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The Fifth Framework Programme of the European CommunityCOMPETITIVE AND SUSTAINABLE GROWTH PROGRAMME

Co-operative Research Project (CRAFT)

Printed circuit boards with high solderability tin coating for lead free soldering

acronym: PRINT

Tele & Radio Research Institute

Printed Circuit Research Department

Ratuszowa 11, Warsaw, Poland

Grażyna Kozioł

Technology trends

Simply……• Smaller

LighterFaster

Cheaper

Environmental issues

• “Green revolution”

• The EC Directive Proposal:

WEEE

RoHS

January 1st, 2006 - ban on lead in electrical and electronic equipment

Pb

Why PRINT

SMEs

• limited R&D resources

• desire for new technologies which fulfil demand of SME

• experience in production

RTD

• large research potential and good equipment

• experience in development of innovative technology

• experience in implementation of new technology

Why PRINT

The Fifth Framework Programme of the ECCo-operative Research Project (CRAFT)

The Project International Consortium possess the skill and competence of RTD and SMEs

The Project Consortium Members

WOJARTPL

SME

ELBID

SME

GSElektronik

DSME

MERKARPL

SME

ITRPL

R&D

ORMECOND

R&D

ELDOSPL

TMBK PartnersPL

Project management/Co-ordination

support

extensive experience in developing tin coatings

experience in production of PCBs and advanced surface mount technology

experience in technology of immersion tin production

experience in testing large research potential and good

equipment

The Project is based on:

The main output of the Project:

The new developed technology of high solderability immersion tin for printed circuits boards implemented at small and medium enterprises.

New solderable tin coating for lead-free soldering conditions.

good quality and reliability soldering joints. Environment friendly packaging and interconnection

technology. The necessary knowledge and materials (educated

personnel, technical data sheets, user’s manual) to enable SMEs.

Proposal number: CRAF – 1999 - 72389

Contract number: G1ST-CT-2002-50254

Duration: 24 Month

The project objectives correspond to the following Key Actions:

Grow-1: Innovative Products, Processes and Organisation

IST-2 : New Methods of Work and Electronic Commerce

IST-6 : Future and emerging technologies

The Project is founded in 50% by the EC budget

Cost:900 T €

IndustrialPartnersFunding:150 T €

Cost:600 T €

Research anddevelopment

partnersFunding:600 T €

Total funding:750 T €

Total cost:1.5 Mio €

Workpackages Structur

Project co-ordination and administrationLeader: Eldos, Co-leader: TM BK

Developmentof theimmersion tintechnologyrequirementsfor lead freesoldering

Leader: ITR

Developmentof theimmersion tinproductiontechnology

Leader:Ormecon

Developmentof theimmersion tincoatingdepositiontechnology

Leader: ITRCo-leader:Ormecon

Developmentof theimplementationdocumentation

Leader:OrmeconCo-leader: ITR

W P 1

W P 2 W P 3 W P 4 W P 5

Project History

August 2001

September 2001

September 2001 - January2002

December2001 - February 2002

February 2002

1. Training ( Craft rules)

2. Creation of the idea of the Project subject research and implementation scheme budget duration

3. Organisation of the Consortium

4. Preparation of the final version of the Project Proposal

5. Submitting the Project