49
Cost Effective Spread Spectrum Clock Generator Design Chulwoo Kim, Minyoung Song, Sewook Hwang Advanced Integrated Systems Lab. Korea University, Seoul, Korea

04_Cost Effective Spread Spectrum Clock Generation Design_고려대_김철우

Embed Size (px)

DESCRIPTION

Spread Spectrum Clock Generation

Citation preview

  • Cost Effective Spread Spectrum Clock Generator Design

    Chulwoo Kim, Minyoung Song, Sewook Hwang

    Advanced Integrated Systems Lab.

    Korea University, Seoul, Korea

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG

    Conclusions

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG

    Conclusions

  • Electromagnetic Interference (EMI)

    Severe at the higher frequency spectral component

    System-level and chip-level

    High performance design

    high integrated and high speed

    Various EMI reduction techniques

    Shielding

    External filtering

    Spread spectrum clock generation

    Introduction

  • Shielding Hard to apply to inter-chip communications

    Cost-expensive

    Methods for EMI Reduction (1)

    EMI Shielding w/ Metal Caps

    CX2520SB (Kyocera)

    EMI Shielding w/ Lids

  • Low voltage differential clocking Decreasing the signal level directly

    Cost of level conversion and complex routing

    Reduced spectrum amplitude

    SNR decrease as well as EMI reduction

    Methods for EMI Reduction (2)

    A

    A/N

    A/N

    t t

    f f

    A

    A/N

  • External filtering Increasing the rise and fall times of the clock.

    The larger rise and fall times, the lower high-frequency spectral components

    Expensive

    Hard to apply for high-frequency applications

    Methods for EMI Reduction (3)

    t

    T

    t

    T

    Tr Tf

    f f

    -20 dB/decade -20 dB/decade

    -40 dB/decade

    1T 1T1Tr

    Tr=Tf

    FILTERin out

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG

    Conclusions

  • Motivation

    To use lower high-frequency spectral signal directly

    To be more effective as well as simple and cost-efficient solution

    Spread spectrum clock generation (SSCG) To shape its clock spectrum itself and reducing its

    peak

    To spread its spectrum itself, its output frequency should be changed slightly

    Spread Spectrum Clock Generation : EMI Reduction of the Clock Itself

  • Carsons rule gives the BW of frequency modulated waveform

    Total energy of original signal is kept unaffected.

    The 98% of the total energy is contained inside a BW calculated :

    SSCGs use the modulation frequency more than 30 kHz

    To avoid audible band (20 ~ 20kHz)

    Typical values of mod. freq.: 30k ~ 250kHz

    Carsons Rule

    2 c mBW f f

  • SSCG output frequency and modulated phase

    fm: The modulation frequency

    Decide how often the output frequency is changed

    : The frequency deviation

    Decide how much the frequency is changed

    Some wireline applications (SATA, DisplayPort, etc. )

    fm and as 30k ~ 33 kHz and 5000ppm, respectively

    Equations for SSCG Output

    s / 2 cos 2 / 2CKout c sf t V f t t V

    0

    , 0t

    mt f t dt

    c cf f

  • fm defines the distance b/w consecutive harmonics (ripples).

    fm and RBW of spectrum analyzer affect themeasured peak values.

    Spectra Analysis (1)

    BW

    fm

  • RBW >fm :The measured values will be higher than theoretical values by means of BPF characteristics

    RBW >fm RBW

  • Spectra Analysis (3)

    10 log c

    m

    fS

    f

    [Komatsu, ASSCC 2007]

    Peak reduction:

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG

    Conclusions

  • The frequency modulation profile To decide the shape of the spectrum EMI reduction

    Conventional profiles The sinusoidal modulation

    Easy to implement with analog circuit

    Hard to implement with digital circuit

    The triangular modulation Simple but not optimum for EMI reduction.

    The Hershey-Kiss modulation Better EMI performance

    Complex due to its non-linearity

    Frequency Modulation Profile (1)

  • 0 1 2 3 4 5 6 7 8 9

    x 10-6

    -0.2

    -0.1

    0

    0.1

    0.2

    Modulating waveform

    time (ms)

    Devia

    tion (

    %)

    0 1 2 3 4 5 6 7 8 9

    x 10-6

    10

    20

    30

    40

    50

    60

    Modulating waveform integral

    time (ms)

    Angle

    (ra

    d)

    1.475 1.48 1.485 1.49 1.495 1.5 1.505 1.51 1.515 1.52 1.525

    x 109

    -140

    -120

    -100

    -80

    -60

    -40

    -20After modulation

    Side-band harmonics (GHz)

    Am

    plit

    ude (

    dB

    V)

    0 1 2 3 4 5 6 7 8 9 10

    x 10-6

    -0.2

    -0.1

    0

    0.1

    0.2

    Modulating waveform

    time (ms)

    Devia

    tion (

    %)

    1 2 3 4 5 6 7 8 9 10

    x 10-6

    0

    20

    40

    60

    80

    100

    Modulating waveform integral

    time (ms)

    Angle

    (ra

    d)

    1.475 1.48 1.485 1.49 1.495 1.5 1.505 1.51 1.515 1.52 1.525

    x 109

    -140

    -120

    -100

    -80

    -60

    -40

    -20After modulation

    Side-band harmonics (GHz)

    Am

    plit

    ude (

    dB

    V)

    Frequency Modulation Profile (2)

    Sinusoidal Triangular Hershey-Kiss

    Devia

    tio

    n (

    ,

    %)

    An

    gle

    (ra

    d)

    Am

    pli

    tud

    e (

    dB

    V)

    1 2 3 4 5 6 7 8 9

    x 10-6

    -0.2

    -0.1

    0

    0.1

    0.2

    Modulating waveform

    time (ms)

    Devia

    tion (

    %)

    1 2 3 4 5 6 7 8 9 10

    x 10-6

    0

    20

    40

    60

    80

    Modulating waveform integral

    time (ms)

    Angle

    (ra

    d)

    1.475 1.48 1.485 1.49 1.495 1.5 1.505 1.51 1.515 1.52 1.525

    x 109

    -140

    -120

    -100

    -80

    -60

    -40

    -20After modulation

    Side-band harmonics (GHz)

    Am

    plit

    ude (

    dB

    V)

  • Profiles also affect the displacement of spread spectrum

    Down spreading is preferable to guarantee setup/hold time margins

    Displacement of Spectrum

    Down

    SpreadingCenter

    Spreading

    Up

    Spreading

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG

    Conclusions

  • A DLL-based clock generator Hard to implement a finer frequency control

    Changing its delay rather than frequency itself

    A PLL-based clock generator Finer frequency control is available.

    Frequency-controllable PLL

    Clock Generation Architecture

    PFD CP VCO

    DIVIDER

    REFCK

    OUTPUTCK

  • Direct control of input of VCO Controlling the CP current

    Feeding external control voltage

    Control the division ratio of the programmable feedback divider Controlling the division ratio

    Design Approaches for SSCG

    PFD CP VCO

    DIVIDER

    Method I:

    Modulating input voltage of VCO

    directly

    Method II:

    Controlling the division ratio of feedback

    divider

    LF

  • PLL loop characteristic does not affect the SS modulation.

    Suffers from PVT variations of CP, LF & VCO gain and generates additional jitter.

    SSCG Using a Programmable CP

    PFD VCO

    Main Divider

    CP1

    DividerProgrammable

    Charge Pump

    Control Signals

    Output CK

    [Chang, JSSC 2003]

  • modulator : To filter out quantization noise

    Quantization noise issues Similar to fractional-N PLL

    Solution PLL loop bandwidth small enough to filter out the quantization

    noise

    To design a modulator to shape the quantization noise better.

    SSCG Using a Programmable Divider

    PD LPF VCO

    DIVIDER

    Input CKOutput CK

    Profile

    [Kokubo, ISSCC 2005]

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG Piecewise Linear Modulation

    Newton-Raphson Profile Generator

    Conclusions

  • Trade-off EMI performance vs. circuit complexity

    The piecewise linear modulation profile (PWL) Linear operation

    Simpler than Hershey-Kiss modulation

    Higher EMI reduction Increasing the slopes near the maximum and minimum peaks

    compare to triangular modulation

    A Cost-Effective Design of SSCG

    time

    T1 T2 T1

    Am

    plitu

    de

    2Am

    Am

    -Am

    1

    2

    1 2

    4

    1

    2

    14 2

    m

    m

    m

    m

    T T

    T T

    T T Tf

    14

    mm

    TA

    14

    mm

    TA

    [Song, CICC 2008]

  • To find optimal value Condition

    Optimum

    1

    1 2

    11

    04

    4

    1

    mm

    m m

    m

    TA

    A T

    T

    4

    5

    6

    7

    8

    9

    x 104

    0

    0.2

    0.4

    0.6

    0.8

    1

    -30

    -28

    -26

    -24

    -22

    -20

    -18

    1; Slope of The Linear Signal During T

    1

    ; Ratio Between T1 and T

    2

    Am

    plit

    ude [

    dB

    V]

  • Simple implementation with digital circuits Synthesizable

    Sync with SSCG reference clock

    The -controller Generating an add value () to change the slope of

    the modulation profile

    The more # of , the higher EMI reduction

    PWL Modulator

    Register

    +

    -Controller

    CK

    Modulation

    Profile

  • The higher resolution of division ratio, the lower quantization noise

    Fractional dividing with 10-multi-phase clock

    Phase mixer : increases the resolution of division ratio

    Proposed Fractional Divider

    DR

    En

    Phase Mixer

    MU

    X 2Ckvco

    Controller

    /60CKfb

    Sel

    En

    Mx

  • Phase selecting A resolution of division ratio is improved by 10 times.

    Dividing with Phase SelectingT

    CKvco

    CKvco

    CKvco

    CKvco

    CKvco

    CKvco

    CKout

    7/10*T 7/10*T 7/10*T

    Shift -3

    phases

    Shift -3

    phases

    Shift -3

    phases

  • Trade-off: VCO multi-phase vs. Phase noise

    20 effective clock phases generated without increasing the number of VCO delay line

    Phase Mixing

    DR

    En

    Phase Mixer

    MU

    X 2Ckvco

    Controller

    /60CKfb

    Sel

    En

    Mx

    Sel Sel Sel

    H L H

    Sel

    En

    Mx

    CKfb

    0.75xT 0.75xT

    59.75xT

  • 9.7dB of peak reduction at 270MHz with down spreading can be achieved from this figure.

    Ex. SSCG Spectrum Results

    PWL modulated spectrum

    Non-modulated spectrum

  • Ex. Die Photo

    Careful for clock skew and noise

  • Performance Comparisons

    Modulation

    Profile

    Freq. Deviation /

    Modulation Freq.

    Process

    Power

    Modulation

    Method

    Peak to peak jitter*

    RMS jitter*

    Output Frequency

    Peak Reduction

    *A jitter w/o spread-spectrum mode

    Triangular

    -5150~-350ppm

    30.3 ~ 33.3us

    0.13um

    -

    Phase

    Interpolation

    57.2ps

    9.3ps

    Sugawara

    SOVC 02

    1.5GHz

    7dB

    Triangular

    -5000 ~ 0ppm

    32us

    0.15um

    -

    Phase

    Interpolation

    -

    -

    Aoyama

    SOVC 03

    1.5GHz

    5.43dB

    Triangular

    -5000 ~ 0ppm

    32us

    0.15um

    54mW

    Delta-Sigma

    -

    -

    Kokubo

    ISSCC 05

    1.5GHz

    10dB[12]

    Triangular

    -5000 ~ 0ppm

    33us

    0.18um

    -

    Delta-Sigma

    41.01ps

    3.07ps

    Lee

    ISSCC 05

    1.5GHz

    9.8dB

    Area - - 0.42mm2 0.31mm2

    Piecewise Linear

    -5000 ~ 0ppm

    32us

    0.18um

    40mW

    Delta-Sigma

    27.88ps

    3.77ps

    Song

    CICC 08

    1.5GHz

    14.2dB

    0.49mm2

    Triangular

    -20000 ~

    0ppm

    7.4 ~ 196us

    -

    15.6mW

    Delta-Sigma

    80ps

    10.7ps

    Ebuchi

    JSSC 09

    125 ~ 1250MHz

    10.9dB @ 104M

    0.47mm2

    Triangular

    -7500 ~

    7500 ppm

    -

    0.35um

    27.5mW

    VCO

    67ps

    10.7ps

    Hsieh

    TCAS 08

    400MHz

    16.3dB

    0.65mm2

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    Cost-Effective Design of SSCG Piecewise Linear Modulation

    Newton-Raphson Profile Generator

    Conclusions

  • Newton-Raphson Profile Generator

    1

    1

    2n n

    n

    xy y x

    y

    2 [ ][ ] [ ]

    2 [ ]

    a X nY n X n AB s

    A X n AB

    - Newton-Raphson formula - Proposed formula

    [Hwang, ISSCC 2011]

  • Newton-Raphson Profile Generator

    -

    i)0 ( / 4)

    [ ] [ ]

    ii) ( / 4) ( / 2)

    [ ] - [ ]

    where ( 0,1,2,...)

    m

    m m

    MAX

    N R

    n T

    X n STEP CNT n

    T n T

    X n CNT STEP CNT n

    n k T k

    - Up/Down Counter

    - STEP : Slope of X

  • Newton-Raphson Profile Generator

    2 [ ][ ] [ ]

    2 [ ]

    A X nY n X n AB S

    A X n AB

    2A

    - A[4:0] : Profile Resolution

    - B[3:0] : Profile Slope

    - S[5:0] : Profile Scale Factor

  • Newton-Raphson Profile Generator

    - Shifter (A=25)

    - Adder

    - Shifter (A=25)

    - Divider

    - Shifter (S=25)

    - Adder

    2 [ ][ ] [ ]

    [ ]

    A X nY n X n AB S

    X n AB

  • Newton-Raphson Profile Generator

    m m m

    m m

    16

    i)0< < (T / 4), (3 T / 4)<

  • Newton-Raphson Profile Generator

    m m m

    m m

    16

    i)0< < (T / 4), (3 T / 4)<

  • Measured Modulation Profile

  • Proposed Architecture

    Double binary-weighted DAC modulates the frequency information inside the frequency-to-voltage converter (FVC) in the frequency-locked loop (FLL).

    Newton-Raphson modulation profile is generated and transferred to the FLL by the digital spread-spectrum controller (DSSC).

  • Measured EMI Reduction

    42 cases : 14 and 3 fm

    EMI Reduction : 19.14dB ~ 23.73dB

  • Measured Spectra

  • Die Micrograph

    Process : 1P6M 0.13m CMOS

    Area : 447.6m X 169.7m = 0.076mm2

  • Comparison with Other Works

  • Outline

    Introduction

    Spread Spectrum Clock Generation

    Frequency Modulation Profile

    Design Approaches for SSCG

    A Cost-Effective Design of SSCG

    Conclusions

  • SSCG

    A powerful solution to reduce EMI reduction

    Becoming essential to many applications

    EMI reduction affected by the freq. modulation profile

    Future Trends

    Proposal of new profile and its optimization

    The SSCG is also a clock source as well as EMI reducing device.

    it is also required to enhance jitter performance.

    A technique to reduce quantization noise should be also developed.

    New EMI reduction mechanism.

    Conclusions

  • K. B. Hardin et al., IEEE Int. Symp. Electromagnetic Compatibility, p. 227-231 (1994).

    H. H. Chang et al., IEEE J. Solid-State Circuits, 4, p. 673-676 (2003).

    M. Sugawara, T. Ishibashi, K. Ogasawara, M. Aoyama, M. Zwerg, S. Glowinski, Y. Kameyama, T. Yanagita, M. Fukaishi, S. Shimoyama, T. Ishihashi and T. Noma, IEEE Symp. VLSI Circuits, p.60-63 (2002).

    M. Aoyama, K. Ogasawara, M. Sugawara, T. Ishibashi, T. Ishibashi, S. Shimoyama, K. Yamaguchi and T. Yanagita, IEEE Symp. VLSI Circuits, p.107-110 (2003).

    M. Kokubo, T. Kawamoto, T. Oshima, T. Noto, M. Suzuki, S. Suzuki, T. Hayasaka, T. Takahashi and J. Kasai, Int. Solid-State Circuits Conf., p. 160-161 (2005).

    M. Song, S. Ahn, I. Jung, Y. Kim and C. Kim, IEEE Custom Integrated Circuits Conf., p. 455-458 (2008).

    T. Hayashi, Y. Inabe, K. Uchimura and A. Iwata, Int. Solid-State Circuits Conf., p. 182-183 (1986).

    H. R. Lee O. Kim, G. Ahn and D.-K. Jung, Int. Solid-State Circuits Conf., p. 162-163 (2005).

    S. Hwang, M. Song, Y. Kwak, I. Jung and C. Kim, Int. Solid-State Circuits Conf., p.360-361 (2011).

    S. Y. Lin and S. I. Liu, IEEE J. Solid-State Circuits, 44, p. 3111-3119 (2009).

    F. Pareschi et al., IEEE Custom Integrated Circuits Conf., p. 451-454 (2008).

    W. Grollitsch et al., Int. Solid-State Circuits Conf., p.478-479 (2010).

    C. D. LeBlanc et al., IEEE Custom Integrated Circuits Conf., p. 479-482 (2009).

    D. D. Caro et al., IEEE J. Solid-State Circuits, 45, p. 1048-1060 (2010).

    M. S. McCorquodale et al., Int. Solid-State Circuits Conf., p.350-351 (2008).

    References