日月光高雄廠資訊中心盛敏成Nov. 23, 2006

Page 2: 日月光半導體 e 化 之 進程與問題之分享

Agenda

ASE Group Our business models Our IT strategy

– A follower, a partner and a leader• 由服務中學習 ,由學習中改善服務

ASEKH IT system evolution Case study

– 晶采計劃– Smart customer SAP II project

Experience sharing Conclusion

Page 3: 日月光半導體 e 化 之 進程與問題之分享

ASE offers the Best Design Manufacturing Services for IC Packaging, IC Substrates, IC Testing, and Systems.

ASE will act as an Extension of Our Customers’ Own Operations in Achieving the Maximum Business Objectives with Minimum Resources.

ASE MISSION

Page 4: 日月光半導體 e 化 之 進程與問題之分享

ASE Group

Test

• Substrate Design

• Manufacturing Service

• Modeling & Simulation

• Program Development

• Wafer Probing

• IC & Module Test

• Burn-In

• Warehousing

• Drop-Shipment

• Package & Module Design

• IC Assembly

• Multi-chip Assembly

• Micro & Hybrid Module

Assembly

System

• DMS (Design Manufacturing Services)

• Board Assembly

• Hybrids & Electronic

Packaging

• Logistic Management

Material

ASE VISION: THE COMPLETE SOLUTION

Page 5: 日月光半導體 e 化 之 進程與問題之分享

Engineering Test

Wafer Bumping/Probing

Materials

Assembly

Final Test

Module, Board Assembly & Test (DMS)

Foundry

Circuit Design

ASE VISION: THE COMPLETE SOLUTION

Operation sites–ASEKH(A/T/M), ASECL(A/T/M), ASEKr(A/T), ASEM(A/T), ASESg(T), ISE(T)–USI

Page 6: 日月光半導體 e 化 之 進程與問題之分享

Electronics Industry Supply Chain

Customer OEM EMS Sub-Assembly Components

customers

customers

customers

suppliers

50+ suppliers

180+ suppliers

1200+ othersuppliers

Japan, US, Taiwan

Other suppliers15+customers

100+ suppliers

GST

Foundry, Pkging & Test

Page 7: 日月光半導體 e 化 之 進程與問題之分享

Our Business Model

Engineering/Manufacturing service provider– Make the parts upon customer specification and

instruction• Key success factor: operation excellence and quality• Compete with other service provider and customers’

MFG teams• Without ERP system until 2004

Business guideline– Easy for customer to do business with ASE

• Seamless integration with customers’ process flow

– Quality, Flexibility, Efficiency

Page 8: 日月光半導體 e 化 之 進程與問題之分享

Supply Chain & Quality Strategy

Demand Uncertainty

Launch Phenomenon

Cost Pressure

High Quality Expectations

Speed & Flexibility

Security of Supply

Efficient Supply Chain

Proactive & Responsive

Environmental Conditions

Best Customer Experience

Page 9: 日月光半導體 e 化 之 進程與問題之分享

Customers’ Supply Chain Objectives

Collaborative forecast, order and inventory management solution connected with key suppliers.

Exception based management Scalable business process integration

with suppliers Centralized visibility to business processes Performance metrics for supplier

management“Building sustainable competitive advantage into the collective supply chain”

LEANSPEED

FLEXIBILITY

Page 10: 日月光半導體 e 化 之 進程與問題之分享

Multi-tier Execution

Business Value

Process Breadth, Number of Trading Partners

Multi-Company Process

Management

One-way Information

Posting

Two-way Information Exchange

Closed-loop, Positive Response With Exception

Alerts

Synchronized Processes, Timely and Quality Information

Multi-tier VisibilityException Management Across Multiple

Tiers of the Value Chain

Data Exchange

Multi-Company Process Management enables a

synchronized Supply-Chain

Decision Support

Exception Management

Data Aggregation

ExceptionAlerts

Page 11: 日月光半導體 e 化 之 進程與問題之分享

Customers’ Goal

Allentown

Thailand

Singapore

Orlando

Twin Cities

Sub Con Assemblers

Foundries

Forecasts

Purchase Orders

Shipping Notices

Shipping Notices

IndirectMaterialsSuppliers

Consignment

Materials

Suppliers

I-BOX

Page 12: 日月光半導體 e 化 之 進程與問題之分享

Approach for I-Box

Functionality at the edge

Point-to-Point Integration One trading partner at a

time

Client-Server Architecture“Thick at the Edge”

“Point-to-Point”

Service Oriented Architecture“Thin at the Edge”

“Intelligent Network”

Functionality in the network Connect once and leverage Shared service economics

Partner F Partner C

Partner E

Partner A Partner B

Partner D

Partner F

Partner E

Partner A Partner B

Partner D

IntelligentNetwork

Partner C

Page 13: 日月光半導體 e 化 之 進程與問題之分享

Our IT Strategy

A follower Learn– Leverage the best practice from customers, competitors,

and industry leaders– ASE has the fortune to work with the most competitive

companies in the IC supply chain– Research: Re-Search

A partner Do– Build up quality information links with customer– Provide process integration solution model to customers

A leader Continuous Improvement– Identify the core function of information integration

process– Develop systematic approach to identify the critical

information links to make business model successful

Page 14: 日月光半導體 e 化 之 進程與問題之分享

ASE IT System Evolution

Home grown legacy systems– Two independent operation company for different services

(Assembly and Test)– Did not build up integrated process with well-organized

information links– IRS system build up for short term solution

Big-Bang Approach– Driving force: to provide turnkey service to customers– GRP project: kicked off on March, 2002– System went live Jan/5/2004– Material operation: KH/CL Jan/2005; SH Sep/2005

Continuous Improvement– Separated instance for Material operation: Aug/2006– PLM system go live Dec/2006– SAP/e project kicked off Dec. 2005

Page 15: 日月光半導體 e 化 之 進程與問題之分享

ASE_Assy_ IT 系統關聯圖 (~2003)

採購管理(Purchase)

庫存管理(Inventory)

進口系統(Import)

保稅系統(Bond)

IQA

系統

應收帳款(A/R)

應付帳款(A/P)

總帳(G/L)

固定資產(A/M)

產品成本系統(Product COST)

Forecast

出口系統 /Price

(Export/Price)

投料系統(T/T)

晶片庫系統Wafer

Bank

成品庫管理Finish Goods Stock

工程資料庫(PEDB)

獎工系統(Bonus)

M

E

S

HR

出口系統成品系統

保稅系統成本系統

出口成品系統

SAP

Cobol+

Informix

Access

Other

System

InterfaceData FlowReference

T/T

Controlling

(CO)

Shipping

Plan

Sales

ReportPacking

Instruction

Notes AP

SPEC/ECN IMQR

VB+

Oracle

Page 16: 日月光半導體 e 化 之 進程與問題之分享

ASRS

Packing

PEDB

Label

PTSetup

Procedure

TDRP

Shipping

Price

PO

SAP

GUI

MES

Invoice

MM

AOL Intranet InternetEqu TimeRecord

BonusCost

Spare Parts

Tooling

Extricity

Others :

FCST TSMCShip Instr.

MES Menu

Plan

TEVHold Bank SPECCAR TesterConfig Hold Lot

E-PR

HR E-HR

ASE_Test_ IT 系統關聯圖 (~2003)

Page 17: 日月光半導體 e 化 之 進程與問題之分享

GRP=ERP+SCM

ERP Inventory

Sales •Order taking•Pricing

Sales •Order taking•Pricing

Purchase•Wafer pur. plan•Purchasing

Purchase•Wafer pur. plan•Purchasing

Financial• GL • AR    • AP

•Fixed asset • Budget/Cost • Cash management

Financial• GL • AR    • AP

•Fixed asset • Budget/Cost • Cash management

Receive CustomerVendor

Quotation

PO

Transfer Pick/Pack Ship

Inventory Documents BillingValidation

Invoice

發料記錄

PaymentPayment

Invoice

Invoice

Invoice

Quotation

PR

Assembly

Finish GoodsWafer consume

Order to production

Wafer Sort Final test

Production Plan•Forecast

•MRP

Production Plan•Forecast

•MRP

Capacity optimization, Material planning and production plan optimizationSCM

Page 18: 日月光半導體 e 化 之 進程與問題之分享

Internal Business Flow

ASEKH- ASSY

ASEKH-TEST

CustomerWafer Sort

Package

Plant 1

Plant 9

Plant 2

Final Test

Order

WIP

/EN

G/B

illi

ng

Central OT

Central Planning

Manufacture

Wafer

In Fab Planning

ASSYTEST

Turnkey$$

$

WIP/ENG/Billing(TEST)

WIP/ENG/Billing(ASSY/TK)

Finish Goods(ASSY)

Finish Goods (TEST/Turnkey)

Bumping

Plant 1

Plant 2

Page 19: 日月光半導體 e 化 之 進程與問題之分享

Goal of ASE GRP Project

Ship

Phase I

Business processes Included :

• Ass’y & Test in KH site

System To Be Implemented

• ERP(Enterprise Resource Planning)

• SCM(Supply Chain Management)

• Middleware (System Integration)

Order Tacking

Integration System

SCM System

ERP System

ASE Group

Procurement

ASET ASEK

Procurement ProcurementProcurementProcurement Procurement

ASE-CL

Ass’yTest

Ship

ASE-China

Ass’yTest

Ship

ASE-Korea

Ass’yTest

Ship

ASE- Malaysia

Ass’yTest

Ship

ASE- others

Ass’yTest

Ship

Procurement

Order fulfillmentCost Down

Page 20: 日月光半導體 e 化 之 進程與問題之分享

Current IT ArchitectureLegacySystemMES PDM

Integ

rated C

usto

mer In

terfaceHRS

Middleware

Middleware

ERP

Notes(w/f)

IRSData

CenterSCM

Interface

LegacySystemMES PEDB HRS Notes(w/f)

Cu

stom

er

Ve

ndo

r

Interface

ASSY

TEST

For CRP and MRP

Order taking and Execution, MM,

and FI/CO

Enterprise Application Integration

Page 21: 日月光半導體 e 化 之 進程與問題之分享

GRP System (1/5/2004)

ERP: SAP R3– SD (Sales and Distributions)– PP (Production Planning)– MM (Material Management)– CO (Controlling)– FI (financial)

SCM: Adexa– SCP (Supply Chain Planning) with CRP and MRP for mon

thly and weekly planning– PP (Plant planning) for daily planning

System Integration– Tibco BW (Business Work)

Page 22: 日月光半導體 e 化 之 進程與問題之分享

Application Architecture

Notes

SAP Adexa

BONUS

PriceCalculation

MES

WorkStream

PromisFactoryWorks

VMI(Web)

B2B(Customer)

2003/6/19Date

ASE GRP project Application Architecture (Total View)Chart Title

Page

Version 1.0

1 of 9

Legend:

ASEKH-Assy System ASEKH-Test System

Data to GRP

Data from GRP

GRP System ASEKH A/T shared sys.

HRIS

應收帳款資料傳送

ePMS

eHR

借機系統

Quotation

Forecast(Web)

ASEKH A/Tseparated sys.

Not existed

ASEKInternet

FTP Server

SpecialCharge

零用金系統

CM

PackingCustomer

Layout系統

ED

PGI

TrackingEngineering Data System

EnoviaPDM

POS

CustomerReport

DataCenter

IRS

B2BProcessor

B2B(Vendor)

Label

Page 23: 日月光半導體 e 化 之 進程與問題之分享

33 機密資料/僅限GRP專案內部使用2004/6/4

Special Process Flow – General Assembly

TSMC收料 IQA 入庫

發料領料單Issue工單Assy SO Adexa

ASSY MES

轉暫存倉 Test庫房收料

Test SO

TEST MES

領料單

入成品庫

出貨DN/Billing

DN/Billing Test IQA

入Test庫

Test庫房發料

工單

confirm工單

入ASSY出貨虛擬倉

入Test成品庫/虛擬倉

Adexa 工單

帳流實體物流MESAdexaGRP

Page 24: 日月光半導體 e 化 之 進程與問題之分享

Future Plan Strategy

– Align with our Group strategy– Provide same information service for customers– Integrate cross operations and cross departments

information for quality operation and efficient management

Approach– Continuous process improvements with internal

customers– Refine IT system architecture to enhance

management information provision– Leverage best practice from customers, partners

and competitors

Page 25: 日月光半導體 e 化 之 進程與問題之分享

Future Plan - 1

Phase 1.1– Include Material operation into GRP system

• Project kick off on July/2004• Best practice deployment, including ASECL

Material

– More customer B2B enhancement• To facilitate the information links with customers• Proactive initiator for ASN and W/O B2B projects

– Analytic information standardization and provision

• Business intelligence data warehouse project• Provide more integrated information for SCPM

Page 26: 日月光半導體 e 化 之 進程與問題之分享

Continuous Improvement Customer portal enhancement

– Phase 1: July/2004; phase 2: Mar/2006– Phase 3: Dec/2006

Sales IT function support– Sales management:

opportunity/quotation/forecast/order/revenue/profit– Customer activity management

SCM system enhancements– Planning/Scheduling/Dispatching– Supply management enhancement

Group ENG data architecture – PLM and more– Central vs. Distributed vs. Hybrid

Page 27: 日月光半導體 e 化 之 進程與問題之分享

Case Study

TSMC ePO, Work order project– Document transfer handling

Smart customer SAP II project– WIP transaction message

Page 28: 日月光半導體 e 化 之 進程與問題之分享

Work Order Business Flow (Before)

Customer Process Transaction Process ASE Process

Buyer

ERP ( SAP)

Create Work Order

New WO Request

WO Request Flow

WO Reply Flow

Work Order

Mail or FAX

Mail or FAX

衍生問題 :- 流程中人為操作錯誤- Batch 人工操作 ,作業時間過長- 不易確認資料傳送成功性- 缺乏資料傳送的不可否認性

Page 29: 日月光半導體 e 化 之 進程與問題之分享

Work Order Business Flow (Before)

Customer Process Transaction Process ASE Process

Buyer

ERP ( SAP)

Create Work Order

New WO Request

WO Request Flow

WO Reply Flow

Work Order

Mail or FAX

Mail or FAX

Planner

WOsSpec.

Manually key in WO & Spec. data to system

ERP

衍生問題 :- 登打資料錯誤頻繁- 規格參照錯誤- 人工操作時間過長- 過於依賴人為判斷

Page 30: 日月光半導體 e 化 之 進程與問題之分享

Work Order Business Flow (Before)

Customer Process Transaction Process ASE Process

Buyer

ERP ( SAP)

Create Work Order

New WO Request

WO Request Flow

WO Reply Flow

Work Order

Mail or FAX

Mail or FAX

Planner

WOsSpec.

Manually key in WO & Spec. data to system

ERP

Check the WO status

Investigate can meet the Order or not

衍生問題 :- 溝通時間過長- 人為溝通造成達交率降低- 雙方認定標準不同

Telephone Telephone

Follow up the Work Order

Follow up the Work Order

Contact with ASE for SOD & key in system

Page 31: 日月光半導體 e 化 之 進程與問題之分享

Buyer

Customer Process Transaction Process

( ( RosettaNet ))

ASE Process

Work Order Business Flow (Current)WO 7B5 Flow

WO 7B6 Flow

A New WO Request

ERP ( SAP)

Create Work Order

RosettaNet Gateway

Internet

Firewall Firewall

Pip7B5

解決問題 :- 自動化 ,減少流程中人為操作錯誤- 無紙化 ,無須人工列印傳真- 提高資料傳送確實性- 減少人為判斷錯誤- 標準化規格溝通容易- 大大減少資料溝通時間

Page 32: 日月光半導體 e 化 之 進程與問題之分享

Buyer

Customer Process Transaction Process

( ( RosettaNet ))

ASE Process

Work Order Business Flow (Current)

MES

Confirm SOD and release to production line

WO 7B5 Flow

WO 7B6 Flow

A New WO Request

ERP ( SAP)

Create Work Order

RosettaNet Gateway

RosettaNet Gateway

Internet

Firewall Firewall

Pip7B5

Planner

ERP

New WO Notice

解決問題 :- 減少流程中人為操作錯誤- WO 資料直接進入系統 ,無須人工介入- 減少大量登打資料 ,人力節省- 減少人為錯誤判斷

Page 33: 日月光半導體 e 化 之 進程與問題之分享

Buyer

Customer Process Transaction Process

( ( RosettaNet ))

ASE Process

Work Order Business Flow (Current)

Query WO reply by vendor

MES

Issue to WIP according to WO & PDM

Reply WO according to SCM system

WO 7B5 Flow

WO 7B6 Flow

A New WO Request

ERP ( SAP)

Create Work Order

RosettaNet Gateway

RosettaNet Gateway

Internet

Firewall Firewall

Pip7B5 Pip7B6

Planner

ERP

New WO Notice

解決問題 :- 回覆資料直接進入系統- 回覆登打資料錯誤減少- 縮短資料覆核時間

Page 34: 日月光半導體 e 化 之 進程與問題之分享

ASE PO Process (Before)

VendorsVendors

PO Request Flow

PO Reply Flow

Purchasing Officer creates PO in ERP

A NewPO

Request

Send PO through Fax to suppliers

Supplier received PO through Fax

PO

ERP 衍生問題 :- 流程中人為操作錯誤- Batch 人工操作 ,作業時間過長- 不易確認資料傳送成功性- 缺乏資料傳送的不可否認性

Page 35: 日月光半導體 e 化 之 進程與問題之分享

ASE PO Process (Before)

Send PO through Fax to suppliers

Supplier received PO through Fax

PO

1. Entry the PO into system 2. Manually file the document

Sales Order System /

Spreadsheet

Manually files it

VendorsVendors

PO Request Flow

PO Reply Flow

Purchasing Officer creates PO in ERP

A NewPO

Request

ERP 衍生問題 :- 流程中人為操作錯誤- 人工操作時間過長- 登打資料錯誤頻繁- 過於依賴人工判斷- 檔案保存不易

PO

Page 36: 日月光半導體 e 化 之 進程與問題之分享

PO

ASE PO Process (Before)

Send PO through Fax to suppliers

Supplier received PO through Fax

Supplier deliver goods

Purchasing Officer follow-up with suppliers manually

Sales Order System /

Spreadsheet

Manually files it

PO

VendorsVendors

PO Request Flow

PO Reply Flow

Purchasing Officer creates PO in ERP

A NewPO

Request

ERP

Review inventory and confirm SOD

Backend System

Reply the PO confirmation

衍生問題 :- 溝通時間過長- 雙方認定標準不同- 人為溝通造成達交率降低- 資料正確性易產生糾紛- 易產生斷料危機 1. Entry the PO into system

2. Manually file the document

Page 37: 日月光半導體 e 化 之 進程與問題之分享

RN PO 3A4/7/8/9 with Vendors (Current)

PO created in customer’s ERP

PO

ERP

ASE Process ASE Process (Private Process)(Private Process)

Vendors ProcessVendors Process(Private Process)(Private Process)

Transaction ProcessTransaction Process

(RosettaNet)(RosettaNet)

VendorsVendors

RN PO Request Flow

RN PO Reply Flow

A NewPO Request

Transport, Translate,

Map & Load

B2B ServerInternet

Firewall Firewall

3A4/8/9PIP

解決問題 :- 自動化 ,減少流程中人為操作錯誤- 無紙化 ,無須人工列印傳真- 提高資料傳送確實性- 減少人為判斷錯誤- 大大減少資料溝通時間- 標準化規格溝通容易

Page 38: 日月光半導體 e 化 之 進程與問題之分享

RN PO 3A4/7/8/9 with Vendors (Current)

PO created in customer’s ERP

ERP

ASE Process ASE Process (Private Process)(Private Process)

Vendors ProcessVendors Process(Private Process)(Private Process)

Transaction ProcessTransaction Process

(RosettaNet)(RosettaNet)

VendorsVendors

RN PO Request Flow

RN PO Reply Flow

A NewPO Request

Transport, Translate,

Map & Load

B2B ServerInternet

Firewall Firewall

3A4/8/9PIP

B2B Server

ERP

POs appear in supplier’s ERP System

Transport, Translate,

Map & Load

3A4/8/9

Notification ConfirmPO Data

解決問題 :- 減少流程中人為操作錯誤- PO 資料直接進入系統 ,無須人工介入- 減少大量登打資料 ,人力節省- 減少人為錯誤判斷- 資料系統化

PO

Page 39: 日月光半導體 e 化 之 進程與問題之分享

RN PO 3A4/7/8/9 with Vendors (Current)

PO created in customer’s ERP

ERP

ASE Process ASE Process (Private Process)(Private Process)

Vendors ProcessVendors Process(Private Process)(Private Process)

Supplier deliver goods

Transaction ProcessTransaction Process

(RosettaNet)(RosettaNet)

VendorsVendors

RN PO Request Flow

RN PO Reply Flow

A NewPO Request

Transport, Translate,

Map & Load

B2B ServerInternet

Firewall Firewall

3A4/8/9PIP

3A7 Notification

3A7PIP

B2B Server

ERP

POs appear in supplier’s ERP System

Transport, Translate,

Map & Load

3A4/8/9

Notification

解決問題 :- 回覆資料直接進入系統- 回覆登打資料錯誤減少- 減少人為判斷錯誤PO Confirm

PO Data

Page 40: 日月光半導體 e 化 之 進程與問題之分享

RN PO 3A4/7/8/9 with Vendors (Current)

PO created in customer’s ERP

ERP

ASE Process ASE Process (Private Process)(Private Process)

Vendors ProcessVendors Process(Private Process)(Private Process)

Supplier deliver goods

Transaction ProcessTransaction Process

(RosettaNet)(RosettaNet)

VendorsVendors

RN PO Request Flow

RN PO Reply Flow

A NewPO Request

Transport, Translate,

Map & Load

B2B ServerInternet

Firewall Firewall

3A4/8/9PIP

3A7 Notification

3A7PIP

B2B Server

ERP

POs appear in supplier’s ERP System

Transport, Translate,

Map & Load

3A4/8/9

Notification

Touch-less, seam-less and trading partners information in your own system

PO ConfirmPO Data

Page 41: 日月光半導體 e 化 之 進程與問題之分享

經 濟 部

T S M C & A S E

M a r . 2 0 0 4 P . 4

• 涵 蓋 台 積 電 與 日 月 光 供 應 鍊 之 工 程 協 同 合 作 ( E n g i n e e r i n g C o l l a b o r a t i o n ) 與 運 籌 協 同 合 作 ( L o g i s t i c s C o l l a b o r a t i o n )

• 包 含 b u s i n e s s l i f e c y c l e 中 所 有 重 要 之 作 業 流 程

專 案 範 圍

封 裝 測 試

台 積 電( 晶 圓 代 工 W a f e r F o u n d r y )

在 製 品出 貨

釘 架 / 基 板 供 應 商

供 應 商

委 工 單 在 製 品 資 料 良 率 資 料 成 品 資 料 測 試 結 果 . . . .等

電 子 訂 單 庫 存 資 料 在 製 品 資 料 出 貨 資 料

日 月 光

整 合 元 件 製 造 商 ( I D M ) /

I C 設 計 公 司 ( F a b l e s s )

電 子 訂 單 在 製 品 資 料 出 貨 資 料 發 票 資 料 測 試 工 程 資 料

專 案 範 圍

上 游

下 游

Page 42: 日月光半導體 e 化 之 進程與問題之分享

Result

TSMC provide turnkey service to customers– ASE provide turnkey service to customers, too

Most complete data link among our customers– Frontier project and benchmarking

More variants of turnkey model coming up– Material flow, information flow, cash flow

Page 43: 日月光半導體 e 化 之 進程與問題之分享

Project Objective – SAP II Project

A Fabless customer started the WIP tracking project – Can consolidate WIP data from global sub-contractor site

s, with multiple data formats. – Allows quick reporting and analysis using data from one s

ystem, which is SAP. – Has been particularly challenging for virtual manufacturi

ng companies. The company is looking forward to building a strategic alliance with its manufacturing partners. This venture should be mutually beneficial to all parties.

– Took this opportunity to establish an end-to-end business process tying together its operations, costing, purchasing, and accounting departments. This is expected to give the company more finance and purchasing control.

Page 44: 日月光半導體 e 化 之 進程與問題之分享

System Dual

SAP

PP

SD

MM MES

PP

SD

MM

TxnRecord

BizTalk

BC TxnRecord

D/N

ABR/MBR

Customer

WIP Txn

SHIP

Vendors

Page 45: 日月光半導體 e 化 之 進程與問題之分享

System Dual in WIP Tracking

W0 : Represent the WIP status at time=0.

Ti: Represent the WIP transaction during that period.

Subcon Customer

W1

W0

Wi

Wi+1

W1

W0

Wi

Wi+1

T1

T2

Ti+1

.

.

.

.

.

....

Page 46: 日月光半導體 e 化 之 進程與問題之分享

Results

Come from behind– Reach 98.5% accurate for

consecutive 3 month A generic WIP-TS system model

– Build up for other three customers– Fast deployment, reliable system

performance

Page 47: 日月光半導體 e 化 之 進程與問題之分享

Experience Sharing

Product consultant vs. Business consultant– Learn from SAP project

Your project vs. Our project Expectation management Training and coaching

– The way– Methodology– Discipline– Management

Page 48: 日月光半導體 e 化 之 進程與問題之分享

Experience Sharing System

– The output from project: the least important– Loading test, stress test

Process– Business process review, re-engineer– Integration test, user acceptance test

People– Teaming, vendor selection– Change management, expectation management,

training, coaching, change enablement Data

– Data conversion, legacy system integration Time

– Schedule control, scope control, environmental factors

Page 49: 日月光半導體 e 化 之 進程與問題之分享

Conclusion

PDCA-embedded IT system– Plan/Operation/Comparison/Action, instead of

operation support only– Build up business intelligence to support

Strategic Enterprise Management (SEM) Process centric information links

– Business process is the key– IT vs. domain knowledge

Customer-oriented– Rigid, but flexible, architecture to fulfill

different business model

Page 50: 日月光半導體 e 化 之 進程與問題之分享

Integrated Management Processes

External communication

Strategy update

Mid-term planningB/S, I/S, Cash Flow

3-5 year strategic planning

Evaluate scenarios

Cascade targets to lower Bus.Units

Detailled operationalplanning

Measureperformance

Business processoptimization

Strategy and Business Management Strategy and Business Management

Performance Management Performance Management

Strategyanalysis and assessment

Adjust operations

Risk estimation

Define objectives, Set targets,

Launch initiatives

Forecast

Strategic PlanningStrategic Planning

Page 51: 日月光半導體 e 化 之 進程與問題之分享

SEM and Business Analytics

Strategic Enterprise Management

PLMAnalytics

Financial Analytics

HRAnalytics

SCMAnalytics

CRMAnalytics

Business Analytics

business processes

BusinessPlanning &Simulation

StrategyManagement

Business Consolidation

PerformanceMeasurement

Suppliers Customers

StakeholderRelationshipManagement

Adapt operations

Detailledoperational

planning

External communication

Strategy update

Mid-term planningB/S, I/S, Cash Flow

3-5 year Strategic planning

Evaluate scenarios

Cascade targets to lower Bus.Units

Strategy analysisand assessment

Strategy & Business Mgmt. Strategy & Business Mgmt.

Manage strategy of Enterprise / Business Units (BU) to create long-term value

Manage performance of BU to improve short-term results

Business processoptimization

Performance Management Performance Management Measure

performance Adapt business operations based on results from Business Analytics

Optimize business processes across functions to improve overall business performance

Transactional processing (ERP, CRM, SCM, ...)

Risk estimation

Strategic Planning

Strategic Planning

Objectives, Targets,Initiatives

Forecast

Page 52: 日月光半導體 e 化 之 進程與問題之分享

Q & AQ & A

Thanks for your listening