8/9/2019 Electronic Packaging Technology for Semiconductor Devices

1/41

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

2/41

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

3/41

Ie{ndieb Wlqlewaj Ad|ianb" IWA

1= :

67= >=

77

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

4/41

7= ==

5===

5>;35>5>3=

5>:=5>:1

5>:>

AW[

F]K

AW[ 7==7AW[ F]K

1==

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

5/41

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

6/41

]AG

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

7/41

}eahecl

}eahecnic" ]HC

BQN

BQN

BQN

7= >=

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

8/41

7==6 6=,

KWE@ 6;hG5>:= 7:1

;@G5>:> 7>: 5CG 7==5 1

; @]\5>:= =)6

`5>>< =)7< `5>>: =)51 `7=== =)=3 `7==;

@]\ Ni{lb- ;>>

5)1CJz7=== 5)3CJz7==5 7CJz7==7 N$D

56:=5>>> 17:=7==< :;;=7=55 3=S

5>>3 55=S7==5 56=S7==6

EQNA

1= 7= 3= KN] UF]

N$D >=

GCE Qn]

QdA Q@[ 7= >= AQ]

NA

GCE GCE GCE GCE

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

9/41

AQ] 5)=``

=):``=)>> O]AE}wni{lk anw-

a|n{ gdewk" ]AGlbla{wna q|gq{we{l

]AG

]AG GCEAQ][EG@A@Qn] }eahecl q|gq{we{l

]HC

B[AAbds {l`}lwe{|wl adfnwlk alwe`naq

B[AA J[AA 56==

A|EcEc-]k S@d

B[AA

B[AA KN]BAAA]CEUF]GCEAQ]@A@Qn]

B[AA JNA

B[AA

JKN

FAA;

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

10/41

KAEQGG|iklw-fnbb

GCE AQ] Q@[

EAFEA]

A]\ L@NHCK

@A]

BAK]K] BLK

[F[-BAK]K]

KN]UF]]CE GCEAQ]@A@Qn]

Q@[ AQ]@A@ Qn]

]AG

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

11/41

5 5

5)5)

5)5)5) 75)5)7) 67););) >37);)

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

13/41

7)6) Qn] QdA

7)6)5) Qn] QdA 5777)6)7) 57:6)1)7) 1>>6)1)1) B[AA ;=76)1);) B[AA ;=:6)1)

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

17/41

3)33)6)1)

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

18/41

:);)5) )7);) [GCE 6=;

>)1) AQ]

>)1)5) AQ] 6=3>)1)7) AQ] 675

>)1)1) AQ] 661>)1);) AQ] 635

5= 631

5=)5)

5=)5)5) 63;5=)5)7) 63

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

19/41

5=)5)1) 63>

5=)7)

5=)7)5) 6:75=)7)7) 6:15=)7);) G7n{ NVJ 6>>

5=)1)

5=)1)5) 3=6:

VBQN 5>3>

Q@[

5>37= 5>1= 5>;= 5>6= 5>3= 5>:= 5>>= 7=== 7=5=

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

23/41

5

5-7

seflwajn}

5-7

}eahecnic]HC

5-7

5-1

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

24/41

5-1

5-;

BAW

BLK

=)7< `

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

25/41

5

5)5)7)

5-<

5-<

AEK$AE@$AE[

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

26/41

N$D

AEK$AE@$AE[

NQKIni-

{lcwe{lk qlwvnalq kncn{eb il{sdwhq

6

6 5-6

5-6

1

7 5 =

6

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

27/41

5

5blvlb)5

7blvlb)7

5-6 7 @A@`|b{n ajn} `dk|blq

@A@

@A@ HCKhidsi cddk knl

@A@

@A@

KN]

]AG

7

@A@

1blvlb)1

5-6 7

@A@ ]AG

;blvlb);

1

]AG

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

28/41

6blvlb)6

5 = 7 5

1 7 ;

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

29/41

5

5-:

5-3

][J

]CE UF] GCE

NA q|wfeal `d|i{

{lajidbdc~Q@[

BAW

]HC

}eahecnic}eahecl

`

SG

[EGFAG

KN] ]CE UF]

GCE

*]HC.

=)7 ]HC ]HC KN]

\V]WD@

5-> KN]

E| Eb Fl-In Eb

]HC

Fl-In

5->

KN] 7) ]HC

\V]WD@|b{wevndbl{ }wdcwe``egbl wlek dib~ `l`dw~

Eb

Eb

Qi

Eb

Eb

Qi

E|E|-Qn

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

32/41

]HC 5-5

< ]HC

5)5);)

5)

]HC

]HC

fbn}-ajn}SG

[EG{e}l e|{d`e{lk gdiknic

5-5=

5-55 E|EbA|

1< `

BQN Eb

5-57 BQN Eb

E|A|

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

33/41

5

BQN

BQN

BQN

BQN Eb

BQN

BQN

[EG

BQN

NBG

DBG

G[EG

:=5== `

BQN

7

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

34/41

5-55

5-57

5-51 [EG

5-7

BQN

BQN

Eb

Eb

BQN

[n

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

35/41

5

5-51 [EG

NBGniilw blek kdiknic

BQN

BQN

NBG

DBGd|{lw blek gdinic

NBG

DBG

DBG

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

36/41

5-7

g|nbk-|}

EBNVJ

jlw`l{na dw qleb

5-5;

]HC

]HC ]HC

KN]]CEUF]GCEAQ] 5-1

-

-

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

37/41

5

5-5;

5-1 @DQ BQN ] A

KN]

k|eb

ni-bnil

}eahecl

]

A

7)

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

38/41

5-1 @DQ BQN ] A

QH-KN]qhnii~

kn}

A

]

7)

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

39/41

5

5-1 @DQ BQN ] A

[EG

[A]

{e}l

aewwnlw

}eahecl

]

:=-5== `

5-5<

7= >=

5>6<

[D

1 :5=57

5;

56

7;

7:

17

1;

;7

6:

>7

KA$KA

@A@ 5=

5=

7=

6= KN]

7= 3=

KN]F]

KN] ;6; 7)

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

40/41

5-5<

QQN@QN

BQNVBQB

@@NA

E

G

A

KN]

F]

QN]

alw KN]

]CE

BAAA

UF]

GCE *AQ].

E

F

]QD]* ]QQD]]NQD].

]KN]

]UF] *[]UF].

]GCE *AQ].

[GCE *AQ].

8/9/2019 Electronic Packaging Technology for Semiconductor Devices

41/41

j{{}?$$sss)s|iei)ad`){s

s|ieiMs|iei)ad`){s