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ALICE PIXELS DETECTOR

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SECTOR

Pixel bus

Pilot MCM

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SECTOR

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PIXEL_BUS & PILOT MCM (right side)

PIXEL BUS

MCM

Signals Analogue power

Analogue ground

300µ

digital power

Digital groundPixel readout chip

Pixel detector

Detector bias

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Pixel bus (version B) cross section

Glue 5µ

Kapton 8µ

1) AGND 50µm

2) VDDA 30µm

3) Horizontal signals 10µm

4) Vertical signals 10µm5) VDD 15µm

6) GND 50µm

7) TOP layer10µm

Aluminium

0.3 0.3 0.3 0.3 0.3

Ni/Au 1µ

Copper

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300µm

300µm

300µm

AGND

VVDA

SIGNALS

GND

VDD

PIXEL BUS PROTOTYPE

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PIXEL BUS PROTOTYPE

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1

2

READOUT CHIP

PIXEL DETECTORAluminiumPolyimide

CARBON FIBER SUPPORT

1 GND 50µ2 VDD 50µ3 SIG 1 10µ4 SIG 2 10µ5 SIG 3+ smd pad 10µ

Glue

COOLING TUBE

Note: the drawing is not to scale

3

4

5

SMD COMPONENTS

HALF STAVE CROSS SECTION

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PIXEL_BUS & PILOT MCM (right side)

8mm

PIXEL BUS

MCM

8ANAPILPILOTCHIP

GOL

100mm

LASER+2 PIN DIODE15mm

Bonding pads

Kapton extender’s soldering pads

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PIXEL_BUS & PILOT MCM (left side)

8mm

MCM

ANAPILPILOTCHIP

GOL

100mm

LASER+2 PIN DIODE

PIXEL BUS

Kapton extender’s soldering pads15mm

Bonding pads

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ALUMIUM GND

Al VDD

Cu GND

Cu VDD

PIXEL_BUSPIXEL_EXTENDER

PIXEL_BUS AND EXTENDERS CONNECTIONS

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Ceramic carrier

chip

CHIP PACKAGE1.27mm

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MCM

Ceramic carrier

chip

CHIP PACKAGE

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Status:

PIXEL BUS. Pixel bus mirror version: tested and approved.. Pixel bus prototype (Cu & Al): in production 09/2003. Pixel bus prototype (Al): start production 10/2003. Final production at CERN (150 pieces): start 01/2004

PILOT MCM. Fr4 prototype: tested and approved.. Ceramic prototype : in production 10/2003. Final production at Sensorex: start end 2003