8/17/2019 15HC08 mems syllabus

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15HC08 MICRO ELECTRO MECHANICAL SYSTEMS

3 0 0 3

OBJECTIVES:

• To introduce microsystems.

• To provide knowledge on science behind microsystems.

• To explain the various fabrication process.

•

To gain knowledge in designing microsystems.• To familiarize the different packaging techniques.

OUTCOMES:

Learners should be able to

• describe microsystems.

• design microsystems.

• understand the basic scientific concepts behind the microsystems.

• gain knowledge on applications of microsystems.

• identify the manufacturing processes of micro systems.

UNIT I OVERVIEW OF MEMS AND MICROSYSTEMS 9

Introduction – icrosystems and microelectronics – iniaturization – !orking principle of microsystems – icro

sensors – Types – icro actuation techniques – icroactuators" icrogrippers# micropump# micromotors andmicrovalves.

UNIT II ENGINEERING SCIENCE FOR MICROSYSTEMS 9

$tomic structure of matter – Ions and ionization – olecular theory of matter and intermolecular forces – %oping ofsemiconductors – %iffusion process – &lasma physics – 'lectrochemistry – (uantum physics.

UNIT III MATERIALS AND FABRICATION PROCESSES 9

)ubstrates and wafers – )ilicon as substrate material – )ilicon compounds – )ilicon piezoresistors – *allium arsenide – (uartz – &iezoelectric crystals – &olymers. &hotolithography – Ion implantation – %iffusion – +xidation – ,-% –

&hysical vapor deposition – %eposition by epitaxy – 'tching – ulk micro/manufacturing – )urface micromachining – LI*$.

UNIT IV MICROSYSTEMS DESIGN 9

)tatic bending of thin plates – Thermo mechanics – 0racture mechanics and mechanical vibration 1quantitative

treatment only2 – %esign considerations – &rocess design – echanical design.

UNIT V PACKAGING AND APPLICATIONS OF MICROSYSTEMS 9

icro system packaging – Interfaces – &ackaging techniques – Three dimensional packaging – $ssembly – )electionof materials – )ignal mapping and transduction – $pplications of microsystems in industries.

TOTAL: 5

TE!T BOOKS:

3. Tai – 4an 5su ') and icrosystems %esign and anufacture Tata c*raw 5ill# )econd 'dition 67786. ,hang Liu 0oundations of ') &earson 'ducation# Third 'dition 6739

REFERENCE BOOKS:

3. ohamed *ad–el–5ak The ') 5and ook ,4, &ress# )econd 'dition 677:

6. ;ulian ! *ardner# -i